KR970046939U - Molding press molding device for manufacturing semiconductor package - Google Patents
Molding press molding device for manufacturing semiconductor packageInfo
- Publication number
- KR970046939U KR970046939U KR2019950052634U KR19950052634U KR970046939U KR 970046939 U KR970046939 U KR 970046939U KR 2019950052634 U KR2019950052634 U KR 2019950052634U KR 19950052634 U KR19950052634 U KR 19950052634U KR 970046939 U KR970046939 U KR 970046939U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- manufacturing semiconductor
- molding
- press molding
- molding device
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970046939U true KR970046939U (en) | 1997-07-31 |
| KR0139128Y1 KR0139128Y1 (en) | 1999-03-20 |
Family
ID=19441817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950052634U KR0139128Y1 (en) | 1995-12-29 | 1995-12-29 | Moulding apparatus of molding press for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0139128Y1 (en) |
-
1995
- 1995-12-29 KR KR2019950052634U patent/KR0139128Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0139128Y1 (en) | 1999-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| LAPS | Lapse due to unpaid annual fee |