JPWO2023063166A1 - - Google Patents

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Publication number
JPWO2023063166A1
JPWO2023063166A1 JP2023554426A JP2023554426A JPWO2023063166A1 JP WO2023063166 A1 JPWO2023063166 A1 JP WO2023063166A1 JP 2023554426 A JP2023554426 A JP 2023554426A JP 2023554426 A JP2023554426 A JP 2023554426A JP WO2023063166 A1 JPWO2023063166 A1 JP WO2023063166A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023554426A
Other versions
JP7499979B2 (ja
JPWO2023063166A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023063166A1 publication Critical patent/JPWO2023063166A1/ja
Publication of JPWO2023063166A5 publication Critical patent/JPWO2023063166A5/ja
Application granted granted Critical
Publication of JP7499979B2 publication Critical patent/JP7499979B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2023554426A 2021-10-15 2022-10-04 研削装置 Active JP7499979B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169856 2021-10-15
JP2021169856 2021-10-15
PCT/JP2022/037113 WO2023063166A1 (ja) 2021-10-15 2022-10-04 研削装置

Publications (3)

Publication Number Publication Date
JPWO2023063166A1 true JPWO2023063166A1 (ja) 2023-04-20
JPWO2023063166A5 JPWO2023063166A5 (ja) 2024-05-08
JP7499979B2 JP7499979B2 (ja) 2024-06-14

Family

ID=85988572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023554426A Active JP7499979B2 (ja) 2021-10-15 2022-10-04 研削装置

Country Status (3)

Country Link
JP (1) JP7499979B2 (ja)
TW (1) TW202330181A (ja)
WO (1) WO2023063166A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0938859A (ja) * 1995-08-01 1997-02-10 Hiraoka Gokin Kogu Kk 自動研削装置
JP2002052444A (ja) 2000-08-08 2002-02-19 Okamoto Machine Tool Works Ltd 平面研削装置およびワ−クの研削方法
JP2004243468A (ja) 2003-02-14 2004-09-02 Okamoto Machine Tool Works Ltd タッチプロ−ブセンサ付平面研削装置
AU2008359518B2 (en) * 2008-07-18 2014-10-23 Waida Mfg Co., Ltd. Method of adjusting machine tool and machine tool
JP5440154B2 (ja) * 2009-12-24 2014-03-12 株式会社ジェイテクト 研削プログラム、自動研削プログラム及び円筒研削盤
JP6909598B2 (ja) * 2017-03-13 2021-07-28 光洋機械工業株式会社 平面研削方法及び平面研削装置
JP7258563B2 (ja) * 2019-01-16 2023-04-17 株式会社岡本工作機械製作所 自動研削装置
JP2021030377A (ja) * 2019-08-26 2021-03-01 株式会社ディスコ 測定装置

Also Published As

Publication number Publication date
JP7499979B2 (ja) 2024-06-14
TW202330181A (zh) 2023-08-01
WO2023063166A1 (ja) 2023-04-20

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