KR102337822B1 - 커버 필름 및 이를 이용한 전자 부품 포장체 - Google Patents

커버 필름 및 이를 이용한 전자 부품 포장체 Download PDF

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Publication number
KR102337822B1
KR102337822B1 KR1020177004913A KR20177004913A KR102337822B1 KR 102337822 B1 KR102337822 B1 KR 102337822B1 KR 1020177004913 A KR1020177004913 A KR 1020177004913A KR 20177004913 A KR20177004913 A KR 20177004913A KR 102337822 B1 KR102337822 B1 KR 102337822B1
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KR
South Korea
Prior art keywords
mass
layer
cover film
resin
heat
Prior art date
Application number
KR1020177004913A
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English (en)
Korean (ko)
Other versions
KR20170044661A (ko
Inventor
아키라 사사키
다카유키 이와사키
다카노리 아츠사카
다다아키 히로오카
시게루 사카모토
Original Assignee
덴카 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 덴카 주식회사 filed Critical 덴카 주식회사
Publication of KR20170044661A publication Critical patent/KR20170044661A/ko
Application granted granted Critical
Publication of KR102337822B1 publication Critical patent/KR102337822B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
KR1020177004913A 2014-08-15 2015-08-06 커버 필름 및 이를 이용한 전자 부품 포장체 KR102337822B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-165353 2014-08-15
JP2014165353 2014-08-15
PCT/JP2015/072403 WO2016024529A1 (ja) 2014-08-15 2015-08-06 カバーフィルムおよびそれを用いた電子部品包装体

Publications (2)

Publication Number Publication Date
KR20170044661A KR20170044661A (ko) 2017-04-25
KR102337822B1 true KR102337822B1 (ko) 2021-12-09

Family

ID=55304158

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004913A KR102337822B1 (ko) 2014-08-15 2015-08-06 커버 필름 및 이를 이용한 전자 부품 포장체

Country Status (5)

Country Link
JP (1) JP6694387B2 (zh)
KR (1) KR102337822B1 (zh)
CN (1) CN106604816B (zh)
TW (1) TWI659838B (zh)
WO (1) WO2016024529A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101295A1 (ja) * 2016-12-02 2018-06-07 大日本印刷株式会社 透明導電性カバーテープ
WO2018225825A1 (ja) * 2017-06-08 2018-12-13 日産化学株式会社 フレキシブルデバイス用基板の製造方法
JP7138651B2 (ja) * 2017-10-31 2022-09-16 デンカ株式会社 カバーフィルム
JP6763421B2 (ja) * 2018-09-18 2020-09-30 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP2022013968A (ja) 2018-11-14 2022-01-19 デンカ株式会社 放熱基板を収容するパッケージおよび梱包箱
SG11202105744QA (en) * 2018-12-19 2021-07-29 Denka Company Ltd Cover film and electronic component package using same
WO2020195713A1 (ja) * 2019-03-26 2020-10-01 三井・ダウ ポリケミカル株式会社 積層体、包装体、フレキシブルコンテナ内袋及びフレキシブルコンテナ
WO2021006208A1 (ja) * 2019-07-11 2021-01-14 デンカ株式会社 カバーフィルム及びそれを用いた電子部品包装体
CN114502482B (zh) * 2019-10-11 2023-10-24 大日本印刷株式会社 电子部件包装用盖带、包装体和包装体用套组
CN110948985A (zh) * 2019-11-28 2020-04-03 江门市蓬江区华龙包装材料有限公司 一种电子载带抗静电易揭膜及其制备方法
JP7469914B2 (ja) * 2020-03-05 2024-04-17 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
JP7289816B2 (ja) * 2020-03-30 2023-06-12 住友ベークライト株式会社 カバーテープおよび電子部品包装体
CN113650384A (zh) * 2021-07-26 2021-11-16 江阴宝柏新型包装材料有限公司 一种易剥离吹膜及其制备方法
WO2023145919A1 (ja) * 2022-01-31 2023-08-03 大日本印刷株式会社 吸湿性フィルムおよび吸湿性積層体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006327624A (ja) * 2005-05-26 2006-12-07 Dainippon Printing Co Ltd カバーテープおよびその製造方法
JP2007090725A (ja) 2005-09-29 2007-04-12 Denki Kagaku Kogyo Kk カバーフィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241220B2 (ja) 1994-10-28 2001-12-25 住友ベークライト株式会社 チップ型電子部品包装用カバーテープ
JP3201507B2 (ja) * 1995-05-30 2001-08-20 住友ベークライト株式会社 電子部品包装用カバーテープ
JPH09175592A (ja) * 1995-12-26 1997-07-08 Du Pont Mitsui Polychem Co Ltd 電子部品包装用カバーテープ
JP3801296B2 (ja) 1997-03-13 2006-07-26 信越ポリマー株式会社 トップカバーテープ
JP2000327024A (ja) 1999-05-17 2000-11-28 Shin Etsu Polymer Co Ltd カバーテープ
JP5296564B2 (ja) * 2009-01-28 2013-09-25 電気化学工業株式会社 カバーフィルム
MY152320A (en) * 2009-03-13 2014-09-15 Denki Kagaku Kogyo Kk Cover film
WO2011158550A1 (ja) * 2010-06-15 2011-12-22 電気化学工業株式会社 カバーテープ
EP2600391A1 (en) * 2010-07-28 2013-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Laminate film, and film for use in production of semiconductor comprising same
JP2012214252A (ja) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006327624A (ja) * 2005-05-26 2006-12-07 Dainippon Printing Co Ltd カバーテープおよびその製造方法
JP2007090725A (ja) 2005-09-29 2007-04-12 Denki Kagaku Kogyo Kk カバーフィルム

Also Published As

Publication number Publication date
WO2016024529A1 (ja) 2016-02-18
JP6694387B2 (ja) 2020-05-13
KR20170044661A (ko) 2017-04-25
TW201613761A (en) 2016-04-16
CN106604816B (zh) 2020-07-24
TWI659838B (zh) 2019-05-21
JPWO2016024529A1 (ja) 2017-06-01
CN106604816A (zh) 2017-04-26

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