KR100685216B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR100685216B1
KR100685216B1 KR1020050086590A KR20050086590A KR100685216B1 KR 100685216 B1 KR100685216 B1 KR 100685216B1 KR 1020050086590 A KR1020050086590 A KR 1020050086590A KR 20050086590 A KR20050086590 A KR 20050086590A KR 100685216 B1 KR100685216 B1 KR 100685216B1
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KR
South Korea
Prior art keywords
substrate
discharge port
vertical position
measurement
processing apparatus
Prior art date
Application number
KR1020050086590A
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English (en)
Korean (ko)
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KR20060051365A (ko
Inventor
겐타로 니시오카
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
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Publication of KR20060051365A publication Critical patent/KR20060051365A/ko
Application granted granted Critical
Publication of KR100685216B1 publication Critical patent/KR100685216B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020050086590A 2004-10-07 2005-09-16 기판 처리 장치 및 기판 처리 방법 KR100685216B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004294705A JP4490780B2 (ja) 2004-10-07 2004-10-07 基板処理装置および基板処理方法
JPJP-P-2004-00294705 2004-10-07

Publications (2)

Publication Number Publication Date
KR20060051365A KR20060051365A (ko) 2006-05-19
KR100685216B1 true KR100685216B1 (ko) 2007-02-22

Family

ID=36372981

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050086590A KR100685216B1 (ko) 2004-10-07 2005-09-16 기판 처리 장치 및 기판 처리 방법

Country Status (4)

Country Link
JP (1) JP4490780B2 (zh)
KR (1) KR100685216B1 (zh)
CN (1) CN1757439B (zh)
TW (1) TWI268812B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4752286B2 (ja) * 2004-12-28 2011-08-17 株式会社ニコン 位置調整装置の制御方法、位置調整装置、及び露光装置
JP4705517B2 (ja) 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP4799390B2 (ja) * 2006-12-15 2011-10-26 中外炉工業株式会社 塗布方法
JP2008238144A (ja) * 2007-03-29 2008-10-09 Toray Eng Co Ltd 塗布装置及び塗布方法
CN101502822B (zh) * 2008-02-04 2012-05-30 联华电子股份有限公司 喷嘴的校准装置及喷嘴的校准方法
KR101020681B1 (ko) 2008-11-18 2011-03-11 세메스 주식회사 평판 디스플레이 소자 제조용 코팅 물질 도포 장치
KR101343502B1 (ko) 2009-07-24 2013-12-19 엘지디스플레이 주식회사 코팅장비의 코터 척
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP6803120B2 (ja) * 2016-11-28 2020-12-23 東レエンジニアリング株式会社 原点検出器及び塗布装置
KR102641446B1 (ko) * 2017-07-19 2024-02-28 주식회사 탑 엔지니어링 디스펜싱 장치
CN118081119B (zh) * 2024-04-23 2024-07-30 西安晟光硅研半导体科技有限公司 一种微射流激光加工头垂直度的调整方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3499438B2 (ja) 1998-05-28 2004-02-23 東京エレクトロン株式会社 塗布方法
KR20050025703A (ko) * 2003-09-08 2005-03-14 한국디엔에스 주식회사 평판표시소자 제조를 위한 기판 상에 포토레지스트를도포하는 장치 및 방법
JP2005296907A (ja) 2004-04-16 2005-10-27 Tokyo Electron Ltd 塗布膜形成装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07256180A (ja) * 1994-03-23 1995-10-09 Sony Corp 板状部材への流体材料の塗布方法及びその装置
JP3731616B2 (ja) * 1996-01-30 2006-01-05 東レ株式会社 塗布装置および塗布方法並びにカラーフィルタの製造装置および製造方法
JP3199239B2 (ja) * 1998-01-06 2001-08-13 東レ株式会社 プラズマディスプレイ用部材の製造方法および装置
JP2003001165A (ja) * 2001-06-26 2003-01-07 Seiko Instruments Inc 液体塗布装置
JP2003243286A (ja) * 2002-02-14 2003-08-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004014393A (ja) * 2002-06-10 2004-01-15 Dainippon Printing Co Ltd プラズマディスプレイパネルの蛍光面形成方法及び蛍光面形成装置
JP2004351261A (ja) * 2003-05-27 2004-12-16 Canon Inc 塗布装置および塗布方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3499438B2 (ja) 1998-05-28 2004-02-23 東京エレクトロン株式会社 塗布方法
KR20050025703A (ko) * 2003-09-08 2005-03-14 한국디엔에스 주식회사 평판표시소자 제조를 위한 기판 상에 포토레지스트를도포하는 장치 및 방법
JP2005296907A (ja) 2004-04-16 2005-10-27 Tokyo Electron Ltd 塗布膜形成装置

Also Published As

Publication number Publication date
JP2006102684A (ja) 2006-04-20
CN1757439A (zh) 2006-04-12
TWI268812B (en) 2006-12-21
CN1757439B (zh) 2011-10-19
JP4490780B2 (ja) 2010-06-30
KR20060051365A (ko) 2006-05-19
TW200626250A (en) 2006-08-01

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