KR102449368B1 - 다층 인쇄회로기판 - Google Patents

다층 인쇄회로기판 Download PDF

Info

Publication number
KR102449368B1
KR102449368B1 KR1020170136836A KR20170136836A KR102449368B1 KR 102449368 B1 KR102449368 B1 KR 102449368B1 KR 1020170136836 A KR1020170136836 A KR 1020170136836A KR 20170136836 A KR20170136836 A KR 20170136836A KR 102449368 B1 KR102449368 B1 KR 102449368B1
Authority
KR
South Korea
Prior art keywords
layer
conductor pattern
metal
laminate
pattern layer
Prior art date
Application number
KR1020170136836A
Other languages
English (en)
Korean (ko)
Other versions
KR20190044418A (ko
Inventor
박용진
강명삼
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020170136836A priority Critical patent/KR102449368B1/ko
Priority to JP2018081675A priority patent/JP7472412B2/ja
Priority to TW107114061A priority patent/TWI788346B/zh
Publication of KR20190044418A publication Critical patent/KR20190044418A/ko
Application granted granted Critical
Publication of KR102449368B1 publication Critical patent/KR102449368B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020170136836A 2017-10-20 2017-10-20 다층 인쇄회로기판 KR102449368B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170136836A KR102449368B1 (ko) 2017-10-20 2017-10-20 다층 인쇄회로기판
JP2018081675A JP7472412B2 (ja) 2017-10-20 2018-04-20 多層プリント回路基板
TW107114061A TWI788346B (zh) 2017-10-20 2018-04-25 多層印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170136836A KR102449368B1 (ko) 2017-10-20 2017-10-20 다층 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20190044418A KR20190044418A (ko) 2019-04-30
KR102449368B1 true KR102449368B1 (ko) 2022-09-30

Family

ID=66285797

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170136836A KR102449368B1 (ko) 2017-10-20 2017-10-20 다층 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP7472412B2 (ja)
KR (1) KR102449368B1 (ja)
TW (1) TWI788346B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10999939B2 (en) 2018-06-08 2021-05-04 Unimicron Technology Corp. Circuit carrier board and manufacturing method thereof
TWI708541B (zh) * 2019-06-06 2020-10-21 欣興電子股份有限公司 線路載板及其製作方法
US11296062B2 (en) * 2019-06-25 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Three-dimension large system integration

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277393A (ja) * 2007-04-26 2008-11-13 Kyocera Corp 実装構造体及びその製造方法
JP2012079767A (ja) * 2010-09-30 2012-04-19 Fujikura Ltd プリント配線板、その製造方法、多層プリント配線板、及びその製造方法
JP2017174997A (ja) * 2016-03-24 2017-09-28 株式会社村田製作所 多層基板、および、多層基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3299679B2 (ja) * 1996-12-27 2002-07-08 新光電気工業株式会社 多層配線基板及びその製造方法
JP2002190549A (ja) * 2000-10-03 2002-07-05 Sumitomo Bakelite Co Ltd 多層配線板および多層配線板の製造方法
JP4324573B2 (ja) * 2005-03-03 2009-09-02 カシオマイクロニクス株式会社 半導体装置及び実装構造体
KR101103301B1 (ko) 2009-12-10 2012-01-11 엘지이노텍 주식회사 다층인쇄회로기판 및 그 제조방법
JP2015162660A (ja) * 2014-02-28 2015-09-07 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
JP6358431B2 (ja) * 2014-08-25 2018-07-18 新光電気工業株式会社 電子部品装置及びその製造方法
KR101947052B1 (ko) * 2015-06-29 2019-02-12 삼성전기주식회사 다층기판 및 다층기판 제조방법
WO2017051809A1 (ja) * 2015-09-25 2017-03-30 大日本印刷株式会社 実装部品、配線基板、電子装置、およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277393A (ja) * 2007-04-26 2008-11-13 Kyocera Corp 実装構造体及びその製造方法
JP2012079767A (ja) * 2010-09-30 2012-04-19 Fujikura Ltd プリント配線板、その製造方法、多層プリント配線板、及びその製造方法
JP2017174997A (ja) * 2016-03-24 2017-09-28 株式会社村田製作所 多層基板、および、多層基板の製造方法

Also Published As

Publication number Publication date
JP2019080031A (ja) 2019-05-23
TWI788346B (zh) 2023-01-01
KR20190044418A (ko) 2019-04-30
JP7472412B2 (ja) 2024-04-23
TW201918140A (zh) 2019-05-01

Similar Documents

Publication Publication Date Title
JP5662551B1 (ja) 配線基板、半導体装置及び配線基板の製造方法
US9226382B2 (en) Printed wiring board
US9021693B2 (en) Method of manufacturing printed circuit board with metal bump
JP6661232B2 (ja) 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
TWI670814B (zh) 單層無芯基板
JPWO2008120755A1 (ja) 機能素子内蔵回路基板及びその製造方法、並びに電子機器
JP2019080032A (ja) 多層プリント回路基板
JPWO2010024233A1 (ja) 機能素子を内蔵可能な配線基板及びその製造方法
JPWO2010010910A1 (ja) コアレス配線基板、半導体装置及びそれらの製造方法
KR102194722B1 (ko) 패키지 기판, 패키지 기판의 제조 방법 및 이를 포함하는 적층형 패키지
US9601422B2 (en) Printed wiring board, semiconductor package, and method for manufacturing printed wiring board
KR102449368B1 (ko) 다층 인쇄회로기판
JP2019041041A (ja) 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
JP3856743B2 (ja) 多層配線基板
JP7148278B2 (ja) 配線基板及びその製造方法
KR102450598B1 (ko) 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법
US6913814B2 (en) Lamination process and structure of high layout density substrate
JP7423887B2 (ja) 多層プリント回路基板
JP6562483B2 (ja) プリント回路基板
JP7131740B2 (ja) プリント回路基板及びパッケージ
JP7163549B2 (ja) プリント回路基板及びプリント回路基板の製造方法
JP7087236B2 (ja) プリント回路基板

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant