JP2017139251A - 基板受け渡し位置の教示方法及び基板処理システム - Google Patents
基板受け渡し位置の教示方法及び基板処理システム Download PDFInfo
- Publication number
- JP2017139251A JP2017139251A JP2016016954A JP2016016954A JP2017139251A JP 2017139251 A JP2017139251 A JP 2017139251A JP 2016016954 A JP2016016954 A JP 2016016954A JP 2016016954 A JP2016016954 A JP 2016016954A JP 2017139251 A JP2017139251 A JP 2017139251A
- Authority
- JP
- Japan
- Prior art keywords
- arm
- substrate
- moved
- wafer
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 76
- 238000012545 processing Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims description 51
- 238000012546 transfer Methods 0.000 claims description 197
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 136
- 230000008569 process Effects 0.000 description 32
- 230000003287 optical effect Effects 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/02—Arm motion controller
- Y10S901/03—Teaching system
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/46—Sensing device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Human Computer Interaction (AREA)
Abstract
【解決手段】搬送アーム32を鉛直方向上方に基準位置Z1から所定距離移動させる(図5(b)、工程A2)。搬送アーム32を水平方向に移動させる(図5(c)、工程A3)。搬送アーム32を鉛直方向下方に所定距離移動させる(図5(d)、工程A4)。搬送アーム32に保持されたウェハWの、当該搬送アーム32に対する水平方向の位置を検出する(図5(g)、工程A7)。工程A1〜A7の一連工程を繰り返し行い、且つ、この一連工程を行うごとに、工程A1における基準位置を、鉛直上方に所定距離移動させる。工程A7で検出された水平方向の位置が所定位置からずれた場合の、搬送アーム32の鉛直方向の位置をウェハWの受け渡し位置と教示する。
【選択図】図5
Description
先ず、本実施形態に係る基板処理システムの構成について説明する。図1は、基板処理システムの構成の概略を示す平面図である。本実施形態の基板処理システム1では、基板としてのウェハWに所定の処理を行う。
次に、以上のように構成された基板処理システム1において行われる、ウェハWの受け渡し位置のティーチングについて説明する。図4に示すように、このウェハWの受け渡し位置Zpは、搬送アーム32の搬送位置(上面)と支持ピン23の支持位置(先端部)が一致する位置である。なお、ティーチングに用いられるウェハWは、製品用のウェハであってもよいし、ダミーウェハ(ベアウェハ)であってもよい。
次に、ウェハWの受け渡し位置のティーチングの第2の実施形態について説明する。第2の実施形態ではティーチングに際し、ウェハWを搬送アーム32で保持した状態で、当該搬送アーム32を鉛直方向に移動させる。図7は、第2の実施形態のティーチングにおける動作を説明する説明図であって、(a)〜(e)は搬送アーム32と支持ピン23の状態を示した側面図であり、(f)は(a)〜(e)の各工程における搬送アーム32の動きを模式的に示した図である。
次に、ウェハWの受け渡し位置のティーチングの第3の実施形態について説明する。第3の実施形態ではティーチングに際し、ウェハWを搬送アーム32で保持した状態で、支持ピン23を鉛直方向に移動させる。図8は、第3の実施形態のティーチングにおける動作を説明する説明図であり(a)〜(e)は搬送アーム32と支持ピン23の状態を示した側面図であり、(f)は(a)〜(e)の各工程における搬送アーム32の動き(実線矢印)と支持ピン23の動き(点線矢印)を模式的に示した図である。
次に、ウェハWの受け渡し位置のティーチングの第4の実施形態について説明する。第4の実施形態ではティーチングに際し、ウェハWを支持ピン23で支持した状態で、当該支持ピン23を鉛直方向に移動させる。図9は、第4の実施形態のティーチングにおける動作を説明する説明図であり(a)〜(g)は搬送アーム32と支持ピン23の状態を示した側面図であり、(h)は(a)〜(g)の各工程における搬送アーム32と支持ピン23の動きを模式的に示した図である。
以上、添付図面を参照しながら本発明の好適な実施の形態について説明したが、本発明はかかる例に限定されない。当業者であれば、特許請求の範囲に記載された思想の範疇内において、各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。
20 処理装置
22 載置台
23 支持ピン
31 ウェハ搬送装置
32 搬送アーム
38 モータ
41 センサ
50 制御部
60 ラインセンサ
W ウェハ
Claims (7)
- 搬送装置のアームと処理装置のピンとの間で基板を受け渡す際の鉛直方向の受け渡し位置を教示する方法であって、
前記アーム又は前記ピンを、鉛直方向の一方向に基準位置から所定距離移動させる第1の工程と、
前記アームを水平方向に移動させる第2の工程と、
前記一方向に移動させた前記アーム又は前記ピンを、鉛直方向の他方向に前記所定距離以上移動させる第3の工程と、
前記アームに保持された前記基板の、当該アームに対する水平方向の位置を検出する第4の工程と、を有し、
前記第1の工程〜前記第4の工程の一連工程を繰り返し行い、且つ、前記一連工程を行うごとに、前記第1の工程における前記基準位置を、前記一方向に前記所定距離移動させ、
前記第4の工程で検出された前記水平方向の位置が所定位置からずれた場合の、前記アーム又は前記ピンの鉛直方向の位置を前記受け渡し位置と教示することを特徴とする、基板受け渡し位置の教示方法。 - 前記第1の工程において、前記ピンに前記基板が支持された状態で、前記アームを前記一方向に移動させ、
前記第3の工程の後であって前記第4の工程の前において、前記アームを前記第2の工程における移動方向と反対方向に移動させた後、前記アームを前記一方向に移動させるか、又は前記ピンを前記他方向に移動させて、前記アームで前記基板を保持することを特徴とする、請求項1に記載の基板受け渡し位置の教示方法。 - 前記第1の工程において、前記アームに前記基板が保持された状態で、前記アームを前記一方向に移動させることを特徴とする、請求項1に記載の基板受け渡し位置の教示方法。
- 前記第1の工程において、前記アームに前記基板が保持された状態で、前記ピンを前記一方向に移動させることを特徴とする、請求項1に記載の基板受け渡し位置の教示方法。
- 前記第1の工程において、前記ピンに前記基板が支持された状態で、前記ピンを前記一方向に移動させ、
前記第3の工程の後であって前記第4の工程の前において、前記アームを前記第2の工程における移動方向と反対方向に移動させた後、前記ピンを前記一方向に移動させるか、又は前記アームを前記他方向に移動させて、前記アームで前記基板を保持することを特徴とする、請求項1に記載の基板受け渡し位置の教示方法。 - 前記第1の工程〜前記第4の工程は、少なくとも真空雰囲気又は加熱雰囲気で行われることを特徴とする、請求項1〜5のいずれか一項に記載の基板受け渡し位置の教示方法。
- 基板を処理する処理装置と、当該処理装置との間で基板を搬送する搬送装置とを備えた基板処理システムであって、
前記処理装置に設けられ、前記基板を支持し、鉛直方向に移動自在のピンと、
前記搬送装置に設けられ、前記基板を保持し、水平方向に移動自在、又は、鉛直方向及び水平方向に移動自在のアームと、
前記アームに対する前記基板の水平方向の位置を検出する位置検出機構と、
前記ピンと前記アームとの間で前記基板を受け渡す際の鉛直方向の受け渡し位置を教示する制御部と、を有し、
前記制御部は、
前記アーム又は前記ピンを、鉛直方向の一方向に基準位置から所定距離移動させる第1の工程と、前記アームを水平方向に移動させる第2の工程と、前記一方向に移動させた前記アーム又は前記ピンを、鉛直方向の他方向に前記所定距離移動させる第3の工程と、前記アームに保持された前記基板の、当該アームに対する水平方向の位置を検出する第4の工程と、を実行するように前記ピン、前記アーム及び前記位置検出機構を制御し、
前記第1の工程〜前記第4の工程の一連工程を繰り返し行い、且つ、前記一連工程を行うごとに、前記第1の工程における前記基準位置を、前記一方向に前記所定距離移動させ、
前記第4の工程で検出された前記水平方向の位置が所定位置からずれた場合の、前記アーム又は前記ピンの鉛直方向の位置を前記受け渡し位置と教示することを特徴とする、基板処理システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016016954A JP6671993B2 (ja) | 2016-02-01 | 2016-02-01 | 基板受け渡し位置の教示方法及び基板処理システム |
CN201710060655.1A CN107026110B (zh) | 2016-02-01 | 2017-01-25 | 基板交接位置的示教方法和基板处理*** |
KR1020170013594A KR101915878B1 (ko) | 2016-02-01 | 2017-01-31 | 기판 주고받음 위치의 교시 방법 및 기판 처리 시스템 |
US15/422,293 US10340175B2 (en) | 2016-02-01 | 2017-02-01 | Substrate transfer teaching method and substrate processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016016954A JP6671993B2 (ja) | 2016-02-01 | 2016-02-01 | 基板受け渡し位置の教示方法及び基板処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017139251A true JP2017139251A (ja) | 2017-08-10 |
JP6671993B2 JP6671993B2 (ja) | 2020-03-25 |
Family
ID=59385365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016016954A Active JP6671993B2 (ja) | 2016-02-01 | 2016-02-01 | 基板受け渡し位置の教示方法及び基板処理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US10340175B2 (ja) |
JP (1) | JP6671993B2 (ja) |
KR (1) | KR101915878B1 (ja) |
CN (1) | CN107026110B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021197553A (ja) * | 2020-06-15 | 2021-12-27 | セメス カンパニー,リミテッド | 基板処理装置、リフトピン高さ偏差の測定方法、及びコンピュータ読出し可能な処理プログラムを記録した記録媒体 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6456712B2 (ja) * | 2015-02-16 | 2019-01-23 | 東京エレクトロン株式会社 | 基板保持機構及びこれを用いた基板処理装置 |
CN105118803B (zh) * | 2015-08-21 | 2019-01-22 | 京东方科技集团股份有限公司 | 顶针机构及支撑装置 |
JP7220030B2 (ja) * | 2018-07-25 | 2023-02-09 | 株式会社ジャパンディスプレイ | マスクユニットの製造装置 |
WO2020106418A1 (en) * | 2018-11-19 | 2020-05-28 | Mattson Technology, Inc. | Systems and methods for workpiece processing |
KR102396431B1 (ko) * | 2020-08-14 | 2022-05-10 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 반송 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014075397A (ja) * | 2012-10-03 | 2014-04-24 | Tokyo Electron Ltd | 搬送機構の位置決め方法 |
JP2014099576A (ja) * | 2012-10-15 | 2014-05-29 | Tokyo Electron Ltd | 搬送機構の位置決め方法、被処理体の位置ずれ量算出方法及び搬送機構のティーチングデータの修正方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970003907B1 (ko) * | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
JP3238432B2 (ja) * | 1991-08-27 | 2001-12-17 | 東芝機械株式会社 | マルチチャンバ型枚葉処理装置 |
JP3272481B2 (ja) * | 1992-05-15 | 2002-04-08 | 東京エレクトロン株式会社 | 被処理物の移載装置の制御方法および移載方法 |
JP3778677B2 (ja) | 1997-12-01 | 2006-05-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2000124288A (ja) * | 1998-10-21 | 2000-04-28 | Dainippon Screen Mfg Co Ltd | 基板搬送方法および基板搬送装置 |
JP2001202123A (ja) * | 2000-01-18 | 2001-07-27 | Sony Corp | 搬送ロボットの教示方法 |
JP3694808B2 (ja) | 2001-04-13 | 2005-09-14 | 株式会社安川電機 | ウェハ搬送用ロボットの教示方法および教示用プレート |
JP3888620B2 (ja) | 2002-01-22 | 2007-03-07 | 東京エレクトロン株式会社 | 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置 |
JP5132904B2 (ja) * | 2006-09-05 | 2013-01-30 | 東京エレクトロン株式会社 | 基板位置決め方法,基板位置検出方法,基板回収方法及び基板位置ずれ補正装置 |
US8386064B2 (en) * | 2008-03-17 | 2013-02-26 | Tokyo Electron Limited | Control device and control method |
JP5083339B2 (ja) | 2010-02-04 | 2012-11-28 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法並びに記憶媒体 |
JP5756032B2 (ja) * | 2012-01-24 | 2015-07-29 | 株式会社安川電機 | ロボットシステム |
JP6148025B2 (ja) * | 2013-02-04 | 2017-06-14 | 株式会社Screenホールディングス | 受渡位置教示方法、受渡位置教示装置および基板処理装置 |
JP6511715B2 (ja) * | 2013-10-31 | 2019-05-15 | セイコーエプソン株式会社 | ロボット制御装置、ロボットシステム、及びロボット |
JP6428466B2 (ja) * | 2014-06-23 | 2018-11-28 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、基板処理システム及び記憶媒体 |
JP6339909B2 (ja) | 2014-09-17 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
-
2016
- 2016-02-01 JP JP2016016954A patent/JP6671993B2/ja active Active
-
2017
- 2017-01-25 CN CN201710060655.1A patent/CN107026110B/zh active Active
- 2017-01-31 KR KR1020170013594A patent/KR101915878B1/ko active IP Right Grant
- 2017-02-01 US US15/422,293 patent/US10340175B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014075397A (ja) * | 2012-10-03 | 2014-04-24 | Tokyo Electron Ltd | 搬送機構の位置決め方法 |
JP2014099576A (ja) * | 2012-10-15 | 2014-05-29 | Tokyo Electron Ltd | 搬送機構の位置決め方法、被処理体の位置ずれ量算出方法及び搬送機構のティーチングデータの修正方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021197553A (ja) * | 2020-06-15 | 2021-12-27 | セメス カンパニー,リミテッド | 基板処理装置、リフトピン高さ偏差の測定方法、及びコンピュータ読出し可能な処理プログラムを記録した記録媒体 |
JP7236502B2 (ja) | 2020-06-15 | 2023-03-09 | セメス カンパニー,リミテッド | 基板処理装置、リフトピン高さ偏差の測定方法、及びコンピュータ読出し可能な処理プログラムを記録した記録媒体 |
Also Published As
Publication number | Publication date |
---|---|
CN107026110B (zh) | 2020-02-14 |
US20170217017A1 (en) | 2017-08-03 |
CN107026110A (zh) | 2017-08-08 |
KR20170091526A (ko) | 2017-08-09 |
JP6671993B2 (ja) | 2020-03-25 |
KR101915878B1 (ko) | 2018-11-06 |
US10340175B2 (en) | 2019-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6671993B2 (ja) | 基板受け渡し位置の教示方法及び基板処理システム | |
KR101485297B1 (ko) | 열처리 장치 및 기판 반송 위치 조정 방법 | |
US9616577B2 (en) | Robot having end effector and method of operating the same | |
KR101335146B1 (ko) | 프로브 카드 검출 장치, 웨이퍼의 위치 정렬 장치 및 웨이퍼의 위치 정렬 방법 | |
US11244849B2 (en) | Substrate transfer device and substrate transfer method | |
JP5189370B2 (ja) | 基板交換装置及び基板処理装置並びに基板検査装置 | |
JP4849825B2 (ja) | 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体 | |
JP6596288B2 (ja) | 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム | |
JP6478878B2 (ja) | 基板処理装置及び基板搬送方法並びに基板搬送プログラムを記憶したコンピュータ読み取り可能な記憶媒体 | |
TWI653704B (zh) | 姿勢變更裝置 | |
JP2013033809A (ja) | ウエハ搬送装置 | |
JP2012038922A (ja) | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 | |
JP7357549B2 (ja) | 基板の位置ずれ検出方法、基板位置の異常判定方法、基板搬送制御方法、及び基板の位置ずれ検出装置 | |
JP4523513B2 (ja) | 基板受け渡し装置、基板受け渡し方法及び記憶媒体 | |
JP4468159B2 (ja) | 基板処理装置及びその搬送位置合わせ方法 | |
JP6700124B2 (ja) | 搬送対象物を搬送する搬送方法 | |
JP4580719B2 (ja) | 基板搬送装置及び基板搬送方法 | |
JP5758993B2 (ja) | アライメント装置およびアライメント方法 | |
JP2008251944A (ja) | 露光装置 | |
JP6656441B2 (ja) | 基板処理装置及び基板搬送方法並びに基板搬送プログラムを記憶したコンピュータ読み取り可能な記憶媒体 | |
JP3205980U (ja) | フォーク用位置決め治具および基板を支持するフォーク並びに複数のフォークを備えた基板を搬送する基板搬送装置 | |
US20230178392A1 (en) | Separating system and separating method | |
WO2021149330A1 (ja) | ウェハ搬送ユニット及びウェハ搬送方法 | |
WO2022202405A1 (ja) | 処理装置及び位置決め方法 | |
KR20240107909A (ko) | 기판 이송 시스템 및 기판 이송 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181105 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190201 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190731 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191010 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200204 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200304 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6671993 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |