KR101138109B1 - Manufacture method of printed circuit board having teflon - Google Patents

Manufacture method of printed circuit board having teflon Download PDF

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Publication number
KR101138109B1
KR101138109B1 KR1020110039706A KR20110039706A KR101138109B1 KR 101138109 B1 KR101138109 B1 KR 101138109B1 KR 1020110039706 A KR1020110039706 A KR 1020110039706A KR 20110039706 A KR20110039706 A KR 20110039706A KR 101138109 B1 KR101138109 B1 KR 101138109B1
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South Korea
Prior art keywords
teflon
plate
printed circuit
circuit board
copper plate
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KR1020110039706A
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Korean (ko)
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정송섭
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(주)엠제이티
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE: A manufacturing method of a printed circuit board using Teflon is provided to enable the effective heat radiation by the formation of via-holes on a printed circuit board. CONSTITUTION: A manufacturing method of a printed circuit board using Teflon comprises following steps. A Teflon plate is formed. A copper plate is formed on the top and bottom surfaces of the Teflon plate. A circuit is printed on the copper plate. The metal plate adheres to the bottom surface of the copper plate. A plurality of via holes is formed on the copper plate, the Teflon plate, and the metal plate. A part of the vertex of the copper plate and the Teflon plate is removed. A screw hole is formed on the vertex of the metal plate. The insertion hole is formed inside the copper plate, the Teflon plate, and the metal plate. The chip is installed in the insertion hole.

Description

테프론을 이용한 인쇄회로기판의 제조방법{manufacture method of printed circuit board having teflon}Manufacturing method of printed circuit board using Teflon {manufacture method of printed circuit board having teflon}

본 발명은 인쇄회로기판의 제조방법에 관한 것으로, 보다 상세하게는 방열이 우수하고, 열 충격을 완화할 수 있으며, 인쇄회로기판을 얇게 할 수 있도록 한 테프론을 이용한 인쇄회로기판의 제조방법에 관한 것이다.
The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a printed circuit board using Teflon, which is excellent in heat dissipation, can mitigate thermal shock, and can thin a printed circuit board. will be.

일반적으로 인쇄회로기판(PCB:Printed Circuit Board)은 에폭시(Epoxy) 수지 등 유전체의 평평한 판 위에 동판, 금박 등의 도전체로 신호의 전달 선로 및 경로를 형성하여 다양한 전자부품을 실장함으로써, 소정의 기능 회로를 구성한다.In general, a printed circuit board (PCB) has a predetermined function by mounting various electronic components by forming a signal transmission line and a path through a conductor such as a copper plate or a gold foil on a flat plate of a dielectric such as an epoxy resin. Configure the circuit.

이와 같은 인쇄회로기판은 사용목적과 적용기능에 따라 다양한 모양과 구조를 갖는데, 특히, 많은 양의 열을 발산하는 소자가 실장 될 경우, 예들 들면, 증폭기가 실장될 경우에는 다음의 조건이 요구된다.Such printed circuit boards have various shapes and structures depending on the purpose of use and application functions. In particular, the following conditions are required when an element emitting a large amount of heat is mounted, for example, when an amplifier is mounted. .

즉, 인쇄회로기판의 표면을 통하여 열을 방열판(Heatsink) 등에 전도시켜 주기 위한 열전도체와, 전기적으로 접지가 안정되어 인쇄회로기판의 배선과 일정한 유전율을 갖게 하여 전송손실을 줄이기 위한 전기 전도체로서의 기능이 동시에 요구되는데, 이때, 금속을 인쇄회로기판에 접합함으로써, 상기 요구사항을 동시에 달성할 수 있다.That is, a heat conductor for conducting heat to heat sinks and the like through the surface of the printed circuit board, and a function as an electrical conductor to reduce transmission loss by having a constant dielectric constant with the wiring of the printed circuit board because the ground is stable. This is required at the same time, whereby the requirements can be achieved simultaneously by bonding the metal to the printed circuit board.

이와 같이 열전도 및 전기전도의 요구조건을 달성하기 위하여 금속판이 접합된 인쇄회로기판의 제작 방법은, 회로가 구성된 인쇄회로부를 금속판에 부착하여 인쇄회로기판을 제작하는 것이고, 금속판이 부착된 인쇄회로기판 원판에 추가적인 후가공을 통하여 회로를 구성하는 것이다.Thus, in order to achieve the requirements of thermal and electrical conduction, a method of manufacturing a printed circuit board on which a metal plate is bonded is to manufacture a printed circuit board by attaching a printed circuit part including a circuit to a metal plate, and a printed circuit board on which a metal plate is attached. Additional post-processing is used to form the circuit.

그러나, 상기한 인쇄회로기판은 방열이 잘 이루어지지 않아, 인쇄회로기판이 가열되어 고장이 발생하는 문제점이 있었다.However, the above-described printed circuit board is not heat radiation well, there is a problem that the printed circuit board is heated to cause a failure.

특히, 상기한 인쇄회로기판을 외부의 충격에 약한 문제점이 있었다.
In particular, the printed circuit board has a weak problem against external impact.

따라서, 본 발명은 상기한 종래 기술에 따른 제반 문제점을 해결하기 위하여 개량발명된 것으로서, 본 발명의 목적은 방열이 우수하고, 열 충격을 완화할 수 있으며, 인쇄회로기판을 얇게 할 수 있도록 한 테프론을 이용한 인쇄회로기판의 제조방법을 제공하는 데 있다.Accordingly, the present invention has been made in order to solve the above problems according to the prior art, an object of the present invention is excellent heat dissipation, can mitigate thermal shock, Teflon to make a printed circuit board thin To provide a method for manufacturing a printed circuit board using.

그러나 본 발명의 목적은 상기에 언급된 목적으로 제한되지 않으며, 언급되지 않은 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
However, the object of the present invention is not limited to the above-mentioned object, other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

상기한 목적을 달성하기 위한 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법은,
일정한 크기의 테프론판(10)을 형성하고, 상기 테프론판(10)의 상면과 저면에 구리판(20)을 형성시킨 후, 상기 구리판(20)에 회로를 인쇄하는 제1단계와, 상기 제1단계 후, 상기 구리판(20)의 저면에 일정한 크기의 금속판(30)을 접착하는 제2단계와, 상기 제2단계 후, 상기 구리판(20), 테프론판(10) 및 금속판(30)에 다 수개의 비어홀(40)을 형성하는 제3단계로 이루어진 테프론을 이용한 인쇄회로기판의 제조방법에 있어서,
상기 제3단계 후, 상기 구리판(20) 및 테프론판(10)의 꼭지점의 일부를 제거하고, 금속판(30)의 꼭지점에 나사공(50)을 형성하는 제4단계와;
상기 제4단계 후, 상기 구리판(20), 테프론판(10) 및 금속판(30)의 내부에 삽입홈(60)을 형성하고, 상기 삽입홈(60)에 칩을 설치하는 단계를 포함하여 이루어진다.
Method for manufacturing a printed circuit board using Teflon according to the present invention for achieving the above object,
Forming a teflon plate 10 having a predetermined size, forming a copper plate 20 on the top and bottom surfaces of the teflon plate 10, and then printing a circuit on the copper plate 20, and the first step After the step, the second step of adhering the metal plate 30 of a predetermined size on the bottom surface of the copper plate 20, and after the second step, the copper plate 20, Teflon plate 10 and the metal plate 30 In the manufacturing method of a printed circuit board using Teflon having a third step of forming several via holes 40,
After the third step, a fourth step of removing a part of the vertices of the copper plate 20 and the Teflon plate 10, and forming a screw hole (50) at the vertex of the metal plate (30);
After the fourth step, forming the insertion groove 60 in the copper plate 20, Teflon plate 10 and the metal plate 30, and the step of installing a chip in the insertion groove (60). .

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이상에서 상술한 바와 같이 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법은 인쇄회로기판에 다 수개의 비어홀을 형성함으로써, 비어홀로 열을 효과적으로 방열할 수 있는바, 열 충격을 완화할 수 있는 효과가 있다.As described above, in the method of manufacturing a printed circuit board using Teflon according to the present invention, by forming a plurality of via holes in the printed circuit board, heat can be effectively dissipated into the via holes, thereby reducing thermal shock. It works.

이로 인해, 인쇄회로기판을 장시간 동안 사용할 수 있는 효과가 있다.As a result, there is an effect that the printed circuit board can be used for a long time.

특히, 본 발명은 인쇄회로기판과 금속판에 삽입홈을 형성하고, 삽입홈에 칩이 설치되도록 하여 인쇄회로기판의 두께를 얇게 할 수 있는 효과가 있다.In particular, the present invention has the effect of forming an insertion groove in the printed circuit board and the metal plate, the chip is installed in the insertion groove to reduce the thickness of the printed circuit board.

그리고, 본 발명은 인쇄회로기판의 4측 꼭지점에 나사공이 설치되어 있는바, 인쇄회로기판을 용이하게 설치할 수 있는 효과가 있다.
In addition, the present invention is provided with a screw hole is provided at the four corners of the printed circuit board, there is an effect that the printed circuit board can be easily installed.

도 1a는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 테프론판을 나타낸 도면,
도 1b는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 테프론판의 상면과 저면에 구리판을 나타낸 도면,
도 1c는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 금속판을 나타낸 도면,
도 1d는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 구리판과 금속판에 비어홀을 나타낸 도면,
도 1e는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 금속판의 꼭지점에 형성된 나사공을 나타낸 도면,
도 1f는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서의 인쇄회로판의 내부에 형성된 삽입홈을 나타낸 도면이다.
도 2a는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서 제조된 인쇄회로기판의 상면을 나타낸 도면,
도 2b는 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법에서 제조된 인쇄회로기판의 저면을 나타낸 도면이다.1a is a view showing a teflon plate in a method of manufacturing a printed circuit board using teflon according to the present invention;
Figure 1b is a view showing a copper plate on the top and bottom of the Teflon plate in the method of manufacturing a printed circuit board using Teflon according to the present invention,
Figure 1c is a view showing a metal plate in the method of manufacturing a printed circuit board using Teflon according to the present invention,
1D is a view showing a via hole in a copper plate and a metal plate in a method of manufacturing a printed circuit board using Teflon according to the present invention;
Figure 1e is a view showing a screw hole formed at the vertex of the metal plate in the method of manufacturing a printed circuit board using Teflon according to the present invention,
Figure 1f is a view showing the insertion groove formed in the inside of the printed circuit board in the method of manufacturing a printed circuit board using Teflon according to the present invention.
Figure 2a is a view showing the upper surface of the printed circuit board manufactured in the method of manufacturing a printed circuit board using Teflon according to the present invention,
Figure 2b is a view showing the bottom of the printed circuit board manufactured in the method of manufacturing a printed circuit board using Teflon according to the present invention.

이하, 본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법의 바람직한 실시 예를 설명하면 다음과 같다. 하기에서 본 발명을 설명함에 있어서, 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략할 것이다.Hereinafter, a preferred embodiment of a method of manufacturing a printed circuit board using Teflon according to the present invention will be described. In the following description of the present invention, detailed descriptions of well-known functions or configurations will be omitted when it is deemed that they may unnecessarily obscure the subject matter of the present invention.

본 발명에 따른 테프론을 이용한 인쇄회로기판의 제조방법을 설명하면 다음과 같다.Referring to the method of manufacturing a printed circuit board using Teflon according to the present invention.

먼저, 도 1a에 도시된 바와 같이, 일정한 크기의 테프론판(10)을 형성한다.First, as shown in Figure 1a, to form a Teflon plate 10 of a constant size.

여기서, 테프론(Teflon)은, 1938년 듀폰연구소의 화학자인 플랭케 박사가 불소수지 PTFE(Poly Tetra Fluoro Ethylene)를 최초로 합성하여 TEFLON이란 상품명으로 상용화하였다. 상기 테프론은 불소와 탄소의 강력한 화학적 결합으로 인해 매우 안정된 화합물을 형성함으로써 거의 완벽한 화학적 비활성 및 내열성, 비점착성, 우수한 절연 안정성, 낮은 마찰계수 등의 특성들을 가지고 있다. 한편, 테프론 코팅은 많은 산업분야에서 응용되고 있는데, 그 사용범위는 일반 주방용기에서부터 기계?자동차?반도체?우주 항공산업 부품에 이르기까지 매우 다양하다.Here, Teflon was first synthesized in 1938 by Ph.D. Ph.D., a chemist at DuPont Laboratories, and made commercially available as TEFLON under the trade name TEFLON. The Teflon forms a very stable compound due to the strong chemical bonding of fluorine and carbon, and thus has almost perfect chemical inertness and heat resistance, non-tackiness, excellent insulation stability, and low coefficient of friction. On the other hand, Teflon coatings are applied in many industries, the range of use is from a general kitchen vessel to machinery, automotive, semiconductor, aerospace components.

그리고, 도 1b에 도시된 바와 같이,상기 테프론판(10)의 상면과 저면에 구리판(20)을 형성시킨 후, 상기 구리판(20)에 회로를 인쇄한다.As shown in FIG. 1B, after the copper plate 20 is formed on the top and bottom surfaces of the Teflon plate 10, a circuit is printed on the copper plate 20.

그리고, 도 1c에 도시된 바와 같이, 상기 구리판(20)의 저면에 일정한 크기의 금속판(30)을 접착한다.As shown in FIG. 1C, the metal plate 30 having a predetermined size is attached to the bottom surface of the copper plate 20.

그리고, 도 1d에 도시된 바와 같이, 상기 구리판(20), 테프론판(10) 및 금속판(30)에 다 수개의 비어홀(40)을 형성한다.In addition, as shown in FIG. 1D, a plurality of via holes 40 are formed in the copper plate 20, the teflon plate 10, and the metal plate 30.

그리고, 도 1e에 도시된 바와 같이, 상기 구리판(20) 및 테프론판(10)의 꼭지점의 일부를 제거하고, 금속판(30)의 꼭지점에 나사공(50)을 형성한다.As shown in FIG. 1E, a part of the vertices of the copper plate 20 and the teflon plate 10 is removed, and a screw hole 50 is formed at the vertex of the metal plate 30.

그리고, 도 1f에 도시된 바와 같이, 상기 구리판(20), 테프론판(10) 및 금속판(30)의 내부에 삽입홈(60)을 형성하고, 상기 삽입홈(60)에 칩을 설치한다.As shown in FIG. 1F, an insertion groove 60 is formed in the copper plate 20, the teflon plate 10, and the metal plate 30, and a chip is installed in the insertion groove 60.

상기 발명의 상세한 설명은 단지 본 발명의 예시적인 것으로서, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미 한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.The detailed description of the invention is merely exemplary of the invention, which is used only for the purpose of illustrating the invention and is not intended to limit the scope of the invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10 : 테프론판
20 : 구리판
30 : 금속판
40 : 비어홀
50 : 관통홀
60 : 삽입홈10: teflon plate
20: copper plate
30: metal plate
40: beer hall
50: through hole
60: insertion groove

Claims (1)

일정한 크기의 테프론판(10)을 형성하고, 상기 테프론판(10)의 상면과 저면에 구리판(20)을 형성시킨 후, 상기 구리판(20)에 회로를 인쇄하는 제1단계와, 상기 제1단계 후, 상기 구리판(20)의 저면에 일정한 크기의 금속판(30)을 접착하는 제2단계와, 상기 제2단계 후, 상기 구리판(20), 테프론판(10) 및 금속판(30)에 다 수개의 비어홀(40)을 형성하는 제3단계로 이루어진 테프론을 이용한 인쇄회로기판의 제조방법에 있어서,
상기 제3단계 후, 상기 구리판(20) 및 테프론판(10)의 꼭지점의 일부를 제거하고, 금속판(30)의 꼭지점에 나사공(50)을 형성하는 제4단계와;
상기 제4단계 후, 상기 구리판(20), 테프론판(10) 및 금속판(30)의 내부에 삽입홈(60)을 형성하고, 상기 삽입홈(60)에 칩을 설치하는 단계를 포함하여 이루어지는 것을 특징으로 하는 테프론을 이용한 인쇄회로기판의 제조방법.Forming a teflon plate 10 having a predetermined size, forming a copper plate 20 on the top and bottom surfaces of the teflon plate 10, and then printing a circuit on the copper plate 20, and the first step After the step, the second step of adhering the metal plate 30 of a predetermined size on the bottom surface of the copper plate 20, and after the second step, the copper plate 20, Teflon plate 10 and the metal plate 30 In the manufacturing method of a printed circuit board using Teflon having a third step of forming several via holes 40,
After the third step, a fourth step of removing a part of the vertices of the copper plate 20 and the Teflon plate 10, and forming a screw hole (50) at the vertex of the metal plate (30);
After the fourth step, forming the insertion groove 60 in the copper plate 20, the teflon plate 10 and the metal plate 30, and installing a chip in the insertion groove 60 Method of manufacturing a printed circuit board using Teflon, characterized in that.
KR1020110039706A 2011-04-27 2011-04-27 Manufacture method of printed circuit board having teflon KR101138109B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221876A1 (en) * 2017-05-30 2018-12-06 주식회사 아모그린텍 Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
CN109618492A (en) * 2018-11-23 2019-04-12 广东工业大学 A kind of processing method of PTFE circuit board apertures

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Publication number Priority date Publication date Assignee Title
JPH1117349A (en) * 1997-06-27 1999-01-22 Nec Corp High-frequency integrated circuit device and manufacture thereof
JPH11330709A (en) 1998-05-14 1999-11-30 Ishikawajima Harima Heavy Ind Co Ltd Metal-clad substrate having heat sink
JP2001358415A (en) 2000-06-16 2001-12-26 Nippon Pillar Packing Co Ltd Printed circuit board
KR20040021040A (en) * 2002-09-02 2004-03-10 박종진 Radio frequency printed circuit board manufacturing method for high output amplifier

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Publication number Priority date Publication date Assignee Title
JPH1117349A (en) * 1997-06-27 1999-01-22 Nec Corp High-frequency integrated circuit device and manufacture thereof
JPH11330709A (en) 1998-05-14 1999-11-30 Ishikawajima Harima Heavy Ind Co Ltd Metal-clad substrate having heat sink
JP2001358415A (en) 2000-06-16 2001-12-26 Nippon Pillar Packing Co Ltd Printed circuit board
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221876A1 (en) * 2017-05-30 2018-12-06 주식회사 아모그린텍 Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
US11006531B1 (en) 2017-05-30 2021-05-11 Amogreentech Co., Ltd. Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
CN109618492A (en) * 2018-11-23 2019-04-12 广东工业大学 A kind of processing method of PTFE circuit board apertures
CN109618492B (en) * 2018-11-23 2021-02-26 广东工业大学 Machining method for PTFE circuit board hole

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