JPWO2019043844A1 - 光学部品及び透明封止部材 - Google Patents
光学部品及び透明封止部材 Download PDFInfo
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- JPWO2019043844A1 JPWO2019043844A1 JP2019538829A JP2019538829A JPWO2019043844A1 JP WO2019043844 A1 JPWO2019043844 A1 JP WO2019043844A1 JP 2019538829 A JP2019538829 A JP 2019538829A JP 2019538829 A JP2019538829 A JP 2019538829A JP WO2019043844 A1 JPWO2019043844 A1 JP WO2019043844A1
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- 230000003287 optical effect Effects 0.000 title claims abstract description 147
- 238000007789 sealing Methods 0.000 title claims abstract description 102
- 239000000758 substrate Substances 0.000 claims description 71
- 239000003795 chemical substances by application Substances 0.000 claims description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000005304 optical glass Substances 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 19
- 239000000463 material Substances 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000001629 suppression Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (14)
- 少なくとも1つの光学素子(12)と、
前記光学素子(12)が収容されるパッケージ(14)と、を有し、
前記パッケージ(14)は、
前記光学素子(12)が実装される実装基板(16)と、
前記実装基板(16)上に接合される透明封止部材(20)と、
前記実装基板(16)に実装された前記光学素子(12)を囲む凹部(26)と、
前記凹部(26)内に充填された屈折率整合剤(28)と、を有し、
前記パッケージ(14)は、前記凹部(26)から外部に連通する少なくとも1つの溝(30)を有することを特徴とする光学部品。 - 請求項1記載の光学部品において、
前記透明封止部材(20)のうち、前記実装基板(16)と接合する部分に前記溝(30)が形成されていることを特徴とする光学部品。 - 請求項1又は2記載の光学部品において、
前記実装基板(16)のうち、少なくとも前記透明封止部材(20)と接合する部分に前記溝(30)が形成されていることを特徴とする光学部品。 - 請求項1〜3のいずれか1項に記載の光学部品において、
複数の前記溝(30)を有し、
複数の前記溝(30)は、放射状に形成されていることを特徴とする光学部品。 - 請求項1〜4のいずれか1項に記載の光学部品において、
前記透明封止部材(20)と前記実装基板(16)とが接合する部分のうち、前記凹部(26)の周囲に、前記凹部(26)に連通する段差(40)が形成されていることを特徴とする光学部品。 - 請求項1〜5のいずれか1項に記載の光学部品において、
前記透明封止部材(20)と前記実装基板(16)とが接合する部分の前記光学部品(10)の底面に対する投影面積をA、前記溝(30)の前記光学部品(10)の底面に対する投影面積をBとしたとき、(B/A)×100が5%以上30%以下であることを特徴とする光学部品。 - 請求項1〜6のいずれか1項に記載の光学部品において、
前記溝(30)の高さ(hc)は、前記光学素子(12)の厚み(hd)より小さいことを特徴とする光学部品。 - 請求項1〜7のいずれか1項に記載の光学部品において、
前記透明封止部材(20)が石英ガラス又は光学ガラスにて構成され、前記屈折率整合剤(28)がシリコーン樹脂又はフッ素樹脂であることを特徴とする光学部品。 - 少なくとも1つの光学素子(12)と、前記光学素子(12)が実装された実装基板(16)と、前記実装基板(16)に実装された前記光学素子(12)を囲む凹部(26)と、を有する光学部品(10)に用いられ、前記実装基板(16)と共に前記光学素子(12)を収容するパッケージ(14)を構成する透明封止部材(20)であって、
前記透明封止部材(20)は、
前記凹部(26)に屈折率整合剤(28)が充填された状態で前記実装基板(16)に接合されるものであって、
前記実装基板(16)と接合する部分に前記凹部(26)から外部に連通する少なくとも1つの溝(30)を有することを特徴とする透明封止部材。 - 請求項9記載の透明封止部材において、
複数の前記溝(30)を有し、
複数の前記溝(30)は、放射状に形成されていることを特徴とする透明封止部材。 - 請求項9又は10記載の透明封止部材において、
前記実装基板(16)と接合する部分のうち、前記凹部(26)の周囲に、前記凹部(26)に連通する段差(40)が形成されていることを特徴とする透明封止部材。 - 請求項9〜11のいずれか1項に記載の透明封止部材において、
前記実装基板(16)と接合する部分の前記光学部品(10)の底面に対する投影面積をA、前記溝(30)の前記光学部品(10)の底面に対する投影面積をBとしたとき、(B/A)×100が5%以上30%以下であることを特徴とする透明封止部材。 - 請求項9〜12のいずれか1項に記載の透明封止部材において、
前記溝(30)の高さ(hc)は、前記光学素子(12)の厚み(hd)より小さいことを特徴とする透明封止部材。 - 請求項9〜13のいずれか1項に記載の透明封止部材において、
前記透明封止部材(20)が石英ガラス又は光学ガラスにて構成され、前記屈折率整合剤(28)がシリコーン樹脂又はフッ素樹脂であることを特徴とする透明封止部材。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2017/031211 WO2019043844A1 (ja) | 2017-08-30 | 2017-08-30 | 光学部品及び透明封止部材 |
Publications (2)
Publication Number | Publication Date |
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JPWO2019043844A1 true JPWO2019043844A1 (ja) | 2020-08-06 |
JP7030126B2 JP7030126B2 (ja) | 2022-03-04 |
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JP2019538829A Active JP7030126B2 (ja) | 2017-08-30 | 2017-08-30 | 光学部品及び透明封止部材 |
Country Status (6)
Country | Link |
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US (1) | US11733434B2 (ja) |
JP (1) | JP7030126B2 (ja) |
KR (1) | KR20200040788A (ja) |
CN (1) | CN111052420A (ja) |
DE (1) | DE112017007951T5 (ja) |
WO (1) | WO2019043844A1 (ja) |
Families Citing this family (5)
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KR102316398B1 (ko) * | 2017-06-16 | 2021-10-22 | 교세라 가부시키가이샤 | 광 커넥터 모듈 |
US11626547B2 (en) * | 2017-11-08 | 2023-04-11 | Xiamen Sanan Optoelectronics Technology, Co., Ltd. | UV LED device |
CN112145986B (zh) * | 2020-07-31 | 2022-11-01 | 中节能晶和科技有限公司 | 一种高光效灯具的制造方法 |
JP2022155737A (ja) * | 2021-03-31 | 2022-10-14 | 日東電工株式会社 | マイクロledディスプレイ装置 |
CN113394180B (zh) * | 2021-06-10 | 2022-05-31 | 广东气派科技有限公司 | 通信用高频功放芯片的封装结构及其封装方法 |
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JP2005223112A (ja) * | 2004-02-05 | 2005-08-18 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
JP2005322680A (ja) * | 2004-05-06 | 2005-11-17 | Rohm Co Ltd | 発光装置 |
JP2006093372A (ja) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | 半導体装置 |
KR20110070120A (ko) * | 2009-12-18 | 2011-06-24 | 서울반도체 주식회사 | 형광체 시트를 갖는 발광장치 및 그 제조방법 |
US20130095583A1 (en) * | 2011-10-17 | 2013-04-18 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led |
JP2014011364A (ja) * | 2012-06-29 | 2014-01-20 | Hoya Candeo Optronics株式会社 | Ledモジュール |
JP2014216484A (ja) * | 2013-04-25 | 2014-11-17 | 三菱樹脂株式会社 | 発光装置及びそのためのレンズ |
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JP2017054894A (ja) * | 2015-09-08 | 2017-03-16 | 日亜化学工業株式会社 | 発光装置 |
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WO2009119850A1 (ja) * | 2008-03-27 | 2009-10-01 | 京セラ株式会社 | 複合光伝送基板および光モジュール |
DE102011003969B4 (de) * | 2011-02-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
JP6128938B2 (ja) | 2013-04-26 | 2017-05-17 | 株式会社トクヤマ | 半導体発光素子パッケージ |
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JP2017011200A (ja) | 2015-06-25 | 2017-01-12 | 株式会社トクヤマ | 発光素子パッケージ |
-
2017
- 2017-08-30 JP JP2019538829A patent/JP7030126B2/ja active Active
- 2017-08-30 WO PCT/JP2017/031211 patent/WO2019043844A1/ja active Application Filing
- 2017-08-30 KR KR1020207006029A patent/KR20200040788A/ko unknown
- 2017-08-30 CN CN201780094531.3A patent/CN111052420A/zh active Pending
- 2017-08-30 DE DE112017007951.9T patent/DE112017007951T5/de active Pending
-
2020
- 2020-02-26 US US16/801,691 patent/US11733434B2/en active Active
Patent Citations (9)
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JP2005223112A (ja) * | 2004-02-05 | 2005-08-18 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
JP2005322680A (ja) * | 2004-05-06 | 2005-11-17 | Rohm Co Ltd | 発光装置 |
JP2006093372A (ja) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | 半導体装置 |
KR20110070120A (ko) * | 2009-12-18 | 2011-06-24 | 서울반도체 주식회사 | 형광체 시트를 갖는 발광장치 및 그 제조방법 |
US20130095583A1 (en) * | 2011-10-17 | 2013-04-18 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led |
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JP2014216484A (ja) * | 2013-04-25 | 2014-11-17 | 三菱樹脂株式会社 | 発光装置及びそのためのレンズ |
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JP2017054894A (ja) * | 2015-09-08 | 2017-03-16 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
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JP7030126B2 (ja) | 2022-03-04 |
KR20200040788A (ko) | 2020-04-20 |
WO2019043844A1 (ja) | 2019-03-07 |
US11733434B2 (en) | 2023-08-22 |
CN111052420A (zh) | 2020-04-21 |
US20200192003A1 (en) | 2020-06-18 |
DE112017007951T5 (de) | 2020-07-09 |
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