TWI275107B - Electrical devices and process for making such devices - Google Patents

Abstract

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Description

A7 B7 經濟部智慧財產局員工消費合作社印製 1275107 五、發明說明（1) 一、 [發明所屬之技術領域] 本發明係關於電氣裝置及總成以及此種裝置及總成之 製法。 二、 [先前技術] 5 眾所周知包含一種具有正溫度係數(PTC)之導電聚合 物組合物之電路保護裝置。此種裝置意圖用於基材例如印 刷電路板之表面安裝，揭示於美國專利案5,831，510 (Zhang 等人），5,852,397 (Chan 等人），及 5,864,281 (Zhang 等人），以及國際公告案第94/01876號（雷肯(Raychem)公 10司）及第95/08176號（雷肯公司）’其揭示内容併述於此以 供參考。此種電路保護裝置通常包含第一及第二層狀電 極；一層狀PTC電阻元件夾置於二電極間；一第三(剩餘) 層狀導電件，其係牢固固定於PTC元件的第二電極的相 同表面上但與第二電極隔開；以及一交叉導體其通過PTC 15 元件的孔隙以及連結第三導電件與第一電極。如此允許由 裝置的同一邊連結至二電極，故裝置可平坦連結於一印刷 電路板上，第一電極係於頂上而無需任何引線。電阻元件 較佳包含由一種PTC導電聚合物組成的層狀元件。較佳 裝置包含一額外導電件及一額外交叉導體，故裝置為對稱 20 性且可以任一方式置於電路板上。 當此等裝置中之二裝置以堆疊配置以物理方式牢固結 合在一起時，可形成複合裝置。此種複合裝置具有單一裝 置的相同小「腳印」於印刷電路板上，亦即佔有小面積， 但具有比使用單一裝置所能方便產生的電阻更低的電阻。A7 B7 Ministry of Economic Affairs Intellectual Property Office Employees Consumption Cooperative Printed 1275107 V. INSTRUCTIONS (1) 1. [Technical Field of the Invention] The present invention relates to an electrical device and an assembly, and a method of manufacturing such a device and assembly. 2. [Prior Art] 5 A circuit protection device comprising a conductive polymer composition having a positive temperature coefficient (PTC) is well known. Such devices are intended for use in the surface mounting of substrates such as printed circuit boards, as disclosed in U.S. Patent Nos. 5,831,510 (Zhang et al.), 5,852,397 (Chan et al.), and 5,864,281 (Zhang et al.), and International Publication No. No. 94/01876 (Raychem, Division 10) and 95/08176 (Reiken), the disclosures of which are hereby incorporated by reference. The circuit protection device generally comprises first and second layered electrodes; a layered PTC resistance element is sandwiched between the two electrodes; and a third (remaining) layered conductive member is firmly fixed to the second of the PTC element. The same surface of the electrode but spaced apart from the second electrode; and a crossover conductor that passes through the aperture of the PTC 15 element and joins the third conductive member to the first electrode. This allows the same side of the device to be connected to the two electrodes so that the device can be flatly attached to a printed circuit board with the first electrode attached to the top without any leads. The resistive element preferably comprises a layered element composed of a PTC conductive polymer. The preferred device includes an additional conductive member and an additional cross-conductor so that the device is symmetrical and can be placed on the circuit board in either manner. A composite device can be formed when two of the devices are physically joined together in a stacked configuration. Such a composite device has the same small "footprint" of a single device on a printed circuit board, i.e., occupies a small area, but has a lower resistance than can be easily produced using a single device.

91541A91541A

A7 B7A7 B7

^75107 此外，此種複合裝置之功率耗散實質上與單獨裝置之一的 功率耗散並無差異。結果複合裝置對一指定維持電流具有 較低電阻，此處「維持電流」為可通過裝置不會造成裝置 失誤的最大電流。 5 三、[發明内容] 經濟部智慧財產局員工消費合作社印製 如國際專利公告案第WO99/53505號（雷肯公司，公告 曰1999年10月21日）所述，其揭示内容併述於此以供參 考，複合裝置可經由將個別裝置分類然後將分類後的裝置 組裝成為複合裝置製備。此種過程冗長，原因在於需要讀 1〇取個別裝置的電阻。發明人今日發現根據本發明可製備^ 層總成，由此總成可劃分為個別複合裝置。此種總成允許 同時製備大量複合裝置。此外，因此處所述方法允許總成 各層於製造成總成之前或之後圖樣化，故由相同起始層可 製備成多種不同裝置。此外，各層的組合容易改變，允許 15單純增強具有組合功能的裝置。各層間之多種互連架構可 簡單實施，具有多種外部電氣接點的裝置可製造而未改變 基本製程。此處所述全部皆進一步增加可由此處揭示方法 以廉價方式量產的不同裝置之寬廣範圍。 本發明提供可於一總成進行多種操作步驟之方法及程 20序，其經由沿x及y方向（此處X及y係對應於層狀pTC 元件平面方向）再度劃分成為複合裝置而獲得複數裝置。 以此種方式製備裝置為優於其它方法的顯著改良，例如述 於國際公告案第WO99/53505號，原因在於對本發明而言 個別裝置無需個別組裝，提高效率因而降低製造過程成 -4-^75107 Furthermore, the power dissipation of such a composite device is substantially independent of the power dissipation of one of the individual devices. As a result, the composite device has a lower resistance to a specified holding current, where "maintaining current" is the maximum current that can pass through the device without causing a device error. 5 III. [Inventive content] The Ministry of Economic Affairs' Intellectual Property Office employee consumption cooperative is printed as described in International Patent Publication No. WO99/53505 (Reken Company, Announcement, October 21, 1999), and its disclosure is described in For reference, the composite device can be prepared by sorting individual devices and then assembling the sorted devices into a composite device. This process is lengthy because it requires reading 1 to take the resistance of the individual devices. The inventors have found today that a layer assembly can be prepared in accordance with the present invention whereby the assembly can be divided into individual composite devices. Such an assembly allows for the simultaneous preparation of a large number of composite devices. Moreover, the method described herein thus allows the layers of the assembly to be patterned before or after fabrication into the assembly, so that the same starting layer can be prepared into a variety of different devices. In addition, the combination of layers is easily changed, allowing 15 to simply enhance the device having the combined function. Multiple interconnect architectures between layers can be easily implemented, and devices with a variety of external electrical contacts can be fabricated without changing the basic process. All of the herein described further increase the broad range of different devices that can be mass produced in an inexpensive manner by the methods disclosed herein. The present invention provides a method and a sequence of steps for performing a plurality of operational steps in an assembly, which are obtained by re-dividing into a composite device in the x and y directions (where X and y are corresponding to the planar direction of the layered pTC element) Device. The preparation of the apparatus in this manner is a significant improvement over other methods, such as that described in International Publication No. WO99/53505, because for the purposes of the present invention, individual devices need not be individually assembled, increasing efficiency and thereby reducing the manufacturing process.

本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） A7 1275107 B7 五、發明說明（3 ) 本。最後，組合各層材料形成此處揭示之複合裝置之方法 允許極為簡單而又適合方法用以形成多種裝置而無需改變 基本製造程序。 於第一特徵方面，本發明提供一種製造一複合聚合物 5 電路保護裝置之方法，該方法包含 (1) 提供一聚合物總成包含 (a) 提供第一及第二積層，各積層包含一層狀聚合物 元件具有至少一導電表面， (b) 提供一導電材料圖樣於一積層之導電表面之至 10 少一面上； (C)以預定配置牢固固定積層於一堆疊，至少一積 層之至少一導電表面構成該堆疊之外部導電表 面，以及 (d)製造複數電氣連結介於第一積層之導電表面與 15 第二積層之導電表面間；以及 (2) 將該堆疊再劃分成為個別裝置，各該裝置包含至少 一電氣連結。 於第二特徵方面，本發明提供一種聚合物總成，包 經濟部智慧財產局員工消費合作社印製 含·· 20 (a) —第一積層包含一層狀聚合物元件具有至少一導電 表面有圖樣； (b) —第二積層包含一層狀聚合物元件具有至少一導電 表面有圖樣，該第二積層係牢固固定於堆疊的第一 積層，故該積層具有第一及第二外部導電表面；以 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 五、發明說明（4) 及 (C)複數橫向導電件，其貫h 第一與第二外部導電表面間。 第二積層介於 使用本發明之方法或總 極前驅物呈電阻元件上具i適當=的製法可經由形成電 ，阻元件係大於預定最終形狀，形成的導^表面形式，該 受’該堆疊亦大於預定最終形狀：電阻元件之堆 分為個別裳置。具有適當形狀的電極將該堆疊再劃 10 15 20 之任一者或任-種组合之非期望的部份i!取:導電表面 研磨、_或钱刻（舉例)達成。伤，°取除可經由 藉化學氣相聽、魏積、濺料將==驅物可經由 PTC電阻元件表面之任一者或任、^電材料圖樣化至 也可使用黏著劑或繋，士戶扩、及口形成。導電材料 激雷mi PTC電阻元件表面。複 叫八為疋導電表面組合間的電互連可於堆疊被再 ==置之前達成。另外，部份或全部預定電極或 接點=的電連結可於堆疊被再劃分為複合裝置之後做成連 結。電互連可設計成介於堆疊之導電表面或裝置之電極之 部份間做成連結，但非全部。 如此於第二特徵方面，本發明提供一種複合裝置其例 如可使用本發明之第—方面之方法或第二方面之總成製 造’該裝置包含 (1) 第一及第二外部層狀電極， (2) 第三及第四内部層狀電極， (3) 第-及第二層狀pTC電阻元件，其個別⑴具有 -6- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） A7 1275107 B7 五、發明說明（5 ) PTC表面，及(ii)包含由一種PTC導電聚合物組成 的層狀元件， 該第一電阻元件具有第一外部電極牢固固定之 第一面，以及第三内部電極牢固固定之相反第二 5 面，以及該第二電阻元件具有一第二外部電極牢固 固定的第一面及一第四内部電極牢固固定的相反的 第二面， (4) 一第五外部層狀導電件，其⑴牢固固定於第一 PTC 電阻元件之第一面，以及（ii)與第一外部電極隔 10 開， (5) —第六外部層狀導電件，其⑴牢固固定於第二PTC 電阻元件之第一面，以及（ii)與第二外部電極隔 開，This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) A7 1275107 B7 V. Invention description (3). Finally, the method of combining the various layers of materials to form the composite device disclosed herein allows for an extremely simple and suitable method for forming a variety of devices without changing the basic manufacturing process. In a first feature aspect, the present invention provides a method of fabricating a composite polymer 5 circuit protection device, the method comprising: (1) providing a polymer assembly comprising (a) providing first and second laminates, each laminate comprising a The layered polymer element has at least one conductive surface, (b) providing a conductive material pattern on at least one side of a laminated conductive surface; (C) firmly fixing the layer in a stack in a predetermined configuration, at least one layer of at least one layer a conductive surface forming an outer conductive surface of the stack, and (d) fabricating a plurality of electrical connections between the conductive surface of the first buildup and the conductive surface of the second buildup; and (2) subdividing the stack into individual devices, Each of the devices includes at least one electrical connection. In a second feature aspect, the present invention provides a polymer assembly, packaged by the Ministry of Economic Affairs, Intellectual Property Office, and a consumer cooperative cooperative. 20 (a) - the first laminate comprises a layered polymer element having at least one conductive surface (b) - the second laminate comprises a layered polymer element having at least one conductive surface patterned, the second laminate being firmly fixed to the first laminate of the stack, such that the laminate has first and second outer conductive surfaces Apply the Chinese National Standard (CNS) A4 specification (210x297 mm) on the paper scale. 5. Inventive Note (4) and (C) The plurality of transverse conductive members are between the first and second external conductive surfaces. The second laminate is in the form of a conductive surface formed by using the method of the present invention or the total electrode precursor on the resistive element, wherein the resistive component is larger than the predetermined final shape, and the formed surface is formed by the formation of the surface. Also greater than the predetermined final shape: the stack of resistive elements is divided into individual skirts. An electrode having a suitable shape is used to subdivide the stack by any one of 10 15 20 or any undesired portion of the combination i! Take: the conductive surface is ground, or etched, for example. Injury, ° can be removed by chemical vapor, Wei, and spatter. == The drive can be patterned via any of the PTC resistive elements or any of the electrical materials. Adhesives or systems can also be used. The expansion of the family and the formation of the mouth. Conductive material The surface of the mi PTC resistive element. The electrical interconnection between the eight sets of conductive surface combinations can be achieved before the stack is re-set. Alternatively, some or all of the predetermined electrodes or contacts = electrical connections may be made after the stack is subdivided into composite devices. The electrical interconnects can be designed to be joined, but not all, between the conductive surfaces of the stack or portions of the electrodes of the device. In a second feature aspect, the present invention provides a composite device which can be fabricated, for example, using the method of the first aspect of the invention or the assembly of the second aspect. The device comprises (1) first and second outer layered electrodes, (2) Third and fourth internal layered electrodes, (3) First and second layered pTC resistor elements, individually (1) with -6- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) A7 1275107 B7 5. Invention Description (5) The PTC surface, and (ii) comprises a layered element composed of a PTC conductive polymer, the first resistive element having a first surface to which the first external electrode is firmly fixed, and The third internal electrode is fixedly fixed to the opposite second 5th surface, and the second resistive element has a second surface fixedly fixed by the second external electrode and a second opposite surface fixedly fixed by the fourth internal electrode, (4) a fifth outer layered conductive member, wherein (1) is firmly fixed to the first surface of the first PTC resistance element, and (ii) is separated from the first external electrode by 10, (5) - a sixth outer layered conductive member, (1) is firmly Fixed to the second PTC resistor element The first side, and (ii) is separated from the second outer electrode,

(6) —第七内部層狀導電件，其⑴牢固固定於第一 PTC 15 電阻元件之第二面，以及（ii)與第三内部電極隔 開， 經濟部智慧財產局員工消費合作社印製 (7) —第八内部層狀導電件，其(i)牢固固定於第二PTC 電阻元件之第一面，以及（ii)與第四内部電極隔 開， 20 (8)—第一孔隙通過第一層狀PTC元件之第一外部電 極與第二層狀PTC元件之第二外部電極間， (9)一第二孔隙，其係介於第一層狀PTC元件之第五 外部層狀導電件與第二層狀PTC元件之第六外部 層狀導電件間， 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） l275l〇7(6) - a seventh internal layered conductive member, (1) firmly fixed to the second side of the first PTC 15 resistive element, and (ii) separated from the third internal electrode, printed by the Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative (7) - an eighth inner layered conductive member, (i) firmly fixed to the first surface of the second PTC resistance element, and (ii) spaced apart from the fourth inner electrode, 20 (8) - the first aperture passes Between the first external electrode of the first layered PTC element and the second external electrode of the second layered PTC element, (9) a second aperture which is interposed between the fifth outer layer of the first layered PTC element Between the sixth outer layered conductive member of the second layered PTC element, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). l275l〇7

五、發明說明（ 經濟部智慧財產局員工消費合作社印製 do)—第一橫向導電件其 (a)位於第一孔隙内部， 於第-層狀PTC元件之第—外部電極 層狀PTC元件之第二外部電極間，。弟― ⑷牢固ϋ定於第-PTC元件、第二 第三層狀元件，以及 70件及 =物理方纽魏料至第—外· 第七内部層狀導電件、第八内部層狀導電件以 及第一外部層狀電極’但未連結至第三或 内部電極，以及 (11) 一第二橫向導電件其 (a) 位於第二孔隙内部， (b) 2第五外部層狀導電件與第六外部層狀導 ⑷牢固蚊於第-PTC元件、第二PTC元件及 第二層狀聚合物層，以及 ⑷以物理方式及電性連結至第五外部層狀導電 件、第三内部電極、第四内部電極以及第六外 20 部層狀導電件，但未連結至第-或第二外部電 才系〇 2第四特徵方面，本發明提供—種錢上根據本發明 ，財面之方法，餘製造複合裝置，電氣組件係附 ;裝置上。此等組件可在總成再劃分成為個別裝置之前 17於總成上，或是在再劃分之後附加於裴置上。 5 10 15 本纸張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） 四 電 1275107 A7 B7 五 、發明說明（〇 10 15 經濟部智慧財產局員工消費合作社印製 20 在第五特徵方面’本發明提供—種纽上根據本發明 特徵方面之方法’驗製造複合裝置，裝置包含額外 的導電層於外部導電表面之至少—面的至少—部份上。此 額外的導電層可餘形成-電氣連結襯墊妓—可再連姓 接觸襯塾以便電氣組件之附接n本發明包含藉由： 發明之第四以及第五特徵方面之方法所製成之裝置。 四、[實施方式] ' 人如後文所述及申請專利且如附圖舉例說明，本發明结 ^多=特色，此處此種特色係以某種内文揭示或揭^作^ —特定組合的一部份，也可用於其它内文及其它組合包括 任何多項特色的組合。 ^本發明之組成及裝置概略包含至少一層狀聚合物元件 或電阻元件，其包含—種PTC組合物，具有正溫度係數 (PTc)表現’亦即於相對小的溫度範圍，電阻係數可隨溫 度產生鮮明增高，「PTC」-則於此處表種組= 或裝置其具有rm值至少為2.5及/或Ri⑼值至少為1〇，較 佳^合物或裝置因具有113()值至少為6,此處Ri4為於^ c範圍之終點及起點之電阻係數比，Ri⑼為於1〇〇它範圍 之終點及起點之電阻係數比，及為於3(rc範圍之終點 及起點之電阻係數比。 一 用於本發明之PTC組合物較佳為導電聚合物，其包含 一種結晶性聚合物成分，於聚合物成分内分散一種粒狀填 料成分包含導電填料例如碳黑或金屬。填料成分也含有」 -9- 本纸張尺度適用中國國家標準(CNS)A4規格（210 x297公釐^ —----V. Description of the invention (Printed by the Consumers' Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs, do)—The first lateral conductive member (a) is located inside the first aperture, and the first external layer of the first layered PTC element is a layered PTC element. Between the second external electrodes. Brother - (4) firmly defined in the first PTC element, the second third layered element, and 70 pieces and = physical square material to the first - outer · seventh inner layered conductive member, the eighth inner layered conductive member And a first outer layered electrode 'but not connected to the third or inner electrode, and (11) a second lateral conductive member (a) located inside the second aperture, (b) 2 fifth outer layered conductive member and a sixth outer layered guide (4) firmly secured to the first PTC element, the second PTC element, and the second layered polymer layer, and (4) physically and electrically coupled to the fifth outer layered conductive member, the third inner electrode The fourth internal electrode and the sixth outer 20 layered conductive member, but not connected to the fourth or second external electrical system 2, the fourth feature aspect, the present invention provides a money according to the present invention, The method, the manufacturing of the composite device, the electrical component attached; the device. These components may be attached to the assembly before the assembly is subdivided into individual devices, or attached to the device after subdivision. 5 10 15 This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm). Four electric 1275107 A7 B7 V. Invention description (〇10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 in the fifth In a feature aspect, the invention provides a composite device in accordance with the method of the features of the present invention, the device comprising an additional conductive layer on at least a portion of at least a face of the outer conductive surface.形成形成-Electrical connection pad 妓 - can be connected to the lining to attach the lining for attachment of the electrical component. The invention comprises a device made by the method of the fourth and fifth aspects of the invention.方式] 'A person as described later and patent application and as illustrated in the accompanying drawings, the present invention is more than a feature. Here, the feature is disclosed or disclosed in a certain context. The invention may also be used in other contexts and other combinations including any combination of features. The composition and apparatus of the present invention generally comprise at least a layered polymer element or a resistive element comprising a PTC composition having Positive temperature coefficient (PTc) performance 'is also in a relatively small temperature range, the resistivity can be significantly increased with temperature, "PTC" - then here the group = or the device has a rm value of at least 2.5 and / or The value of Ri(9) is at least 1〇, and the preferred compound or device has a value of 113() of at least 6, where Ri4 is the resistivity ratio of the end point and the starting point of the ^c range, and Ri(9) is in the range of 1〇〇. The ratio of the resistivity of the end point and the starting point is the ratio of the resistivity of the end point and the starting point of the range of 3 (the PTC composition used in the present invention is preferably a conductive polymer comprising a crystalline polymer component, Dispersing a granular filler component in the polymer component contains a conductive filler such as carbon black or metal. The filler component also contains -9- This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 x 297 mm ^ —-- -

1275107 A7 B7 五、發明說明（8) 種非導電填料，非導電填料不僅改變導電聚合物的電氣性 質同時也改變物理性質。組合物也含有一或多種其它成 分，例如抗氧化劑，交聯劑，偶合劑，阻燃劑，或彈性 體。PTC組合物較佳具有電阻係數於23°c小於50歐姆-厘 5 米，特別小於10歐姆-厘米，尤其小於5歐姆-厘米。用於 本發明之適當導電性聚合物揭示於例如美國專利案第 4,237,441 (van Konynenburg 等人），4,304,987 (van Konynenburg 等人），4,514,620 (Cheng 等人），4,534,889 (van Konynenburg 等人），4,545,926 (Fouts 等人）， 10 4,724,417 (Au 等人），4,774,024 (Deep 等人），4,935，156 (van Konynenburg 等人），5,049,850 (Evans 等人）， 15 5,378,407 (Chandler·等人），5,451，919 (Chu 等人）， 5,582,770 (Chu 等人）’ 5,747，147 (Wartenberg 等人）以及 5,801，612號（Chandler等人），及美國專利申請案第 09/364,504 號（Isozaki 等人，申請曰 1999 年 7 月 3〇 曰）。 此等專利案及申請案之揭示併述於此以供參考。 另外PTC組合物可為陶瓷材料。 層狀元# 經濟部智慧財產局員工消費合作社印製 20 本發明之裝置較佳包含PTC纽元件，其為層狀元件 且可由一或多種導電聚合物件組成，其中至少—導 物件係由PTC材料組成。當有多於—種導電聚合物ς 時，電流較佳循序流經不同組合物，例如當各組 狀形式而伸展跨整個裝置。t有單—PTC組合 曰 元件之預定厚度係大於單-步驟可方便地製備的厚度，具 -10- A7 B7 1275107 五 '發明說明（9) 有預定厚度之PTC元件可方便地經由將二或多層例如熔 體擠壓層PTC組合物利用加熱及加壓積層結合在一起製 備。當有多於一種PTC組合物時，PTC元件通常係經由 例如利用加熱及加壓積層不同組合物元件接合在一起製 5 備。 本發明之總成包含第一及第二積層，且包含額外積 層。第一及第一積層各自包含一層狀聚合物元件，具有至 少一導電表面例如呈下述金屬箔電極形式，本說明書中，1275107 A7 B7 V. INSTRUCTIONS (8) Non-conductive fillers that not only alter the electrical properties of the conductive polymer but also change the physical properties. The composition also contains one or more other ingredients such as an antioxidant, a crosslinking agent, a coupling agent, a flame retardant, or an elastomer. The PTC composition preferably has a resistivity of less than 50 ohm-cm 5 m at 23 ° C, particularly less than 10 ohm-cm, especially less than 5 ohm-cm. Suitable conductive polymers for use in the present invention are disclosed, for example, in U.S. Patent Nos. 4,237,441 (van Konynenburg et al.), 4,304,987 (van Konynenburg et al.), 4,514,620 (Cheng et al.), 4,534,889 (van Konynenburg et al.), 4,545,926 ( Fouts et al., 10 4,724,417 (Au et al.), 4,774,024 (Deep et al.), 4,935,156 (van Konynenburg et al.), 5,049,850 (Evans et al.), 15 5,378,407 (Chandler et al.), 5,451,919 ( Chu et al., 5, 582, 770 (Chu et al.), 5, 747, 147 (Wartenberg et al.) and 5, 801, 612 (Chandler et al.), and U.S. Patent Application Serial No. 09/364,504 (Isozaki et al., filed 1999) July 3〇曰). The disclosures of these patents and applications are hereby incorporated by reference. Additionally the PTC composition can be a ceramic material. Layered Element #Ministry of Economics Intellectual Property Office Staff Consumer Cooperative Printed 20 The device of the present invention preferably comprises a PTC button element which is a layered element and which may be comprised of one or more conductive polymer members, at least - the guide member is made of a PTC material composition. When there is more than one type of conductive polymer ,, the current preferably flows sequentially through the different compositions, e.g., as the various forms extend across the entire device. t has a single-PTC composite 曰 element of the predetermined thickness is greater than the single-step can be easily prepared thickness, with -10- A7 B7 1275107 five 'invention description (9) PTC element with a predetermined thickness can be conveniently passed through the second or Multilayers such as melt extruded layer PTC compositions are prepared by combining heat and pressure laminates. When there is more than one PTC composition, the PTC elements are typically joined together by, for example, laminating different composition elements using heat and pressure. The assembly of the present invention comprises first and second laminates and includes additional laminates. The first and first laminates each comprise a layered polymer element having at least one electrically conductive surface, for example in the form of a metal foil electrode as described below, in this specification,

各積層係指一層。第一及第二積層之層狀元件包含PTC 10組合物其為相同，或各層包含不同的PTC組合物。例如 可使用具有不同電阻係數之PTC組合物，互連架構修訂 成一層作為加熱器，而第二層作為過電流保護裝置。各層 也包含具有不同交換溫度（亦即裝置由低電阻態交換成高 電阻態之>孤度）之PTC組合物。例如此種裝置可用於形成 15雙層PTC溫度感測器，一層對較低溫範圍最敏感，而第 二層對較高溫範圍最敏感。此外，積層中之一或多層包含 零電阻溫度係數(ZTC)組合物或負電阻溫度係數(NTCS)組合 物0 各積層無需包含一層導電層。例如其它可用於複合裝 20置之層狀元件之組合物包含介電材料例如聚酯或填充介電 材料如FR4環氧樹月旨。可作為絕緣層，對裝置提供額外剛 硬性，或材料可選擇有助於架設及包裝裝置。此外，層狀 7L件包含一種組合其具有相當高之導熱係數而可辅助於複 σ物之各層間傳熱，或基材與複合物之表面架設裝置之一 計 線Each layer refers to a layer. The layered elements of the first and second laminates comprise the same composition of the PTC 10 composition, or the layers comprise different PTC compositions. For example, PTC compositions having different resistivities can be used, with the interconnect structure revised to a layer as a heater and the second layer as an overcurrent protection device. Each layer also contains a PTC composition having different exchange temperatures (i.e., the device is switched from a low resistance state to a high resistance state). For example, such a device can be used to form a 15-layer PTC temperature sensor, one layer being most sensitive to the lower temperature range and the second layer being most sensitive to the higher temperature range. In addition, one or more of the layers includes a zero temperature coefficient of resistance (ZTC) composition or a negative temperature coefficient of resistance (NTCS) composition. 0 The layers do not need to include a conductive layer. For example, other compositions useful for laminating elements of composite 20 comprise a dielectric material such as a polyester or a filled dielectric material such as FR4 epoxy. It can be used as an insulating layer to provide additional rigidity to the unit, or the material can be selected to aid in erection and packaging. In addition, the layered 7L member comprises a combination of a surface erection device which has a relatively high thermal conductivity and which can assist in the heat transfer between the layers of the complex sigma or the substrate and the composite.

經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 -11- 1275107Ministry of Economic Affairs, Intellectual Property Bureau, X Consumer Cooperatives, Printing -11- 1275107

10 15 經濟部智慧財產局員工消費合作社印製 20 層間傳熱。相反地，層狀元件包含組合物—餘合物，复 具有相對較低導熱係數可作為各層間之絕、 材間之絕熱體。當希望裝置可響應過電壓^，；_層^= 含-種材料其通常為絕緣但當達到某種電壓閾值位準時= 成導電。此種組合物包含變阻器粒子分散於聚合 内。其它可用於本發明之各個具體實施例之組合物包括阻 燃^料、膨脹劑、及微波吸收材料俾允許裝置使用特定頻 率範圍之輻射加熱。 構成總成用以製備複合裝置之層狀元件厚度可有不 同。例如極薄的層狀元件可用為單層用以提供極低電阻， 而較厚的層狀元件可用作為第二層俾提供機械強度。 電極及導雷轰面 藉本發明方法製造的特別有用的裝置包含至少二金屬 箔電極，有聚合物元件夾置於其間。特別有用的裝置包含 一堆疊包含η種聚合物ΡΤ(：元件，其各自有二金屬箔電 極’以及(n-1)黏著層以交錯圖樣夾置於pTC元件間俾形成 複合裝置’ PTC元件包含堆疊的頂及底組件。此種裝置具 有電極電連結，故PTC元件將並聯連結，結果形成一種 複合裝置具有低電阻，於20°C通常為低於10歐姆，較佳 低於5歐姆，更佳低於1歐姆，特別低於〇 5歐姆，又更 低電阻亦屬可能例如低於〇·〇5歐姆。特別適當的箔電極為 顯微粗糙金屬箔電極，特別揭示於美國專利第4,689,475 (Matthiesen)及4,800,253號(Kleiner等人）以及國際專利公 告案第WO95/34081號（雷肯公司，公告曰1995年12月 •12- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐）10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 layers of heat transfer. Conversely, the layered element comprises a composition-residue having a relatively low thermal conductivity as a thermal barrier between the layers. When it is desired that the device can respond to an overvoltage, the layer is normally insulated but becomes conductive when a certain voltage threshold level is reached. Such a composition comprises varistor particles dispersed within the polymerization. Other compositions useful in various embodiments of the present invention include flame retardants, expansion agents, and microwave absorbing materials that allow the device to use radiant heating at a particular frequency range. The thickness of the layered components used to form the composite device can vary. For example, an extremely thin layered element can be used as a single layer to provide very low resistance, while a thicker layered element can be used as a second layer to provide mechanical strength. Electrodes and Thunderbolts A particularly useful apparatus made by the method of the present invention comprises at least two metal foil electrodes with a polymeric element sandwiched therebetween. A particularly useful apparatus comprises a stack comprising η kinds of polymer ΡΤ (: elements each having two metal foil electrodes ' and (n-1) an adhesive layer interposed between pTC elements in a staggered pattern to form a composite device PTC element comprises Stacked top and bottom assemblies. Such devices have electrical connections to the electrodes, so that the PTC elements will be connected in parallel, resulting in a composite device having low resistance, typically less than 10 ohms, preferably less than 5 ohms at 20 ° C. Preferably less than 1 ohm, especially less than 〇5 ohm, and lower resistance is also possible, for example, below 〇·〇5 ohm. A particularly suitable foil electrode is a micro-rough metal foil electrode, particularly disclosed in U.S. Patent No. 4,689,475 ( Matthiesen) and 4,800,253 (Kleiner et al.) and International Patent Publication No. WO95/34081 (Reken Company, Announcement 曰 December 1995 • 12- This paper scale applies the Chinese National Standard (CNS) A4 specification (210x297 mm) )

A7 B7 1275107 五、發明說明（n) M日），其揭示併述於此以供參考。電極可經修改而產生 預疋熱效應，因而對複合裝置各層間之各個互連點提供電 接觸點俾獲得預定功能，以及提供電接觸點用以架設裝置 於印刷電路板、容座、晶片或其它適當用途。結合多重内 5部及外部接觸點之複合裝置例如顯示於圖16至20，22及 23 〇 10 省類似的金屬箔類型可用於於聚合物總成形成層合物的 導電表面。另外，導電表面可由導電油墨、濺鍍或以其它 方式施用的金屬層、金屬網或其它適當層形成。特佳導電 面為可蝕刻表面例如用於圖樣化及/或容易焊接表面。積 層之導電表面具有於25 C之電阻係數至少比其附著的聚合 物元件於25°C之電阻係數低1〇〇倍。 " 、圖樣於一指定積層兩邊可相同或可相異。額外圖樣可 15 1成於製程的任-點’例如-旦形成堆㈣斜形成於積 二，外部導電表面，或作為附件於堆疊總成完成前附著於 内部導電表面。 、 叉導體 經濟部智慧財產局員工消費合作社印製 「孔隙」一詞用於此處表示一開口，其當以相對於裝 置平面直角觀視時， 、 20 (a) 具有閉合的截面例如圓形、_或概略多角形，或 (b) 具有狀截面’「凹人載面」—詞用於此處表示開 玫性截面其⑴深度至少為截面之最大寬度之〇15 倍，杈佳至少0.5倍，特佳至少12倍，例如四分 之一圓或半圓或末端開放的開槽，及/或至少有 -13- 本紙張尺度適用中國6標準(CNS)A4規格（21〇 X 297公楚) 經濟部智慧財產局員工消費合作社印製 1275107 A7 B7 五、發明說明（I2 ) 一部份此處截面的兩相對緣彼此平行。 由於本發明涉及可劃分成複數電裝置的總成，故孔隙 通常具有封閉截面，但若-或多條劃分線通過封閉截面的 孔隙，則所得裝置的孔隙將具有開放截面。雖然用於某此 5具體實施例，希望開放截面為如前定義的凹部截面，但為 了確保通過孔隙的交叉導體於裝置的安裝或使用期間不會 受損或鬆脫’用於其它具體實施例，較佳交叉導體係錢^ 於裝置之橫向平坦面上。為了製造此種裝置，較佳^成 (欲劃分為多個裝置)具有複數細長矩形孔隙例如開槽而各 10自有金屬鐘敷於其上。然後總成經劃分成鑛敷孔 坦橫向導電件於多個裝置上。 、千 總成的孔隙可具有不同大小及/或形狀俾配合裝置的配 置及載流能力。 孔隙可為圓孔’圓孔用於多個案例為滿意，但若總成 15包括孔隙’該等孔隙由至少一條劃分線所橫過，則以細長 孔隙為較佳，原因在於對劃分線的準確度的要求較低故。 >當孔隙未被齡線所橫過時，可如具有所需載流能力 的父叉導體方便般的小孔隙。通常單一交又導體為對第一 電極至裝置反邊做電連結全部所需。但二或多交叉導體可 20用以製造相同連結。交又導體數目之大小及其熱容對電路 保護裝置的失誤率有影響。通常孔隙及交又導體伸展遍布 總成全部各層。另外孔隙及交又導體可僅伸展於總成之某 些層而形成具有不同功能的裝置。 隙可於交又導體安置定位前形成’或孔隙的形成與 _— -14- 本纸張尺度賴中關家標----A7 B7 1275107 V. Description of the Invention (n) M-day), which is hereby incorporated by reference. The electrodes can be modified to produce a pre-heating effect, thereby providing electrical contact points to the various interconnection points between the various layers of the composite device to achieve a predetermined function, and providing electrical contacts for mounting the device on a printed circuit board, receptacle, wafer or other Proper use. A composite device incorporating multiple inner and outer contact points, such as the one shown in Figures 16 through 20, 22 and 23, can be used to form a conductive surface of the polymer assembly. Alternatively, the conductive surface can be formed from a conductive ink, a metal layer that is sputtered or otherwise applied, a metal mesh, or other suitable layer. Particularly preferred conductive surfaces are etchable surfaces such as for patterning and/or easy soldering of the surface. The laminated conductive surface has a resistivity at 25 C that is at least 1 times lower than the resistivity of the attached polymer component at 25 °C. " , the pattern on the two sides of a specified layer can be the same or can be different. The additional pattern may be formed at any point of the process, for example, forming a stack (four) obliquely formed on the second conductive outer surface, or as an attachment to the inner conductive surface prior to completion of the stack assembly. The term "pore" printed by the Intellectual Property Office of the Ministry of Economic Affairs of the Fork Conductor Ministry of Economics is used to denote an opening here, when viewed at right angles to the plane of the device, 20 (a) has a closed section such as a circle. , _ or a rough polygon, or (b) a section of ''concave man''''''''''''''' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Times, especially good at least 12 times, such as quarter circle or semicircle or open slot, and / or at least -13 - this paper size applies to China 6 standard (CNS) A4 specifications (21〇X 297 public Chu ) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1275107 A7 B7 V. Invention Description (I2) The two opposite edges of the section here are parallel to each other. Since the present invention relates to an assembly that can be divided into a plurality of electrical devices, the apertures typically have a closed cross-section, but if - or more of the dividing lines pass through the apertures of the closed cross-section, the apertures of the resulting device will have an open cross-section. Although for some of the 5 specific embodiments, it is desirable that the open cross section is a recessed section as previously defined, but to ensure that the crossover conductor through the aperture will not be damaged or loosened during installation or use of the device 'for other specific embodiments Preferably, the cross-conducting system is on the laterally flat surface of the device. In order to manufacture such a device, it is preferred (to be divided into a plurality of devices) having a plurality of elongated rectangular apertures such as slots and each of which has its own metal clock applied thereto. The assembly is then divided into ore-filled transverse conductive members on a plurality of devices. The pores of the thousand assemblies may have different sizes and/or shapes, configurations of the mating device, and current carrying capacity. The pores may be round holes. The round holes are satisfactory for many cases, but if the assembly 15 includes pores, the pores are traversed by at least one dividing line, the elongated pores are preferred because of the dividing line. The accuracy requirement is lower. > When the pores are not traversed by the age line, it is as small as possible for the parent fork conductor having the desired current carrying capacity. Usually a single cross and a conductor are all required to electrically connect the first electrode to the opposite side of the device. However, two or more cross conductors 20 can be used to make the same link. The number of conductors and their heat capacity have an impact on the failure rate of the circuit protection device. Usually the pores and the cross-conductors extend across all layers of the assembly. In addition, the apertures and the conductors may extend only over certain layers of the assembly to form devices having different functions. The gap can be formed before the placement of the conductor and the positioning of the conductor or the formation of the pores _- -14- The paper scale depends on the Zhongguan family standard -----

1275107 一—— 五、H呑兄明U3 ； 交叉導體的安置可同時進行。較佳程序係例如藉鑽孔、切 片、路由或任何其它適當技術形成孔隙，及然後鍍敷或以 其它方式塗裝或填補孔隙内表面。鍍敷可藉無電鍍敷或電 解鍍敷或藉二者的組合進行。鍍敷可為單層或多層且可由 5單一金屬或金屬混合物特別焊料組成。鍍敷經常係形成於 總成之其它暴露導電面上。若此種鍍敷不合所需，則其它 暴露導電面可被遮蔽或以其它方式脫敏化，或可選擇性去 除非期望的鑛敷層。本發明包括鑛敷不僅產生交叉導體同 時也產生裝置之層狀導電件之至少一部份的可能性。 10 用以製造貫穿絕緣電路板之導電通孔的鍍敷技術可用 於本發明。 另一項提供交叉導體之技術係將可模製或液態導電組 合物置於預先形成的孔隙内，若屬期望或若有所需導電組 合物於孔隙内處理組合物，因而產生具有預定性質的交叉 15導體。組合物可例如利用篩網選擇性供給孔隙，或若有所 需於前處理至少部份總成使組合物不會沾黏後供給於全體 總成。例如若有所需熔融導電組合物及焊料可使用波焊接 技術以此種方式使用。 父叉V體也可由預先形成件提供，例如金屬桿或管例 20 如鉚釘。當使用此種預先形成件時，可於其置於裝置内定 位時形成孔隙。 交叉導體可部份或完全填補孔隙。當孔隙被部份填補 時，玎於裝置連結至其它電氣組件特別藉焊接過程連結時 進一步填補（包括完全填補）。可藉提供額外焊料於孔隙内 -15- 本紙張尺度適用中國國家標準(CNS)A4規格（210 X297公釐）1275107 One - five, H呑 brother Ming U3; the placement of the cross conductor can be carried out simultaneously. The preferred procedure is to form apertures, such as by drilling, dicing, routing, or any other suitable technique, and then plating or otherwise coating or filling the inner surface of the aperture. Plating can be carried out by electroless plating or electrolytic plating or a combination of the two. The plating may be a single layer or a plurality of layers and may be composed of a single metal or a mixture of metals, particularly a solder. Plating is often formed on other exposed conductive surfaces of the assembly. If such plating is not desired, the other exposed conductive surfaces may be masked or otherwise desensitized, or may be selectively removed unless desired. The present invention includes the possibility that the mineral deposit not only produces a cross conductor but also produces at least a portion of the layered conductive member of the device. 10 Plating techniques for fabricating conductive vias through an insulated circuit board can be used in the present invention. Another technique for providing a cross-conductor is to place a moldable or liquid conductive composition in a preformed void, if desired or if the desired conductive composition is used to treat the composition within the pore, thereby producing a crossover having predetermined properties. 15 conductors. The composition can be selectively supplied to the pores, e.g., using a screen, or if desired, to pre-treat at least a portion of the assembly so that the composition does not stick to the entire assembly. For example, if desired, the molten conductive composition and solder can be used in this manner using wave soldering techniques. The parent fork V body can also be provided by a preform, such as a metal rod or tube 20 such as a rivet. When such a preform is used, the aperture can be formed when it is positioned within the device. The cross conductor can partially or completely fill the pores. When the pores are partially filled, they are further filled (including full filling) when the device is joined to other electrical components, especially by the soldering process. Additional solder can be supplied to the pores -15- This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X297 mm)

經濟部智慧財產局員工消費合作社印製 1275107 Α7 Β7 五、發明說明（μ 或周圍輔助，_包括焊料鍍敷於孔_及關。通常於 裝置連結至其它電氣組件前，至少部份交叉導體被安置定 位。但本發明包括交又導體係於連結過程例如於焊接過程 藉焊料的毛細作用形成。 5 《叉導體可設計成選擇性連結部份層亦即部份積層但 非全部，此種交叉導體示於圖15。此種交叉導體之製法包 含形成-孔隙其係大於交又導體的預定大小，以絕緣物質 填補孔隙，形成-内孔於絕緣物質内部，以及錢敷内孔而 使其變成導電性。此種方法使内電極與交叉導體絕緣但仍 10 然允許外電極做電連結。 非交叉導體之連接器 電極與PTC電阻元件之各面上的任何剩餘件間的電連 結較佳係經由前述交又導體進行。但可為任一種導體例如 -種導體即使未結合至裝置的其它部份仍可保持定位，例 15如U字形件其伸展環繞裝置之一層或多層組合末端。 剩餘層致導電件 經濟部智慧財產局員工消費合作社印製 本I明裝置之較佳具體實施例包含額外（剩餘）導電 件’其牢_定於PTC元件之與第二電極相同面上但與 第二電極分開。此一剩餘層狀導電件帶有交叉導體或其它 20連接器可呈現而提供電路徑至其它電極，電路徑係經由去 除部份層狀導電件形成，而該層狀導電件之剩餘部份作為 電極。剩餘層狀導電件可存在於層狀元件之内面及外面兩 面上。剩餘層狀導電件形狀以及剩餘件與電極中間間隙形 狀可變更而配合裝置的期望特性以及方便製造。剩餘導電 -16- 1275107Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1275107 Α7 Β7 V. Invention Description (μ or surrounding assistance, _ including solder plating on holes _ and off. Usually at least part of the cross conductor is connected before the device is connected to other electrical components Positioning. However, the present invention includes a cross-linking system formed by a capillary action of a soldering process such as a soldering process. 5 "The cross-conductor can be designed to selectively connect a partial layer, that is, a partial layer but not all, such a cross. The conductor is shown in Fig. 15. The method of manufacturing the cross conductor includes forming a void which is larger than a predetermined size of the conductor and the conductor, filling the pore with an insulating material, forming an inner pore inside the insulating material, and causing the inner hole to become Conductivity. This method insulates the inner electrode from the cross conductor but still allows the outer electrode to be electrically connected. The electrical connection between the connector electrode of the non-crossing conductor and any remaining parts on each side of the PTC resistor element is preferably Conducted via the aforementioned cross-conductor, but may be any type of conductor such as a type of conductor that remains positioned even if not bonded to other parts of the device, Example 15 such as U The glyph member is stretched around one or more layers of the combined end of the device. The remaining layer of the conductive member of the Ministry of Economic Affairs, the Intellectual Property Office, the employee consortium, and the preferred embodiment of the device include an additional (remaining) conductive member On the same side of the PTC element as the second electrode but separated from the second electrode. This remaining layered conductive member with a cross conductor or other 20 connectors can be presented to provide an electrical path to the other electrodes, the electrical path is via the removal portion The layered conductive member is formed, and the remaining portion of the layered conductive member serves as an electrode. The remaining layered conductive member may exist on the inner surface and the outer surface of the layered member. The shape of the remaining layered conductive member and the remaining member and the electrode are intermediate The shape of the gap can be changed to match the desired characteristics of the device and to facilitate manufacturing. Remaining Conductor-16- 1275107

五、發明說明（l5 5 10 15 經濟部智慧財產局員工消費合作社印製 20 牛方便地於矩形裝置-端為小矩形，藉__矩形_ 隔開。另外剩餘件可為島’藉—封閉截面間隙與電 開。裝置也可設計成不含剩餘層狀導電件，如圖12 所不。 其它層狀元# 裝置之第H層狀PTC電阻元件或總成之第 第二積層可以物理方式牢固@定成堆疊，使用第三 件介於其間形成堆疊。第三層狀元件包含非導電 如熱熔黏著劑或可硬化黏合材料，其中添加填料可 殊熱或機雜f 1三層狀元件也包含可魏單體或 無機系統例如環氧樹脂類，丙烯酸g旨類，丙烯系類，胺= 甲酸醋類，料、類，贿，賴樹賴等。若需要層狀: 件作為電絕緣體’則較佳電阻係數至少為1()6歐姆^米 特別至少H)9歐姆·厘米，某些具體實施例希望第三層狀元 件包含導電材料。用於此料體實施例，第三層狀元件用 於以電氣及物理方式將各層連結在—起。結合導電第三層 狀元件之複合裝置配置顯示於圖15。用於其它具體實ς 例，希望第三元件包含一種導電材料，其僅於一方向具有 導電性(參考圖14)。第三層狀元件也提供其 熱層而辅助複合裝置各層間的傳熱。 導 另外裝置可設計成不含分開層狀層俾將裝置之各元件 牢固固定在一起。例如可製造裝置其類似圖8所示但去除 層狀元件26。交叉導體32及52可仰賴電連結將二層並聯 連結’以及以物理方式將各層固定在-起。目21顯示另 -17- 本纸張尺度適用中國國家標準(CNS)A4規袼（2ΐ〇χ297公爱）V. Description of invention (l5 5 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 cattle conveniently in a rectangular device - the end is a small rectangle, separated by __ rectangle _. The remaining pieces can be borrowed - closed by the island The cross-section gap and the electrical opening. The device can also be designed to be free of residual layered conductive members, as shown in Figure 12. The other layered element # device of the H-layer PTC resistance element or the second layer of the assembly can be physically Firmly @定ed into a stack, using a third piece to form a stack between them. The third layered element contains a non-conductive material such as a hot-melt adhesive or a hardenable adhesive material, wherein the addition of the filler can be a special heat or a miscellaneous f 1 three-layered component Also included can be a monomer or inorganic system such as epoxy resin, acrylic acid, propylene, amine = formic acid vinegar, material, class, bribe, Lai Lai, etc. If required: layer as an electrical insulator 'The preferred resistivity is at least 1 () 6 ohms per meter, especially at least H) 9 ohms per centimeter, and certain embodiments contemplate that the third layered component comprises a conductive material. For this embodiment of the material, the third layered element is used to electrically and physically join the layers together. A composite device configuration incorporating a conductive third layered component is shown in FIG. For other specific examples, it is desirable that the third component comprises a conductive material that is electrically conductive only in one direction (refer to Figure 14). The third layered element also provides its thermal layer to aid in heat transfer between the various layers of the composite device. The additional device can be designed to be free of separate layers and securely hold the components of the device together. For example, a device can be fabricated which is similar to that shown in Figure 8 but with the layered element 26 removed. The cross conductors 32 and 52 can be connected in parallel by the electrical connection and the physical layers of the layers. Item 21 shows another -17- This paper scale applies to China National Standard (CNS) A4 regulations (2ΐ〇χ297 public)

經濟部智慧財產局員工消費合作社印製 1275107 A7 B7 五、發明說明（16) 一例，此處複合裝置無需分開層狀元件介於各層間。 裝置 於簡單裝置，如圖5所示，有二外部電極、二内部電 極、二交叉導體或其它導體以及四剩餘導電件。此種配置 5 有用原因在於裝置為頂至底對稱，允許方便藉自動化設備 或以其它方式安裝。 特佳本發明之電路保護裝置具有於23°C之電組小於1 歐姆，較佳小於0.5歐姆，特佳小於0.3歐姆，尤其小於 0.1歐姆，且包含第一及第二層狀PTC電阻元件，其各自 10 (a)由導電聚合物組成，該聚合物具有於23°c之電阻係數 小於50歐姆-厘米，較佳小於10歐姆-厘米，特佳小於5 歐姆厘米且具有PTC表現：以及(b)具有第一面及第二 面。第一外部金屬箔電極接觸第一 PTC元件之第一面， 而第二外部金屬箔電極接觸第二PTC元件之第一面。第 15 三及第四内部金屬箔電極分別接觸第一及第二PTC元件 之第二面。裝置較佳具有第五及第六剩餘外部金屬箔導電 件，第五接觸第一 PTC元件之第一面且與第一外部電極 隔開，第六接觸第二PTC元件之第一面且與第二外部電 極隔開。通常有第七及第八剩餘内部金屬箔導電件，第七 20 接觸第一 PTC元件之第二面且與第三内部電極隔開，而 第八接觸第二PTC元件之第二面且與第四内部電極隔 開。裝置也包含一或多個額外層狀聚合物元件其可為導電 或為絕緣。較佳額外元件之一為第三層狀聚合物元件，其 為絕緣，位於第一與第二PTC元件間，且牢固固定於 -18- 本紙張尺度適用中國國家標準(CNS)A4規格（210 X297公釐）Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 A7 B7 V. Invention Description (16) As an example, the composite device does not need to separate layered components between the layers. The device is shown in a simple device, as shown in Figure 5, having two external electrodes, two internal electrodes, two crossed conductors or other conductors, and four remaining conductive members. This configuration 5 is useful because the device is top-to-bottom symmetrical, allowing for easy installation by automated equipment or by other means. The circuit protection device of the present invention has a power group of 23 ° C which is less than 1 ohm, preferably less than 0.5 ohm, particularly preferably less than 0.3 ohm, especially less than 0.1 ohm, and includes first and second layered PTC resistor elements, Each of 10 (a) consists of a conductive polymer having a resistivity of less than 50 ohm-cm at 23 ° C, preferably less than 10 ohm-cm, particularly preferably less than 5 ohm cm and having PTC performance: and b) has a first side and a second side. The first outer metal foil electrode contacts the first side of the first PTC element and the second outer metal foil electrode contacts the first side of the second PTC element. The fifteenth and fourth inner metal foil electrodes contact the second faces of the first and second PTC elements, respectively. Preferably, the device has fifth and sixth remaining outer metal foil conductive members, the fifth contact first face of the first PTC component and spaced apart from the first outer electrode, and the sixth contact first face of the second PTC component and The two external electrodes are separated. There are generally seventh and eighth remaining inner metal foil conductive members, the seventh 20 contacts the second side of the first PTC element and is spaced apart from the third inner electrode, and the eighth contacts the second side of the second PTC element and The four internal electrodes are separated. The device also includes one or more additional layered polymeric elements which may be electrically conductive or insulative. One of the preferred additional components is a third layered polymer component that is insulated between the first and second PTC components and is firmly attached to the -18- paper scale for the Chinese National Standard (CNS) A4 specification (210). X297 mm)

[275107 A7 B7 五 、發明說明（Γ 10 15 經濟部智慧財產局員工消費合作社印製 20 ptc元件之暴露内表面，其可包含PTC元件的内面或其 内部電極或内部導電件。PTC元件、電極及剩餘導電件界 定二孔隙，第一孔隙係介於第一外部電極、第七及第八内 部剩餘導電件與第二外部電極間；而第二孔隙係介於第五 剩餘外部導電件、第三及第四内部電極與第六剩餘外部導 電件間，且通過第一及第二PTC元件及第三層狀聚合物 層（若存在）。此外，裝置包含第一及第二橫向導電件其係 由金屬組成。第一橫向導電件係位於第一孔隙内部，且以 物理及電性連結至第一及第二外部電極以及第七及第八内 部剩餘導電件。第二橫向導電件係位於第二孔隙内部，且 以物理方式及電性連結至第五及第六外部剩餘導電件以及 第三及第四内部電極。 其它裝置具體實施例不含剩餘(也稱做額外）導電件。 本發明裝置可具有任何適當尺寸。但應用上之一大優 點係讓I置大小儘可能縮小。較佳裝置具有最大維度^ 12毫米較佳至多7毫米及/或表面積至多6G平方毫来，較 佳至多40平方毫米，特別至多3〇平方毫米。表面積可^ 更小例如至多15平方毫米。 方法 此處揭示之方法可極為經濟地製造裝 =層堆疊上進行全部或大半方法步驟，然後將二 堆疊的劃分可沿通過任何、、部份或 主Η导電面或通過任何、部份或全部交 此等劃分線摘齡隔㈣财射具有讀特 19- 本紙張尺度適財關家標準χ 2-97公€ 計 線 1275107[275107 A7 B7 V. INSTRUCTIONS INSTRUCTIONS (Γ 10 15 The Intellectual Property Intelligence Bureau Employees Consumer Cooperatives prints the exposed inner surface of a 20 ptc component, which may include the inner surface of the PTC component or its internal electrodes or internal conductive members. PTC components, electrodes And the remaining conductive members define two apertures, wherein the first aperture is between the first external electrode, the seventh and eighth inner remaining conductive members and the second outer electrode; and the second aperture is between the fifth remaining outer conductive member, Between the third and fourth inner electrodes and the sixth remaining outer conductive member, and passing through the first and second PTC elements and the third layered polymer layer (if present). Further, the device includes first and second lateral conductive members The first lateral conductive member is located inside the first aperture and is physically and electrically connected to the first and second external electrodes and the seventh and eighth internal remaining conductive members. The second lateral conductive member is located The second aperture is internally and physically and electrically connected to the fifth and sixth outer remaining conductive members and the third and fourth inner electrodes. Other device embodiments do not contain the remaining (also called Additional) Conductive members. The device of the present invention can be of any suitable size. However, one of the great advantages of the application is to minimize the size of the I. The preferred device has a maximum dimension of 12 mm, preferably at most 7 mm and/or a surface area of at most 6 G. Square millimeters, preferably up to 40 square millimeters, especially up to 3 square millimeters. The surface area can be as small as, for example, up to 15 square millimeters. Methods The method disclosed herein can be used to manufacture all or most of the methods on a stack of layers very economically. Step, and then divide the two stacks along the pass through any, part or main conductive surface or through any, part or all of the dividing line to pick up the age (four) of the financial output has read special 19 - the paper size is suitable Treasury Standard χ 2-97 公计计线1275107

5 10 15 經濟部智慧財產局員工消費合作社印製 20 定構型裝置的形狀例如筆直、彎曲或❹。同理 線例如電極與剩餘件__也可具有任何適⑼狀= 劃分前之转步科常仙任財 ^ 、 =:r部導㈣樣化；= 外朴電面圖樣化。但於組裝前可將内及 圖樣化依據最終裝置的預定功能而定，；與 且、電面相同或相異。例如圖5，6，8，9 ^ 内部電極’該内部電極為外部電極的 鏡像。圖1〇及18至2〇顯示裝置具有内 =化:式與外部一經常可經由去除： 刻^壓、或研磨導電材料而圖樣化導電面。另外，圖樣 可藉添加方法製造例如網印、缝或沈積。用於某些用 :二交替由一積層的兩相對面取以交錯長條去除導電材 料條俾平魅品的物理應力。所得_含有間隙或凹部， 該間隙或㈣卩適合關裝置的第二電極與驗件，隔開一 裝置與另-裝置’提供總成再劃分為個別裝置的劃界線， 允許個別積層或組裝堆疊定向，或提供記號。 /交叉導體亦即電連結可於積層形成為堆疊之前或之後 形成。若希望形成不會橫過全部堆疊層的交叉導體，則方 便地可僅形成預定積層的交又導體然後組裝堆疊。另外， 使用盲通孔法，於堆疊組裝後可做出連結。堆疊的組震例 如可於多階段完成，例如製備某些積層且牢固固定在一 起，對部份組構的堆疊進行若干進_步製程步驟(例如形 成及鍍敫交叉導體），及然後其它積層可牢固固定於此部 -20_ 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公楚） 1275107 B7 五、發明說明（l9 10 15 經濟部智慧財產局員工消費合作社印製 20 份組構的堆疊而完成總成。堆4再劃分為複合I置可 多種技術完成例如鋸割、切變 '切曰曰、 日日7、衡孔及失緊例如 使用鑛、t、刀片、線、喷水搶、失緊裝置、雷射或复组 合達成。若干由單4層製造裝置之較佳方法揭示於美國 f利第5,864,281號。此等方法自適應於再劃分積層堆 疊，例如如此處所述。另外該方法 无之右干步驟，例如牢固 固定積層於—堆疊且利用交又導體做出複數電賴可同時 完成。 為了減少於隨後製程步驟期間因收縮造成的卷曲或勉 曲，較佳施用圖樣環繞至少-積層周邊。較佳圖樣係藉一 種方法製造’該方法包含環繞積層周邊以交錯截面設計例 如「W」子形或「Z」字形選擇性由各積層之至少一導電 面去除導電材料，因此外層導電面之外緣間有電連續。 部份或全部外部導電面可以絕緣層例如焊料罩或標記 材料覆蓋，例如揭示於美國專利第5,831，510號。 外部組件 將被動式或主動式電氣組件直接電連結至本發明之裝 置或在本發明之總成分開為個別之裝置之前連結至該總 成’經常是有用的。在此等情況下，多層結構係作用為電 路板’固定有跨接導體以使可連結至組件及/或裝置的内 部元件。在一較佳實施例中，一單一 PTC積層可位在兩 絕緣積層之間，於該PTC積層中，導電聚合物成分係位 在兩金屬箔電極之間，而該絕緣層係各包括—或多個個別 的層或薄膜’例如環氧半固化片（pre-preg)。箔、墨形式的 -21 · 本紙張尺度適用中國國家標準(CNS)A4規格（21〇 X297公爱） ά 計 線 1275107 A7 B7 五、發明說明（20 ) 5 10 15 經 濟 部 智 慧 財 產 局 員 工 消費 合 作 社 印 20如 金屬層或s其他層可附加於絕緣層 之^，以及提供從-外部導電表面到;表於層與層 或藉由跨接導體而至内部導電表面之 、 跨接導體而定，組件可從導電聚合物層隔離。。視所使用的 組件與接至裝置的電連結係藉由連 ^ 塾完成。該連結可為,，硬連線”，意即相疋接觸襯 如焊接或祕m歧可歸^持久的連結’例 ::的彈簧、接線或其他元件之可再連結：π 久性的電連馳墊通常包括適於焊接 ^ = 焊料，常祕於銅上1再連結的細她 產生會影響請電連結及/或令使帛劣化 層的 形成，或塗覆此種材料。適合的材料 = 金)，、以及_合金，以及其他用於傳統二器二 料。此等材料係彻傳統印刷電路板技術施加。通常較佳 係將持久性電連結襯墊固定在裝置或組合的一個外部表 面，而可再連結式的接觸襯墊固定在相對的外部表面，但 兩種類型可以在同一側或在兩側，視熱方面及/或設計考 I而定。包括有已經持久性地附加於其上之電組件，並且 包括可再連結式接觸襯墊的組合或裴置係較為合用的，例 如，當欲將裝置附接至一系統時，像是電池充電系統。 組件可為電被動式，例如電阻器、電容器、或熱敏電 阻器，或者是電主動式，例如控制積體電路、場效電晶 體、或分流調節積體電路。 為了提供所附加的組件額外的支持，内部支持件、徽 -22- A7 B7 1275107 五、發明說明（22 ) 置於7與8間。堆壘經鍍敷而於各孔隙提供管形交叉導體 11 (以及於堆疊的其它暴露外表面上提供鍍敷層12)。如所 示，堆疊可貫穿管形交叉導體再劃分而形成具有半圓形截 面的交叉導體。 5 圖5為藉再劃分堆疊形成的複合裝置2之透視圖，二 層狀PTC元件17及18各自分別有外部電極14及1#，外 部剩餘導電件36及361，内部電極16及161及内部剩餘導 電件38及38’，層狀PTC元件17及18使用層狀元件26 牢固固定在一起。第一橫向件31及第二橫向件51為藉鍍 10 敷法形成的中空管，其中暴露面以銅鍍敷，然後以焊料鍍 敷而形成第一鍍敷層32於橫向件31上以及形成第二鍍敷 層52於橫向件51上。電介質塗層55覆蓋裝置的外表 面，但希望作電連結處除外。鍍敷12外加至外部電極的 暴露部。虛線間區指示電介質塗層55下方不含電極材料 15 部份。 圖6顯示如圖5之複合裝置2焊接至絕緣基材9上之 軌線41及43之剖面圖。 經濟部智慧財產局員工消費合作社印製 圖7為沿圖8至11，14及21之線VIII-VIII所示多種 複合裝置之截面平面圖。虛線指示位於電介質層55下方 20 部份，其中不存在有電極材料。注意對圖8-11，14及21 所示剖面圖，未顯示電介質層55。圖8及9顯示並聯連結 的兩種PTC元件配置。用於圖8所示裝置，於交換高電 阻態時，層狀元件26於電位外加至外部電極14及外部剩 餘導電件36時不具有跨層狀元件26可能的電位降。但對 -24- 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） 1275107 A7 B7 圖9所示裝置而言，於交換態時，層狀元件26對相同外 部電連結而言具有跨元件之電⑽。目ig顯示圖8所示 裝置變化，不含内部剩餘導電件。圖U顯示經由並聯連 、一個層狀7L件Π、18及15)形成的複合裝置，層狀元件 5 26 "於17與18間，以及層狀元件26,介於18與19間。 所示裝置版本具有内部電極16，16,，16，，及16，，，，以及内 部剩餘導電件38，38,，38”及38，，，。 圖12為不含剩餘導電件之裝置之平面圖；沿XIII-ΧΙΠ之截關示於圖13。虛線指示外部電介質層55下方 10區域，此處不存在有電極材料。電介質層未顯示於圖 13 〇 圖14為藉本發明方法形成的複合裝置，其中交叉導 體未70全伸展貫穿堆疊全部各層。為了製造此處所示裝 置，交又導體59僅伸展於堆疊之各層狀元件的外部與内 經濟部智慧財產局員工消費合作社印製 15部導電面間；然後層狀元件使用各向異性導電物質57牢 固固定在一起，導電物質57僅於z方向導電，此處z表 示由複合裝置之底至頂的方向。導電物質57提供内部剩 餘導電件38及38’與内部電極16與16,間的電連結，而未 造成38或381短路至16或16,。 20 圖15顯示其中層狀元件17及18串聯連結之複合裝 置。層狀元件係使用導電材料61牢固固定在一起。交叉 導體製作於堆疊内，連結至部份導電面但非全部。為了形 成此種交叉導體，大於交叉導體預定維度的孔隙貫穿堆疊 形成。然後孔隙以絕緣物質63填補，使用絕緣體63填補 -25- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） [2751075 10 15 Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative 20 The shape of the fixed device is straight, curved or curved. The same line, such as the electrode and the remaining part __, can also have any suitable (9) shape = before the division, the step of the family, Chang Xian Ren Cai ^, =: r part guide (four) sample; = the exterior of the electric surface pattern. However, the internal and patterning may be based on the intended function of the final device prior to assembly; the same or different from the electrical surface. For example, Figures 5, 6, 8, 9 ^ Internal Electrode' This internal electrode is a mirror image of the external electrode. Figures 1A and 18 to 2A show that the device has a built-in and a pattern that can be patterned by removing or etching the conductive material. Alternatively, the pattern can be fabricated by, for example, screen printing, seaming or depositing. It is used for some purposes: two alternating by a pair of two opposite faces taken by staggered strips to remove the physical stress of the conductive material strip. The resulting _ contains a gap or recess, the gap or (d) 卩 is suitable for the second electrode of the device and the inspection piece, separating a device from the other device to provide an assembly and subdividing into individual device demarcation lines, allowing individual lamination or assembly Stack orientations or provide markers. The cross-conductor, i.e., the electrical connection, can be formed before or after the laminate is formed into a stack. If it is desired to form a cross-conductor that does not traverse all of the stacked layers, it is convenient to form only the cross-conductors of the predetermined stack and then assemble the stack. In addition, the blind via method can be used to make a connection after stack assembly. The stacked group vibrations can be completed, for example, in multiple stages, such as preparing certain laminates and firmly fixing them together, performing a number of steps in the stacking process (for example, forming and plating a cross-conductor), and then stacking other layers. Can be firmly fixed to this section -20_ This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 public Chu) 1275107 B7 V. Invention description (l9 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 groups The stacking of the structure completes the assembly. The stack 4 is subdivided into composite I, which can be completed by various techniques such as sawing, shearing, cutting, day 7, weighing and de-tightening, for example, using mines, t, blades, wires, Water jet robbing, unstraining devices, lasers or complex combinations are achieved. A number of preferred methods for fabricating a single 4-layer device are disclosed in U.S. Patent No. 5,864,281. These methods are adapted to subdivide stacks, for example as herein. In addition, the method does not have a right-drying step, such as firmly fixing the stack on the stack, and using the cross-conductor to make a plurality of electric laps can be simultaneously completed. To reduce the shrinkage caused by the shrinkage during subsequent processing steps Preferably, the pattern is applied to surround at least the periphery of the laminate. The preferred pattern is produced by a method comprising 'surrounding the periphery of the laminate with a cross-sectional design such as a "W" sub-shape or a "Z"-shaped selectivity from each laminate. The at least one electrically conductive surface removes the electrically conductive material so that there is electrical continuity between the outer edges of the outer electrically conductive surface. Some or all of the outer electrically conductive surface may be covered by an insulating layer such as a solder mask or a marking material, such as disclosed in U.S. Patent No. 5,831,510. It is often useful for an external component to electrically connect a passive or active electrical component directly to the device of the present invention or to the assembly prior to the assembly of the present invention as a separate device. In such cases, the multilayer structure The function is that the circuit board 'fixes a jumper conductor to enable connection to internal components of the component and/or device. In a preferred embodiment, a single PTC laminate can be positioned between two insulating laminates in the PTC laminate. The conductive polymer component is between the two metal foil electrodes, and the insulating layer each includes - or a plurality of individual layers or films - such as epoxy semi-curing Pre-preg. -21 in foil and ink form · This paper scale applies to China National Standard (CNS) A4 specification (21〇X297 public) ά Counting line 1275107 A7 B7 V. Invention description (20) 5 10 15 Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperatives, etc. 20 such as metal layers or s other layers may be attached to the insulating layer and provided from the external conductive surface to the surface or layer or through the jumper conductor to the internal conductive surface Depending on the conductor, the components can be isolated from the conductive polymer layer. Depending on the components used and the electrical connections to the device are made by means of a connection. The connection can be, hardwired, meaning That is, the contact lining of the phase, such as soldering or mismatching, can be attributed to a long-lasting connection. Example: Springs, wiring or other components can be re-joined: π-long electrical galvanic mats usually include soldering, soldering, Often secreted on the copper, the re-joining of the copper will affect the electrical connection and/or the formation of the degraded layer, or the coating of such materials. Suitable materials = gold), and _alloys, and others for conventional two-component materials. These materials are applied by conventional printed circuit board technology. It is generally preferred to attach the permanent electrical connection pads to an outer surface of the device or combination, and the re-connectable contact pads are attached to the opposite outer surface, but the two types can be on the same side or on both sides. Depending on the heat and / or design test I. Included are electrical components that have been permanently attached thereto, and combinations or devices that include re-connectable contact pads are useful, for example, when the device is to be attached to a system, such as battery charging system. The components can be electrically passive, such as resistors, capacitors, or thermistors, or electrically active, such as control integrated circuits, field effect transistors, or shunt regulated integrated circuits. In order to provide additional support for the additional components, the internal support, emblem -22- A7 B7 1275107 V, invention description (22) is placed between 7 and 8. The stack is plated to provide tubular cross-conductors 11 in each of the apertures (and to provide a plating layer 12 on the other exposed outer surfaces of the stack). As shown, the stack can be subdivided through the tubular cross-conductor to form a cross-conductor having a semi-circular cross-section. 5 is a perspective view of the composite device 2 formed by subdividing the stack. The two-layered PTC elements 17 and 18 respectively have external electrodes 14 and 1#, external remaining conductive members 36 and 361, internal electrodes 16 and 161 and internal portions. The remaining conductive members 38 and 38', the layered PTC elements 17 and 18 are firmly fixed together using the layered member 26. The first cross member 31 and the second cross member 51 are hollow tubes formed by a plating method, wherein the exposed surface is plated with copper, and then soldered to form a first plating layer 32 on the cross member 31 and A second plating layer 52 is formed on the cross member 51. Dielectric coating 55 covers the outer surface of the device, except where it is desired to make electrical connections. The plating 12 is applied to the exposed portion of the external electrode. The inter-dashed area indicates that there is no electrode material 15 under the dielectric coating 55. Figure 6 shows a cross-sectional view of the trajectories 41 and 43 of the composite device 2 of Figure 5 soldered to an insulating substrate 9. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Staff Consumer Cooperatives Figure 7 is a cross-sectional plan view of various composite devices shown in Figures VIII-VIII of Figures 8 through 11, 14 and 21. The dashed line indicates the portion 20 below the dielectric layer 55 in which no electrode material is present. Note that for the cross-sectional views shown in Figures 8-11, 14 and 21, the dielectric layer 55 is not shown. Figures 8 and 9 show two PTC component configurations connected in parallel. For the apparatus of Fig. 8, when the high resistance state is switched, the layered element 26 does not have a potential drop across the layered element 26 when applied to the external electrode 14 and the outer remaining conductive member 36 at the potential. However, for the -24- paper scale, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. 1275107 A7 B7 In the device shown in Figure 9, the layered component 26 is electrically connected to the same externally in the exchange state. It has electricity across components (10). The ig shows the device variation shown in Figure 8, without the internal remaining conductive members. Figure U shows a composite device formed by a parallel connection of a layered 7L piece Π, 18 and 15), a layered element 5 26 " between 17 and 18, and a layered element 26 between 18 and 19. The device version shown has internal electrodes 16, 16, 16, and 16, and, and internal remaining conductive members 38, 38, 38" and 38,. Figure 12 is a device that does not contain the remaining conductive members. The plan view; the cut along XIII-ΧΙΠ is shown in Fig. 13. The dotted line indicates the area under the outer dielectric layer 55, where there is no electrode material. The dielectric layer is not shown in Fig. 13 and Fig. 14 is a composite formed by the method of the present invention. Apparatus wherein the cross-conductor 70 is fully extended throughout the stack of layers. To fabricate the device shown herein, the cross-conductor 59 extends only outside of the stacked layer elements and is printed by the Ministry of Commerce, Intellectual Property Office, Staff Consumer Cooperative 15 The conductive elements are then firmly fixed together using an anisotropic conductive material 57, and the conductive material 57 is only conductive in the z direction, where z represents the direction from the bottom to the top of the composite device. The conductive material 57 provides internal residual The electrical connection between the conductive members 38 and 38' and the internal electrodes 16 and 16 does not cause 38 or 381 to be short-circuited to 16 or 16. 20 Figure 15 shows a composite device in which the layered members 17 and 18 are connected in series. The pieces are firmly fixed together using a conductive material 61. The cross-conductors are fabricated in the stack and joined to a portion of the conductive faces but not all. To form such cross-conductors, pores larger than a predetermined dimension of the cross-conductors are formed through the stack. Substance 63 is filled and filled with insulator 63 -25 This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) [275107

五、發明說明 24 的容積内部形成兩個較小的孔隙65及6 以及暴露的外部電極具有鍵敷層η及&。孔隙65及67 :16顯示複合裝置之平面圖，其包括 三個外部電連結點。_ 置且具有 5 17。 -裝置77及79之電連結圖顯示於圖 圖以顯不圖16沿線xvm_xvm 體52係於内部剩_ % Α °】面圖。父又導 餘件38及難内二f及做電接觸…間隙隔開剩 ，、内部電極Μ及16，。也存在有額 10 經濟部智慧財產局員工消費合作社印製 圖19顯示圖16沿線ΧΙΧ-ΧΙΧ之剖面圖。交叉導體 72於内部剩餘導電件38及38,做電接觸。以間隙隔開剩餘 件38及38與内部電極I6及。也存在有額外導電件 46、 圖2〇顯示沿圖16ΧΧ-ΧΧ之剖面圖。 圖21顯示一複合裝置，其僅有一内部電極16係由一 個僅有導電面的堆疊形成。層狀元件卩組合層狀 兀件78。層狀儿件可壓合在—起形成接合，故無需第三層 狀元件來將層狀元件牢固固定在一起。例如層狀元件17 可包含PTC元件，而78包含具有黏著性質的電介質基 20 材。 圖22為複合裳置之平面圖，其具有多個交叉導體提 供額外载電流能力，額外強勁俾防止其它交叉導體受損或 形成開路。虛線指示不含電極材料區；點線指示一額外交 叉導體區。 15 -26« 裝 計 線 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公复） 1275107 B7 五、發明說明（25 5 10 15 經濟部智慧財產局員工消費合作社印製 20 圖23為沿圖22 ΧΧΙ™之剖面圖(未顯示電介質 層55)。第二孔隙81有-金屬鑛敷層以且形成 連 結介於内部電極16與㈣。注意有—區環繞外部電極Μ 及1#而該處不存在有電極材料。 圖24為堆疊1之分解視圖，其中三層_後的㈣ 積層107、108、109制黏著層形式的非導電層狀層 106,、106"彼此附著。額外非導電層1〇6及1〇6，„分別連二 金屬猪層110、ill至蝕刻後的積層107及1〇9。所得堆^ 可劃分為侧裝置2 ’如目25所示。於侧及/或其它處 理步驟後，多段金屬簡110、m殘留於暴露黏著劑面 116、116·上作為連結至電路板或其它基材的襯墊。各裝置 上存在有第一檢向件31帶有第一鍍敷層32以及第二橫向 件51帶有第二鍍敷層52。 ' 圖26為堆疊1之分解視圖，其中單一蝕刻及鑽孔導 電積層117夾置於二非導電層狀層116、116，間。各非導 電層狀層可為黏著劑例如環氧樹脂預浸布且包含一或多分 開層。層狀金屬箔層120、121附著於非導電層狀層116、 116’且形成其它堆疊層。當各層利用加熱及加壓層合在一 起時’黏著劑將填補導電積層117的孔隙。加工處理後， 各裝置2 (示於圖27)可由堆疊丨分開。電連結襯墊122係 由金屬硒層120形成，襯塾用以附著一或多電氣阻件如石夕 裝置之裝置表面。組件的附著揭示於國際專利申請案第 PCT/US00/07801號（申請日2〇〇〇年3月17日），其揭示併 述於此以供參考。由金屬箔層121形成的電連結襯墊123 -27· 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公楚） 五、發明說明（26V. INSTRUCTION OF THE INVENTION 24 The interior of the volume forms two smaller apertures 65 and 6 and the exposed external electrode has a bonding layer η and & The apertures 65 and 67: 16 show a plan view of the composite device including three external electrical connection points. _ has 5 17 . - The electrical connection diagrams of the devices 77 and 79 are shown in the figure to show that the xvm_xvm body 52 along the line 16 is in the internal _% Α ° plane. The father and the remaining parts 38 and the hard inside two f and make electrical contact... the gap is left, and the internal electrodes are 16 and 16 . There are also a number of 10 Ministry of Economic Affairs Intellectual Property Bureau staff consumption cooperative printing Figure 19 shows a cross-sectional view of Figure 16 along the line ΧΙΧ-ΧΙΧ. The cross conductor 72 has electrical contacts 38 and 38 remaining therein for electrical contact. The remaining members 38 and 38 and the internal electrode I6 are separated by a gap. There are also additional conductive members 46, and Fig. 2A shows a cross-sectional view taken along line ΧΧ-ΧΧ of Fig. 16. Figure 21 shows a composite device having only one internal electrode 16 formed by a stack of conductive surfaces only. The layered member 卩 combines the layered member 78. The layered members can be pressed together to form a joint, so that a third layered member is not required to securely hold the layered members together. For example, the layered element 17 may comprise a PTC element and the 78 comprises a dielectric based material having adhesive properties. Figure 22 is a plan view of a composite skirt with multiple crossover conductors to provide additional current carrying capability with additional robustness to prevent damage to other crossover conductors or to form an open circuit. The dashed line indicates that there is no electrode material area; the dotted line indicates an additional cross conductor area. 15 -26« Loading line The paper size is applicable to China National Standard (CNS) A4 specification (210x297). 1275107 B7 V. Invention description (25 5 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 20 Figure 23 is along Figure 22 is a cross-sectional view of the TM (the dielectric layer 55 is not shown). The second aperture 81 has a metal ore layer and is formed to be interposed between the internal electrodes 16 and (4). Note that the region surrounds the external electrodes Μ and 1# There is no electrode material present. Figure 24 is an exploded view of the stack 1 in which the three layers of the back (four) laminates 107, 108, 109 are made of non-conductive layered layers 106 in the form of adhesive layers, 106 " attached to each other. Layers 1〇6 and 1〇6, „ respectively connect the metal layer 110, ill to the etched layer 107 and 1〇9. The resulting stack can be divided into side devices 2' as shown in item 25. On the side and / After the other processing steps, the plurality of metal stencils 110, m remain on the exposed adhesive surface 116, 116· as a liner attached to the circuit board or other substrate. The first detecting member 31 is present on each device. A plating layer 32 and a second cross member 51 are provided with a second plating layer 52. ' Figure 26 An exploded view of the stack 1 in which a single etched and drilled conductive buildup 117 is sandwiched between two non-conductive layered layers 116, 116. Each of the non-conductive layered layers may be an adhesive such as an epoxy prepreg and comprise a Or multiple layers. The layered metal foil layers 120, 121 are attached to the non-conductive layered layers 116, 116' and form other stacked layers. The adhesive will fill the conductive laminate 117 when the layers are joined together by heat and pressure. After the processing, each device 2 (shown in Figure 27) can be separated by a stack of iridium. The electrical bond pad 122 is formed by a metal selenium layer 120 for attaching one or more electrical resistives such as a shixi device. The surface of the device. The attachment of the component is disclosed in International Patent Application No. PCT/US00/07801, filed on Jan. 17, 2011, the disclosure of which is incorporated herein by reference. Electrical connection pad 123 -27· This paper size is applicable to China National Standard (CNS) A4 specification (210x297 public Chu) V. Invention description (26

1275107 用以附著裝置至電路板或其它基材。第—及第二 及51分別以層32及52錢敷。也存在有「隔離」、橫向件 或通孔124。此係由黏著劑填補孔隙形成，貫穿該處又鑽 孔另一孔且鍍敷。 处入鑽 5 K 28為裝置的立體圖，其中被單_並鑽孔的導電 積層117係以類似圖27之裝置的方式夾置在兩非導2 ㈣5,例如施加於層狀Si層一= = == = 相對的外部表面上係固定有複數㈣連 曰= …，其係由綱層121製成並鑛上称出二 至谭接襯墊m及/或接觸概塾125之三個隔離的橫= ==Λ聚合物積層117之一表面連接致力-表面 圖29a到29d顯示構成實例5所述類型 15別層的平面圖。圖29a顯示裂置的頂表面，^ 三個隔離的橫向件124和兩個橫向件31，以及四= 20 ΐ 125 °該表面的剩餘部分係以電介質（焊接遮罩)5= =。圖29b顯不内部電極16之表面，其係加 合物層Π(未圖示)上。在本裳置中，有、ζ = 於接觸襯墊125之下以提供支持。圖29c顯=二3 極16’之表面，其係附加至相對 17.h m 狀電極16之導電聚合物層 17的另-表面。圖29d顯示裝置的底表面 的焊接襯塾123。 有十-個锻錫 本發明係藉下列實例舉例說明。 -28^ 本紙張尺度適用中國國家標準(CNS)A4^格（210x297^jy 1275107 A7 B7 五、發明說明（27 ) 實例1 根據圖1及2之堆疊係藉下列方法製備。二積層個別 厚度約0.264毫米_〇4忖)係經由附著厚約ο·毫米 (0.0014叶則㈣至厚Q 193毫雜嶋_)導電聚合 5物薄#兩邊製備。導絲合物之製法係混合約·容積比 碳黑（雷文(—η™) 430得自哥倫比亞化學公司）與約60% 容積比高密度聚乙烯(奇伏榮(Chevr〇nTM) 9659得自奇伏榮 公司）然後擠壓成為薄片且於連續製程積層。積層薄片切 成各積層大小0·30米X 〇·4ΐ米（12吋χ 16吋）。積層使用 10 4.5 MeV電子束照射至4.5百萬雷得。 各積層環繞周邊以非對稱圖樣鑽孔而提供孔隙及開槽 於已知x-y取向對正積層平面的各積層。排齊孔及開槽用 以對正斑塊彼此形成堆疊，隨後對正工具用於成像、焊料 罩蓋及鍍敷作業。厚〇·0762毫米（〇〇〇3吋）的改性丙烯酸 15系黏著劑（皮拉路斯(pyraiuxTM) lfo得自杜邦公司）層也鑽 孔排齊孔適合供對正用。 二積層之各層之一薄層表面使用蝕刻技術圖樣化，其 中首先塗布蝕刻抗蝕劑然後以預定圖樣成像。蝕刻抗蝕劑 經濟部智慧財產局員工消費合作社印製 經顯像且於抗蝕劑被去除前使用氯化銅完成蝕刻。該等薄 20層經圖樣化而界定各裝置及剩餘導電件周邊，此外，積層 金屬箔外緣經蝕刻而提供環繞周邊的交替交叉方向圖樣，1275107 is used to attach the device to a circuit board or other substrate. The first and second and 51 are respectively applied by layers 32 and 52. There are also "isolation", cross members or through holes 124. This is formed by an adhesive filling pore, through which another hole is drilled and plated. The drill 5 K 28 is a perspective view of the device, wherein the conductive layer 117 of the single-drilled hole is sandwiched between two non-conductive 2 (four) 5 in a manner similar to the device of FIG. 27, for example, applied to the layered Si layer === = = The opposite outer surface is fixed with a complex number (four) flail = ..., which is made of the layer 121 and weighs two isolated crosses of the tandem pad m and/or the contact profile 125. === One of the surface joints of the polymer laminate 117 is force-surface. Figures 29a to 29d show plan views constituting the 15 layers of the type described in Example 5. Figure 29a shows the top surface of the split, three isolated cross members 124 and two cross members 31, and four = 20 ΐ 125 ° The remainder of the surface is made of dielectric (welding mask) 5 = =. Fig. 29b shows the surface of the internal electrode 16, which is an additive layer (not shown). In this dress, there is, ζ = under the contact pad 125 to provide support. Figure 29c shows the surface of the two 3 poles 16' which is attached to the other surface of the conductive polymer layer 17 opposite the 17.h m electrode 16. Figure 29d shows the welded lining 123 of the bottom surface of the device. There are ten forging tins. The invention is illustrated by the following examples. -28^ This paper scale applies to China National Standard (CNS) A4^ grid (210x297^jy 1275107 A7 B7 V. Inventive Note (27) Example 1 The stack according to Figures 1 and 2 is prepared by the following method. 0.264 mm _ 〇 4 忖) is prepared by attaching a thickness of about ο·mm (0.0014 leaf (four) to thick Q 193 嶋 嶋 )) conductive polymer 5 thinner # both sides. The method of the wire-forming compound is mixed with a volume ratio of carbon black (Raven (-ηTM) 430 from Columbia Chemical Company) and about 60% volume ratio high density polyethylene (Chevr〇nTM 9659) Since Qifurong Company) is then extruded into sheets and laminated in a continuous process. The laminated sheets are cut into layers of 0·30 m X 〇·4 m (12 吋χ 16 吋). The laminate was irradiated with a 4.5 4.5 VV electron beam to 4.5 million ret. Each of the laminates is drilled in an asymmetrical pattern around the perimeter to provide voids and grooving layers of the known x-y orientation to the plane of the positive laminate. The holes and slots are used to form a stack of aligned plaques, which are then used for imaging, solder capping, and plating operations. Thick 〇·0762 mm (〇〇〇3吋) modified acrylic 15 series adhesive (pyraiuxTM lfo from DuPont) layer is also drilled for hole alignment. The surface of one of the layers of the two layers is patterned using an etching technique in which an etch resist is first applied and then imaged in a predetermined pattern. Etching resists Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, developed and etched using copper chloride before the resist is removed. The thin 20 layers are patterned to define the perimeter of each device and the remaining conductive members. In addition, the outer edges of the laminated metal foil are etched to provide an alternate cross-directional pattern around the perimeter.

如圖2所示，提供電連續的路徑用於隨後錫/鉛的電解鍍 敷。 X 經由設置二積層，其圖樣匹配的蝕刻邊面向内，有一 -29- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 1275107 Λ7 Β7 五、發明說明（28) 黏著劑層夾置於其間形成一堆疊，如圖2所示。固定件用 以對正層狀積層，堆疊於加壓下加熱而永久性附著各層成 為一種層狀結構。形成的堆疊厚度約為〇·6ΐ毫米（〇·〇24 口寸）。 5 貫穿整個堆疊鑽孔直徑〇·94毫米（0.037吋)之孔而形 成孔隙。堆疊使用電漿蝕刻處理。然後孔隙塗布膠體石 墨，堆疊以銅做電解鍍敷。 然後堆疊的外部金屬箔層藉餘刻圖樣化。排齊孔用以 確保钱刻圖樣與先前钱刻的内部各層適當對正。環繞邊緣 10 之交替交叉方向圖樣係如前述蝕刻。 焊料罩（芬達爾（Finedel) DSR 2200 C-7得自塔木拉開 肯(Tamura Kaken)公司）施於堆疊之外部金屬箔層上，沾黏 硬化然後施用於堆疊之第二外部金屬箱層上，沾黏硬化， 然後焊料罩經成像及顯像。做記號標示各部件，然後面板 15 加熱而完全硬化罩蓋。錫鉛悍料板沈積於焊料襯墊區用於 附著裝置之電路板。 經濟部智慧財產局員工消費合作社印製 總成被劃分而製造圖5所示裝置，劃分方式為首先使 用剪或鋸將總成分成多個長條，然後將長條藉機械夾緊再 分成個別裝置，該過程使用二步驟式方法，其中長條首先 20 於分隔線彎曲而於導電聚合物形成裂痕，然後沿該分隔線 剪開。製造的裝置具有維度約45毫米χ3·4毫米X 〇·7毫 米（0.179吋X 0.133吋X 0.029吋）以及電阻約0.031歐 姆。藉焊料再流而安裝於印刷電路板後，裝置具有電阻約 0.050歐姆。 -30- 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） A7 B7 [275107 五、發明說明（29 實例2 根據圖24之堆疊係藉下述方法製備。如實例1製備 三積層、照射且鑽孔排齊孔。四層如實例丨之改性丙烯酸 係黏著劑以及兩層1盘司銅箔(厚〇·〇34毫米(0.00135时)） 於一邊接受灰色氧化物處理然後鑽孔適合對正用的排齊 孔。使用實例1蝕刻技術，全部三積層上的二箔電極外表 面經圖樣化界定個別裝置周邊及剩餘導電件，以及界定面 板周邊上的交替交叉方向圖樣。 10 15 經濟部智慧財產局員工消费合作社印製 20 藉設置一層銅箔於底部（處理面向上)接著為一層黏著 層，三層積層其圖樣匹配之蝕刻側係於固定件定向，黏著 層夾置於各層間，接著為一黏著層於最頂積層上，然後為 一層銅箔層置於頂上(處理面向下）而形成一堆疊。固定件 用以對正層狀積層，堆疊於加壓的同時加熱而永久性附著 各層成為積層結構。所得堆疊厚度約119毫米（〇.〇47 吋）。直徑0.94毫米（0.037吋)之孔鑽孔貫穿整個堆疊形成 孔隙。堆疊使用電漿蝕刻處理，孔隙塗布膠體石墨，堆疊 以銅做電解鍍敷。 然後堆疊之外部金屬箔層使用排齊孔蝕刻圖樣化而確 保適當對正。環繞邊緣的交錯交叉方向圖樣係如前述蝕 刻。 §己號及焊料施用如同實例1。然後堆疊總成使用實例 1程序分割而製造圖25所示裝置。製程的裝置具有維度約 4.5 毫米 χ3·4 毫米 χ1·2 毫米（0.179 吋 χθ.133 吋 χ〇·〇47 吋)以及電阻約0.018歐姆。藉焊料再流而安裝於印刷電路 -31 -本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 1275107 A7 B7 五、發明說明'— 板後，裝置具有電阻约0.029歐姆。 實例3 根據圖26之堆壘總成係藉下述方法製備。製備厚約 〇·198毫米（0·〇〇78吋)之積層，製法係將厚約0.0356毫米 5 (〇·0014吋)之鎳/鋼箔附著於厚0.127毫米（0.005吋)之導電 聚合物薄片之二主面上。導電聚合物之製法係混合約37% 容積比碳黑（雷文430)與約1〇·5%容積比高密度聚乙烯 (LB832 ’伊開斯塔(Equistar)公司製造）及約52 5%共聚物 (EBA705，伊開斯塔製造），如實例丨然後於連鎖製程擠壓 10成為薄片及積層。積層薄片切成0.10米x 0.41米(4吋χ 16吋)的各積層。 積層如實例1鑽孔排齊孔，直徑0.127毫米（〇·050对） 之孔於積層形成孔隙。四層厚〇·〇38毫米（〇·0015吋)之環 氧樹脂預浸布(44Ν多薄膜得自亞龍(Adon)公司）及兩層如 15實例1處理的1盎司銅箔也鑽孔對正用以排齊孔。 積層之二箔電極外表面使用實例1所述餘刻技術圖樣 化而界定剩餘導電件，以及額外蝕刻結構特徵作為隨後隔 離處理的排齊基準記號。 經濟部智慧財產局員工消費合作社印製 堆疊之形成方式係放置一層銅箔於底部（處理面向 20 上）’接著為兩層預浸布層（於圖26顯示為單層），積層， 二預浸布層，以及然後一銅箔層置於頂上（處理面向下）形 成堆疊。固定件用以對正各層，堆疊加壓之同時加熱而永 久性附著各層成為積層結構，且強迫環氧樹脂完全填補積 層的孔隙。形成堆疊厚度為約0.61毫米（0 024忖）。 -32- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 1275107 Α7 Β7 五、發明說明（η 直徑〇·94毫米（〇·〇37吋)及ο·”毫米（〇舶吋)之孔貫 穿整個堆疊鑽孔形成孔隙，直徑〇·57毫米（〇 〇23吋)之孔 則貫穿整個堆疊鑽孔形成孔隙，該孔隙對中於環氧樹脂填 補孔隙，後述孔隙藉環氧樹脂與積層的電極隔離。堆疊使 用電漿關處理，孔隙塗布勝體石墨，堆疊使用銅電^ 敷。 然後堆疊的外部金屬箔層藉蝕刻圖樣化。排齊孔用於 確保蝕刻圖樣係適當對正先前蝕刻的内部各層。 10 15 經濟部智慧財產局員工消費合作社印製 20As shown in Figure 2, an electrical continuous path is provided for subsequent electroplating of tin/lead. X is set by two layers, the pattern matching the etched side facing inward, there is a -29- paper scale for the Chinese National Standard (CNS) A4 specification (210x297 mm) 1275107 Λ7 Β7 5, invention description (28) adhesive layer clip A stack is formed therebetween, as shown in FIG. The fixing member is used to align the layered laminate, and the stack is heated under pressure to permanently adhere the layers to form a layered structure. The resulting stack has a thickness of approximately 〇·6ΐ mm (〇·〇 24 inches). 5 The pores are formed through the entire hole of the stack with a diameter of 〇·94 mm (0.037 吋). The stack is processed using a plasma etch. The pores are then coated with colloidal graphite and stacked in copper for electrolytic plating. The stacked outer metal foil layers are then patterned by the remainder. The holes are aligned to ensure that the money pattern is properly aligned with the internal layers of the previous money. The alternate cross direction pattern around the edge 10 is etched as previously described. A solder mask (Finedel DSR 2200 C-7 from Tamura Kaken) was applied to the outer metal foil layer of the stack, hardened and applied to the second outer metal box layer of the stack. On, it is hardened and then the solder mask is imaged and imaged. Mark the parts and then heat the panel 15 to completely harden the cover. Tin-lead slabs are deposited in the solder pad area for the board of the device. The Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing assembly is divided to manufacture the device shown in Figure 5, which is divided into several strips by first using shears or saws, and then the strips are mechanically clamped and then divided into individual parts. Apparatus, the process uses a two-step process in which the strips are first bent 20 at the dividing line to form a crack in the conductive polymer and then cut along the dividing line. The device was fabricated to have a dimension of about 45 mm χ 3 · 4 mm X 〇 · 7 mm (0.179 吋 X 0.133 吋 X 0.029 吋) and a resistance of about 0.031 ohms. After being mounted on the printed circuit board by solder reflow, the device has a resistance of about 0.050 ohms. -30- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) A7 B7 [275107 V. Description of invention (29 Example 2) According to the stack of Figure 24, it was prepared by the following method. Three layers, illuminating and drilling holes, four layers of modified acrylic adhesive as in the case, and two layers of one-plate copper foil (thick 〇·〇 34 mm (0.00135 hr)) are treated with gray oxide on one side. The hole is then drilled to fit the aligned holes. Using the Example 1 etching technique, the outer surfaces of the two foil electrodes on all three laminate layers are patterned to define the perimeter of the individual devices and the remaining conductive features, as well as to define alternating cross-directional patterns on the perimeter of the panel. 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20 By placing a layer of copper foil on the bottom (processing up), followed by an adhesive layer, three layers of layers matching the pattern of the etched side to the orientation of the fixture, adhesive layer clip Placed between the layers, followed by an adhesive layer on the topmost layer, and then a layer of copper foil placed on top (processed face down) to form a stack. The fixture is used to align the layered layers, stacked At the same time of pressurization, the layers are permanently attached to form a laminated structure. The resulting stack has a thickness of about 119 mm (〇.〇47 吋). A hole having a diameter of 0.94 mm (0.037 Å) is drilled through the entire stack to form pores. The stack is etched using plasma. Treatment, the pores are coated with colloidal graphite, and the stack is electrolytically plated with copper. Then the stacked outer metal foil layers are patterned using the aligned holes to ensure proper alignment. The staggered cross direction pattern of the surrounding edges is as described above. And solder application was as in Example 1. The stacked assembly was then divided using the procedure of Example 1 to produce the apparatus shown in Figure 25. The apparatus of the process had dimensions of about 4.5 mm χ 3 · 4 mm χ 1 · 2 mm (0.179 吋χ θ. 133 吋χ〇 〇47 吋) and the resistance is about 0.018 ohms. Installed on the printed circuit by solder reflow -31 - This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) 1275107 A7 B7 V. Invention description '- The device has a resistance of about 0.029 ohms. Example 3 The stacking assembly according to Fig. 26 was prepared by the following method. The product of the thickness of about 198 mm (0·〇〇78吋) was prepared. The layer is prepared by attaching a nickel/steel foil having a thickness of about 0.0356 mm 5 (〇·0014 吋) to the two main faces of a conductive polymer sheet having a thickness of 0.127 mm (0.005 Å). The conductive polymer is mixed by about 37 % volume ratio carbon black (Raven 430) and about 1 〇 5% volume ratio high density polyethylene (LB832 'Equistar (manufactured by Equistar)) and about 52 5% copolymer (EBA705, Icta Manufactured, as in the example, and then extruded into 10 sheets and laminates in an interlocking process. The laminated sheets were cut into 0.10 m x 0.41 m (4 吋χ 16 吋) layers. The laminates were drilled in the same manner as in Example 1, and the pores having a diameter of 0.127 mm (〇·050 pairs) formed pores in the laminate. Four layers of thick enamel 〇 38 mm (〇·0015 吋) epoxy prepreg (44 Ν multi film from Adon) and two layers of 1 oz copper foil treated as in Example 1 The alignment is used to align the holes. The outer surface of the laminated two foil electrode was patterned using the residual technique described in Example 1 to define the remaining conductive features, as well as additional etched structural features as alignment marks for subsequent isolation processing. The Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing stack is formed by placing a layer of copper foil on the bottom (processing surface 20) 'Next two-layer prepreg layer (shown as a single layer in Figure 26), laminated, two pre- The dip layer, and then a layer of copper foil placed on top (processed face down) forms a stack. The fixing member is used to align the layers, press and heat while permanently adhering the layers to a laminated structure, and forcing the epoxy resin to completely fill the laminated pores. The stack thickness was formed to be about 0.61 mm (0 024 忖). -32- This paper size is applicable to China National Standard (CNS) A4 specification (210x297 mm) 1275107 Α7 Β7 5. Invention description (η diameter 〇·94 mm (〇·〇37吋) and ο·” mm The hole forms a hole through the entire stack of holes, and the hole with a diameter of 57·57 mm (〇〇23吋) forms a hole through the entire stack of drilled holes, which is centered on the epoxy resin to fill the pores, and the pores are epoxy resin It is isolated from the laminated electrodes. The stack is treated with plasma, the pores are coated with graphite, and the stack is coated with copper. The stacked external metal foil layer is then patterned by etching. The holes are used to ensure that the etching pattern is properly aligned. The inner layers previously etched. 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20

為了製造如圖27所述裝置，總成藉鋸鋸開，於一方 向切片面板長度然後將面板做90度角旋轉且將面板寬度 單向切片，使用積層上的蝕刻基準結構特徵作為鋸開的定 位記號。製造的裝置具有維度約4·5毫米χ 13·77毫米X 〇·61 毫米（0.177 吋 χ〇·542 吋 χ〇·〇24 时）。 此等個別裝置於帶式爐上加熱處理而加熱裝置至高於 聚合物溶點(>13Gt：)，冷卻至室溫然後使用钻照射源=射 至7百萬雷得。 所得裝置具有電阻當跨導電聚合物積層量測時電阻約 為0.028麟’而當跨隔開的通孔與導電聚合物積層量測 時大於1 X 1G6歐姆。藉焊料再流絲於印刷電路板 引線上後，裝置於跨導電聚合物積層量測時具有電阻約 0.042歐姆，以及跨隔開的通孔與導電聚合物積層量 '時 電阻係大於1 X 106歐姆。裝置適合直接附著電氣二=至穿 置，孔隙及檢向導電件定位成依據確切電連結而定 — 的電氣組件如電純元件可電連結至導電聚合物 -33- 1275107 A7 B7 五、發明說明（32 導電聚合物積層做電隔離。 實例4 經濟部智慧財產局員工消費合作社印製 除指明者外，一組合一般係遵循實例3之程序製備。 所使用的電鍍鎳/銅箔有0.0432 mm (0.0017英吋）的總厚 5度。個別積層上的箔之最外層表面係以振動研磨擦洗機擦 洗’然後浸在蝕刻劑中以從鎳/銅箔移除鎳鍍層，留下裸 銅表面。接著此等外表面係利用如同實例1中的光阻/成 像/顯影/#刻/剝除技術製作圖樣，藉以界定裝置之電極特 徵、剩餘電極結構以及回鍅特徵以使隔離過程中之裝置角 10落的電極毛刺最小化，或是在免除隔離之後在裝置邊緣有 暴路的電極。而後該等外表面係被擦洗並且以一連串化學 洛(麥克德密特公司供應之多重連結）處理以將銅面板表面 作表面處理以改善黏著性。然後形成如實例3中之堆疊。 孔隙具有0·57 mm (0.023英吋)之口徑，其係鑽過整個 15堆疊以形成開口，具有〇·57 mm (0.23英吋)之口徑的額外 孔隙系鑽過整個堆疊以形成集中在124 mm(〇 〇49英吋)之 口徑而填有環氧物之開口處的開口；後者開口係藉由環氧 物，與積層之電極完全隔離。該堆疊係以電漿蝕刻處理。 該等開口而後係塗覆膠狀石墨，該堆疊係以電解鍍上銅。 2〇 而後该堆豐的外部金屬箔層係利用上述光阻/成像/顯 影/餘刻/剝除技術製作圖樣，以在面板的一側產生可用作 為焊接襯塾（用於引線或電子組件之附接）以及在面板的另 -側產生可作為細㈣（驗表面接娜連接）的特徵 組a。亦產生用作為用於後續隔離程序之重合基準光罩的To make the device as shown in Figure 27, the assembly is sawed by a saw, the panel length is sliced in one direction and then the panel is rotated at a 90 degree angle and the panel width is unidirectionally sliced, using the etched reference structural features on the laminate as a saw. Positioning token. The manufactured device has a dimension of about 4·5 mm χ 13·77 mm X 〇 · 61 mm (0.177 吋 542 · 542 吋 χ〇 〇 24 hours). These individual devices were heat treated on a belt furnace to heat the device above the polymer melting point (>13 Gt:), cooled to room temperature and then drilled to a source of 7 million Rays. The resulting device has a resistance of about 0.028 Å when measured across a layer of conductive polymer and greater than 1 X 1 G6 ohm when measured across a spaced via and conductive polymer laminate. After the solder is reflowed onto the printed circuit board leads, the device has a resistance of about 0.042 ohms when measured across the conductive polymer laminate, and the resistance is greater than 1 X 106 when the amount of the vias and the conductive polymer are stacked across the spaced apart vias. ohm. The device is suitable for direct attachment of electrical two = to wear, and the aperture and the direction-directing conductive member are positioned according to the exact electrical connection - electrical components such as electrical pure components can be electrically connected to the conductive polymer - 33 - 1275107 A7 B7 5. Description of the invention (32 Conductive polymer laminates are electrically isolated. Example 4 Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printing In addition to the specified ones, a combination is generally prepared following the procedure of Example 3. The electroplated nickel/copper foil used has 0.0432 mm ( The total thickness of 0.0017 inches is 5 degrees. The outermost surface of the foil on the individual laminates is scrubbed with a vibratory abrasive scrubber' and then immersed in an etchant to remove the nickel coating from the nickel/copper foil leaving a bare copper surface. These outer surfaces are then patterned using photoresist/imaging/developing/#etching/stripping techniques as in Example 1 to define the electrode characteristics of the device, the remaining electrode structure, and the retroreflective features to provide the device angle during the isolation process. 10 falling electrode burrs are minimized, or electrodes that have a violent path at the edge of the device after isolation. The outer surfaces are then scrubbed and serialized with a series of chemical lodges (McDmitett) The multiple connections of the supply were treated to surface-treat the copper panel surface to improve adhesion. Then a stack as in Example 3 was formed. The pores had a caliber of 0·57 mm (0.023 inch), which was drilled through the entire stack of 15 An opening is formed, and an additional pore having a diameter of 〇·57 mm (0.23 inch) is drilled through the entire stack to form an opening centered at an opening of 124 mm (〇〇 49 inches) and filled with an epoxy; The latter opening is completely isolated from the laminated electrode by an epoxy. The stack is treated by plasma etching. The openings are then coated with colloidal graphite, which is electrolytically plated with copper. The abundance of the outer metal foil layer is patterned using the photoresist/imaging/development/release/stripping techniques described above to produce a weld lining (for attachment of leads or electronic components) on one side of the panel and The other side of the panel produces a feature set a that can be used as a fine (four) (surface contact connection). It also produces a coincident reference mask for use in subsequent isolation procedures.

本紙張尺度適用中國國家標準(CNS)A4^^x297公爱了 A7 B7 ^75107 五、發明說明（33) 特徵。接觸襯墊係以0.25 mm (0.010英吋）寬的軌跡匯集在 —起以利後續襯墊表面的電鍍。 如實例1中之液態可光成像焊料罩材料係利用絹版印 刷程序施加至面板的兩側。此焊料罩層係利用原圖光成像 5 於兩側，在原圖中，係留下焊接襯墊以及接觸襯墊未曝 光。該面板係經過顯影以及剝除以僅留下暴露於焊接襯墊 以及接觸襯墊的金屬。該面板係以102-115°C烘烤4小時 以使焊料罩完全固化。 阻劑係施加至面板具有焊接襯墊的一側，而在面板另 10 一側的接觸襯墊係以鎳接著是硬金電鍍，之後阻劑被剝 除。阻劑係施加至面板具有金接觸襯墊的一側，而面板具 有焊接概塾的另一側係以錫浸鍍，之後剝除阻劑。 經濟部智慧財產局員工消費合作社印製 該組合係被分割以製造如圖28所示之裝置，其係利 用晶圓鑛，以及積層上作為錯定位標記的钱刻對齊基準特 15 徵，沿面板長度方向切割多次，將面板旋轉90度，而後 面板寬度方向切割多次。所生產的裝置具有大約為28 X 7·6 X 0·61 mm (1·102 X 0.299 X 0.024 英时)之尺寸。各裝置 具有五個穿孔鍍敷通道（兩個通道係連接至PTC積層，而 三個通道係加以隔離且僅連接至焊接及/或接觸襯墊）、四 20個鍵金接觸襯墊在一側的外表面（如圖28以及29a)，以及 總共12個鍍錫焊接襯墊在另一側之外表面（如圖29d)。 該等裝置係被熱處理並照射，如同實例3。處理過的 裝置當跨導電聚合物積層測量時具有〇〇2i歐姆之電阻， 而當跨隔離通道以及導電聚合物積層而測量時具有大於 -35- A7 B7 1275107 五、發明說明（34 ) lxio6歐姆之電阻。在藉由焊料回流而安裝Ni引線之後， 該等裝置當跨導電聚合物積層測量時具有0.028歐姆之電 阻，而當跨隔離通道以及導電聚合物積層而測量時具有大 於1 X 106歐姆之電阻。 5 實例5 除了以下所述者之外，係遵循實例4之方法製備一組 合。該等積層係以與積層夾具相符的配準孔隙而鑽有口徑 1.24 mm (0.049英吋)之孔隙以及口徑〇·457 mm (0.018英 吋)之孔隙以製造積層中的開口。 10 該組合係被分割以生產尺寸大約為28 X 7.6 X 0.61 mm (1·1〇2 X 0.299 X 0.024英吋)之裝置。如實例4之裝置，各 裝置具有五個穿孔鑛敷之通道（兩個通道連接至PTC積層 而三個通道被隔離並僅連接至焊接及/或接觸襯墊）以及四 個鍍金連結襯墊於一側的外表面，並在另一側的外表面有 15 12個鍍錫的焊接襯墊。此外，有四個填充環氧物之〇·457 mm (0·018英吋)之開口於各接觸襯墊之下，聚集在預期之 各接觸襯墊之接觸力點周圍（如圖29b所示）。 該等裝置係被熱處理並照射，如同實例4。處理過的 經濟部智慧財產局員工消費合作社印製 裝置¥跨導電聚合物積層測量時具有〇 歐姆之電阻， 20而當跨隔離通道以及導電聚合物積層而測量時具有大於 lxlO6歐姆之電阻。在藉由焊料回流而安裝Ni引線之後， 該等裝置當跨導電聚合物積層測量時具有0·028歐姆之電 阻而^跨隔離通道以及導電聚合物積層而測量時具有大 於lxlO6歐姆之電阻。 -36- 本紙張尺度適用帽@^標格⑵Gx297 $ -~—- A7 B7 經濟部智慧財產局員工消費合作社印製 1275107 五、發明說明（35 ) 五、[圖式簡單說明] 本發明係於附圖舉例說明，附圖中，圖i為於本發明 之第-特徵方面形成之-堆疊之裁面透視圖，該堆疊可再 劃分為複數個別複合裝置； 5 圖2為已經於内部導電表面圖樣化之堆疊之分解視 圖； 圖3為一堆疊之頂部平面圖； 圖4為一堆疊之截面沿圖3之線IV_IV所取之剖面 Γ5Ί · 園， 10 圖5為本發明之複合裝置之透視圖； 圖6為複合裝置架設於一印刷電路板上且平行電路板 之剖面圖； 圖7為複合裝置之平面圖，進一步舉例說明於圖8， 9，10，η，14 及 21 ; 15 圖8，9及10為有二元件並聯連結之複合裝置之沿圖 7線VIII-VIII所取之截面圖； 圖11為有三元件並聯連結之複合裝置之沿圖7線 VIII·VIII所取之截面圖； 圖12為另一複合裝置之平面圖，帶有二元件並聯連 20 結但無圖13所示之剩餘導電件； 圖13為沿圖12之線ΧΙΙΙ-ΧΙΙΙ所取之截面圖； 圖14為有二元件並聯連結之另一複合裝置之沿圖7 線VIII-VIII所取之截面圖； 圖15為一帶有二元件係串聯連結之複合裝置之剖面 -37- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐）This paper scale applies to the Chinese National Standard (CNS) A4^^x297 publicly entitled A7 B7 ^75107 V. Invention Description (33) Features. The contact pads are collected in a 0.25 mm (0.010 inch) wide track to facilitate plating of subsequent pad surfaces. The liquid photoimageable solder mask material as in Example 1 was applied to both sides of the panel using a stencil printing procedure. This solder cap layer is imaged on both sides using the original image, leaving the solder pads and the contact pads unexposed in the original image. The panel is developed and stripped to leave only the metal exposed to the solder pads and the contact pads. The panel was baked at 102-115 ° C for 4 hours to fully cure the solder mask. The resist is applied to the side of the panel having the solder pad, and the contact pads on the other side of the panel are plated with nickel followed by hard gold, after which the resist is stripped. The resist is applied to the side of the panel having the gold contact pad, and the other side of the panel having the solder pattern is tin immersed, after which the resist is stripped. Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives Division, the assembly is divided to produce the device shown in Figure 28, which uses the wafer mine, and the money on the laminate as a misalignment mark to align the benchmark. Cut the length direction multiple times, rotate the panel 90 degrees, and cut the width of the rear panel multiple times. The device produced has a size of approximately 28 X 7·6 X 0·61 mm (1·102 X 0.299 X 0.024 inches). Each device has five perforated plating channels (two channels are connected to the PTC laminate, three channels are isolated and only connected to the solder and/or contact pads), and four 20 key gold contact pads are on one side The outer surface (as in Figures 28 and 29a), and a total of 12 tin-plated solder pads on the other side of the other surface (Figure 29d). The devices were heat treated and irradiated as in Example 3. The treated device has a resistance of 〇〇2i ohms when measured across the conductive polymer laminate, and greater than -35-A7 when measured across the isolation channel and the conductive polymer laminate. V7 1275107 5. Invention (34) lxio6 ohms Resistance. After the Ni leads were mounted by solder reflow, the devices had a resistance of 0.028 ohms when measured across the conductive polymer laminate and a resistance of greater than 1 X 106 ohms when measured across the isolation channel and the conductive polymer laminate. 5 Example 5 A set was prepared following the procedure of Example 4 except as described below. The laminates are drilled with apertures of 1.24 mm (0.049 inch) and calibers of 457 mm (0.018 inch) with registration apertures conforming to the buildup fixture to create openings in the laminate. 10 The combination was divided to produce a device measuring approximately 28 X 7.6 X 0.61 mm (1·1〇2 X 0.299 X 0.024 inches). As in the apparatus of Example 4, each device has five perforated channels (two channels connected to the PTC laminate and three channels are isolated and connected only to the solder and/or contact pads) and four gold-plated bond pads There are 15 12 tinned solder pads on the outer surface of one side and the outer surface on the other side. In addition, there are four epoxide-filled 457 mm (0·018 inch) openings under each contact pad that collect around the desired contact force of each contact pad (as shown in Figure 29b). ). The devices were heat treated and irradiated as in Example 4. The processed Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing device has a resistance of 〇 ohm when measured across the conductive polymer laminate, and has a resistance greater than lx10 6 ohms when measured across the isolation channel and the conductive polymer laminate. After the Ni wire is mounted by solder reflow, the devices have a resistance of 0. 028 ohms when measured across the conductive polymer laminate and have a resistance greater than lxlO6 ohms when measured across the isolation channel and the conductive polymer laminate. -36- This paper size is applicable to the cap@^标格(2)Gx297 $ -~—- A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 V. Invention description (35) V. [Simple description] The present invention is based on BRIEF DESCRIPTION OF THE DRAWINGS In the drawings, FIG. 1 is a perspective view of a stacked-formed stack formed in the first aspect of the present invention, the stack being subdivided into a plurality of individual composite devices; 5 FIG. 2 is already on the inner conductive surface Figure 3 is a top plan view of a stack; Figure 4 is a cross-section of a stack taken along line IV_IV of Figure 3, 园5Ί · 园, 10 Figure 5 is a perspective view of the composite device of the present invention Figure 6 is a cross-sectional view of the composite device mounted on a printed circuit board and parallel to the circuit board; Figure 7 is a plan view of the composite device, further illustrated in Figures 8, 9, 10, η, 14 and 21; 15 Figure 8, 9 and 10 are cross-sectional views taken along line VIII-VIII of Fig. 7 of a composite device having two elements connected in parallel; Fig. 11 is a cross-sectional view taken along line VIII.VIII of Fig. 7 of the composite device having three elements connected in parallel; Figure 12 is a plan view of another composite device Figure 2 shows a cross-sectional view taken along line ΧΙΙΙ-ΧΙΙΙ of Figure 12; Figure 14 shows another composite device with two elements connected in parallel. Figure 14 is a cross-sectional view taken along line ΧΙΙΙ-ΧΙΙΙ of Figure 12; Section taken along line VIII-VIII of Figure 7; Figure 15 is a section of a composite unit with two elements connected in series -37- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm)

A7 1275107 B7 五、發明說明（36) 圖； 圖16為帶有多於二個外部電連結點之複合裝置之平 面圖； 圖17為個別裝置連結在一起形成圖16及18至20之 5 複合裝置之互連架構之電路圖。 圖18，19及20為分別沿圖16之線XVIII-XVIII， XIX-XIX及XX-XX所取之剖面圖； 圖21為帶有二外部電極及一内部電極之複合裝置之 剖面圖； 10 圖22為帶有多個電連結介於複合裝置之各層間之複 合裝置之平面圖； 圖23為沿圖22之線XXIII_XXIII之剖面圖； 圖24及26為本發明之堆疊之分解圖，該堆疊形成一 總成且可再劃分為複數個別複合裝置；以及 15 圖25及27分別為由圖24及26之堆疊製成的本發明 之裝置之透視圖。 圖28為具有接觸襯墊的複合裝置之透視圖；以及 圖29a至29d為包含圖28之複合裝置之各層的平面 經濟部智慧財產局員工消費合作社印製 圖 20 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 1275107 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（37 ) 圖號說明： 1 2 3 ^ 3! 5 5、5, 6 7 8 11 10 12 14、14， 16、16， 17 18 15 19 26 31 32 36、36， 20 38、38， 46， 51 52 55 堆疊 複合裝置 圖樣化外部導電面 圖樣化内部導電面 絕緣層狀元件 層狀元件 層狀元件 管形交叉導體 鍍敷層 外部電極 内部電極 層狀PCT元件 層狀PCT元件 層狀元件 層狀元件 第一橫向件 第一鍍敷層 外部剩餘導電件 間隙隔開剩餘件 額外導電件 第二橫向件 第二鍍敷層、交叉導體 電介質塗層 -39- 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐） 1275107 at B7 經濟部智慧財產局員工消費合作社印製A7 1275107 B7 5. Inventive Note (36) Figure; Figure 16 is a plan view of a composite device with more than two external electrical connection points; Figure 17 is a composite device with individual devices joined together to form Figure 16 and Figures 18 to 20 Circuit diagram of the interconnect architecture. 18, 19 and 20 are cross-sectional views taken along lines XVIII-XVIII, XIX-XIX and XX-XX of Fig. 16, respectively; Fig. 21 is a cross-sectional view of a composite device having two external electrodes and an internal electrode; Figure 22 is a plan view of a composite device having a plurality of electrical connections between layers of the composite device; Figure 23 is a cross-sectional view taken along line XXIII_XXIII of Figure 22; Figures 24 and 26 are exploded views of the stack of the present invention, the stack An assembly is formed and subdivided into a plurality of individual composite devices; and 15 Figures 25 and 27 are perspective views of the device of the present invention, respectively, made from the stack of Figures 24 and 26. Figure 28 is a perspective view of a composite device having a contact pad; and Figures 29a to 29d are printed by the Ministry of Finance, Intellectual Property Office, and the Consumers' Cooperative of the Ministry of Plane, including the layers of the composite device of Figure 28. Figure 20 applies to the Chinese National Standard ( CNS)A4 specification (210x297 mm) 1275107 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (37) Figure number description: 1 2 3 ^ 3! 5 5,5, 6 7 8 11 10 12 14,14,16,16, 17 18 15 19 26 31 32 36,36, 20 38,38, 46, 51 52 55 Stacking composite device patterning external conductive surface patterning internal conductive surface insulating layer element layer element layer Element-shaped tubular cross-conductor plating layer external electrode internal electrode layered PCT element layered PCT element layered element layered element first cross-piece first plating layer outer remaining conductive member gap separated remaining piece additional conductive member second Cross-piece second plating layer, cross-conductor dielectric coating-39- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) 1275107 at B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative System

五、發明說明（3〇 57 59 61 63 5 65 67 78 81 82 10 106’、106 107 108 109 110 15 111 116、1161 117 120 121 20 122 123 124 向異性導電物質 交叉導體 導電材料 絕緣物質 孔隙 孔隙 層狀元件 孔隙 金屬鍍敷層 非導電層狀層 導電積層 導電積層 導電積層 金屬箔 金屬箔層 暴露黏著劑面 導電積層 層狀金屬箔層 層狀金屬箔層 電連結襯墊 電連結襯塾 通孔 -40- 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐）V. Description of invention (3〇57 59 61 63 5 65 67 78 81 82 10 106', 106 107 108 109 110 15 111 116, 1161 117 120 121 20 122 123 124 Anisotropic conductive material Cross conductor Conductive material Insulating material Porosity pore Layered element Pore metal plating layer Non-conductive layered layer Conductive laminated layer Conductive laminated layer Conductive laminated layer Metal foil Metal foil layer Exposed adhesive agent surface Conductive laminated layer Metal foil layer Layered metal foil layer Electrical connection pad Electrical connection lining Through hole -40- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

日修(表)正本 六、申請專利範圍 Δβ 專利申請案第91 135771號 Α8 ROC Patent Appln. No. 91135771 B8 修正後無劃線之中文申4專利範圍修正本-附件（二） _Amended Claims in Chinese - Enel. ΠΙ)_ ^ (民國95年&月7日送呈） D8 (Submitted on September 7, 2006) 10 15 經濟部智慧財產局員工消費合作社印製 20 i. 一種製造一複合聚合物電路保護裝置之方法，該方法 包含 (1) 提供一聚合物總成，包含 ()kt、第一及第二積層，各積層包含一層狀聚合 物元件，其具有至少一導電表面， (b)提供—導電材料圖樣於一積層之導電表面中的 至少一面上， (C)以預定配置固定積層成為—堆疊，至少一積層 之至少一導電表面包含該堆疊之一外部導電^ 面， ⑷= 造複數個電氣連結於第—積層之—導電表面 一第一積層之一導電表面間，以及 T加複數個電氣組件於該堆疊之外部導電表 面；以及 (2) 將該總成再書彳分成 少一電氣連^==置’各該裝置包含⑴至 、、口，以及（u)至少—雷 2·如申請專利範圍第丨 二、、、 外部導雷#& 、之方去，其中該總成包含二個 L表而電氣組件係附加至該二個外部導電 表面 3·如申請專利範圍第丨項之 加至持久性的電氣連結塾。#中該電氣組件係附 4·如申請專利範圍第3項之方 含可焊接材料。 、中《氣連結墊包 5·如申晴專利範圍第1項之方法， 泰其中該電氣組件係附 -41 -Japanese revision (table) original six, patent application scope Δβ patent application No. 91 135771 Α 8 ROC Patent Appln. No. 91135771 B8 Corrected non-lined Chinese application 4 Patent scope amendments - Annex (II) _Amended Claims in Chinese - Enel. ΠΙ)_ ^ (Represented on the Republic of China 95th & 7th) D8 (Submitted on September 7, 2006) 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20 i. Manufacturing a Composite Polymer Circuit Protection A method of apparatus comprising: (1) providing a polymer assembly comprising () kt, first and second laminates, each laminate comprising a layered polymeric component having at least one electrically conductive surface, (b) providing a conductive material pattern on at least one of the conductive surfaces of the laminate, (C) fixed stacking in a predetermined configuration as a stack, at least one conductive surface of at least one of the stacks comprising an outer conductive surface of the stack, (4) = complex number Electrically coupled to the first layer of the conductive layer - a conductive surface between the first layer, and T plus a plurality of electrical components on the outer conductive surface of the stack; and (2) the total Re-booking is divided into one less electrical connection ^==set' each device contains (1) to, mouth, and (u) at least - Ray 2 · as claimed in the second paragraph, , and external guide mine # & Wherein, the assembly includes two L-tables and the electrical components are attached to the two outer conductive surfaces. 3. The permanent electrical connection is added as in the scope of the claims. #中 The electrical component is attached. 4. If the third item of the patent application is included, it contains weldable materials. , "Gas connection pad 5", such as the method of Shen Qing patent range, item 1, the Thai electrical component is attached -41 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公董） 91541B 接 訂 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 1275107 六、申請專利範圍 加至可再連結的接觸墊。 6. 如申請專利範圍第5項之方法，其中該可再連結的接 觸塾包含金、妃或是把錄合金。 7. 如申請專利範圍第1項之方法，其中一額外導電層係 5 附加至該等外部導電表面中的至少一面的至少一部 份，以形成電氣連結墊或是可再連結的接觸墊。 8·如申請專利範圍第1項之方法，其中第一積層中之層 狀聚合物元件包含PTC導電聚合物組合物。 9. 如申請專利範圍第8項之方法，其中第二積層之層狀 10 聚合物元件包含電介質材料。 10. 如申請專利範圍第9項之方法，其中該總成尚包含一 第三積層，該第三積層包含為電介質的一層狀元件， 該第二及第三積層位於第一積層之頂部與底部。 11. 一種製造一複合聚合物電路保護裝置之方法，該方法 15 包含 (1)提供一聚合物總成，包含 (a) 提供第一及第二積層，各積層包含一層狀聚合 物元件，其具有至少一導電表面， (b) 提供一導電材料圖樣於一積層之導電表面中的 20 至少一面上， (c) 以預定配置固定積層成為一堆疊，至少一積層 之至少一導電表面包含該堆疊之一外部導電表 面， (d) 製造複數個電氣連結於第一積層之一導電表面 -42 - 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐）This paper scale applies to China National Standard (CNS) A4 specification (210x297 dongdong) 91541B Order A8 B8 C8 D8 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 VI. Patent application scope Add to reconnectable contact pads. 6. The method of claim 5, wherein the re-attachable contact comprises gold, tantalum or alloy. 7. The method of claim 1, wherein an additional conductive layer 5 is attached to at least a portion of at least one of the outer conductive surfaces to form an electrical connection pad or a re-bondable contact pad. 8. The method of claim 1, wherein the layered polymer element in the first laminate comprises a PTC conductive polymer composition. 9. The method of claim 8, wherein the layered 10 polymer element of the second laminate comprises a dielectric material. 10. The method of claim 9, wherein the assembly further comprises a third laminate, the third laminate comprising a layered component that is a dielectric, the second and third laminates being located at the top and bottom of the first laminate . 11. A method of making a composite polymer circuit protection device, the method 15 comprising (1) providing a polymer assembly comprising (a) providing first and second laminates, each laminate comprising a layer of polymeric components, Having at least one electrically conductive surface, (b) providing a conductive material pattern on at least one of 20 of the laminated conductive surfaces, (c) fixing the laminate in a predetermined configuration to form a stack, at least one electrically conductive surface of the at least one laminate comprising the Stacking one of the external conductive surfaces, (d) manufacturing a plurality of electrically conductive surfaces connected to one of the first laminates - 42 - This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1275107 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 與第二積層之一導電表面間， (2) 將該總成再劃分成為個別裝置，各該裝置包含至少 一電氣連結；以及 (3) 附加至少一電氣組件至各裝置之一外部導電表面。 5 12·如申請專利範圍第11項之方法，其中第一積層中之層 狀聚合物元件包含PTC導電聚合物組合物。 13·如申請專利範圍第12項之方法，其中第二積層之層狀 聚合物元件包含電介質材料。 14·如申請專利範圍第13項之方法，其中該總成尚包含一 10 第三積層，該第三積層包含為電介質的一層狀元件， 該第二及第三積層位於第一積層之頂部與底部。 15. —種製造一複合聚合物電路保護裝置之方法，該方法 包含 (1)提供一聚合物總成，包含 15 (a)提供第一積層，第一積層包含一層狀聚合物元 件，該層狀聚合物元件包含導電聚合物組合物 且具有至少一導電表面， (b) 提供第二積層，第二積層包含一層狀聚合物元 件，該層狀聚合物元件包含一絕緣聚合物組合 20 物且具有至少一導電表面， (c) 提供一導電材料之圖樣於一積層的導電表面中 之至少一面上， (d) 以預定配置固定積層成為一堆疊，至少一積層 之至少一導電表面包含該堆疊之一外部導電表 -43 - 本紙張尺度適用中國國家標準(CNS)A4規格（210x297公釐）1275107 A8 B8 C8 D8 Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Cooperatives. VI. Between the scope of application for patents and one of the conductive layers of the second laminate. (2) The assembly is subdivided into individual devices, each of which contains at least one electrical Connecting; and (3) attaching at least one electrical component to an external conductive surface of each of the devices. The method of claim 11, wherein the layered polymer element in the first laminate comprises a PTC conductive polymer composition. 13. The method of claim 12, wherein the layered polymer element of the second laminate comprises a dielectric material. 14. The method of claim 13, wherein the assembly further comprises a 10th buildup layer, the third buildup layer comprising a layered component that is a dielectric, the second and third buildup layers being located on top of the first buildup layer and bottom. 15. A method of making a composite polymer circuit protection device, the method comprising (1) providing a polymer assembly comprising 15 (a) providing a first laminate, the first laminate comprising a layered polymer component, The layered polymer element comprises a conductive polymer composition and has at least one electrically conductive surface, (b) providing a second laminate, the second laminate comprising a layered polymer element comprising an insulating polymer combination 20 And having at least one electrically conductive surface, (c) providing a pattern of a conductive material on at least one of the laminated conductive surfaces, (d) fixing the laminate in a predetermined configuration to form a stack, at least one of the at least one electrically conductive surface comprising One of the stacks of external conductive meters -43 - This paper size applies to China National Standard (CNS) A4 specifications (210x297 mm) 4 訂4 order 1275107 as B8 C8 _D8_ 六、申請專利範圍 ' 面， (e) 製造複數個電氣連結於第一積層之一導電表面 與第二積層之一導電表面間，以及 (f) 提供一額外的導電層於該等外部導電表面中之 5 至少一面的至少一部份上，以形成一電氣連結 墊或是一可再連結的接觸墊；以及 (2)將該總成再劃分成為個別裝置，各該裝置包含⑴至 少一電氣連結，以及(ii)至少一電氣連結墊或是可再 連結的接觸墊。 10 16.如申請專利範圍第15項之方法，其中各裝置包含至少 、 一個電氣連結墊於一外部表面以及至少一個可再連結 的接觸墊於另一外部表面。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐）1275107 as B8 C8 _D8_ VI. Patent application scope, (e) manufacturing a plurality of electrical connections between one of the conductive surfaces of the first laminate and one of the conductive surfaces of the second laminate, and (f) providing an additional conductive layer At least a portion of at least one of the five outer conductive surfaces to form an electrical connection pad or a re-connectable contact pad; and (2) subdividing the assembly into individual devices, each of the devices Including (1) at least one electrical connection, and (ii) at least one electrical connection pad or a re-bondable contact pad. 10. The method of claim 15, wherein each device comprises at least one electrical connection pad on an outer surface and at least one rejoinable contact pad on the other outer surface. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives. This paper scale applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm).