KR101807696B1 - 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법 - Google Patents

무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법 Download PDF

Info

Publication number
KR101807696B1
KR101807696B1 KR1020177013993A KR20177013993A KR101807696B1 KR 101807696 B1 KR101807696 B1 KR 101807696B1 KR 1020177013993 A KR1020177013993 A KR 1020177013993A KR 20177013993 A KR20177013993 A KR 20177013993A KR 101807696 B1 KR101807696 B1 KR 101807696B1
Authority
KR
South Korea
Prior art keywords
copper
acid
solution
catalyst
catalyst solution
Prior art date
Application number
KR1020177013993A
Other languages
English (en)
Korean (ko)
Other versions
KR20170059493A (ko
Inventor
에이 우치다
카오루 타나카
아이 카와바타
Original Assignee
이시하라 케미칼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시하라 케미칼 가부시키가이샤 filed Critical 이시하라 케미칼 가부시키가이샤
Publication of KR20170059493A publication Critical patent/KR20170059493A/ko
Application granted granted Critical
Publication of KR101807696B1 publication Critical patent/KR101807696B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/72—Copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
KR1020177013993A 2014-02-07 2015-01-13 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법 KR101807696B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014022271A JP6145681B2 (ja) 2014-02-07 2014-02-07 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法
JPJP-P-2014-022271 2014-02-07
PCT/JP2015/050634 WO2015118907A1 (ja) 2014-02-07 2015-01-13 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157023382A Division KR20150113111A (ko) 2014-02-07 2015-01-13 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법

Publications (2)

Publication Number Publication Date
KR20170059493A KR20170059493A (ko) 2017-05-30
KR101807696B1 true KR101807696B1 (ko) 2017-12-11

Family

ID=53777715

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177013993A KR101807696B1 (ko) 2014-02-07 2015-01-13 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법
KR1020157023382A KR20150113111A (ko) 2014-02-07 2015-01-13 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020157023382A KR20150113111A (ko) 2014-02-07 2015-01-13 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법

Country Status (5)

Country Link
JP (1) JP6145681B2 (ja)
KR (2) KR101807696B1 (ja)
CN (1) CN105121701B (ja)
TW (1) TWI613321B (ja)
WO (1) WO2015118907A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6735981B2 (ja) * 2016-04-08 2020-08-05 石原ケミカル株式会社 無電解銅メッキ方法及び当該方法を用いたプリント配線板の製造方法
CN107434240A (zh) * 2016-05-25 2017-12-05 迈奇曼德（北京）科技有限责任公司 一种适用于便携制氧装置的制氧方法
JP6343787B1 (ja) * 2017-06-01 2018-06-20 石原ケミカル株式会社 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法
CN109112585A (zh) * 2017-06-22 2019-01-01 海门市源美美术图案设计有限公司 一种版辊镀铜液
CN107586989B (zh) * 2017-08-15 2019-08-30 中南大学 一种铜基高温自润滑复合材料
US10294569B2 (en) * 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN109536934A (zh) * 2018-12-25 2019-03-29 杭州东方表面技术有限公司 一种用于非金属表面金属化调整工序的处理溶液
TWI764121B (zh) * 2019-04-04 2022-05-11 德商德國艾托特克公司 活化用於金屬化之非傳導或含碳纖維之基材表面的方法
CN110042372B (zh) * 2019-05-07 2021-06-29 广东东硕科技有限公司 磺酸基芳香化合物的新应用
CN110385443A (zh) * 2019-07-28 2019-10-29 长春黄金研究院烟台贵金属材料研究所有限公司 一种酸性体系纳米铜溶胶的制备方法
CN110670050B (zh) * 2019-10-24 2021-11-12 深圳市松柏实业发展有限公司 化学镀铜活化液及其制备方法
CN113684473B (zh) * 2021-07-26 2023-04-25 广州三孚新材料科技股份有限公司 一种塑料用化学镀铜液及其制备方法
CN113737159A (zh) * 2021-08-30 2021-12-03 广东东硕科技有限公司 用于抑制铜面化学镀渗镀的预浸液及其制备方法和应用
CN114346254B (zh) * 2022-01-21 2023-08-18 重庆科技学院 一种在低共熔离子液体中制备纳米铜粉的方法
JP7214936B1 (ja) 2022-02-22 2023-01-31 悦雄 野村 抗菌・抗ウィルス性組成物およびその製造方法。

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002317274A (ja) 2000-10-24 2002-10-31 Shipley Co Llc メッキ触媒

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123762A (ja) * 1984-07-09 1986-02-01 Nec Corp 無電解めつき用銅コロイド触媒液およびその製造方法
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
GB0025990D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts and electronic packaging substrates plated therewith
JP4493942B2 (ja) * 2003-06-26 2010-06-30 旭化成イーマテリアルズ株式会社 酸化第一銅コロイド分散液
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
JP2006322729A (ja) * 2005-05-17 2006-11-30 Sumitomo Metal Mining Co Ltd 無機コロイド溶液中の脂肪酸の定量的形態分析方法
JP5570285B2 (ja) * 2010-04-19 2014-08-13 株式会社日本表面処理研究所 無電解めっき法で用いる触媒水溶液、その触媒水溶液の調製方法及びその触媒水溶液を用いた無電解めっき法並びにその無電解めっき法を用いて形成した金属皮膜を備える金属層付被めっき物
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
TWI546409B (zh) * 2011-11-14 2016-08-21 Ishihara Chemical Co Ltd Electroless copper plating solution and electroless copper plating method
JP6047713B2 (ja) * 2012-05-11 2016-12-21 石原ケミカル株式会社 無電解銅メッキ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002317274A (ja) 2000-10-24 2002-10-31 Shipley Co Llc メッキ触媒

Also Published As

Publication number Publication date
JP2015147987A (ja) 2015-08-20
KR20150113111A (ko) 2015-10-07
TWI613321B (zh) 2018-02-01
KR20170059493A (ko) 2017-05-30
TW201531591A (zh) 2015-08-16
WO2015118907A1 (ja) 2015-08-13
JP6145681B2 (ja) 2017-06-14
CN105121701B (zh) 2018-09-28
CN105121701A (zh) 2015-12-02

Similar Documents

Publication Publication Date Title
KR101807696B1 (ko) 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법
TWI621736B (zh) 化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法
KR101831100B1 (ko) 무전해 구리도금용 구리 콜로이드 촉매액 및 무전해 구리도금 방법
TWI597384B (zh) Electroless nickel or electroless nickel alloy pretreatment solution and plating method
KR102322950B1 (ko) 무전해 구리 도금용의 구리 콜로이드 촉매액, 무전해 구리 도금 방법, 및 구리 도금 기판의 제조방법
CN115803476A (zh) 化学镀镍或镍合金用镍胶体催化液、化学镀镍或镍合金方法、以及镀镍或镍合金基板的制造方法
WO2021220788A1 (ja) 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液、無電解ニッケル又はニッケル合金メッキ方法、及びニッケル又はニッケル合金メッキ基板の製造方法
JP2005082879A (ja) 無電解めっきの前処理用組成物
JP6735981B2 (ja) 無電解銅メッキ方法及び当該方法を用いたプリント配線板の製造方法
JP2023008598A (ja) 無電解ニッケル又はニッケル合金メッキ方法
EP3792374A1 (en) Electroless copper plating bath

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant