TW200626250A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing methodInfo
- Publication number
- TW200626250A TW200626250A TW094127597A TW94127597A TW200626250A TW 200626250 A TW200626250 A TW 200626250A TW 094127597 A TW094127597 A TW 094127597A TW 94127597 A TW94127597 A TW 94127597A TW 200626250 A TW200626250 A TW 200626250A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate processing
- slit nozzle
- vertical position
- vertical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
To provide a substrate treatment apparatus capable of accurately controlling the distance between a discharging port and a substrate and having a nozzle easy to manufacture. In the substrate treatment 1, linear gauges 81, 82 for measuring the vertical position as the position in the direction perpendicular to the substrate to be treated measure the vertical position of the discharging port 41c of the slit nozzle 41 to discharge the treatment liquid to the substrate to be treated and the measured sites P, P' and control vertical movement of the slit nozzle 41 by lift mechanisms 43, 44 to transfer the slit nozzle 41 in the direction vertical to the substrate utilizing the measured result of the vertical position.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004294705A JP4490780B2 (en) | 2004-10-07 | 2004-10-07 | Substrate processing apparatus and substrate processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200626250A true TW200626250A (en) | 2006-08-01 |
TWI268812B TWI268812B (en) | 2006-12-21 |
Family
ID=36372981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127597A TWI268812B (en) | 2004-10-07 | 2005-08-12 | Substrate processing apparatus and substrate processing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4490780B2 (en) |
KR (1) | KR100685216B1 (en) |
CN (1) | CN1757439B (en) |
TW (1) | TWI268812B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI478273B (en) * | 2010-05-12 | 2015-03-21 | Tokyo Electron Ltd | Substrate processing device,substrate processing method,and memory medium recorded with program |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4752286B2 (en) * | 2004-12-28 | 2011-08-17 | 株式会社ニコン | Position adjustment apparatus control method, position adjustment apparatus, and exposure apparatus |
JP4705517B2 (en) | 2006-05-19 | 2011-06-22 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, program, and recording medium |
JP4799390B2 (en) * | 2006-12-15 | 2011-10-26 | 中外炉工業株式会社 | Application method |
JP2008238144A (en) * | 2007-03-29 | 2008-10-09 | Toray Eng Co Ltd | Apparatus and method for applying coating liquid |
CN101502822B (en) * | 2008-02-04 | 2012-05-30 | 联华电子股份有限公司 | Calibrating equipment of nozzle and calibration method of nozzle |
KR101020681B1 (en) | 2008-11-18 | 2011-03-11 | 세메스 주식회사 | Apparatus of coating photo resist composition in a Flat Panel Display manufacturing |
KR101343502B1 (en) | 2009-07-24 | 2013-12-19 | 엘지디스플레이 주식회사 | Coater chuck of coating apparatus |
JP6803120B2 (en) * | 2016-11-28 | 2020-12-23 | 東レエンジニアリング株式会社 | Origin detector and coating device |
KR102641446B1 (en) * | 2017-07-19 | 2024-02-28 | 주식회사 탑 엔지니어링 | Dispenser |
CN118081119B (en) * | 2024-04-23 | 2024-07-30 | 西安晟光硅研半导体科技有限公司 | Method for adjusting perpendicularity of micro-jet laser processing head |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07256180A (en) * | 1994-03-23 | 1995-10-09 | Sony Corp | Method for applying fluid material to planar member and device therefor |
JP3731616B2 (en) * | 1996-01-30 | 2006-01-05 | 東レ株式会社 | Coating apparatus and coating method, and color filter manufacturing apparatus and manufacturing method |
JP3199239B2 (en) * | 1998-01-06 | 2001-08-13 | 東レ株式会社 | Manufacturing method and apparatus for plasma display member |
JP3499438B2 (en) | 1998-05-28 | 2004-02-23 | 東京エレクトロン株式会社 | Application method |
JP2003001165A (en) * | 2001-06-26 | 2003-01-07 | Seiko Instruments Inc | Liquid coating device |
JP2003243286A (en) * | 2002-02-14 | 2003-08-29 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
JP2004014393A (en) * | 2002-06-10 | 2004-01-15 | Dainippon Printing Co Ltd | Phosphor screen forming method and phosphor screen forming device of plasma display panel |
JP2004351261A (en) * | 2003-05-27 | 2004-12-16 | Canon Inc | Coater and coating method |
KR100566405B1 (en) * | 2003-09-08 | 2006-03-31 | 세메스 주식회사 | Apparatus and method for coating photoresist on a substrate for manufacturing flat panel display devices |
JP4372606B2 (en) | 2004-04-16 | 2009-11-25 | 東京エレクトロン株式会社 | Coating film forming device |
-
2004
- 2004-10-07 JP JP2004294705A patent/JP4490780B2/en active Active
-
2005
- 2005-08-12 TW TW094127597A patent/TWI268812B/en active
- 2005-09-08 CN CN2005100999261A patent/CN1757439B/en active Active
- 2005-09-16 KR KR1020050086590A patent/KR100685216B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI478273B (en) * | 2010-05-12 | 2015-03-21 | Tokyo Electron Ltd | Substrate processing device,substrate processing method,and memory medium recorded with program |
Also Published As
Publication number | Publication date |
---|---|
JP2006102684A (en) | 2006-04-20 |
CN1757439A (en) | 2006-04-12 |
KR100685216B1 (en) | 2007-02-22 |
TWI268812B (en) | 2006-12-21 |
CN1757439B (en) | 2011-10-19 |
JP4490780B2 (en) | 2010-06-30 |
KR20060051365A (en) | 2006-05-19 |
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