KR102605917B1 - 스크라이빙 장치 - Google Patents

스크라이빙 장치 Download PDF

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Publication number
KR102605917B1
KR102605917B1 KR1020160042749A KR20160042749A KR102605917B1 KR 102605917 B1 KR102605917 B1 KR 102605917B1 KR 1020160042749 A KR1020160042749 A KR 1020160042749A KR 20160042749 A KR20160042749 A KR 20160042749A KR 102605917 B1 KR102605917 B1 KR 102605917B1
Authority
KR
South Korea
Prior art keywords
substrate
unit
scribing
loading stage
holding member
Prior art date
Application number
KR1020160042749A
Other languages
English (en)
Korean (ko)
Other versions
KR20170115635A (ko
Inventor
김흔
마석현
김효진
김학성
하완용
최한현
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020160042749A priority Critical patent/KR102605917B1/ko
Priority to CN201610887336.3A priority patent/CN107265839B/zh
Publication of KR20170115635A publication Critical patent/KR20170115635A/ko
Application granted granted Critical
Publication of KR102605917B1 publication Critical patent/KR102605917B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Liquid Crystal (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160042749A 2016-04-07 2016-04-07 스크라이빙 장치 KR102605917B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020160042749A KR102605917B1 (ko) 2016-04-07 2016-04-07 스크라이빙 장치
CN201610887336.3A CN107265839B (zh) 2016-04-07 2016-10-11 划片设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160042749A KR102605917B1 (ko) 2016-04-07 2016-04-07 스크라이빙 장치

Publications (2)

Publication Number Publication Date
KR20170115635A KR20170115635A (ko) 2017-10-18
KR102605917B1 true KR102605917B1 (ko) 2023-11-27

Family

ID=60052993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160042749A KR102605917B1 (ko) 2016-04-07 2016-04-07 스크라이빙 장치

Country Status (2)

Country Link
KR (1) KR102605917B1 (zh)
CN (1) CN107265839B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102067987B1 (ko) * 2017-11-23 2020-01-20 주식회사 탑 엔지니어링 기판 절단 장치
KR102114025B1 (ko) * 2018-01-30 2020-05-25 주식회사 탑 엔지니어링 기판 절단 장치
KR102158035B1 (ko) * 2018-05-24 2020-09-22 주식회사 탑 엔지니어링 기판 절단 장치
KR20200092022A (ko) 2019-01-24 2020-08-03 (주)두영티앤에스 짐벌부와 조명부에 방열판이 구비된 드론 장착형 조명장치
KR20200098067A (ko) 2019-02-11 2020-08-20 조정기 짐벌부와 조명부에 구비된 방열판을 고정하는 고정연장대가 설치되는 드론 장착형 조명장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005231915A (ja) 2004-02-17 2005-09-02 Kawasaki Heavy Ind Ltd 板ガラスの割断システム
KR101331067B1 (ko) * 2012-06-01 2013-11-19 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 수직 공급 로더 컨베이어 장치
KR101346379B1 (ko) 2012-12-28 2014-01-03 주식회사 영산테크노 코팅장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100582848B1 (ko) * 2004-04-14 2006-05-23 주식회사 탑 엔지니어링 비금속재 절단장치
JP4503384B2 (ja) * 2004-07-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
KR100628276B1 (ko) * 2004-11-05 2006-09-27 엘지.필립스 엘시디 주식회사 스크라이브 장비 및 이를 구비한 기판의 절단장치 및이것을 이용한 기판의 절단방법
JP4301213B2 (ja) * 2005-06-22 2009-07-22 株式会社ダイフク 搬送用走行体の配送設備
KR100753162B1 (ko) 2005-12-29 2007-08-30 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버
KR100762738B1 (ko) * 2005-12-29 2007-10-04 주식회사 탑 엔지니어링 수막현상을 이용한 기판 이송장치
JP2009105081A (ja) * 2007-10-19 2009-05-14 Ebatekku:Kk 基板処理装置
KR20110042733A (ko) * 2009-10-20 2011-04-27 주식회사 탑 엔지니어링 기판위치결정장치 및 방법
JP2014091652A (ja) * 2012-11-05 2014-05-19 Mitsuboshi Diamond Industrial Co Ltd 基板分断装置
KR101543875B1 (ko) * 2013-12-02 2015-08-11 세메스 주식회사 기판 이송 장치 및 이를 포함하는 기판 검사 장치
KR101668778B1 (ko) * 2014-05-29 2016-10-31 주식회사 탑 엔지니어링 스크라이브 장치
JP6357914B2 (ja) * 2014-06-26 2018-07-18 三星ダイヤモンド工業株式会社 スクライブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005231915A (ja) 2004-02-17 2005-09-02 Kawasaki Heavy Ind Ltd 板ガラスの割断システム
KR101331067B1 (ko) * 2012-06-01 2013-11-19 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 수직 공급 로더 컨베이어 장치
KR101346379B1 (ko) 2012-12-28 2014-01-03 주식회사 영산테크노 코팅장치

Also Published As

Publication number Publication date
CN107265839A (zh) 2017-10-20
KR20170115635A (ko) 2017-10-18
CN107265839B (zh) 2021-07-06

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