KR101786962B1 - Anisotropic heat spreading sheet and electronic device having the same - Google Patents

Anisotropic heat spreading sheet and electronic device having the same Download PDF

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Publication number
KR101786962B1
KR101786962B1 KR1020150111139A KR20150111139A KR101786962B1 KR 101786962 B1 KR101786962 B1 KR 101786962B1 KR 1020150111139 A KR1020150111139 A KR 1020150111139A KR 20150111139 A KR20150111139 A KR 20150111139A KR 101786962 B1 KR101786962 B1 KR 101786962B1
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South Korea
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heat
adhesive
layer
insulating
heat dissipation
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KR1020150111139A
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Korean (ko)
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KR20160018421A (en
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황승재
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주식회사 아모그린텍
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/005—Dendritic macromolecules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to an anisotropic heat dissipating sheet and an electronic apparatus having the same, wherein the anisotropic heat dissipating sheet comprises: a heat dissipating layer for dissipating heat generated from a heat generating component of an electronic device to dissipate heat; And a heat insulating adhesive layer applied to the heat dissipating layer and having a function of adhering the heat dissipating layer to the mating member and a heat insulating function of suppressing the heat transfer in the vertical direction from the heat dissipating layer.

Description

[0001] The present invention relates to an anisotropic heat spreading sheet and an electronic device having the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipation device for an electronic device, and more particularly, to a heat dissipation device for rapidly dissipating heat generated from a heat generating component of an electronic device, And an electronic apparatus having the anisotropic heat dispersion sheet.

In recent years, the technology has rapidly developed, and high-performance, light-weight, and shortened electronic devices have appeared on the market and are being commercialized.

If such an electronic device fails to dissipate heat generated internally, excessive heat accumulation may cause image retention, system failure, and shortened product life. In severe cases, it may cause explosion or fire .

Particularly, a portable terminal such as a mobile phone (smart phone) is required to be downsized and lightweight in order to maximize the portability and convenience of the user, and components integrated in smaller and smaller spaces for high performance are mounted. As a result, the parts used in the mobile terminal have higher performance and higher heat generation temperature, and the higher temperature increases the performance of the portable terminal by affecting adjacent components.

On the other hand, a portable terminal such as a mobile phone is often used in contact with a human face in use. Heat generated in the portable terminal is transmitted to the skin, resulting in a low temperature image, It is necessary to lower the heat transmitted to the outside of the mobile terminal to a certain temperature or less.

In order to solve the problem caused by the heat generated by the mobile terminal, various materials have been adopted. However, until now, an optimal material capable of suppressing vertical heat transfer has not been developed yet, This is urgent.

Korean Patent Registration No. 10-1361105

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an anisotropic heat dissipating sheet which can hybridize a heat dissipating member and a heat insulating member to suppress heat transfer in a vertical direction, And an object of the present invention is to provide an electronic apparatus having the same.

Another object of the present invention is to provide a heat insulating adhesive which can be realized at low cost by employing an adiabatic adhesive prepared by including an adiabatic filler in a pressure sensitive adhesive (or adhesive) for adhering a heat spreading member to a counterpart, A dispersion sheet and an electronic apparatus having the dispersion sheet.

According to an aspect of the present invention, there is provided an anisotropic heat dissipation sheet comprising: a heat dissipation layer for dissipating heat generated from a heat-generating component of an electronic device to dissipate heat; And a heat insulating adhesive layer applied to the heat dissipating layer and having a function of adhering the heat dissipating layer to the mating member and a heat insulating function of suppressing the heat transfer in the vertical direction from the heat dissipating layer.

According to a preferred embodiment of the present invention, the heat dissipation layer may be formed of a metal or nonmetal thin plate having a thermal conductivity of 200 W / mk or more, more preferably a copper thin film, an aluminum thin film, and a graphite sheet. Considering the cost aspect, it is preferable to use copper thin film or aluminum thin film.

The heat-insulating adhesive layer may include an adhesive resin and an insulating filler dispersed in the adhesive resin. At this time, the heat-insulating filler may be a plate-like heat-insulating filler arranged horizontally in the adhesive resin so as to more effectively suppress the vertical transmission of heat.

The adhesive resin may be any one of acrylic, epoxy, urethane, polyamide, polyethylene, E.V.A., polyester, and P.V.C. adhesive resins, and the heat insulating filler may be an airgel.

On the other hand, the adiabatic adhesive layer may be a hot melt adhesive layer sheet having a plurality of pores in which thermally adherable fibers are accumulated and in a web state or an inorganic ball state.

The adiabatic adhesive layer may be a nanofiber web structure having a plurality of pores formed by accumulating fibers obtained by electrospinning a spinning solution containing an adhesive resin, a heat insulating filler and a solvent, and forming an air-insulating chamber.

According to another aspect of the present invention, there is provided an electronic apparatus including a main body including a plurality of components including a heat generating component; And an anisotropic heat-dissipating sheet as described above attached to the main body or a cover coupled to the main body so as to dissipate the heat generated from the heat-generating component and dissipate heat and to suppress the vertical transmission of the heat .

According to the present invention, there is provided a simple structure and method in which a relatively low-cost copper or aluminum thin film is employed as a heat spreading member and the heat spreading member is adhered to a place requiring heat dissipation and heat insulation with an adiabatic adhesive, Characteristics, that is, prevention of deterioration of heat generating parts and temperature rise of the case can be solved.

1A and 1B are sectional views of a heat-radiating tape according to the present invention,
FIGS. 2A to 2C are cross-sectional views showing a state in which the heat-radiating tape according to the present invention is adhered to an electronic device part,
3 is a cross-sectional view of an anisotropic heat-dissipating sheet according to the first embodiment of the present invention,
4 is a cross-sectional view of an anisotropic heat-dissipating sheet according to a second embodiment of the present invention,
5 is a cross-sectional view of an anisotropic heat-dissipating sheet according to a third embodiment of the present invention,
6 is a cross-sectional view of a heat-dissipating adhesive applied to an anisotropic heat-dissipating sheet according to a third embodiment of the present invention,
7 is a cross-sectional view of an anisotropic heat dissipating sheet according to a fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 1A and 1B, the heat radiation tapes 100a and 100b according to the present invention include adhesive layers 110, 110a, and 110b; An insulating filler 120 dispersed in the adhesive layers 110, 110a, and 110b and blocking heat; And a heat dissipation layer 130 formed on one side or both sides of the adhesive layers 110, 110a, and 110b.

The heat dissipation tapes 100a and 100b according to the present invention are excellent in tackiness due to an ultra-thin structure composed of the adhesive layers 110, 110a and 110b and the heat dissipation layer 130, The heat-insulating filler 120 and the heat-dissipating layer 130 have an advantage that the heat-insulating and heat-dissipating can be performed together with the ultra-thin tape structure.

The adhesive layers 110, 110a, and 110b are films made of an adhesive material and serve to adhere the heat-radiating tapes 100a and 100b to a heat-generating component or an adjacent component of the heat-generating component. At this time, when the adhesive material is formed of the adhesive material having excellent thermal conductivity, the heat generated from the heat generating component can be quickly transmitted to the heat dissipating layer 130.

The adhesive layers 110, 110a, and 110b (including the adhesive layer described later) may be formed of an acrylic resin, an epoxy resin, a urethane resin, a polyamide resin, a polyethylene resin, an EVA resin, Based, or PVC-based. The adhesive layers 110, 110a, and 110b can also be formed as a hot melt adhesive layer sheet in a web state or an inorganic ball state in which fibers capable of thermally adhering are accumulated and have a plurality of pores.

That is, the adhesive layers 110, 110a and 110b are embodied as a web having a plurality of pores formed by accumulating heat-stickable fibers obtained by electrospinning a thermal spraying material, a heat insulating filler 120, You can.

In this case, since the size of the thermally adherable fiber can be reduced to a nano-size of 1 μm or less, the pore size becomes small in this case, and the air of the pore is suppressed from being convected to become a fine pocket for heat- .

Therefore, the adhesive layers 110, 110a, and 110b are structurally capable of having heat shielding ability due to the micro pores formed between the nanofibers.

Further, when the heat insulating filler 120 is smaller than the size of the heat sealable fiber, the heat insulating filler 120 is confined within the electrospun fiber.

At this time, the fibers fall down with the heat insulating filler 120 embedded therein, are arranged in the horizontal direction, and are accumulated in the vertical direction to form the adhesive layers 110, 110a, and 110b.

Therefore, in the present invention, the thermally adherable fibers having the heat insulating filler 120 embedded therein can be accumulated, and the plate-like heat insulating filler can be arranged substantially in the horizontal direction.

The heat insulating filler 120 is dispersed in the form of powder in the adhesive layers 110, 110a and 110b and blocks heat transferred to the adhesive layers 110, 110a, and 110b. The heat insulating filler 120 is preferably made of an airgel having excellent heat insulating properties, but is not limited thereto.

The size of the heat insulating filler 120 may be 0.1 to 1000 μm and the shape of the heat insulating filler 120 may be a spherical shape, a polygonal shape or a plate shape. For example, the heat insulating filler 120 of a plate- The blocking efficiency of the heat transmitted in the vertical direction of the adhesive layers 110, 110a, and 110b can be increased.

Here, the heat insulating filler 120 is dispersed in the adhesive layers 110, 110a and 110b, and the heat components flowing into the adhesive layer 110, 110a, and 110b regions where the heat insulating filler 120 does not exist, (110, 110a, 110b) without being blocked by the adhesive layer (120).

Therefore, in the present invention, the heat insulating filler 120 is arranged in the horizontal direction of the adhesive layers 110, 110a, and 110b so as to increase the blocking efficiency of the heat component transmitted in the vertical direction of the adhesive layer 110 .

If the spherical heat insulating filler is further dispersed in the adhesive layers 110, 110a and 110b in which the plate-like heat insulating filler is dispersed, the spherical heat insulating filler is positioned between the plate heat insulating fillers, So that the heat shielding ability can be further enhanced.

The heat dissipation tapes 100a and 100b may be used for electronic equipment. In this case, the electronic equipment includes a main body including a plurality of components including a heat generating component; And a heat-radiating tape adhered to the heat-generating component or adhered to the component adjacent to the heat-generating component.

Meanwhile, in the present invention, the adhesive layers 110, 110a, and 110b may be formed by stacking first and second adiabatic adhesive layers having different sizes or different shapes of heat-insulating fillers dispersed therein.

That is, if the heat insulating fillers of different sizes or different shapes are dispersed in the first and second adiabatic adhesive layers, the heat blocking path of the first adiabatic adhesive layer and the heat blocking path of the second adiabatic adhesive layer are different, The efficiency can be improved.

For example, when the plate-like heat insulating filler is dispersed in the first adiabatic adhesive layer and the spherical adiabatic filler is dispersed in the second adiabatic adhesive layer, the heat transferred to the first adiabatic adhesive layer is partially blocked by the plate- The heat which is not blocked by the heat insulating filler is transmitted to the second heat insulating adhesive layer and is blocked by the spherical heat insulating filler, thereby increasing the heat insulating efficiency.

In the present invention, a first web having a plurality of pores formed by accumulating fibers capable of thermo-sticking obtained by electrospinning a spinning solution mixed with a thermosensitive material, a first heat-insulating filler and a solvent, Heat-sealable layer obtained by electrospinning a spinning solution in which a thermally adhesive material, a second heat-insulating filler and a solvent are mixed, and fibers in which a second heat-insulating filler is embedded are accumulated in a first web An adiabatic pressure-sensitive adhesive can be realized as a second adiabatic adhesive layer made of a second web having a plurality of pores.

That is, the lamination structure of the first and second adiabatic adhesive layers can be easily formed by electrospinning, and each of the first and second adiabatic adhesive layers has a plurality of pores for accumulating the fibers to form the air- Accordingly, there is a characteristic that a heat shielding capability can be structurally provided.

The heat-radiating layer 130 is preferably made of a material having a heat conductivity of 200 to 2000 W / mK, and may be made of one of Cu, Al and graphite.

2A to 2C are sectional views showing a state in which the heat radiation tape according to the present invention is adhered to an electronic device part.

The heat-radiating tape according to the present invention is directly adhered to a heat-generating component of an electronic device or is adhered to a component adjacent to the heat-generating component to perform heat insulation and heat radiation.

That is, the heat dissipation tape 100a having the adhesive layer 110 formed on one surface of the heat dissipation layer 130 shown in FIG. 1A is adhered to the heat dissipation component 210 (FIG. (FIG. 2B) and blocks and diffuses the heat generated by the heat generating component 210.

The double-sided heat radiation tape 100b having the adhesive layers 110a and 110b formed on both sides of the heat dissipation layer 130 shown in FIG. 1B is adhered to each of the components 220 adjacent to the heat generating component 210, 210 can be prevented from being intercepted and diffused and transmitted to the adjoining part 220.

3 is a cross-sectional view of an anisotropic heat-dissipating sheet according to the first embodiment of the present invention.

In the present invention, an anisotropic heat-dissipating sheet can be realized by combining a reinforcing sheet with the above-mentioned heat-radiating tape. Here, the reinforcing sheet may be a heat insulating member or a heat radiating member, and the heat radiating sheet and the reinforcing sheet may be adhered to each other with an adhesive layer interposed between the heat radiating sheet and the reinforcing sheet.

That is, in the present invention, the ability to suppress the heat generated from the heat-generating component of the electronic device from being transmitted to the outside of the electronic device by stacking the reinforcing sheet on the heat-radiating tape and radiating heat from the heat- So that the temperature of the front and rear surfaces of the electronic apparatus can be maintained at a specified temperature or lower.

Therefore, the anisotropic heat-dissipating sheet of the present invention can efficiently suppress the heat generated from the heat-generating component from being transmitted to the outside, so that it is possible to prevent a user who is in close contact with the electronic device from suffering a low-

3, the anisotropic heat dissipation sheet provided with the heat dissipation tape according to the first embodiment of the present invention includes a heat dissipation layer 130 for dispersing and / or diffusing heat generated from a heat-generating component of an electronic device to dissipate heat, A heat radiation tape (100b) formed on both sides of the heat dissipation layer (130) and including adhesive layers (110a, 110b) in which the heat dissipation pillar for shielding the heat is dispersed therein; And a heat radiation sheet 310 adhered to the adhesive layer 110a of the heat radiation tape 100b to diffuse and dissipate the heat.

The adhesive layers 110a and 110b may be applied to the heat dissipation layer 130 to adhere the heat dissipation layer 130 to the mating member 130 and to perform heat insulation function for suppressing heat transfer in the vertical direction from the heat dissipation layer 130 .

The heat-radiating sheet 310 may be made of a material having a heat conductivity of about 200 to 3000 W / mK, that is, any one of Cu, Al, Ag, Ni, and graphite or a combination thereof. Taking into consideration the unit price and the characteristics, a laminated structure of Cu, graphite, Cu and graphite can be preferably used.

The heat-radiating sheet 310 quickly dissipates the heat generated from the heat-generating component in the horizontal direction to prevent locally high heat from being generated, thereby preventing the heat-generating component and components built in the electronic device from being damaged by high heat.

Therefore, in the anisotropic heat-dissipating sheet according to the first embodiment of the present invention, the heat of the heat-generating components transmitted to the adhesive layers 110a and 110b of the heat-radiating tape 100b is absorbed by the heat-insulating fillers 110a and 110b dispersed in the adhesive layers 110a and 110b. The heat that has not been blocked is diffused in the heat dissipation layer 130 of the heat dissipation tape 100b and diffused again in the heat dissipation sheet 310 to improve the heat dissipation efficiency with the ultra thin structure sheet.

4 is a cross-sectional view of an anisotropic heat-dissipating sheet according to a second embodiment of the present invention.

Referring to FIG. 4, the anisotropic heat dissipation sheet according to the second embodiment of the present invention includes a first heat dissipation layer 130a for diffusing and radiating heat, and a first heat dissipation layer 130b formed on both sides of the heat dissipation layer 130a, A heat radiation tape (100b) including adhesive layers (110a, 110b) in which an insulating filler to be shielded is dispersed therein; A heat dissipation sheet 310 which is adhered to the adhesive layer 110a of the heat dissipation tape 100b and adheres to one side to diffuse the heat to dissipate heat; A supplementary adhesive layer 110c formed on the other surface of the heat-radiating sheet 310 and having a heat-insulating filler interposed therebetween to block the heat; And a second heat dissipation layer 130b adhered to the supplementary adhesive layer 110c to diffuse and radiate heat.

That is, in the anisotropic heat dissipation sheet according to the second embodiment of the present invention, the supplementary adhesive layer 110c and the second heat dissipation layer 130b are formed on the heat dissipation sheet 310 of the anisotropic heat dissipation sheet of the first embodiment shown in Fig. The heat absorbed by the heat insulating sheet 310 is blocked by the heat insulating filler of the supplementary adhesive layer 110c and diffused in the second heat dissipating layer 130b to dissipate heat.

FIG. 5 is a cross-sectional view of an anisotropic heat dissipation sheet according to a third embodiment of the present invention, and FIG. 6 is a sectional view of a heat dissipation adhesive applied to an anisotropic heat dissipation sheet according to a third embodiment of the present invention.

5, an anisotropic heat-dissipating sheet according to a third embodiment of the present invention includes a heat dissipation adhesive 320 formed on the second heat dissipation layer 130b of the anisotropic heat dissipation sheet according to the second embodiment of the present invention will be. The heat-dissipating adhesive 320 is for dispersing a thermally conductive filler therein, thereby promoting heat diffusion, thereby enhancing heat dissipation capability.

6, the heat dissipation adhesive 320 includes an adhesive layer 321; A first thermally conductive filler (322) dispersed in the adhesive layer (321) and diffusing the transferred heat horizontally; And a second thermally conductive filler (323) dispersed in the adhesive layer (321) and transferring the heat to the first thermally conductive filler (322).

The heat dissipation adhesive 320 of the present invention can improve the heat dissipation efficiency by diffusing the heat transferred from the exothermic part in the horizontal direction in the first thermally conductive filler 322 by being adhered to or adjacent to the exothermic part. The second thermally conductive filler 323 functions to transfer the heat transferred from the heat generating component to the first thermally conductive filler 322 to promote thermal diffusion in the horizontal direction of the heat- Can be improved.

That is, the first and second thermally conductive fillers 322 and 323 are dispersed in the adhesive layer 321 to promote diffusion of the heat of the heat generating component in the horizontal direction, It is possible to lower the temperature of the heat transmitted in the vertical direction.

The second thermally conductive filler 323 may be located in the region of the adhesive layer 321 where the first thermally conductive filler 322 is not present and may transfer the heat of the exothermic component to the first thermally conductive filler 322, Change the progress path.

The first thermally conductive filler 322 preferably has a plate-like structure (or a rectangular structure) so as to diffuse in the horizontal direction of the heat-radiating adhesive 320. The first thermally conductive filler 322 may be a graphite nano fiber, a carbon nano tube, And may be made of at least one of fiber, AlN (aluminum nitride), and BN (boron nitride). The first thermally conductive filler 322 is preferably formed in a shape having an aspect ratio of 1: 100.

The second thermally conductive filler 323 may have a spherical structure to transfer heat to the first thermally conductive filler 322. At this time, the second thermally conductive filler 323 receives heat transferred from the heat-generating component And diffuses to the spherical surface to change the path of the heat transmitted in the vertical direction of the heat-dissipating adhesive 320 to rapidly transfer heat to the first thermally conductive filler 322. The second thermally conductive filler 323 is preferably made of at least one of MgO, Al 2 O 3 , SiC, and diamond.

Here, the first thermally conductive filler 322 may be arranged on a plurality of layers having vertically spaced apart layers of the adhesive layer 321, and the second thermally conductive filler 323 may be arranged on the first thermally conductive filler 322 ). ≪ / RTI >

The first and second thermally conductive fillers 322 and 323 may be made of a material having a thermal conductivity of about 200 to 3000 W / mk.

It is preferable that the first and second thermally conductive fillers 322 and 323 contain 5 to 15 wt% of the total weight of the adhesive layer 321. If the adhesive layer 321 contains the first and second thermally conductive fillers 322 and 323 of 5 wt% or less, a desired level of heat dissipation efficiency can not be obtained and the first and second thermally conductive fillers 322 and 323 of 15 wt% There is a drawback that the adhesive performance is deteriorated.

7 is a cross-sectional view of an anisotropic heat dissipating sheet according to a fourth embodiment of the present invention.

Referring to FIG. 7, the anisotropic heat dissipation sheet according to the fourth embodiment of the present invention further includes an electrically conductive adhesive 330 on the second heat dissipation layer 130b of the anisotropic heat dissipation sheet according to the second embodiment of the present invention. .

The electrically conductive adhesive layer 330 is capable of blocking and absorbing electromagnetic waves and capable of performing an adhesive function. The electrically conductive adhesive layer 330 may be formed of an electrically conductive metal such as Ni, Cu, or Ag, which is excellent in electrical conductivity, carbon black, An adhesive material comprising at least one electrically conductive material selected from the group consisting of graphene, conductive polymer (PDOT). The adhesive material is laminated on the heat-radiating sheet 310 by various methods such as coating, sputtering, and printing.

In the heat-radiating tape and the anisotropic heat-dissipating sheet described above, when the pressure-sensitive adhesive layer is exposed to the outside, the handling properties such as transportation and storage may deteriorate due to the adhesive property of the pressure- The release member is adhered to the adhesive layer exposed on the upper surface or the lower surface.

That is, the release member is attached to the adhesive layer before adhering to the components of the heat radiation tape and the anisotropic heat dissipation sheet to perform the function of protecting the adhesive layer, separating the release member, and then attaching the heat radiation tape and the anisotropic heat- To attach to the component.

Such a release member can be made of a resin material such as a PET film, and a fiber material other than a resin material can be used.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limited to the embodiments set forth herein. Various changes and modifications may be made by those skilled in the art.

The present invention provides a heat-insulating tape having an ultra-thin structure capable of effectively suppressing the transfer of heat generated from a heat-generating component of an electronic device and capable of adhesion.

100a, 100b: heat radiation tape 110, 110a, 110b, 110c, 321:
120: adiabatic filler 130, 130a, 130b:
210: heat generating component 220: adjacent component
310: heat-radiating sheet 320: heat-
321: adhesive layer 322, 323: thermally conductive filler
330: electrically conductive adhesive layer

Claims (10)

A heat dissipation layer that dissipates heat generated from heat generating components of the electronic device to dissipate heat; And
And a heat insulating adhesive layer applied to the heat dissipating layer and having a function of adhering the heat dissipating layer to the partner and a heat insulating function of suppressing the heat transfer in the vertical direction from the heat dissipating layer,
Wherein the heat-insulating adhesive layer is a nanofiber web structure having a plurality of pores in which nanofibers obtained by electrospinning of a spinning solution containing an adhesive resin, a heat insulating filler and a solvent are accumulated to form an air-
The heat dissipation layer is formed of a metal or nonmetal thin plate having a thermal conductivity of 200 W / mk or more,
Wherein the heat-insulating filler is a plate-like heat-insulating filler arranged horizontally in the adhesive resin. delete The method according to claim 1,
Wherein the heat dissipation layer is made of any one selected from a copper thin film, an aluminum thin film and a graphite sheet. delete delete The method according to claim 1,
Wherein the adhesive resin is any one selected from acrylic, epoxy, urethane, polyamide, polyethylene, EVA, polyester, and PVC adhesive resins. The method according to claim 1,
Wherein the heat-insulating filler is an airgel. delete delete A main body including a plurality of components including a heat generating component; And
The anisotropic heat dissipation according to any one of claims 1, 3, 6 and 7, which is attached to the main body or the cover coupled to the main body so as to dissipate the heat generated from the heat-generating component and dissipate the heat, And a sheet.
KR1020150111139A 2014-08-06 2015-08-06 Anisotropic heat spreading sheet and electronic device having the same KR101786962B1 (en)

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KR102551743B1 (en) * 2018-04-04 2023-07-06 엘지이노텍 주식회사 Heat radiation sheet, portable device and wireless charging device using the same

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