KR102365099B1 - 스크라이브 방법 및 스크라이브 장치 - Google Patents

스크라이브 방법 및 스크라이브 장치 Download PDF

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Publication number
KR102365099B1
KR102365099B1 KR1020150083708A KR20150083708A KR102365099B1 KR 102365099 B1 KR102365099 B1 KR 102365099B1 KR 1020150083708 A KR1020150083708 A KR 1020150083708A KR 20150083708 A KR20150083708 A KR 20150083708A KR 102365099 B1 KR102365099 B1 KR 102365099B1
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KR
South Korea
Prior art keywords
knife
scribing
scribe
substrate
sealing material
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KR1020150083708A
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English (en)
Korean (ko)
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KR20160046282A (ko
Inventor
아키라 모리
료타 사카구치
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20160046282A publication Critical patent/KR20160046282A/ko
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor

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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Liquid Crystal (AREA)
KR1020150083708A 2014-10-20 2015-06-12 스크라이브 방법 및 스크라이브 장치 KR102365099B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-214061 2014-10-20
JP2014214061A JP6384264B2 (ja) 2014-10-20 2014-10-20 スクライブ方法およびスクライブ装置

Publications (2)

Publication Number Publication Date
KR20160046282A KR20160046282A (ko) 2016-04-28
KR102365099B1 true KR102365099B1 (ko) 2022-02-18

Family

ID=55766291

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150083708A KR102365099B1 (ko) 2014-10-20 2015-06-12 스크라이브 방법 및 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP6384264B2 (ja)
KR (1) KR102365099B1 (ja)
CN (1) CN105523711B (ja)
TW (1) TWI660921B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102027136B1 (ko) * 2017-09-27 2019-10-01 주식회사 탑 엔지니어링 스크라이빙 장치
TWI774883B (zh) * 2017-12-26 2022-08-21 日商三星鑽石工業股份有限公司 黏合基板的劃線方法以及劃線裝置
JP6967275B2 (ja) * 2017-12-26 2021-11-17 三星ダイヤモンド工業株式会社 スクライブ方法およびスクライブ装置
KR102457343B1 (ko) * 2020-12-14 2022-10-21 한국미쯔보시다이아몬드공업(주) 단자부를 갖는 접합 취성 기판의 스크라이빙 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003114420A (ja) 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd 液晶表示パネルの製造方法
US20030147035A1 (en) 2002-02-07 2003-08-07 Lg. Philips Lcd Co., Ltd. Device for cutting liquid crystal display panel and method for cutting using the same
JP2003255362A (ja) 2002-03-05 2003-09-10 Citizen Watch Co Ltd セルとその製造方法およびそのセルを用いた液晶光学素子
JP2003313036A (ja) 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
WO2010029660A1 (ja) 2008-09-12 2010-03-18 シャープ株式会社 表示パネルの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200408061A (en) * 2002-07-02 2004-05-16 Mitsuboshi Diamond Ind Co Ltd Substrate slicing system for sealed substrates and the substrate slicing method
JP2006137641A (ja) 2004-11-12 2006-06-01 Sanyo Electric Co Ltd ガラス基板の切断方法
KR100978259B1 (ko) * 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
JP2010052995A (ja) * 2008-08-29 2010-03-11 Mitsuboshi Diamond Industrial Co Ltd マザー基板のスクライブ方法
KR100978858B1 (ko) * 2008-09-01 2010-08-31 세메스 주식회사 스크라이빙 장치 및 방법
JP5348430B2 (ja) * 2011-05-24 2013-11-20 三星ダイヤモンド工業株式会社 スクライブ装置
CN102515493B (zh) * 2011-11-28 2014-05-21 深圳市华星光电技术有限公司 液晶面板的切割装置及切割方法
JP5767595B2 (ja) * 2012-02-23 2015-08-19 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003114420A (ja) 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd 液晶表示パネルの製造方法
US20030147035A1 (en) 2002-02-07 2003-08-07 Lg. Philips Lcd Co., Ltd. Device for cutting liquid crystal display panel and method for cutting using the same
JP2003255362A (ja) 2002-03-05 2003-09-10 Citizen Watch Co Ltd セルとその製造方法およびそのセルを用いた液晶光学素子
JP2003313036A (ja) 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
WO2010029660A1 (ja) 2008-09-12 2010-03-18 シャープ株式会社 表示パネルの製造方法

Also Published As

Publication number Publication date
TWI660921B (zh) 2019-06-01
JP6384264B2 (ja) 2018-09-05
CN105523711B (zh) 2020-07-07
KR20160046282A (ko) 2016-04-28
JP2016079075A (ja) 2016-05-16
TW201615577A (zh) 2016-05-01
CN105523711A (zh) 2016-04-27

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