KR102639455B1 - 경화성 조성물 및 전자 부품의 제조 방법 - Google Patents

경화성 조성물 및 전자 부품의 제조 방법 Download PDF

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Publication number
KR102639455B1
KR102639455B1 KR1020177028748A KR20177028748A KR102639455B1 KR 102639455 B1 KR102639455 B1 KR 102639455B1 KR 1020177028748 A KR1020177028748 A KR 1020177028748A KR 20177028748 A KR20177028748 A KR 20177028748A KR 102639455 B1 KR102639455 B1 KR 102639455B1
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KR
South Korea
Prior art keywords
curable composition
weight
acrylic monomer
resist
titanium oxide
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KR1020177028748A
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English (en)
Korean (ko)
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KR20180087137A (ko
Inventor
도시오 다까하시
시게루 나까무라
다까시 니시무라
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다이요 홀딩스 가부시키가이샤
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Publication of KR20180087137A publication Critical patent/KR20180087137A/ko
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Publication of KR102639455B1 publication Critical patent/KR102639455B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020177028748A 2015-11-24 2016-11-24 경화성 조성물 및 전자 부품의 제조 방법 KR102639455B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015228779 2015-11-24
JPJP-P-2015-228779 2015-11-24
PCT/JP2016/084798 WO2017090680A1 (ja) 2015-11-24 2016-11-24 硬化性組成物及び電子部品の製造方法

Publications (2)

Publication Number Publication Date
KR20180087137A KR20180087137A (ko) 2018-08-01
KR102639455B1 true KR102639455B1 (ko) 2024-02-23

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KR1020177028748A KR102639455B1 (ko) 2015-11-24 2016-11-24 경화성 조성물 및 전자 부품의 제조 방법

Country Status (5)

Country Link
JP (2) JP6145232B1 (ja)
KR (1) KR102639455B1 (ja)
CN (1) CN107531815B (ja)
TW (1) TWI724068B (ja)
WO (1) WO2017090680A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019017047A1 (ja) * 2017-07-21 2019-01-24 積水化学工業株式会社 硬化性組成物、電子部品及び電子部品の製造方法
JP6646641B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト硬化性組成物、プリント配線板及び電子部品の製造方法
JP6646640B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト光硬化性組成物及び電子部品の製造方法
JP7362991B2 (ja) * 2018-03-30 2023-10-18 太陽ホールディングス株式会社 インクジェット印刷用硬化性組成物、その硬化物、及びその硬化物を有する電子部品
JP7362992B2 (ja) * 2018-03-30 2023-10-18 太陽ホールディングス株式会社 硬化性組成物、その硬化物およびこれを有する電子部品
TW201942144A (zh) * 2018-03-30 2019-11-01 日商太陽油墨製造股份有限公司 噴墨印刷用硬化性組成物、其之硬化物、及具有該硬化物之電子零件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012053254A (ja) * 2010-09-01 2012-03-15 Sekisui Chem Co Ltd 光及び熱硬化性組成物、ソルダーレジスト組成物及びプリント配線板
WO2015012228A1 (ja) 2013-07-25 2015-01-29 東レ株式会社 タッチパネル用ネガ型感光性白色組成物、タッチパネル及びタッチパネルの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650460B2 (ja) * 2010-08-18 2015-01-07 株式会社タムラ製作所 白色硬化性樹脂組成物
JP2014114402A (ja) 2012-12-11 2014-06-26 Taiyo Ink Mfg Ltd 光硬化性組成物および成型品
JP6359814B2 (ja) 2013-09-17 2018-07-18 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
US11220604B2 (en) * 2013-11-06 2022-01-11 Sekisui Chemical Co., Ltd. Method for manufacturing cured film, method for manufacturing electronic component, and electronic component
JP2015106160A (ja) 2015-01-19 2015-06-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012053254A (ja) * 2010-09-01 2012-03-15 Sekisui Chem Co Ltd 光及び熱硬化性組成物、ソルダーレジスト組成物及びプリント配線板
WO2015012228A1 (ja) 2013-07-25 2015-01-29 東レ株式会社 タッチパネル用ネガ型感光性白色組成物、タッチパネル及びタッチパネルの製造方法

Also Published As

Publication number Publication date
TWI724068B (zh) 2021-04-11
JPWO2017090680A1 (ja) 2017-11-24
JP2017141472A (ja) 2017-08-17
KR20180087137A (ko) 2018-08-01
CN107531815B (zh) 2021-05-11
JP6145232B1 (ja) 2017-06-07
TW201734059A (zh) 2017-10-01
WO2017090680A1 (ja) 2017-06-01
CN107531815A (zh) 2018-01-02

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