JP5067101B2 - 接着剤組成物 - Google Patents
接着剤組成物 Download PDFInfo
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- JP5067101B2 JP5067101B2 JP2007259101A JP2007259101A JP5067101B2 JP 5067101 B2 JP5067101 B2 JP 5067101B2 JP 2007259101 A JP2007259101 A JP 2007259101A JP 2007259101 A JP2007259101 A JP 2007259101A JP 5067101 B2 JP5067101 B2 JP 5067101B2
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- 125000005442 diisocyanate group Chemical group 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
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- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- SEZLVNATVKZSQO-UHFFFAOYSA-N 3-methyl-1-[3-(3-methyl-2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1=CC=CC(N2C(C(C)=CC2=O)=O)=C1 SEZLVNATVKZSQO-UHFFFAOYSA-N 0.000 description 1
- SMKMSUCZZOQDGA-UHFFFAOYSA-N 3-methyl-1-[4-(3-methyl-2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1=CC=C(N2C(C(C)=CC2=O)=O)C=C1 SMKMSUCZZOQDGA-UHFFFAOYSA-N 0.000 description 1
- ZYFIFFPWXKYFRR-UHFFFAOYSA-N 3-methyl-1-[4-[4-[1-[4-[4-(3-methyl-2,5-dioxopyrrol-1-yl)phenoxy]phenyl]decyl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C(C)=CC2=O)=O)C=CC=1C(CCCCCCCCC)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=C(C)C1=O ZYFIFFPWXKYFRR-UHFFFAOYSA-N 0.000 description 1
- UMIADIZYYGHJBZ-UHFFFAOYSA-N 3-methyl-1-[4-[4-[2-[4-[4-(3-methyl-2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C(C=C1)=CC=C1OC1=CC=C(C(C)(C)C=2C=CC(OC=3C=CC(=CC=3)N3C(C(C)=CC3=O)=O)=CC=2)C=C1 UMIADIZYYGHJBZ-UHFFFAOYSA-N 0.000 description 1
- ZLPORNPZJNRGCO-UHFFFAOYSA-N 3-methylpyrrole-2,5-dione Chemical compound CC1=CC(=O)NC1=O ZLPORNPZJNRGCO-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- NFWPZNNZUCPLAX-UHFFFAOYSA-N 4-methoxy-3-methylaniline Chemical compound COC1=CC=C(N)C=C1C NFWPZNNZUCPLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- XWUNIDGEMNBBAQ-UHFFFAOYSA-N Bisphenol A ethoxylate diacrylate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCCOC(=O)C=C)C=C1 XWUNIDGEMNBBAQ-UHFFFAOYSA-N 0.000 description 1
- FVSKBQVTQRMJAJ-UHFFFAOYSA-N C(C)(C)(C)C=C[Si](C=C)(C=C)OO[Si](C=C)(C=C)C=CC(C)(C)C Chemical compound C(C)(C)(C)C=C[Si](C=C)(C=C)OO[Si](C=C)(C=C)C=CC(C)(C)C FVSKBQVTQRMJAJ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- UNKQAWPNGDCPTE-UHFFFAOYSA-N [2,5-dimethyl-5-(3-methylbenzoyl)peroxyhexan-2-yl] 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C=2C=C(C)C=CC=2)=C1 UNKQAWPNGDCPTE-UHFFFAOYSA-N 0.000 description 1
- XBCFXELSWDAYIW-UHFFFAOYSA-N [4-[2-[4-(prop-2-enoyloxymethoxy)phenyl]propan-2-yl]phenoxy]methyl prop-2-enoate Chemical compound C=1C=C(OCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCOC(=O)C=C)C=C1 XBCFXELSWDAYIW-UHFFFAOYSA-N 0.000 description 1
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- JAHGTMJOPOCQIY-UHFFFAOYSA-N benzyl benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOCC1=CC=CC=C1 JAHGTMJOPOCQIY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- UPDZRIPMRHNKPZ-UHFFFAOYSA-N carboxyoxy 4,4-dimethoxybutyl carbonate Chemical compound COC(OC)CCCOC(=O)OOC(O)=O UPDZRIPMRHNKPZ-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- LRIKRVKBBZQMPA-UHFFFAOYSA-N ethenylperoxysilane Chemical compound [SiH3]OOC=C LRIKRVKBBZQMPA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- XNTUJOTWIMFEQS-UHFFFAOYSA-N octadecanoyl octadecaneperoxoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCCCCCCCC XNTUJOTWIMFEQS-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000004979 silylperoxides Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- XTXFUQOLBKQKJU-UHFFFAOYSA-N tert-butylperoxy(trimethyl)silane Chemical compound CC(C)(C)OO[Si](C)(C)C XTXFUQOLBKQKJU-UHFFFAOYSA-N 0.000 description 1
- 229940113165 trimethylolpropane Drugs 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
[式(I)中、Xはジイソシアネート残基を示し、Yはジオール残基を示し、nは1〜100の整数を示す。ただし、Yで示されるジオール残基のうち10〜90mol%は下記一般式(II)で表される構造を有する残基であり、かつYで表されるジオール残基のうち10〜90mol%は重量平均分子量500以上のジオールの残基である。]
等が挙げられ、これらは1種を単独で又は2種以上を混合して用いることができる。
[式中、R1及びR2は、それぞれ独立に水素原子又はメチル基を示し、mは1〜10の整数を示す。]
等の(メタ)アクリレート変性エポキシ化合物が挙げられる。これらの(メタ)アクリレート変性エポキシ化合物は、例えば2官能性エポキシ化合物と(メタ)アクリル酸とを反応させることにより得られるものであり、例示したものの他にも種々の2官能性エポキシ化合物から得られる(メタ)アクリレート変性エポキシ化合物を用いることができる。これらは1種を単独で又は2種以上を混合して用いることができる。
−(CH2−CH2−CH2−CH2−O)−、
−(CH2−CH(CH3)−O)−、
−(CH2−CH2−O)−、
−(CH2−CH2−CH2−CH2−O)−、
−(CH2−CH(CH3)−O)a−(CH2−CH2−O)b− (a/b=9/1〜1/9mol%)、
−[CO−(CH2)4−CO−O−(CH2)2−O]−、
−[CO−(CH2)4−CO−O−(CH2)2−O−(CH2)2−O]−、
−[CO−(CH2)4−CO−O−CH2−CH(CH3)−O]−、
−[CO−(CH2)4−CO−O−(CH2)4−O]−、
−[CO−(CH2)4−CO−O−(CH2)6−O]−、
−[CO−(CH2)4−CO−O−CH2−C(CH3)2−CH2−O]−、
−[CO−(CH2)8−CO−O−(CH2)6−O]−、
−[CO−(CH2)5−O]−、
−[CO−O−(CH2)6−O]−、
−R3−(Si(CH3)2−O)−R3− (R3は炭素数1〜10の有機基)
等の繰り返し単位を有する重量平均分子量500以上のジオールが挙げられる。これらのジオールは1種を単独で、又は2種以上を混合して用いることができる。また、このようなジオールの重量平均分子量は500〜5,000であることが好ましく、1,000〜2,000であることがより好ましい。
下記化学式(a)で表されるエチレングリコールジグリシジルエーテルのメタクリル酸付加物(共栄社化学株式会社製、商品名エポキシエステル40EM)(0.5mol)、重量平均分子量2000のポリ(テトラメチレングリコール)(0.5mol)、4,4’−ジイソシアネートジフェニルメタン(0.425mol)、2,4’−ジイソシアネートジフェニルメタン(0.425mol)、ジラウリル酸ジブチルすず(0.5mmol)をメチルエチルケトン(MEK)中、60℃で3時間反応させ、ウレタン樹脂(PUA−1)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算でMw(重量平均分子量)=65,000、Mn(数平均分子量)=35,000であった。
エチレングリコールジグリシジルエーテルのメタクリル酸付加物の代わりに、下記化学式(b)で表されるビスフェノールAジグリシジエーテルのメタクリル酸付加物(共栄社化学株式会社製、商品名エポキシエステル3000M)(0.5mol)を用いた他はPUA−1の合成と同様にして、ウレタン樹脂(PUA−2)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算で、Mw=60,000、Mn=34,000であった。
重量平均分子量2000のポリテトラメチレングリコール(0.5mol)の代わりに、重量平均分子量2000のポリヘキサメチレンカーボネートジオール(0.5mol)を用いた他はPUA−1の合成と同様にして、ウレタン樹脂(PUA−3)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算で、Mw=64,000、Mn=33,000であった。
エチレングリコールジグリシジルエーテルのメタクリル酸付加物の物質量を0.7molに、重量平均分子量2000のポリ(テトラメチレングリコール)の物質量を0.3molに変更した他は、ウレタン樹脂(PUA−1)の合成と同様にして、ウレタン樹脂(PUA−3)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算でMw=52,000、Mn=24,000であった。
4,4’−ジイソシアネートジフェニルメタン(0.5mol)、2,4’−ジイソシアネートジフェニルメタン(0.5mol)、重量平均分子量2000のポリ(テトラメチレングリコール)(0.9mol)、2−ヒドロキシエチルメタクリレート(0.5mol)、ジラウリル酸ジブチルすず(0.5mmol)をメチルエチルケトン(MEK)中、60℃で3時間反応させ、両末端にアクリレートが付加した比較用ウレタン樹脂(PUA−5)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算でMw=50,000、Mn=20,000であった。
4,4’−ジイソシアネートジフェニルメタン(0.5mol)、2,4’−ジイソシアネートジフェニルメタン(0.5mol)、重量平均分子量2000のポリ(テトラメチレングリコール)(0.7mol)、2−ヒドロキシエチルメタクリレート(0.8mol)、ジラウリル酸ジブチルすず(0.5mmol)をメチルエチルケトン(MEK)中、60℃で3時間反応させ、両末端にアクリレートが付加した比較用ウレタン樹脂(PUA−6)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算でMw=9,000、Mn=5,000であった。
エチレングリコールジグリシジルエーテルのメタクリル酸付加物の物質量を1.0molとし、且つ重量平均分子量2000のポリ(テトラメチレングリコール)を用いなかったこと以外は、ウレタン樹脂(PUA−1)の合成と同様にして、ウレタン樹脂(PUA−7)のMEK溶液を得た。得られた樹脂のGPCを測定したところ、ポリスチレン換算でMw=50,000、Mn=22,000であった。
熱可塑性樹脂として、フェノキシ樹脂(PKHC、ユニオンカーバイド社製商品名、重量平均分子量45,000)を、ラジカル重合性物質として、イソシアヌル酸EO変性ジアクリレート(M215、東亜合成株式会社製商品名)、及び2−(メタ)アクリロキシエチルホスフェート(ライトエステルP−2M、共栄社化学株式会社製商品名)を、ウレタン樹脂として上述のPUA−1、PUA−2、PUA−3及びPUA−4を、硬化剤として、t−ヘキシルパーオキシ−2−エチルヘキサノネートの50質量%DOP(ジオクチルフタレート)溶液(日本油脂株式開会社製、商品名パーキュアHO)を、導電粒子として、ポリスチレンを核とする粒子の表面に、厚み0.20μmの金層を設けた平均粒子径4μm、比重2.5の導電粒子をそれぞれ準備した。
ウレタン樹脂としてPUA−5、PUA−6、PUA−7を用いたこと以外は実施例1〜3と同様にして、フィルム状接着剤を作製した。
上記で得られたフィルム状接着剤を、ライン幅25μm、ピッチ50μm、厚み18μmの銅回路を500本有するフレキシブル回路板(FPC)と、厚み0.20μmの酸化インジウムスズ(ITO)の薄層を形成したガラス(厚み1.1mm、表面抵抗20Ω/cm)との間に配置し、175℃、3MPaで15秒間の加熱加圧を行って幅2mmにわたり接続を行い、回路接続構造体を作製した。
上記で得られた回路接続構造体の隣接回路間の抵抗値を、接着直後、及び、85℃、85%RHの高温高湿槽中に120時間保持した後に、マルチメーターで測定した。抵抗値は隣接回路間の抵抗150点の平均値として示した。得られた結果を表2に示す。
上記で得られた回路接続構造体における回路部材間の接着強度を、JIS−Z0237に準じて90度はく離法で測定した。ここで、接着強度の測定装置としては東洋ボールドウィン株式会社製テンシロンUTM−4を用い、はく離速度50mm/min、25℃で測定した。なお、接着強度は、接着直後、及び、85℃、85%RHの高温高湿槽中に120時間保持した後に測定した。得られた結果を表2に示す。
Claims (5)
- (A)側鎖に(メタ)アクリレート基を有し、重量平均分子量が10,000〜500,000であるウレタン樹脂と、
(B)光照射又は加熱により遊離ラジカルを発生する硬化剤と、
を含有し、
前記(A)ウレタン樹脂が下記一般式(I)で表される共重合体を含む接着剤組成物。
−(CH 2 −CH 2 −CH 2 −CH 2 −O)−、
−(CH 2 −CH(CH 3 )−O)−、
−(CH 2 −CH 2 −O)−、
−(CH 2 −CH(CH 3 )−O) a −(CH 2 −CH 2 −O) b − (a/b=9/1〜1/9mol%)、
−[CO−(CH 2 ) 4 −CO−O−(CH 2 ) 2 −O]−、
−[CO−(CH 2 ) 4 −CO−O−(CH 2 ) 2 −O−(CH 2 ) 2 −O]−、
−[CO−(CH 2 ) 4 −CO−O−CH 2 −CH(CH 3 )−O]−、
−[CO−(CH 2 ) 4 −CO−O−(CH 2 ) 4 −O]−、
−[CO−(CH 2 ) 4 −CO−O−(CH 2 ) 6 −O]−、
−[CO−(CH 2 ) 4 −CO−O−CH 2 −C(CH 3 ) 2 −CH 2 −O]−、
−[CO−(CH 2 ) 8 −CO−O−(CH 2 ) 6 −O]−、
−[CO−(CH 2 ) 5 −O]−、
−[CO−O−(CH 2 ) 6 −O]−、又は、
−R 3 −(Si(CH 3 ) 2 −O)−R 3 − (R 3 は炭素数1〜10の有機基)、
の繰り返し単位を有する重量平均分子量500以上のジオールの残基である。]
- (C)熱可塑性樹脂及び/又は熱可塑性エラストマーをさらに含有する、請求項1記載の接着剤組成物。
- (D)ラジカル重合性物質をさらに含有する、請求項1又は2記載の接着剤組成物。
- (E)導電粒子をさらに含有する、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 前記Yで表されるジオール残基のうち残余の90〜10mol%が、
−(CH 2 −CH 2 −CH 2 −CH 2 −O)−、
−(CH 2 −CH(CH 3 )−O)−、又は、
−(CH 2 −CH 2 −O)−、
の繰り返し単位を有する重量平均分子量500以上のジオールの残基である、請求項1〜4のいずれか一項に記載の接着剤組成物。
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