KR20140025517A - 얼라인먼트 장치 및 얼라인먼트 방법 - Google Patents

얼라인먼트 장치 및 얼라인먼트 방법 Download PDF

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Publication number
KR20140025517A
KR20140025517A KR1020137033207A KR20137033207A KR20140025517A KR 20140025517 A KR20140025517 A KR 20140025517A KR 1020137033207 A KR1020137033207 A KR 1020137033207A KR 20137033207 A KR20137033207 A KR 20137033207A KR 20140025517 A KR20140025517 A KR 20140025517A
Authority
KR
South Korea
Prior art keywords
alignment
spin chuck
inert gas
target object
substrate
Prior art date
Application number
KR1020137033207A
Other languages
English (en)
Korean (ko)
Inventor
야스히로 다키모토
히로아키 즈키모토
다이스케 후지타
Original Assignee
다즈모 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다즈모 가부시키가이샤 filed Critical 다즈모 가부시키가이샤
Publication of KR20140025517A publication Critical patent/KR20140025517A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020137033207A 2011-06-02 2012-05-16 얼라인먼트 장치 및 얼라인먼트 방법 KR20140025517A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011123892 2011-06-02
JPJP-P-2011-123892 2011-06-02
PCT/JP2012/062482 WO2012165142A1 (ja) 2011-06-02 2012-05-16 アライメント装置およびアライメント方法

Publications (1)

Publication Number Publication Date
KR20140025517A true KR20140025517A (ko) 2014-03-04

Family

ID=47259005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137033207A KR20140025517A (ko) 2011-06-02 2012-05-16 얼라인먼트 장치 및 얼라인먼트 방법

Country Status (4)

Country Link
JP (1) JP5758993B2 (ja)
KR (1) KR20140025517A (ja)
TW (1) TWI479588B (ja)
WO (1) WO2012165142A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109285804B (zh) * 2017-07-21 2020-12-01 中芯国际集成电路制造(上海)有限公司 晶圆垂直稳定性校准***及校准晶圆垂直稳定性的方法
JP7203575B2 (ja) * 2018-11-08 2023-01-13 住友重機械工業株式会社 ウエハアライメント装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242250A (ja) * 1997-02-26 1998-09-11 Fujitsu Ltd ウェハ位置検出方法、アライメント装置、及び、半導体処理装置
JP2002329769A (ja) * 2001-04-27 2002-11-15 Lintec Corp アライメント装置
JP5029486B2 (ja) * 2008-05-13 2012-09-19 東京エレクトロン株式会社 塗布装置、塗布方法及び記憶媒体
JP5384220B2 (ja) * 2009-06-22 2014-01-08 東京応化工業株式会社 アライメント装置およびアライメント方法

Also Published As

Publication number Publication date
JP5758993B2 (ja) 2015-08-05
TW201306152A (zh) 2013-02-01
JPWO2012165142A1 (ja) 2015-02-23
TWI479588B (zh) 2015-04-01
WO2012165142A1 (ja) 2012-12-06

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E601 Decision to refuse application