KR20050073528A - 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물 - Google Patents
폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물 Download PDFInfo
- Publication number
- KR20050073528A KR20050073528A KR1020040115011A KR20040115011A KR20050073528A KR 20050073528 A KR20050073528 A KR 20050073528A KR 1020040115011 A KR1020040115011 A KR 1020040115011A KR 20040115011 A KR20040115011 A KR 20040115011A KR 20050073528 A KR20050073528 A KR 20050073528A
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- adhesive composition
- polyurethane
- bis
- general formula
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
Claims (13)
- 일반식(I)로 표시되는 폴리우레탄이미드수지.[식(I)중, R1은 방향족고리 또는 지방족고리를 포함하는 2가의 유기기, R2는 분자량 100~10000의 2가의 유기기, R3은 4개 이상의 탄소를 포함하는 4가의 유기기, n 및 m은 1~100의 정수이다.]
- 제 1항에 있어서, 디이소시아네이트와 디올로부터 얻어진 폴리우레탄올리고머를 테트라카본산이무수물로 사슬연장한 블록공중합체인 것을 특징으로 하는 폴리우레탄이미드수지.
- 제 1항에 있어서, 일반식(I)중, R1의 10mol%~100mol%가 하기 일반식(II)로 표시되는 구조를 갖는 것을 특징으로 하는 폴리우레탄이미드수지.
- 제 1항에 있어서, 상기 일반식(I)중, R2의 10mol%~100mol%가 하기 일반식(III)으로 표시되는 반복단위로 이루어지는 평균분자량 100~10000의 2가의 유기기인 것을 특징으로 하는 폴리우레탄이미드수지.
- 제 1항에 있어서, 평균분자량이 5000~500000이고, 케톤계 용매에 가용인 것을 특징으로 하는 폴리우레탄이미드수지.
- 폴리우레탄이미드수지와 3차원 가교성 수지를 포함하는 것을 특징으로 하는 접착제 조성물.
- 제 1항에 기재된 폴리우레탄이미드수지를 포함하는 접착제 조성물.
- 제 7항에 있어서, 3차원 가교성 수지를 더 포함하는 것을 특징으로 하는 접착제 조성물.
- 제 6항 내지 제 8항 중 어느 한 항에 있어서, 상기 폴리우레탄이미드수지가, 폴리우레탄올리고머를 테트라카본산이무수물로 사슬연장한 블록공중합체인 것을 특징으로 하는 접착제 조성물.
- 제 6항 내지 제 8항 중 어느 한 항에 있어서, 상기 3차원 가교성 수지가 적어도 라디칼중합물질이고, 광조사 또는 가열에 의해 유리라디칼을 발생하는 경화제를 함유하고 있는 것을 특징으로 하는 접착제 조성물.
- 제 6항 내지 제 8항 중 어느 한 항에 있어서, 상기 3차원 가교성 수지가 적어도 에폭시수지이고, 잠재성 경화제를 함유하는 것을 특징으로 하는 접착제 조성물.
- 제 6항 내지 제 11항 중 어느 한 항에 있어서, 도전입자를 더 포함하는 것을 특징으로 하는 접착제 조성물.
- 제 6항 내지 제 12항 중 어느 한 항에 기재된 접착제 조성물을 회로접속용 부재에 사용하는 회로접속용 접착제 조성물.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002923 | 2004-01-08 | ||
JPJP-P-2004-00002923 | 2004-01-08 | ||
JPJP-P-2004-00002922 | 2004-01-08 | ||
JP2004002922 | 2004-01-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070065001A Division KR100860892B1 (ko) | 2004-01-08 | 2007-06-29 | 접착제 조성물, 및 회로접속용 접착제 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050073528A true KR20050073528A (ko) | 2005-07-14 |
KR100792056B1 KR100792056B1 (ko) | 2008-01-04 |
Family
ID=34889283
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040115011A KR100792056B1 (ko) | 2004-01-08 | 2004-12-29 | 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물 |
KR1020070065001A KR100860892B1 (ko) | 2004-01-08 | 2007-06-29 | 접착제 조성물, 및 회로접속용 접착제 조성물 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070065001A KR100860892B1 (ko) | 2004-01-08 | 2007-06-29 | 접착제 조성물, 및 회로접속용 접착제 조성물 |
Country Status (3)
Country | Link |
---|---|
KR (2) | KR100792056B1 (ko) |
CN (2) | CN1637034B (ko) |
TW (2) | TW200526710A (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8212370B2 (en) | 2006-10-04 | 2012-07-03 | Hitachi Chemical Company, Ltd. | Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste |
US8293847B2 (en) | 2006-08-04 | 2012-10-23 | Hitachi Chemical Co., Ltd. | Film-like adhesive, adhesive sheet, and semiconductor device using same |
KR20160064032A (ko) * | 2013-09-27 | 2016-06-07 | 데쿠세리아루즈 가부시키가이샤 | 언더필재 및 이것을 사용한 반도체 장치의 제조 방법 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100243303A1 (en) * | 2006-08-22 | 2010-09-30 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
CN101657482B (zh) * | 2007-04-19 | 2014-04-16 | Kaneka株式会社 | 新型聚酰亚胺前体组合物及其利用 |
CN101121101B (zh) * | 2007-07-06 | 2010-06-02 | 清华大学 | 聚氨酯酰亚胺渗透汽化芳烃/烷烃分离膜的制备方法 |
US9781836B2 (en) | 2009-10-07 | 2017-10-03 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board |
TWI510521B (zh) * | 2013-01-21 | 2015-12-01 | Daxin Materials Corp | 聚亞醯胺結構以及聚亞醯胺樹脂組成物 |
CN104031241A (zh) * | 2013-03-09 | 2014-09-10 | 东莞市长安东阳光铝业研发有限公司 | 一种有机硅改性聚氨酯-酰亚胺材料的制备方法及其应用 |
JP6578100B2 (ja) * | 2014-12-25 | 2019-09-18 | 日東シンコー株式会社 | 絶縁紙 |
CN105097068B (zh) * | 2015-06-25 | 2017-03-08 | 英利能源(中国)有限公司 | 导电胶、太阳能电池串及其制备方法 |
CN112789317B (zh) * | 2018-10-02 | 2023-03-10 | 纳美仕有限公司 | 树脂组合物、带有基材的膜、金属/树脂层压体及半导体装置 |
CN110041212B (zh) * | 2019-05-21 | 2020-10-02 | 吉林大学 | 一种含氟多胺单体及其制备方法、一种聚酰亚胺及其制备方法和一种聚酰亚胺膜 |
CN110373026B (zh) * | 2019-09-02 | 2021-06-29 | 无锡创彩光学材料有限公司 | 聚酰亚胺树脂组合物及其制备方法和薄膜 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929358A (en) * | 1989-08-09 | 1990-05-29 | Exxon Research And Engineering Company | Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics |
US5098982A (en) * | 1989-10-10 | 1992-03-24 | The B. F. Goodrich Company | Radiation curable thermoplastic polyurethanes |
JPH0523558A (ja) * | 1989-12-19 | 1993-02-02 | Exxon Res & Eng Co | 支持薄層膜の製造 |
US4962271A (en) * | 1989-12-19 | 1990-10-09 | Exxon Research And Engineering Company | Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction |
US5254659A (en) * | 1990-03-27 | 1993-10-19 | Hitachi, Ltd. | Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires |
KR970006896B1 (ko) * | 1993-11-10 | 1997-04-30 | 생산기술연구원 | 내열성 폴리(우레탄-이미드)수지 및 그 제조방법 |
SG76530A1 (en) * | 1997-03-03 | 2000-11-21 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
GB9814835D0 (en) * | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
US6403753B1 (en) * | 2000-01-18 | 2002-06-11 | Sandia Corporation | Method of making thermally removable polyurethanes |
KR100545255B1 (ko) * | 2003-04-29 | 2006-01-24 | (주)애드뷰 | 전도성 고분자를 포함하는 액정 배향제 조성물, 이를이용한 액정 배향막, 그 제조방법 및 상기 액정 배향막을포함하는 액정 소자 |
JP2006241174A (ja) * | 2005-02-07 | 2006-09-14 | Hitachi Chem Co Ltd | ダイボンディング用フィルム状接着剤及びこれを用いた接着シート、並びに半導体装置。 |
-
2004
- 2004-12-29 KR KR1020040115011A patent/KR100792056B1/ko active IP Right Grant
- 2004-12-31 TW TW093141783A patent/TW200526710A/zh not_active IP Right Cessation
- 2004-12-31 TW TW097124567A patent/TW200848483A/zh unknown
-
2005
- 2005-01-06 CN CN2005100001931A patent/CN1637034B/zh not_active Expired - Fee Related
- 2005-01-06 CN CN2009100016085A patent/CN101445714B/zh not_active Expired - Fee Related
-
2007
- 2007-06-29 KR KR1020070065001A patent/KR100860892B1/ko not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8293847B2 (en) | 2006-08-04 | 2012-10-23 | Hitachi Chemical Co., Ltd. | Film-like adhesive, adhesive sheet, and semiconductor device using same |
US8212370B2 (en) | 2006-10-04 | 2012-07-03 | Hitachi Chemical Company, Ltd. | Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste |
KR20160064032A (ko) * | 2013-09-27 | 2016-06-07 | 데쿠세리아루즈 가부시키가이샤 | 언더필재 및 이것을 사용한 반도체 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW200526710A (en) | 2005-08-16 |
KR100860892B1 (ko) | 2008-09-29 |
CN1637034A (zh) | 2005-07-13 |
KR100792056B1 (ko) | 2008-01-04 |
CN101445714A (zh) | 2009-06-03 |
TW200848483A (en) | 2008-12-16 |
CN1637034B (zh) | 2010-04-28 |
CN101445714B (zh) | 2013-03-20 |
TWI314567B (ko) | 2009-09-11 |
KR20070077201A (ko) | 2007-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100860892B1 (ko) | 접착제 조성물, 및 회로접속용 접착제 조성물 | |
KR101100524B1 (ko) | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법 | |
EP1229095B1 (en) | Adhesive agent, method for connecting wiring terminals and wiring structure | |
JP4862921B2 (ja) | 回路接続材料、回路接続構造体及びその製造方法 | |
KR100559154B1 (ko) | 배선접속재료 및 그것을 사용한 배선판과 배선접속용필름상 접착제 | |
KR101205170B1 (ko) | 회로 접속 재료 및 회로 부재의 접속 구조 | |
KR101100507B1 (ko) | 필름상 회로 접속 재료 및 회로 부재의 접속 구조 | |
KR20100009539A (ko) | 회로 접속 재료 및 회로 단자의 접속 구조 | |
JP4604682B2 (ja) | ポリウレタンイミド樹脂及びこれを用いた接着剤組成物 | |
JP4617848B2 (ja) | 接着剤組成物及び回路接続用接着剤組成物 | |
JP4743204B2 (ja) | 変性ポリウレタン樹脂及びこれを用いた接着剤組成物、並びに回路部材の接続方法及び回路部材の接続構造 | |
JP5067101B2 (ja) | 接着剤組成物 | |
JP2008255312A (ja) | 接着剤組成物 | |
JP2008045099A (ja) | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料 | |
JP2010004067A (ja) | 回路接続材料 | |
KR20080103462A (ko) | 접착제 조성물 | |
JP2009182365A (ja) | 回路板の製造方法及び回路接続材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121221 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20131220 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20141219 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20151218 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20161216 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20181220 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20191220 Year of fee payment: 13 |