KR20120107327A - Including ceramic thermosetting resins metal copper clad laminate - Google Patents

Including ceramic thermosetting resins metal copper clad laminate Download PDF

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Publication number
KR20120107327A
KR20120107327A KR1020110024956A KR20110024956A KR20120107327A KR 20120107327 A KR20120107327 A KR 20120107327A KR 1020110024956 A KR1020110024956 A KR 1020110024956A KR 20110024956 A KR20110024956 A KR 20110024956A KR 20120107327 A KR20120107327 A KR 20120107327A
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KR
South Korea
Prior art keywords
substrate
metal
resin
ceramic
present
Prior art date
Application number
KR1020110024956A
Other languages
Korean (ko)
Inventor
표희연
Original Assignee
주식회사 시노펙스그린테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 시노펙스그린테크 filed Critical 주식회사 시노펙스그린테크
Priority to KR1020110024956A priority Critical patent/KR20120107327A/en
Publication of KR20120107327A publication Critical patent/KR20120107327A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/04—Inorganic
    • B32B2266/045—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/02—Ceramics

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  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The metal heat-dissipating substrate including ceramic in the thermosetting resin of the present invention has a fine hole, a metal oxide substrate having a filler filled in the fine holes, and a heat-dissipating resin obtained by mixing an insulating resin and a ceramic on the main surface of the metal oxide substrate. The present invention relates to a substrate for electronic parts such as a semiconductor chip or LED chip, and a method of manufacturing the same. The present invention relates to a metal heat-dissipating substrate comprising ceramic in a thermosetting resin obtained by insulating a substrate for an electronic component having a plate as a base material and an aluminum plate and bonding copper foil.

Description

Including ceramic Thermosetting resins metal copper clad laminate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal heat-dissipating substrate comprising ceramic in a thermosetting resin used for an electronic component substrate, and more particularly, to a surface of an anodized or soft etched aluminum substrate having a constant thickness. The present invention relates to a metal heat-dissipating substrate including ceramics in a thermosetting resin for electronic parts based on an aluminum plate, which is bonded to minimize heat accumulation.

Conventional electronic circuit boards are susceptible to heat, and heat dissipation is not easy. As such heat generation of the electronic circuit board deteriorates the function of the device, a substrate material having a high heat dissipation effect is required. Therefore, a heat dissipation substrate having thermal stability and high heat dissipation effect is required as a manufacturing technology of insulating resin and ceramic material.

Accordingly, the present invention has been made to solve the above-described problems, and is very effective in dissipating heat generated by elements on a substrate using heat-insulating resins on metals, minimizing the thickness of the metal substrate, and realizing light and small size reduction, The purpose of the present invention is to provide a substrate having a high heat dissipation performance by reducing manufacturing costs by reducing processes that require many packaging processes such as a semiconductor or LED chip using a substrate.

In order to solve the above object, a metal heat-dissipating substrate including ceramic in the thermosetting resin of the present invention has fine pores, a metal oxide substrate having a filler filled in the fine pores, and an insulating resin and a ceramic on the main surface of the metal oxide substrate. The heat-resistant resin mixed with the copper foil is bonded to the thermosetting resin with a metal copper foil to include a ceramic. Here, the metal oxide substrate is characterized in that the aluminum substrate.

On the other hand, the filler is characterized in that the magnesium oxide, aluminum oxide, aluminum nitride and the like resin (epoxy) or polymer (polymer) of the resin system (resin) combined with the epoxy resin. Here, the metal thin film is characterized in that the copper.

The present invention uses a oxidation method rather than a mechanical processing method, the heat generation effect is very good, a considerable process simplification and manufacturing cost can be very low, and accordingly the heat dissipation resin on the metal to emit heat on the substrate elements It is very effective, minimizes the thickness of the metal substrate and realizes light and small size, reduces the manufacturing cost by reducing the number of packaging processes such as semiconductor or LED chip using the metal substrate, and heat dissipation performance There is an advantage that can provide an excellent substrate.

1 is an overall cross-sectional view of a metal heat radiation board including a ceramic in the thermosetting resin according to the present invention.
2 is a cross-sectional view of an aluminum sheet surface oxide for forming a metal heat-dissipating substrate including a ceramic in the thermosetting resin according to the present invention.
2 is a cross-sectional view of a resin coated copper (RCC) for forming a metal heat-dissipating substrate including a ceramic in a thermosetting resin according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the configuration and operation of the metal heat-radiating substrate comprising a ceramic in the thermosetting resin according to the present invention.

1 is a cross-sectional view of an aluminum sheet surface oxidation of a metal heat-resistant substrate comprising a ceramic in a thermosetting resin according to the present invention, Figure 2 is a resin coated copper foil of a metal heat-resistant substrate comprising a ceramic in a thermosetting resin according to the present invention (RCC: Resin coated Copper)

The present invention comprises the step of selectively oxidizing using an aluminum plate to form an insulator and filling an insulating material in the pores formed in the insulator to form a metal oxide substrate, curing to harden the metal oxide substrate filled with the insulating material, Joining the cured metal oxide substrate with a copper clad laminate.

The present invention is a cross-sectional view insulated from the oxidation method on the aluminum plate for electronic components, and the insulating ceramic resin layer is a resin-based epoxy resin filled with an insulating layer of 80um to 300um thickness in the copper foil. It can be seen from Figure 2 that can be used RCC (resin coated copper foil) mixed with a polymer or a resin or a combination of epoxy and polymer and aluminum oxide, magnesium oxide, aluminum nitride.

Next, the fillers are bonded to each other and finely oxidized in the aluminum plate so that the fillers are completely bonded and hardened by curing. The curing may be performed at a temperature of about 120 ° C to 250 ° C and a time of about 2 to 6 hours. Here, the thickness of the copper foil may be about 18 to 105um.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined in the appended claims. Is within the scope of the description.

Claims (4)

Including a ceramic in a thermosetting resin having a metal copper foil by bonding a copper oxide with a metal foil having a fine hole, a metal oxide substrate having a filler filled in the fine holes and a heat dissipating resin mixed with an insulating resin and a ceramic on the main surface of the metal oxide substrate Metal radiating substrate.
The heat dissipation substrate of claim 1, wherein the metal oxide substrate is an aluminum substrate.
The method of claim 1, wherein the filler is a resin (epoxy) or a polymer (resin) based on the thermosetting resin ceramics, characterized in that the magnesium oxide, aluminum oxide, aluminum nitride, etc. Metal radiating substrate comprising a.
The heat dissipation substrate of claim 1, wherein the metal thin film is made of copper.
KR1020110024956A 2011-03-21 2011-03-21 Including ceramic thermosetting resins metal copper clad laminate KR20120107327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110024956A KR20120107327A (en) 2011-03-21 2011-03-21 Including ceramic thermosetting resins metal copper clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110024956A KR20120107327A (en) 2011-03-21 2011-03-21 Including ceramic thermosetting resins metal copper clad laminate

Publications (1)

Publication Number Publication Date
KR20120107327A true KR20120107327A (en) 2012-10-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110024956A KR20120107327A (en) 2011-03-21 2011-03-21 Including ceramic thermosetting resins metal copper clad laminate

Country Status (1)

Country Link
KR (1) KR20120107327A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304759A (en) * 2015-05-29 2017-01-04 旭景光电股份有限公司 Ultra-thin equal backing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304759A (en) * 2015-05-29 2017-01-04 旭景光电股份有限公司 Ultra-thin equal backing
CN106304759B (en) * 2015-05-29 2018-12-11 旭景光电股份有限公司 Ultra-thin equal backing

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