KR100945329B1 - 전기 장치 및 이러한 장치를 제조하기 위한 방법 - Google Patents
전기 장치 및 이러한 장치를 제조하기 위한 방법 Download PDFInfo
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- KR100945329B1 KR100945329B1 KR1020047008986A KR20047008986A KR100945329B1 KR 100945329 B1 KR100945329 B1 KR 100945329B1 KR 1020047008986 A KR1020047008986 A KR 1020047008986A KR 20047008986 A KR20047008986 A KR 20047008986A KR 100945329 B1 KR100945329 B1 KR 100945329B1
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- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
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- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (13)
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- (1) 중합식 조립체를 제공하는 단계와,(2) 조립체를 각각이 적어도 하나의 전기 연결부를 포함하는 개별 장치로 세분화하는 단계와,(3) 적어도 하나의 전기 부품을 각각의 장치의 외부 도전성 표면에 부착하는 단계를 포함하고,상기 중합식 조립체를 제공하는 단계는(a) 각각이 적어도 하나의 도전성 표면을 갖는 적층 중합체 요소를 구비한 제1 및 제2 적층물을 제공하는 단계와,(b) 하나의 적층물 위의 적어도 하나의 도전성 표면에 도전성 재료의 패턴을 제공하는 단계와,(c) 적어도 하나의 적층물의 적어도 하나의 도전성 표면이 스택의 외부 도전성 표면을 구비하고, 상기 스택에 적층물을 원하는 형상으로 고정시키는 단계와,(d) 제1 적층물의 도전성 표면과 제2 적층물의 도전성 표면 사이에 복수의 전기 연결부를 형성하는 단계를 포함하고,상기 제1 적층물의 적층 중합체 요소는 PTC 도전성 중합체 조성물을 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- 제6항에 있어서, 상기 제2 적층물의 적층 중합체 요소는 유전체 재료를 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- 제7항에 있어서, 상기 조립체는 유전체인 적층 요소를 구비한 제3 적층물을 더 포함하고, 제2 및 제3 적층물은 제1 적층물의 상부 및 바닥부에 위치되는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- (1) 중합식 조립체를 제공하는 단계와,(2) 조립체를 각각이 (ⅰ) 적어도 하나의 전기 연결부와 (ⅱ) 적어도 하나의 전기 연결 패드 또는 재연결가능한 접촉 패드를 구비한 개별 장치로 세분화하는 단 계를 포함하고,상기 중합식 조립체를 제공하는 단계는(a) 적어도 하나의 도전성 표면을 갖고 도전성 중합체 조성물을 구비한 적층 중합체 요소를 포함하는 제1 적층물을 제공하는 단계와,(b) 적어도 하나의 도전성 표면을 갖고 절연성 중합체 조성물을 구비한 적층 중합체 요소를 포함하는 제2 적층물을 제공하는 단계와,(c) 하나의 적층물 위의 적어도 하나의 도전성 표면에 도전성 재료의 패턴을 제공하는 단계와,(d) 적어도 하나의 적층물의 적어도 하나의 도전성 표면이 스택의 외부 도전성 표면을 구비하고, 상기 스택에 적층물을 원하는 형상으로 고정시키는 단계와,(e) 제1 적층물의 도전성 표면과 제2 적층물의 도전성 표면 사이에 복수의 전기 연결부를 형성하는 단계와,(f) 전기 연결 패드 또는 재연결가능한 접촉 패드를 형성하도록 적어도 하나의 외부 도전성 표면의 적어도 일부에 추가 도전성 층을 제공하는 단계를 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- 제9항에 있어서, 각각의 장치는 하나의 외부 표면에 적어도 하나의 전기 연결 패드와 다른 외부 표면에 적어도 하나의 재연결가능한 접촉 패드를 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- (1) 중합식 조립체를 제공하는 단계와,(2) 조립체를 (ⅰ) 적어도 하나의 전기 연결부와, (ⅱ) 적어도 하나의 전기 부품을 구비한 개별 장치로 세분화하는 단계를 포함하고,상기 중합식 조립체를 제공하는 단계는(a) 각각이 적어도 하나의 도전성 표면을 갖는 적층 중합체 요소를 구비한 제1 및 제2 적층물을 제공하는 단계와,(b) 하나의 적층물 위의 적어도 하나의 도전성 표면에 도전성 재료 패턴을 제공하는 단계와,(c) 적어도 하나의 적층물의 적어도 하나의 도전성 표면이 스택의 외부 도전성 표면을 구비하고, 상기 스택에 적층물을 원하는 형상으로 고정시키는 단계와,(d) 제1 적층물의 도전성 표면과 제2 적층물의 도전성 표면 사이에 복수의 전기 연결부를 형성하는 단계와,(e) 복수의 전기 부품을 스택의 외부 도전성 표면에 부착하는 단계를 포함하고,상기 제1 적층물의 적층 중합체 요소는 도전성 중합체 조성물을 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- 제11항에 있어서, 상기 제2 적층물의 적층 중합체 요소는 유전체 재료를 포함하는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
- 제11항에 있어서, 상기 조립체는 유전체인 적층 요소를 구비한 제3 적층물을 더 포함하고, 제2 및 제3 적층물은 제1 적층물의 상부 및 바닥부에 위치되는 복합 중합체 회로 보호 장치를 제조하기 위한 방법.
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PCT/US2002/039392 WO2003050827A1 (en) | 2001-12-12 | 2002-12-10 | Electrical devices and process for making such devices |
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- 2002-12-10 KR KR1020047008986A patent/KR100945329B1/ko active IP Right Grant
- 2002-12-10 JP JP2003551796A patent/JP2005513763A/ja active Pending
- 2002-12-10 EP EP02804759A patent/EP1454329A1/en not_active Withdrawn
- 2002-12-10 WO PCT/US2002/039392 patent/WO2003050827A1/en active Application Filing
- 2002-12-10 KR KR1020097016425A patent/KR101063994B1/ko active IP Right Grant
- 2002-12-10 CN CN028280199A patent/CN1625788B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
KR101063994B1 (ko) | 2011-09-08 |
KR20100117682A (ko) | 2010-11-03 |
JP2005513763A (ja) | 2005-05-12 |
EP1454329A1 (en) | 2004-09-08 |
KR20090088461A (ko) | 2009-08-19 |
KR20040064739A (ko) | 2004-07-19 |
US20020162214A1 (en) | 2002-11-07 |
CN1625788A (zh) | 2005-06-08 |
US6854176B2 (en) | 2005-02-15 |
CN1625788B (zh) | 2010-06-09 |
WO2003050827A1 (en) | 2003-06-19 |
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