KR101866248B1 - 레이저 가공 방법 및 레이저 가공 장치 - Google Patents

레이저 가공 방법 및 레이저 가공 장치 Download PDF

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Publication number
KR101866248B1
KR101866248B1 KR1020130093914A KR20130093914A KR101866248B1 KR 101866248 B1 KR101866248 B1 KR 101866248B1 KR 1020130093914 A KR1020130093914 A KR 1020130093914A KR 20130093914 A KR20130093914 A KR 20130093914A KR 101866248 B1 KR101866248 B1 KR 101866248B1
Authority
KR
South Korea
Prior art keywords
laser light
groove
brittle material
material substrate
along
Prior art date
Application number
KR1020130093914A
Other languages
English (en)
Korean (ko)
Other versions
KR20140071220A (ko
Inventor
켄지 후쿠하라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20140071220A publication Critical patent/KR20140071220A/ko
Application granted granted Critical
Publication of KR101866248B1 publication Critical patent/KR101866248B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020130093914A 2012-11-29 2013-08-08 레이저 가공 방법 및 레이저 가공 장치 KR101866248B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012260984A JP6035127B2 (ja) 2012-11-29 2012-11-29 レーザ加工方法及びレーザ加工装置
JPJP-P-2012-260984 2012-11-29

Publications (2)

Publication Number Publication Date
KR20140071220A KR20140071220A (ko) 2014-06-11
KR101866248B1 true KR101866248B1 (ko) 2018-06-11

Family

ID=50854932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130093914A KR101866248B1 (ko) 2012-11-29 2013-08-08 레이저 가공 방법 및 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP6035127B2 (zh)
KR (1) KR101866248B1 (zh)
CN (1) CN103846554B (zh)
TW (1) TWI587960B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108022831B (zh) * 2016-11-03 2021-06-04 无锡华润上华科技有限公司 沟槽制备方法及半导体装置制备方法
JP2019177410A (ja) * 2018-03-30 2019-10-17 Ｄｇｓｈａｐｅ株式会社 加工方法、加工システム、加工プログラム。
JPWO2021009961A1 (zh) * 2019-07-16 2021-01-21

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274328A (ja) * 2009-04-30 2010-12-09 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
JP2012006320A (ja) * 2010-06-28 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370310B2 (ja) * 1999-06-18 2003-01-27 三星ダイヤモンド工業株式会社 レーザーを用いたスクライブ法
JP4634089B2 (ja) * 2004-07-30 2011-02-16 浜松ホトニクス株式会社 レーザ加工方法
CN100548564C (zh) * 2004-08-06 2009-10-14 浜松光子学株式会社 激光加工方法及半导体装置
WO2006070825A1 (ja) * 2004-12-28 2006-07-06 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法および基板分断システム
CN100536108C (zh) * 2005-11-16 2009-09-02 株式会社电装 半导体器件和半导体基板切分方法
JP2008153420A (ja) * 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
US8598490B2 (en) * 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
JP5495511B2 (ja) * 2008-05-27 2014-05-21 株式会社ディスコ ウエーハの分割方法
JP5122378B2 (ja) * 2008-06-09 2013-01-16 株式会社ディスコ 板状物の分割方法
JP5155030B2 (ja) * 2008-06-13 2013-02-27 株式会社ディスコ 光デバイスウエーハの分割方法
JP5395411B2 (ja) * 2008-11-20 2014-01-22 株式会社ディスコ ウエーハのレーザー加工方法
JP2011233641A (ja) * 2010-04-26 2011-11-17 Disco Abrasive Syst Ltd 板状物のレーザー加工方法
JP5597051B2 (ja) * 2010-07-21 2014-10-01 浜松ホトニクス株式会社 レーザ加工方法
JP5444158B2 (ja) 2010-08-02 2014-03-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
JP2012109364A (ja) * 2010-11-17 2012-06-07 Disco Abrasive Syst Ltd 光デバイスユニットの加工方法
JP5536713B2 (ja) * 2011-05-19 2014-07-02 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274328A (ja) * 2009-04-30 2010-12-09 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
JP2012006320A (ja) * 2010-06-28 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
일본 공개특허공보 특개2010-274328호(2010.12.09.) 1부. *

Also Published As

Publication number Publication date
CN103846554B (zh) 2018-02-09
JP2014105147A (ja) 2014-06-09
CN103846554A (zh) 2014-06-11
TWI587960B (zh) 2017-06-21
JP6035127B2 (ja) 2016-11-30
KR20140071220A (ko) 2014-06-11
TW201420249A (zh) 2014-06-01

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