KR0139128Y1 - Moulding apparatus of molding press for semiconductor package - Google Patents
Moulding apparatus of molding press for semiconductor package Download PDFInfo
- Publication number
- KR0139128Y1 KR0139128Y1 KR2019950052634U KR19950052634U KR0139128Y1 KR 0139128 Y1 KR0139128 Y1 KR 0139128Y1 KR 2019950052634 U KR2019950052634 U KR 2019950052634U KR 19950052634 U KR19950052634 U KR 19950052634U KR 0139128 Y1 KR0139128 Y1 KR 0139128Y1
- Authority
- KR
- South Korea
- Prior art keywords
- molding press
- mold
- semiconductor package
- molding
- heat
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 4
- 239000010438 granite Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
본 고안은 반도체패키지 제조용 몰딩프레스의 금형장치에 관한 것으로, 와이어본딩된 리드프레임을 컴파운드로 몰딩시 금형에 가해지는 열이 외부로 전달되는 것은 방지하여 제품의 품질 및 생상성을 향상시킬 수 있는 것으로, 바텀캐비티, 바텀컬블럭, 바텀체이스가 결합되고, 그 하부에는 바텀베이스블럭과 바텀볼스타가 결합되며, 히터가 설치되어 하형다이의 상부를 일정온도(175℃)로 가열하는 몰딩프레스의 금형장치에 있어서, 상기 바텀베이스블럭과 바텀볼스타사이에 단열판을 설치하여 열이 하부의 바텀볼스타 쪽으로 전달되는 것을 방지하도록 된 반도체패키지 제조용 몰딩프레스의 금형장치이다.The present invention relates to a mold apparatus of a molding press for manufacturing a semiconductor package, and to prevent heat from being transferred to the mold when molding the wire-bonded lead frame into a compound, thereby improving product quality and productivity. Bottom cavity, bottom curl block and bottom chase are combined, and bottom base block and bottom ball star are coupled to the bottom, and a heater is installed to mold the molding press of the upper part of the lower die to a certain temperature (175 ° C). In the, is a mold apparatus of a molding press for manufacturing a semiconductor package to install a heat insulating plate between the bottom base block and the bottom ball star to prevent heat from being transferred toward the bottom ball star.
Description
제1도는 본 고안이 설치된 몰딩프레스의 전체 구성을 보인 정면도.1 is a front view showing the overall configuration of the molding press in which the present invention is installed.
제2도는 본 고안의 요부 구조를 보인 단면도.Figure 2 is a cross-sectional view showing the main structure of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 하형다이 11 : 바텀캐비티10: die die 11: bottom cavity
12 : 바텀컬블럭 13 : 바텀체이스12: bottom color block 13: bottom chase
14 : 바텀베이스블럭 15 : 바텀볼스타14: Bottom Base Block 15: Bottom Ball Star
18 : 히터 20 : 단열판18: heater 20: heat insulation plate
본 고안은 반도체패키지 제조용 몰딩프레스의 금형장치에 관한 것으로, 더욱 상세하게는 와이어본딩된 리드프레임에 컴파운드로 몰딩할 때에는 금형을 일정온도(175℃)로 가열하여야 컴파운드가 잘 주입되어 결합력을 향상시키고, 제품의 품질을 향상시키는 바, 이때 금형에 가해지는 열이 외부로 전달되는 것은 방지하고, 리드프레임이 위치하는 상·하형다이가 맞물리는 부위로만 열이 전달되도록 한 반도체패키지 제조용 몰딩프레스의 금형장치에 관한 것이다.The present invention relates to a mold apparatus of a molding press for manufacturing a semiconductor package. More specifically, when molding a compound into a wire-bonded lead frame, the mold must be heated to a constant temperature (175 ° C.) to inject a compound to improve bonding strength. In order to improve the quality of the product, at this time, the heat applied to the mold is prevented from being transferred to the outside, and the mold of the molding press for manufacturing a semiconductor package, in which the heat is transferred only to a portion where the upper and lower dies where the lead frame is located is engaged. Relates to a device.
일반적으로 반도체패키지 제조용 몰딩프레스는 상형다이와 하형다이로 구성되며, 상기 상·하형다이에 본딩된 리드프레임이 위치되어 상·하형다이가 맞물린 상태에서 컴파운드가 주입되어 몰딩을 하게된다. 이때, 상기 컴파운드는 일정온도(175℃)에서 녹아 주입되는데, 상·하형다이에 이와같은 온도로 열을 가해주어야 몰딩작업을 할 수 있는 것이다.In general, a molding press for manufacturing a semiconductor package includes an upper die and a lower die, and a lead frame bonded to the upper and lower dies is positioned so that a compound is injected and molded while the upper and lower dies are engaged. At this time, the compound is melted at a predetermined temperature (175 ℃), it is injected, the upper and lower dies should be heated to such a temperature to perform the molding operation.
이와같이 상·하형다이에 열을 가해주기 위해서는 상·하형다이에 각각 히터를 설치하여 열을 가해 주었다. 그러나, 종래에는 상·하형다이에 열을 가할 때 불필요한 부분으로 열이 전달되어 외부로 열을 빼앗기게 되므로 몰딩시 필요한 일정온도로 열을 가하지 못하여 몰딩작업시 불량을 초래하는 요인이 되었던 것이다.In order to apply heat to the upper and lower dies, heaters were installed on the upper and lower dies, respectively, to apply heat. However, in the related art, heat is transferred to an unnecessary part when heat is applied to the upper and lower dies, thereby depriving the heat to the outside, thereby causing a defect in molding work because the heat cannot be applied at a predetermined temperature required for molding.
즉, 종래의 경우에는 히터에 의해 가해진 열이 단열이 되지 않고 외부로 빼앗기게 됨으로 상·하형다이를 일정온도로 가열하기 위해 히터에 사용되는 전기 사용량이 많아졌고, 온도 콘트롤을 하지 못하여 불량을 발생시켜 제품의 신뢰성이 저하되는 문제점이 있었던 것이다.That is, in the conventional case, since the heat applied by the heater is not insulated and is taken away to the outside, the amount of electricity used for the heater to heat the upper and lower dies to a constant temperature increases, and the temperature control is not performed, resulting in a defect. There was a problem that the product reliability is lowered.
또한, 히터에서 전달되는 열이 금형의 볼스타 쪽으로 전달되어 열팽창에 의한 장비의 수명을 단축시키는 문제점도 있었던 것이다.In addition, there is a problem that the heat transferred from the heater is transferred to the ball star of the mold to shorten the life of the equipment by thermal expansion.
따라서, 본 고안은 이와같은 문제점을 해소하기 위하여 안출된 것으로, 와이어본딩된 리드프레임을 몰딩하기 위해 히터에 의해 상·하형다이를 일정온도(175℃)로 가열하는 열을 불필요한 부분으로 전달되지 않도록 하여 몰딩장비를 보호하며, 온도 콘트롤을 용이하게 하므로써 불필요한 전기 사용량을 줄이고, 제품의 불량을 방지하여 생산성을 향상시키도록 된 반도체패키지 제조용 몰딩프레스의 금형장치를 제공함에 그 목적이 있다.Therefore, the present invention has been devised to solve such a problem, so that the heat for heating the upper and lower dies to a constant temperature (175 ° C.) by a heater to mold the wire-bonded lead frame is not transferred to an unnecessary portion. The purpose of the present invention is to provide a mold apparatus of a molding press for manufacturing a semiconductor package to protect molding equipment and to reduce temperature by facilitating temperature control, and to improve productivity by preventing unnecessary product defects.
이러한 본 고안의 목적을 달성하기 위해서는 바텀캐비티, 바텀컬블럭, 바텀체이스가 결합되고, 그 하부에는 바텀베이스블럭과 바텀볼스타가 결합되며, 히터가 설치되어 하형다이의 상부를 일정온도(175℃)로 가열하는 몰딩프레스의 금형장치에 있어서, 상기 바텀베이스블럭과 바텀볼스타사이에 단열판을 설치하여 열이 하부의 바텀볼스타 쪽으로 전달되는 것을 방지하도록 된 것을 특징으로 하는 반도체패키지 제조용 몰딩프레스의 금형장치에 의해 가능하다.In order to achieve the object of the present invention, the bottom cavity, bottom curl block, bottom chase is coupled, the bottom base block and bottom ball star is coupled, the heater is installed, the upper part of the lower die die constant temperature (175 ℃) In the molding apparatus of a molding press for heating with a), an insulating plate is installed between the bottom base block and the bottom ball star to prevent heat from being transferred toward the bottom ball star of the semiconductor package manufacturing press of the molding press It is possible by the mold apparatus.
이하, 본 고안을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 몰딩프레스(A)의 전체구성을 도시한 정면도로서, 몰딩프레스(A)의 일측에는 온로더유니트(B), 예열장치(C), 펠렛로딩유니트(D)를 설치하고, 몰딩프레스(A)의 전방에는 인풋아암유니트를 설치하며, 후방에 아웃풋아암유니트와 크리너를 일체형으로 설치하고, 상기 인풋·아웃풋유니트에는 리드프레임을 집는 그립퍼유니트를 설치하며, 몰딩프레스(A)의 타측에는 디컬링유니트(E), 픽 플레이스유니트(F) 및 언로더유니트(G)가 각각 설치되어 있다.FIG. 1 is a front view showing the overall configuration of the molding press A. On one side of the molding press A, an on-loader unit B, a preheating device C, and a pellet loading unit D are provided. An input arm unit is installed at the front of (A), an output arm unit and a cleaner are integrally installed at the rear, and a gripper unit is provided at the input output unit to hold a lead frame, and the other side of the molding press (A) A decaling unit E, a pick place unit F and an unloader unit G are provided, respectively.
제2도는 본 고안의 금형장치를 도시한 도면으로 여기서는 하형다이(10)를 나타내고 있는 것으로, 본딩된 리드프레임을 성형시키는 바텀캐비티(11)와 몰딩컴파운드가 흘러들어가는 바텀컬블럭(12)이 바텀체이스(13)에 결합되어 있다.2 is a view showing a mold apparatus of the present invention, which shows a lower die 10. The bottom cavity 11 for forming the bonded lead frame and the bottom collar block 12 into which the molding compound flows are bottomed. It is coupled to the chase 13.
상기 바텀체이스(13)에는 하형다이(10)를 일정온도(175℃)로 가열하기 위한 히터(18)가 설치되어 있으며, 바텀체이스(13)의 하부에는 바텀베이스블럭(14)이 결합되며, 그 하부에 바텀볼스타(15)가 결합되어 있는데, 상기 바텀베이스블럭(14)과 바텀볼스타(15) 사이에는 단열판(20)이 설치되어 상기 히터(18)에서 가열되는 열이 하부로 전달되는 것을 방지하여 열손실을 예방한다.The bottom chase 13 is provided with a heater 18 for heating the lower die 10 to a predetermined temperature (175 ℃), the bottom base block 14 is coupled to the bottom of the bottom chase 13, The bottom ball star 15 is coupled to the bottom, and the heat insulating plate 20 is installed between the bottom base block 14 and the bottom ball star 15 is transferred to the heat is heated in the heater 18 to the bottom. To prevent heat loss.
상기 단열판(20)은 단열과 강도를 모두 갖춘 재료로서, 예를들면 화강암과 같은 돌을 사용하는 것이 바람직하며, 상기 단열판(20)은 단열뿐만 아니라, 몰딩을 위한 금형의 신뢰도를 높여주고, 전기소모도 줄일 수 있는 잇점이 있는 것이다. 또한, 이와같이 구성된 본 고안은 상형다이에도 동일하게 설치되는 것이다.The heat insulating plate 20 is a material having both heat insulation and strength, for example, it is preferable to use a stone such as granite, the heat insulating plate 20 not only heat insulation, but also increase the reliability of the mold for molding, electrical There is also an advantage to reduce consumption. In addition, the present invention configured as described above is also installed in the upper die.
이상의 설명에서와 같이 본 고안은 몰딩시 필요한 일정온도를 히터에 의해서 금형에 가할 때 열이 불필요한 부위로 전달되는 것을 방지하여 열손실을 막고, 온도 콘트롤을 용이하게 하여 제품의 불량을 방지하여 생산성을 향상시키며, 장비를 보호할 수 있는 효과가 있다.As described above, the present invention prevents heat loss by preventing heat from being transferred to unnecessary parts when a certain temperature required for molding is applied to the mold by a heater, and facilitates temperature control, thereby preventing product defects and improving productivity. It has the effect of protecting the equipment.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970046939U KR970046939U (en) | 1997-07-31 |
| KR0139128Y1 true KR0139128Y1 (en) | 1999-03-20 |
Family
ID=19441817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0139128Y1 (en) |
-
1995
- 1995-12-29 KR KR2019950052634U patent/KR0139128Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970046939U (en) | 1997-07-31 |
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