JP2000015665A - Mold for injection molding - Google Patents
Mold for injection moldingInfo
- Publication number
- JP2000015665A JP2000015665A JP10190665A JP19066598A JP2000015665A JP 2000015665 A JP2000015665 A JP 2000015665A JP 10190665 A JP10190665 A JP 10190665A JP 19066598 A JP19066598 A JP 19066598A JP 2000015665 A JP2000015665 A JP 2000015665A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- manifold
- plate
- cavity
- same size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 title claims abstract 3
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 abstract description 13
- 125000006850 spacer group Chemical group 0.000 abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 102100025012 Dipeptidyl peptidase 4 Human genes 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101000908391 Homo sapiens Dipeptidyl peptidase 4 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C2045/277—Spacer means or pressure pads between manifold and mould plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、射出成形金型、さ
らに詳しくは熱硬化性樹脂の成形に用いられるホットラ
ンナー射出成形金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection mold, and more particularly to a hot runner injection mold used for molding a thermosetting resin.
【０００２】[0002]
【従来の技術】従来のホットランナー金型は、樹脂を高
温で溶融状態のまま、キャビティに導く必要があるた
め、図２に示すように、高温維持部にはヒーター２を内
蔵または貼着したマニホールド１を用い、熱損失を少な
くするため、マニホールド１のサイズを小型化し、マニ
ホールド外周には成形圧力を受けるためのスペーサーブ
ロック３を設けていた。又、マニホールド１の周囲には
断熱の為の空気層４を設け、成形圧を受けるマニホール
ド１の上下部分にはライザーパッド５が設けられてい
た。2. Description of the Related Art In a conventional hot runner mold, it is necessary to guide a resin into a cavity while keeping the resin in a molten state at a high temperature. Therefore, as shown in FIG. The size of the manifold 1 was reduced in order to reduce heat loss by using the manifold 1, and a spacer block 3 for receiving a molding pressure was provided on the outer periphery of the manifold. Further, an air layer 4 for heat insulation is provided around the manifold 1, and riser pads 5 are provided on upper and lower portions of the manifold 1 which receives molding pressure.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記し
た従来構造の金型では次のような問題点を有していた。
すなわち、マニホールド部の成形圧力は、ライザーパ
ッドで部分的に受けるため、金型強度がスペーサーブロ
ック部に対して不足して、撓みが生じ易い。 スペーサーブロック部と、マニホールドおよびライザ
ーパッド部は、成形時に温度差が生ずるため、金型設計
通りの膨張を行わず、そのためキャビティ面の完全な平
面度は得にくい。However, the above-mentioned mold having the conventional structure has the following problems.
That is, since the molding pressure of the manifold portion is partially received by the riser pad, the mold strength is insufficient with respect to the spacer block portion, and the bending is likely to occur. The spacer block, the manifold and the riser pad do not expand according to the design of the mold due to a temperature difference during molding, so that it is difficult to obtain perfect flatness of the cavity surface.
【０００４】これらの理由から、従来の金型構造では、
熱硬化性樹脂のような流動性の高い樹脂材料では、バリ
が発生し易いという問題があった。本発明は熱硬化性樹
脂のホットランナー金型において、金型強度を確保し、
キャビティ面の平面度を保つことによって、バリの少な
い成形品を得ることを目的とする。[0004] For these reasons, in the conventional mold structure,
A resin material having a high fluidity such as a thermosetting resin has a problem that burrs are easily generated. The present invention, in a hot runner mold of thermosetting resin, to ensure mold strength,
An object is to obtain a molded product with less burrs by maintaining the flatness of the cavity surface.
【０００５】[0005]
【課題を解決するための手段】この課題を解決するため
に本発明は、溶融樹脂の流動経路を形成するマニホール
ド部と、前記マニホールド部に連結されたホットランナ
ーと、キャビティ型板を備えた射出成形金型において、
マニホールド部をキャビティ型板と水平方向に同一サイ
ズで形成し、同一サイズの断熱板を介してキャビティ型
板に固設したことを特徴とするものである。SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides an injection unit having a manifold section for forming a flow path of a molten resin, a hot runner connected to the manifold section, and a cavity template. In the molding die,
The manifold portion is formed in the same size in the horizontal direction as the cavity template, and is fixed to the cavity template via a heat insulating plate of the same size.
【０００６】本発明によると、従来装置が備えていたマ
ニホールド外周のスペーサーブロックや、空気断熱層を
廃して、成形圧を受ける全面に断熱板を配置することに
より、金型強度を向上すると共に、金型構造の差から生
ずる膨張差を無くすように構成したものである。これに
より、キャビティ面の平面度を保つことが容易になり、
バリの少ない成形品が得られる。According to the present invention, the spacer block on the outer periphery of the manifold and the air heat insulating layer provided in the conventional apparatus are eliminated, and the heat insulating plate is disposed on the entire surface receiving the molding pressure, thereby improving the mold strength. The structure is such that the difference in expansion caused by the difference in the mold structure is eliminated. This makes it easier to maintain the flatness of the cavity surface,
A molded product with less burrs can be obtained.
【０００７】[0007]
【発明の実施の形態】本発明の請求項１に記載の発明
は、溶融樹脂の流動経路を形成するマニホールド部と、
前記マニホールド部に連結されたホットランナーと、キ
ャビティ型板を備えた射出成形金型において、マニホー
ルド部をキャビティ型板と水平方向に同一サイズで形成
し、同一サイズの断熱板を介してキャビティ型板に固設
したことを特徴とするものである。DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a manifold section for forming a flow path of a molten resin,
In an injection mold having a hot runner connected to the manifold portion and a cavity template, the manifold portion is formed in the same size in the horizontal direction as the cavity template, and the cavity template is formed via a heat insulating plate of the same size. It is characterized by being fixedly mounted.
【０００８】本発明によると、マニホールド外周に設け
られていたスペーサーブロックや、空気断熱層を廃し
て、成形圧を受ける全面に断熱板を配置したので、金型
構成部品の熱膨張差により生ずる撓みの発生を防止で
き、キャビティ面の平面度を保ち、かつ空間部が無いの
で金型強度が増大するという作用を有する。以下、本発
明の実施の形態について、図１を用いて説明する。 （実施の形態１）図１は、熱硬化性樹脂のホットランナ
ー金型構造を示し、図１において、６はホットランナー
マニホールド部のランナー、７はキャビティ型板と水平
方向に同一サイズを有するマニホールド用プレート、８
はキャビティ型板、９はマニホールド用プレート７に連
結しているホットランナーである。また、熱硬化性樹脂
の成形時に、マニホールド用プレート７の温度を１００
℃付近に維持する必要があるため、このプレート内には
温調回路又はヒーター１０が配置されている。また、キ
ャビティ型板８は温度を２００℃付近に維持する必要が
あるため、ヒーター１１が配置されている。マニホール
ド用プレート７とキャビティ型板８の間には、このプレ
ート間の熱伝達を遮断するため、同一サイズの断熱板１
２がキャビティ型板全面に配置されており、マニホール
ド用プレート７は金型取付板１３に嵌着されるボルト１
４によりキャビティ型板８に固定されている。また、マ
ニホールド用プレート７の成形機への取付け面には、金
型から成形機への熱の伝達を防止するため、断熱板１５
を設けることもできる。According to the present invention, the spacer block and the air heat insulating layer provided on the outer periphery of the manifold are eliminated, and the heat insulating plate is disposed on the entire surface receiving the molding pressure. Can be prevented, the flatness of the cavity surface is maintained, and the mold strength is increased because there is no space. Hereinafter, embodiments of the present invention will be described with reference to FIG. (Embodiment 1) FIG. 1 shows a hot runner mold structure of a thermosetting resin. In FIG. 1, reference numeral 6 denotes a runner of a hot runner manifold portion, and 7 denotes a manifold having the same size in the horizontal direction as that of a cavity mold plate. Plate, 8
Is a cavity template, and 9 is a hot runner connected to the manifold plate 7. Further, when molding the thermosetting resin, the temperature of the manifold plate 7 is set to 100 ° C.
Since it is necessary to maintain the temperature in the vicinity of ° C., a temperature control circuit or a heater 10 is arranged in this plate. Further, since the temperature of the cavity template 8 needs to be maintained at around 200 ° C., the heater 11 is provided. In order to cut off heat transfer between the manifold plate 7 and the cavity template 8, a heat insulating plate 1 of the same size is provided.
2 is disposed on the entire surface of the cavity template, and the manifold plate 7 is provided with bolts 1 fitted to the mold mounting plate 13.
4 is fixed to the cavity template 8. In order to prevent heat transfer from the mold to the molding machine, a heat insulating plate 15 is provided on the mounting surface of the manifold plate 7 to the molding machine.
Can also be provided.
【０００９】[0009]
【発明の効果】以上のように本発明によれば、マニホー
ルド部のサイズをキャビティ型板と同一サイズに拡大
し、従来の金型において設けられていたマニホールド外
周のスペーサーブロックや空気断熱層を廃して、成形圧
を受ける全面に断熱板を配置することにより、金型強度
を向上すると共に、金型構造の差に起因する熱膨張差を
無くすように構成することにより、キャビティ面の平面
度を保つことができ、成形品のバリを削減できるという
有利な効果が得られる。As described above, according to the present invention, the size of the manifold portion is enlarged to the same size as the cavity mold plate, and the spacer block and the air heat insulating layer on the outer periphery of the manifold provided in the conventional mold are eliminated. By arranging the heat insulating plate on the entire surface receiving the molding pressure, the mold strength is improved, and the flatness of the cavity surface is reduced by eliminating the thermal expansion difference caused by the difference in the mold structure. This has the advantageous effect that the burr of the molded article can be reduced.
【図１】本発明の一実施の形態による熱硬化性樹脂のホ
ットランナー金型構造である。FIG. 1 is a hot runner mold structure of a thermosetting resin according to an embodiment of the present invention.
【図２】従来のホットランナー金型構造である。FIG. 2 shows a conventional hot runner mold structure.
１ マニホールド ２ ヒーター ３ スペーサーブロック ４ 空気層 ５ ライザーパッド ６ ランナー ７ マニホールド用プレート ８ キャビティ型板 ９ ホットランナー １０ 温調回路又はヒーター １１ ヒーター １２ 断熱板 １３ 金型取付板 １４ ボルト １５ 断熱板 DESCRIPTION OF SYMBOLS 1 Manifold 2 Heater 3 Spacer block 4 Air layer 5 Riser pad 6 Runner 7 Manifold plate 8 Cavity template 9 Hot runner 10 Temperature control circuit or heater 11 Heater 12 Insulating plate 13 Mold mounting plate 14 Bolt 15 Insulating plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大久保 直幸 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4F202 AA35 AJ13 AM33 CA11 CB01 CD26 CK03 CK88 CS01 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Naoyuki Okubo 1006 Kazuma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 4F202 AA35 AJ13 AM33 CA11 CB01 CD26 CK03 CK88 CS01
Claims (1)
ルド部と、前記マニホールド部に連結されたホットラン
ナーと、キャビティ型板を備えた射出成形金型におい
て、マニホールド部をキャビティ型板と水平方向に同一
サイズで形成し、同一サイズの断熱板を介してキャビテ
ィ型板に固設したことを特徴とする射出成形金型。1. An injection molding die having a manifold part for forming a flow path of a molten resin, a hot runner connected to the manifold part, and a cavity template. An injection mold having the same size and fixed to a cavity mold plate via a heat insulating plate of the same size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10190665A JP2000015665A (en) | 1998-07-06 | 1998-07-06 | Mold for injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10190665A JP2000015665A (en) | 1998-07-06 | 1998-07-06 | Mold for injection molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000015665A true JP2000015665A (en) | 2000-01-18 |
Family
ID=16261871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10190665A Pending JP2000015665A (en) | 1998-07-06 | 1998-07-06 | Mold for injection molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000015665A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2876618A1 (en) * | 2004-10-15 | 2006-04-21 | Delachaux Sa Sa | MOLDING INJECTION DEVICE WITH DISTRIBUTED SUPPORT |
| KR101186336B1 (en) | 2010-04-30 | 2012-09-28 | 주식회사 유도 | Insulation Pad of Hotrunner System |
| KR102089368B1 (en) * | 2019-01-21 | 2020-03-16 | 신흥화학(주) | Block Type Resin Providing Apparatus for Injection Molding of Thermosetting Resin |
-
1998
- 1998-07-06 JP JP10190665A patent/JP2000015665A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2876618A1 (en) * | 2004-10-15 | 2006-04-21 | Delachaux Sa Sa | MOLDING INJECTION DEVICE WITH DISTRIBUTED SUPPORT |
| WO2006042941A1 (en) * | 2004-10-15 | 2006-04-27 | Delachaux S.A. | Distributed bearing injection moulding device |
| JP2008516797A (en) * | 2004-10-15 | 2008-05-22 | ドゥラショー、ソシエテ、アノニム | Distributed support injection molding equipment |
| KR101186336B1 (en) | 2010-04-30 | 2012-09-28 | 주식회사 유도 | Insulation Pad of Hotrunner System |
| KR102089368B1 (en) * | 2019-01-21 | 2020-03-16 | 신흥화학(주) | Block Type Resin Providing Apparatus for Injection Molding of Thermosetting Resin |
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