KR101184558B1 - 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법 - Google Patents

무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법 Download PDF

Info

Publication number
KR101184558B1
KR101184558B1 KR20100111134A KR20100111134A KR101184558B1 KR 101184558 B1 KR101184558 B1 KR 101184558B1 KR 20100111134 A KR20100111134 A KR 20100111134A KR 20100111134 A KR20100111134 A KR 20100111134A KR 101184558 B1 KR101184558 B1 KR 101184558B1
Authority
KR
South Korea
Prior art keywords
metal plating
compounds
electroless metal
pretreatment agent
pretreatment
Prior art date
Application number
KR20100111134A
Other languages
English (en)
Korean (ko)
Other versions
KR20120049727A (ko
Inventor
조성민
테루아키 시모지
전동주
김치성
이동준
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR20100111134A priority Critical patent/KR101184558B1/ko
Priority to JP2011028245A priority patent/JP5296115B2/ja
Publication of KR20120049727A publication Critical patent/KR20120049727A/ko
Application granted granted Critical
Publication of KR101184558B1 publication Critical patent/KR101184558B1/ko

Links

Images

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR20100111134A 2010-11-09 2010-11-09 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법 KR101184558B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20100111134A KR101184558B1 (ko) 2010-11-09 2010-11-09 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법
JP2011028245A JP5296115B2 (ja) 2010-11-09 2011-02-14 無電解金属メッキの前処理剤およびこれを用いた回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20100111134A KR101184558B1 (ko) 2010-11-09 2010-11-09 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20120049727A KR20120049727A (ko) 2012-05-17
KR101184558B1 true KR101184558B1 (ko) 2012-09-19

Family

ID=46267455

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20100111134A KR101184558B1 (ko) 2010-11-09 2010-11-09 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법

Country Status (2)

Country Link
JP (1) JP5296115B2 (ja)
KR (1) KR101184558B1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9506150B2 (en) * 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000178752A (ja) 1998-12-15 2000-06-27 Okuno Chem Ind Co Ltd 無電解メッキ用パラジウム触媒除去剤
JP2002069656A (ja) 2000-08-31 2002-03-08 Daiwa Kasei Kenkyusho:Kk パラジウム又はパラジウム化合物の溶解処理液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250105A (en) * 1991-02-08 1993-10-05 Eid-Empresa De Investigacao E Desenvolvimento De Electronica S.A. Selective process for printing circuit board manufacturing
JPH10284825A (ja) * 1997-04-09 1998-10-23 Sumitomo Metal Mining Co Ltd プリント配線板の製造方法
JP3454765B2 (ja) * 1999-12-07 2003-10-06 住友大阪セメント株式会社 貴金属系触媒除去液
JP4606899B2 (ja) * 2005-02-17 2011-01-05 富士フイルム株式会社 金属パターン形成方法、金属パターン及びそれを用いたプリント配線板並びにｔｆｔ配線回路
JP4734637B2 (ja) * 2005-11-10 2011-07-27 国立大学法人岩手大学 表面反応性固体，表面反応性固体の製造方法，表面反応性固体を用いた配線基板及び配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000178752A (ja) 1998-12-15 2000-06-27 Okuno Chem Ind Co Ltd 無電解メッキ用パラジウム触媒除去剤
JP2002069656A (ja) 2000-08-31 2002-03-08 Daiwa Kasei Kenkyusho:Kk パラジウム又はパラジウム化合物の溶解処理液

Also Published As

Publication number Publication date
JP5296115B2 (ja) 2013-09-25
KR20120049727A (ko) 2012-05-17
JP2012102392A (ja) 2012-05-31

Similar Documents

Publication Publication Date Title
JP4932094B2 (ja) 無電解金めっき液および無電解金めっき方法
WO2011149019A1 (ja) 金メッキ金属微細パターン付き基材の製造方法、金メッキ金属微細パターン付き基材、プリント配線板、インターポーザ及び半導体装置
JP6367606B2 (ja) 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法
JP2007123883A (ja) プリント回路基板のメッキ層形成方法およびこれから製造されたプリント回路基板
EP2910666A1 (en) Pre-treatment process for electroless plating
TW201516143A (zh) 樹脂遮罩層用洗淨劑組合物及電路基板之製造方法
TWI732045B (zh) 印刷配線基板之製造方法
KR102502531B1 (ko) 환원 처리와 동시에 사용되는 무전해 도금용 전처리액, 및 프린트 배선 기판의 제조 방법
EP3196339B1 (en) Method for manufacturing wiring substrate
KR101184558B1 (ko) 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법
CN109252148A (zh) 在感光性树脂的表面形成金属层的方法
JP6471392B2 (ja) 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法
JP4831710B1 (ja) 無電解金めっき液及び無電解金めっき方法
KR100849060B1 (ko) 땜납기판처리용 지그 및 전자회로기판에 대한 땜납분말의부착방법
JP2010100895A (ja) 還元型無電解金めっき用前処理液及び無電解金めっき方法
KR101194541B1 (ko) 주석 또는 주석 합금 도금의 변색 방지제, 및 이를 이용한 회로 기판 및 그 제조방법
CN1659312A (zh) 用于银沉积的酸性溶液及在金属表面上沉积银层的方法
CN114790548A (zh) 印刷电路板用除钯液、除钯方法和印刷电路板的制备方法
KR20130048103A (ko) 인쇄회로기판의 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150707

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee