KR101411138B1 - 액처리장치 - Google Patents

액처리장치 Download PDF

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Publication number
KR101411138B1
KR101411138B1 KR1020090006153A KR20090006153A KR101411138B1 KR 101411138 B1 KR101411138 B1 KR 101411138B1 KR 1020090006153 A KR1020090006153 A KR 1020090006153A KR 20090006153 A KR20090006153 A KR 20090006153A KR 101411138 B1 KR101411138 B1 KR 101411138B1
Authority
KR
South Korea
Prior art keywords
nozzle
coating liquid
liquid
coating
light
Prior art date
Application number
KR1020090006153A
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English (en)
Korean (ko)
Other versions
KR20090083281A (ko
Inventor
쓰네나가 나카시마
나오후미 기시타
미치오 기노시타
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090083281A publication Critical patent/KR20090083281A/ko
Application granted granted Critical
Publication of KR101411138B1 publication Critical patent/KR101411138B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR1020090006153A 2008-01-29 2009-01-23 액처리장치 KR101411138B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-017148 2008-01-29
JP2008017148A JP4887310B2 (ja) 2008-01-29 2008-01-29 液処理装置

Publications (2)

Publication Number Publication Date
KR20090083281A KR20090083281A (ko) 2009-08-03
KR101411138B1 true KR101411138B1 (ko) 2014-06-23

Family

ID=41035752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090006153A KR101411138B1 (ko) 2008-01-29 2009-01-23 액처리장치

Country Status (2)

Country Link
JP (1) JP4887310B2 (ja)
KR (1) KR101411138B1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4941570B2 (ja) * 2010-03-04 2012-05-30 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5336441B2 (ja) * 2010-08-24 2013-11-06 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5459279B2 (ja) * 2011-09-02 2014-04-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5672204B2 (ja) * 2011-09-13 2015-02-18 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2016185502A (ja) * 2015-03-27 2016-10-27 セイコーエプソン株式会社 液滴吐出ヘッド検査装置、液滴吐出ヘッド検査方法および液滴吐出装置
JP6685197B2 (ja) * 2016-07-26 2020-04-22 東京エレクトロン株式会社 基板処理装置およびノズル
JP6752081B2 (ja) * 2016-08-12 2020-09-09 東京エレクトロン株式会社 接液ノズルの洗浄方法及び洗浄装置
US11923220B2 (en) 2018-01-26 2024-03-05 Tokyo Electron Limited Substrate processing apparatus
KR102120952B1 (ko) 2018-07-04 2020-06-09 세메스 주식회사 액체 토출 특성 검출 장치
TWI767244B (zh) * 2020-05-29 2022-06-11 朗曦科技股份有限公司 半導體製程腔體之氣體噴頭
KR20240062690A (ko) * 2022-11-02 2024-05-09 한국전기연구원 도파광을 이용한 노즐 접촉 확인 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582431A (ja) * 1991-09-19 1993-04-02 Nec Yamagata Ltd 半導体ウエーハのフオトレジスト塗布装置
KR20040036534A (ko) * 2002-10-25 2004-04-30 동경 엘렉트론 주식회사 레지스트 도포방법 및 레지스트 도포장치
JP2005021755A (ja) 2003-06-30 2005-01-27 Micro Jet:Kk 塗布装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030102392A1 (en) * 2001-12-03 2003-06-05 Illinois Tool Works Inc. Internal impingement nozzle
JP4583235B2 (ja) * 2005-05-09 2010-11-17 東京エレクトロン株式会社 処理液吐出装置およびその動作検証方法ならびに同装置の駆動制御方法
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582431A (ja) * 1991-09-19 1993-04-02 Nec Yamagata Ltd 半導体ウエーハのフオトレジスト塗布装置
KR20040036534A (ko) * 2002-10-25 2004-04-30 동경 엘렉트론 주식회사 레지스트 도포방법 및 레지스트 도포장치
JP2005021755A (ja) 2003-06-30 2005-01-27 Micro Jet:Kk 塗布装置

Also Published As

Publication number Publication date
KR20090083281A (ko) 2009-08-03
JP2009181982A (ja) 2009-08-13
JP4887310B2 (ja) 2012-02-29

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