KR20080048053A - 전자결합 모듈 부가 물품 - Google Patents
전자결합 모듈 부가 물품 Download PDFInfo
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- KR20080048053A KR20080048053A KR1020087007773A KR20087007773A KR20080048053A KR 20080048053 A KR20080048053 A KR 20080048053A KR 1020087007773 A KR1020087007773 A KR 1020087007773A KR 20087007773 A KR20087007773 A KR 20087007773A KR 20080048053 A KR20080048053 A KR 20080048053A
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- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
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- H01Q11/08—Helical antennas
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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Abstract
Description
Claims (21)
- 무선 IC칩과, 상기 무선 IC칩을 탑재하고, 소정의 공진 주파수를 가지는 공진회로를 포함하는 급전회로를 마련한 급전회로 기판으로 이루어지는 전자(電磁)결합 모듈이 물품에 장착되어 있고,상기 물품은 상기 전자결합 모듈의 상기 급전회로로부터 전자결합을 통하여 공급된 송신신호를 방사하는, 및/또는, 받은 수신신호를 전자결합을 통하여 상기 급전회로에 공급하는 방사판을 구비하고 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 물품 그 자체가 본래 가지고 있는 금속물인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 방사판용으로 물품에 부여된 금속 패턴인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 유전체인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 공진회로는 커패시터 소자 와 인덕터 소자로 구성된 집중 상수형 공진회로인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항에 있어서, 상기 집중 상수형 공진회로는 LC 직렬 공진회로 또는 LC 병렬 공진회로인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제6항에 있어서, 상기 집중 상수형 공진회로는 복수의 LC 직렬 공진회로 또는 복수의 LC 병렬 공진회로를 포함하여 구성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제7항 중 어느 한 항에 있어서, 상기 커패시터 소자는 상기 무선 IC칩의 후단이며, 상기 무선 IC칩과 상기 인덕터 소자 사이에 배치되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제8항 중 어느 한 항에 있어서, 상기 급전회로 기판은 복수의 유전체층 또는 자성체층을 적층하여 이루어지는 다층기판이며, 상기 커패시터 소자와 상기 인덕터 소자는 상기 다층기판의 표면 및/또는 내부에 형성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제8항 중 어느 한 항에 있어서, 상기 급전회로 기판은 유전체 또 는 자성체의 단층 기판이며, 상기 커패시터 소자 및/또는 인덕터 소자는 상기 단층 기판의 표면에 형성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 상기 급전회로 기판은 단단한(rigid) 수지제 또는 세라믹제의 기판인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제11항 중 어느 한 항에 있어서, 상기 방사판의 전기장은 상기 공진 주파수의 반파장의 정수(整數)배인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1기판측 전극 패턴에 의해 직접 전기적으로 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1 기판측 전극 패턴 사이의 용량결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제14항에 있어서, 상기 칩측 전극 패턴 및 상기 제1기판측 전극 패턴은 각각 서로 평행한 평면전극 패턴이며, 상기 무선 IC칩과 상기 급전회로 기판은 유전성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1기판측 전극 패턴 사이의 자기결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제16항에 있어서, 상기 칩측 전극 패턴 및 상기 제1기판측 전극 패턴은 각각 코일상 전극 패턴이며, 상기 무선 IC칩과 상기 급전회로 기판은 절연성 또는 자성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제17항 중 어느 한 항에 있어서, 상기 급전회로 기판에 제2기판측 전극 패턴이 마련되어져 있고, 상기 급전회로 기판과 상기 방사판은 상기 제2기판측 전극 패턴과 상기 방사판 사이의 용량결합에 의해 접속되어 있는 것을 특징으 로 하는 전자결합 모듈 부가 물품.
- 제18항에 있어서, 상기 제2기판측 전극 패턴은 상기 방사판에 대하여 평행하게 배치된 평면전극 패턴이며, 상기 급전회로 기판과 상기 방사판은 유전성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제17항 중 어느 한 항에 있어서, 상기 급전회로 기판에 제2기판측 전극 패턴이 마련되어져 있고, 상기 급전회로 기판과 상기 방사판은 상기 제2기판측 전극 패턴과 상기 방사판 사이의 자기결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제20항에 있어서, 상기 제2기판측 전극 패턴은 코일상 전극 패턴이며, 상기 급전회로 기판과 상기 방사판은 절연성 또는 자성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
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US7274297B2 (en) † | 2004-07-01 | 2007-09-25 | Intermec Ip Corp. | RFID tag and method of manufacture |
JP2006039902A (ja) * | 2004-07-27 | 2006-02-09 | Ntn Corp | Uhf帯無線icタグ |
JP4482403B2 (ja) * | 2004-08-30 | 2010-06-16 | 日本発條株式会社 | 非接触情報媒体 |
US20060044769A1 (en) † | 2004-09-01 | 2006-03-02 | Forster Ian J | RFID device with magnetic coupling |
US7158033B2 (en) * | 2004-09-01 | 2007-01-02 | Avery Dennison Corporation | RFID device with combined reactive coupler |
JP4125275B2 (ja) * | 2004-09-02 | 2008-07-30 | 日本電信電話株式会社 | 非接触ic媒体制御システム |
JP4600742B2 (ja) * | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | 印字ヘッド及びタグラベル作成装置 |
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2007
- 2007-03-06 JP JP2008513098A patent/JP4674638B2/ja active Active
- 2007-03-06 KR KR1020087007773A patent/KR100963057B1/ko active IP Right Grant
- 2007-03-06 EP EP18190763.5A patent/EP3428852A1/en not_active Withdrawn
- 2007-03-06 BR BRPI0702919-5A patent/BRPI0702919B1/pt active IP Right Grant
- 2007-03-06 EP EP14182409.4A patent/EP2830006A1/en not_active Withdrawn
- 2007-03-06 EP EP07737818.0A patent/EP2012258B2/en active Active
- 2007-03-06 WO PCT/JP2007/054243 patent/WO2007125683A1/ja active Application Filing
- 2007-03-06 RU RU2008112222/09A patent/RU2386169C2/ru active
- 2007-03-06 CN CN2007800010942A patent/CN101351817B/zh active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101425460B1 (ko) * | 2011-09-30 | 2014-08-01 | 브로드콤 코포레이션 | 무선으로 동작가능한 기능 블록들을 갖는 장치 |
Also Published As
Publication number | Publication date |
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EP2012258A1 (en) | 2009-01-07 |
KR100963057B1 (ko) | 2010-06-14 |
ATE526648T1 (de) | 2011-10-15 |
RU2386169C2 (ru) | 2010-04-10 |
BRPI0702919A2 (pt) | 2011-03-22 |
WO2007125683A1 (ja) | 2007-11-08 |
EP2410473A1 (en) | 2012-01-25 |
CN101351817A (zh) | 2009-01-21 |
CN101351817B (zh) | 2012-04-25 |
JP4674638B2 (ja) | 2011-04-20 |
JPWO2007125683A1 (ja) | 2009-09-10 |
EP2830006A1 (en) | 2015-01-28 |
EP2012258B2 (en) | 2014-10-22 |
BRPI0702919B1 (pt) | 2019-05-07 |
EP3428852A1 (en) | 2019-01-16 |
EP2012258B1 (en) | 2011-09-28 |
EP2410473B1 (en) | 2014-10-29 |
EP2012258A4 (en) | 2010-03-31 |
RU2008112222A (ru) | 2009-10-10 |
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