JP6970685B2 - 光学部品及び透明体 - Google Patents
光学部品及び透明体 Download PDFInfo
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- JP6970685B2 JP6970685B2 JP2018553644A JP2018553644A JP6970685B2 JP 6970685 B2 JP6970685 B2 JP 6970685B2 JP 2018553644 A JP2018553644 A JP 2018553644A JP 2018553644 A JP2018553644 A JP 2018553644A JP 6970685 B2 JP6970685 B2 JP 6970685B2
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- 230000003287 optical effect Effects 0.000 title claims description 159
- 239000012780 transparent material Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 64
- 239000012790 adhesive layer Substances 0.000 claims description 43
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 11
- 230000000630 rising effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 25
- 230000001070 adhesive effect Effects 0.000 description 25
- 230000006866 deterioration Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
Claims (12)
- 紫外光(12)を出射する少なくとも1つの光学素子(14)と、
前記光学素子(14)が収容されるパッケージ(16)とを有し、
前記パッケージ(16)は、
前記光学素子(14)が実装される実装基板(18)と、前記実装基板(18)上に有機系の接着層(20)を介して接合される透明体(22)とを有し、前記紫外光(12)が前記透明体(22)を伝って前記接着層(20)まで導光せず、且つ、前記紫外光(12)が前記接着層(20)に直接当たらない構造を有し、
前記透明体は、前記実装基板(18)上に有機系の前記接着層(20)を介して接合され、前記実装基板(18)上に固定された台座(31)と、該台座(31)上に一体に形成されたレンズ体(28)と、前記台座(31)に設けられ、且つ、前記光学素子(14)を囲む下面開口の凹部(32)とを有し、
前記レンズ体(28)の前記台座(31)の上面(26u)から立ち上がる部分の接線(S)の角度は、80°以上〜90°未満であることを特徴とする光学部品。 - 請求項1記載の光学部品において、
前記実装基板(18)の下面(18b)から前記光学素子(14)の光出射面(14a)までの高さと、前記実装基板(18)の下面(18b)から前記接着層(20)までの高さとは互いに異なることを特徴とする光学部品。 - 請求項1又は2記載の光学部品において、
前記接着層(20)は、前記実装基板(18)の実装面(18u)の方向に沿って形成され、
前記実装基板(18)の下面(18b)から前記光学素子(14)の光出射面(14a)までの高さをha、前記実装基板(18)の下面(18b)から前記接着層(20)までの高さをhbとしたとき、
ha>hb
であることを特徴とする光学部品。 - 請求項1〜3のいずれか1項に記載の光学部品において、
前記光学素子(14)の下面にサブマウント(24)を有することを特徴とする光学部品。 - 請求項1〜4のいずれか1項に記載の光学部品において、
前記実装基板(18)は、前記実装基板(18)の下面からの高さが、前記光学素子(14)が実装される面より、前記透明体(22)が接合される面の方を低くさせる段差(40)を有することを特徴とする光学部品。 - 請求項1又は2記載の光学部品において、
前記実装基板(18)の下面(18b)から前記光学素子(14)の光出射面(14a)までの高さをha、前記実装基板(18)の下面(18b)から前記接着層(20)までの高さをhbとしたとき、
ha<hb
であることを特徴とする光学部品。 - 請求項6記載の光学部品において、
前記接着層(20)は、前記実装基板(18)の実装面(18u)の方向に沿って形成され、
前記実装基板(18)と前記透明体(22)とで構成される前記光学素子(14)の収容空間(30)に遮光部(42)が配置されていることを特徴とする光学部品。 - 請求項7記載の光学部品において、
前記実装基板(18)と前記遮光部(42)とが一体に形成されていることを特徴とする光学部品。 - 請求項7又は8記載の光学部品において、
前記実装基板(18)の実装面のうち、前記遮光部(42)で囲まれた領域に複数の前記光学素子(14)が実装されていることを特徴とする光学部品。 - 請求項6記載の光学部品において、
前記光学素子(14)から出射される前記紫外光(12)の配光角が180°未満であることを特徴とする光学部品。 - 請求項1〜10のいずれか1項に記載の光学部品において、
前記透明体(22)のうち、前記接着層(20)と接触する面に前記紫外光(12)が透過しない材料(50)が配置されていることを特徴とする光学部品。 - 紫外光(12)を出射する少なくとも1つの光学素子(14)と、前記光学素子(14)が実装される実装基板(18)とを有するパッケージ(16)を具備した光学部品に用いられる透明体であって、
前記透明体は、前記実装基板(18)上に有機系の接着層(20)を介して接合され、前記実装基板(18)上に固定された台座(31)と、該台座(31)上に一体に形成されたレンズ体(28)と、前記台座(31)に設けられた下面開口の凹部(32)とを有し、
前記レンズ体(28)の前記台座(31)の上面(26u)から立ち上がる部分の接線(S)の角度は、80°以上〜90°未満であることを特徴とする透明体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2017/014336 | 2017-04-06 | ||
JP2017014336 | 2017-04-06 | ||
PCT/JP2017/022475 WO2018100775A1 (ja) | 2017-04-06 | 2017-06-19 | 光学部品及び透明体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018100775A1 JPWO2018100775A1 (ja) | 2020-03-05 |
JP6970685B2 true JP6970685B2 (ja) | 2021-11-24 |
Family
ID=62242418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018553644A Active JP6970685B2 (ja) | 2017-04-06 | 2017-06-19 | 光学部品及び透明体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11114595B2 (ja) |
JP (1) | JP6970685B2 (ja) |
CN (1) | CN110476261A (ja) |
DE (1) | DE112017007401B4 (ja) |
WO (1) | WO2018100775A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107369755A (zh) * | 2017-07-27 | 2017-11-21 | 旭宇光电(深圳)股份有限公司 | 紫外led封装结构 |
JP7149563B2 (ja) * | 2018-06-12 | 2022-10-07 | パナソニックIpマネジメント株式会社 | 発光装置 |
KR102613886B1 (ko) | 2018-08-06 | 2023-12-15 | 서울바이오시스 주식회사 | 발광 장치, 및 이를 포함하는 광 조사기 |
JP7269140B2 (ja) * | 2019-09-10 | 2023-05-08 | パナソニックホールディングス株式会社 | 半導体レーザ装置 |
JP7397687B2 (ja) * | 2020-01-22 | 2023-12-13 | スタンレー電気株式会社 | 深紫外光を発する発光装置及びそれを用いた水殺菌装置 |
JP7488088B2 (ja) | 2020-04-02 | 2024-05-21 | 日機装株式会社 | 半導体発光装置 |
JP7400675B2 (ja) | 2020-09-15 | 2023-12-19 | 豊田合成株式会社 | 発光装置 |
JP7387978B2 (ja) * | 2021-04-20 | 2023-11-29 | 日亜化学工業株式会社 | 発光装置 |
WO2022260174A1 (ja) * | 2021-06-11 | 2022-12-15 | シチズン電子株式会社 | 発光装置 |
JP7220333B1 (ja) | 2021-06-18 | 2023-02-09 | 日本碍子株式会社 | テラヘルツ装置用部材 |
WO2023222483A1 (en) * | 2022-05-18 | 2023-11-23 | Ams-Osram International Gmbh | Optoelectronic device and method for manufacturing an optoelectronic device |
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TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
US6791660B1 (en) * | 2002-02-12 | 2004-09-14 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
ES2335878T3 (es) * | 2002-08-30 | 2010-04-06 | Lumination, Llc | Led recubierto con eficacia mejorada. |
US7211835B2 (en) | 2003-07-09 | 2007-05-01 | Nichia Corporation | Light emitting device, method of manufacturing the same and lighting equipment |
JP2007311707A (ja) * | 2006-05-22 | 2007-11-29 | Ushio Inc | 紫外線発光素子パッケージ |
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KR101516358B1 (ko) * | 2012-03-06 | 2015-05-04 | 삼성전자주식회사 | 발광 장치 |
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JP2014150094A (ja) * | 2013-01-31 | 2014-08-21 | Panasonic Corp | 紫外線発光装置 |
JP6128938B2 (ja) | 2013-04-26 | 2017-05-17 | 株式会社トクヤマ | 半導体発光素子パッケージ |
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JP2017011200A (ja) * | 2015-06-25 | 2017-01-12 | 株式会社トクヤマ | 発光素子パッケージ |
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-
2017
- 2017-06-19 CN CN201780089274.4A patent/CN110476261A/zh active Pending
- 2017-06-19 DE DE112017007401.0T patent/DE112017007401B4/de active Active
- 2017-06-19 JP JP2018553644A patent/JP6970685B2/ja active Active
- 2017-06-19 WO PCT/JP2017/022475 patent/WO2018100775A1/ja active Application Filing
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2019
- 2019-10-03 US US16/591,965 patent/US11114595B2/en active Active
Also Published As
Publication number | Publication date |
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DE112017007401B4 (de) | 2023-07-06 |
CN110476261A (zh) | 2019-11-19 |
US11114595B2 (en) | 2021-09-07 |
DE112017007401T5 (de) | 2019-12-19 |
JPWO2018100775A1 (ja) | 2020-03-05 |
WO2018100775A1 (ja) | 2018-06-07 |
US20200035884A1 (en) | 2020-01-30 |
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