KR101095095B1 - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
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- KR101095095B1 KR101095095B1 KR1020090006571A KR20090006571A KR101095095B1 KR 101095095 B1 KR101095095 B1 KR 101095095B1 KR 1020090006571 A KR1020090006571 A KR 1020090006571A KR 20090006571 A KR20090006571 A KR 20090006571A KR 101095095 B1 KR101095095 B1 KR 101095095B1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Public Health (AREA)
- Power Engineering (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (5)
- 처리액을 토출하는 토출구 및 그 토출구로 처리액을 안내하는 처리액유로(流路)를 갖는 처리액토출노즐과,상기 처리액토출노즐의 상기 처리액유로에 처리액을 공급하는 처리액공급부와,상기 처리액토출노즐의 상기 처리액유로 내의 처리액을 흡인하는 흡인기구를 구비하고,상기 처리액유로는,상류단(上流端)으로부터 하류단(下流端)까지 상승하도록 뻗는 제1 유로와,상기 제1 유로의 상기 하류단으로부터 상기 토출구까지 하강하도록 뻗는 제2 유로를 포함하고,상기 처리액공급부는 상기 제1 유로의 상기 상류단으로부터 상기 하류단을 향해 처리액을 공급하며,상기 흡인기구는 상기 제1 유로에 접속되는 제1 흡인로를 갖고, 상기 제2 유로 내의 처리액을 상기 토출구로부터 상기 제1 유로를 향하는 방향으로 상기 제1 유로 및 상기 제1 흡인로를 통하여 흡인하는 기판처리장치.
- 삭제
- 처리액을 토출하는 토출구 및 그 토출구로 처리액을 안내하는 처리액유로(流路)를 갖는 처리액토출노즐과,상기 처리액토출노즐의 상기 처리액유로에 처리액을 공급하는 처리액공급부와,상기 처리액토출노즐의 상기 처리액유로 내의 처리액을 흡인하는 흡인기구를 구비하고,상기 처리액유로는,상류단(上流端)으로부터 하류단(下流端)까지 상승하도록 뻗는 제1 유로와,상기 제1 유로의 상기 하류단으로부터 상기 토출구까지 하강하도록 뻗는 제2 유로를 포함하고,상기 처리액공급부는 상기 제1 유로의 상기 상류단에 접속되는 공급로를 갖고, 상기 공급로를 통하여 상기 제1 유로의 상기 상류단으로부터 상기 하류단을 향해 처리액을 공급하며,상기 흡인기구는 상기 공급로에 접속되는 제2 흡인로를 갖고, 상기 제2 유로 내의 처리액을 상기 토출구로부터 상기 제1 유로를 향하는 방향으로 상기 제1 유로, 상기 공급로 및 상기 제2 흡인로를 통하여 흡인하는 기판처리장치.
- 제1항 또는 제3항에 있어서,상기 처리액토출노즐은 상기 토출구를 복수 갖고,상기 처리액유로는 상기 제2 유로를 복수 포함하며, 상기 복수의 제2 유로는 상기 제1 유로의 상기 하류단으로부터 분기(分岐)되어 상기 복수의 토출구까지 뻗도록 설치된 기판처리장치.
- 제1항 또는 제3항에 있어서,상기 처리액토출노즐은 처리액으로서 현상액을 토출하고,상기 처리액토출노즐과 일체적으로 설치되어, 린스액을 토출하는 린스액토출노즐을 더 구비하는 기판처리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008076567A JP5317505B2 (ja) | 2008-03-24 | 2008-03-24 | 基板処理装置 |
JPJP-P-2008-076567 | 2008-03-24 |
Publications (2)
Publication Number | Publication Date |
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KR20090101814A KR20090101814A (ko) | 2009-09-29 |
KR101095095B1 true KR101095095B1 (ko) | 2011-12-16 |
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KR1020090006571A KR101095095B1 (ko) | 2008-03-24 | 2009-01-28 | 기판처리장치 |
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JP (1) | JP5317505B2 (ko) |
KR (1) | KR101095095B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5317504B2 (ja) * | 2008-03-24 | 2013-10-16 | 株式会社Sokudo | 現像装置および現像方法 |
JP5521731B2 (ja) * | 2010-04-20 | 2014-06-18 | 凸版印刷株式会社 | 現像処理方法及び現像処理装置 |
JP6216200B2 (ja) * | 2013-09-30 | 2017-10-18 | 株式会社Screenホールディングス | 基板処理装置 |
JP6173192B2 (ja) * | 2013-12-03 | 2017-08-02 | 株式会社ディスコ | 液体噴射装置 |
JP6385864B2 (ja) * | 2015-03-18 | 2018-09-05 | 株式会社東芝 | ノズルおよび液体供給装置 |
JP6924614B2 (ja) | 2017-05-18 | 2021-08-25 | 株式会社Screenホールディングス | 基板処理装置 |
CN112435941A (zh) * | 2020-11-27 | 2021-03-02 | 华虹半导体(无锡)有限公司 | 单片湿法清洗机台的防滴液装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005161130A (ja) * | 2003-11-28 | 2005-06-23 | Seiko Epson Corp | 吐出ヘッド機構およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH0469920A (ja) * | 1990-07-10 | 1992-03-05 | Tokyo Electron Ltd | 現像装置 |
JP3398272B2 (ja) * | 1995-12-05 | 2003-04-21 | 大日本スクリーン製造株式会社 | 薬液吐出ノズル |
JPH09160256A (ja) * | 1995-12-07 | 1997-06-20 | Dainippon Screen Mfg Co Ltd | 液体吐出装置 |
JP3434650B2 (ja) * | 1996-10-03 | 2003-08-11 | 大日本スクリーン製造株式会社 | 基板塗布装置 |
JP3633775B2 (ja) * | 1998-02-12 | 2005-03-30 | 大日本スクリーン製造株式会社 | 処理液吐出ノズルおよび基板処理装置 |
JPH11111603A (ja) * | 1997-10-07 | 1999-04-23 | Dainippon Screen Mfg Co Ltd | 基板現像方法及びその装置 |
JPH11226475A (ja) * | 1998-02-12 | 1999-08-24 | Dainippon Screen Mfg Co Ltd | 処理液吐出ノズルおよび基板処理装置 |
JP3633774B2 (ja) * | 1998-02-12 | 2005-03-30 | 大日本スクリーン製造株式会社 | 処理液吐出ノズルおよび基板処理装置 |
JP2002170803A (ja) * | 2000-12-04 | 2002-06-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4347734B2 (ja) * | 2004-03-25 | 2009-10-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005161130A (ja) * | 2003-11-28 | 2005-06-23 | Seiko Epson Corp | 吐出ヘッド機構およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 |
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JP5317505B2 (ja) | 2013-10-16 |
JP2009231620A (ja) | 2009-10-08 |
KR20090101814A (ko) | 2009-09-29 |
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