JPWO2021192916A1 - - Google Patents
Info
- Publication number
- JPWO2021192916A1 JPWO2021192916A1 JP2022509488A JP2022509488A JPWO2021192916A1 JP WO2021192916 A1 JPWO2021192916 A1 JP WO2021192916A1 JP 2022509488 A JP2022509488 A JP 2022509488A JP 2022509488 A JP2022509488 A JP 2022509488A JP WO2021192916 A1 JPWO2021192916 A1 JP WO2021192916A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/20—Refractory metals
- B22F2301/205—Titanium, zirconium or hafnium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/40—Carbon, graphite
- B22F2302/406—Diamond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020053219 | 2020-03-24 | ||
PCT/JP2021/008634 WO2021192916A1 (ja) | 2020-03-24 | 2021-03-05 | 複合材料、及び放熱部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021192916A1 true JPWO2021192916A1 (ja) | 2021-09-30 |
JPWO2021192916A5 JPWO2021192916A5 (ja) | 2022-11-30 |
Family
ID=77891318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022509488A Pending JPWO2021192916A1 (ja) | 2020-03-24 | 2021-03-05 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230126268A1 (ja) |
EP (1) | EP4130309A1 (ja) |
JP (1) | JPWO2021192916A1 (ja) |
KR (1) | KR20220152386A (ja) |
CN (1) | CN115427599A (ja) |
WO (1) | WO2021192916A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7273374B2 (ja) * | 2018-02-21 | 2023-05-15 | 住友電気工業株式会社 | 複合材料、及び複合材料の製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT245269B (de) * | 1962-11-20 | 1966-02-25 | Plansee Metallwerk | Hochtemperatur-Werkstoff |
JP3893681B2 (ja) * | 1997-08-19 | 2007-03-14 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法 |
JP2003201528A (ja) * | 2001-10-26 | 2003-07-18 | Ngk Insulators Ltd | ヒートシンク材 |
JP4251986B2 (ja) * | 2001-11-09 | 2009-04-08 | 住友電工ハードメタル株式会社 | 高熱伝導性ダイヤモンド焼結体とその製造方法 |
JP2004197153A (ja) | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
AT7522U1 (de) * | 2004-04-29 | 2005-04-25 | Plansee Ag | Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff |
AT7492U1 (de) * | 2004-06-01 | 2005-04-25 | Ceratizit Austria Gmbh | Verschleissteil aus einem diamanthaltigen verbundwerkstoff |
JP2008066379A (ja) * | 2006-09-05 | 2008-03-21 | Sumitomo Electric Ind Ltd | 複合材料 |
GB0810542D0 (en) * | 2008-06-09 | 2008-07-16 | Element Six Production Pty Ltd | Cubic boron nitride compact |
EP2332674B1 (en) * | 2008-10-03 | 2019-11-27 | Sumitomo Electric Industries, Ltd. | Composite member |
CN101831584A (zh) * | 2009-03-10 | 2010-09-15 | 北京有色金属研究总院 | 高导热铜基复合材料及其制备方法 |
CN101985702B (zh) * | 2010-06-29 | 2013-02-06 | 北京科技大学 | 一种超高导热、低热膨胀系数金刚石复合材料及制备方法 |
WO2016029162A1 (en) * | 2014-08-21 | 2016-02-25 | Materion Corporation | Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material |
KR101611435B1 (ko) | 2014-09-24 | 2016-04-12 | 경일산업 주식회사 | 태양전지 패널용 정션박스 |
KR20180075502A (ko) * | 2015-10-30 | 2018-07-04 | 스미토모덴키고교가부시키가이샤 | 소결체 및 그 제조 방법 |
CN105624505B (zh) * | 2015-12-25 | 2017-09-22 | 富耐克超硬材料股份有限公司 | 一种金属基超硬复合材料及其制备方法 |
JP7089383B2 (ja) | 2018-03-20 | 2022-06-22 | ミネベアミツミ株式会社 | 送風機 |
JP7188957B2 (ja) | 2018-09-26 | 2022-12-13 | 古河機械金属株式会社 | 硫化物系無機固体電解質材料、固体電解質、固体電解質膜およびリチウムイオン電池 |
-
2021
- 2021-03-05 WO PCT/JP2021/008634 patent/WO2021192916A1/ja unknown
- 2021-03-05 EP EP21775180.9A patent/EP4130309A1/en not_active Withdrawn
- 2021-03-05 KR KR1020227032447A patent/KR20220152386A/ko unknown
- 2021-03-05 US US17/912,508 patent/US20230126268A1/en active Pending
- 2021-03-05 CN CN202180024227.8A patent/CN115427599A/zh active Pending
- 2021-03-05 JP JP2022509488A patent/JPWO2021192916A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20220152386A (ko) | 2022-11-15 |
WO2021192916A1 (ja) | 2021-09-30 |
US20230126268A1 (en) | 2023-04-27 |
CN115427599A (zh) | 2022-12-02 |
EP4130309A1 (en) | 2023-02-08 |
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