JPWO2008102628A1 - 蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 - Google Patents
蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 Download PDFInfo
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- JPWO2008102628A1 JPWO2008102628A1 JP2009500125A JP2009500125A JPWO2008102628A1 JP WO2008102628 A1 JPWO2008102628 A1 JP WO2008102628A1 JP 2009500125 A JP2009500125 A JP 2009500125A JP 2009500125 A JP2009500125 A JP 2009500125A JP WO2008102628 A1 JPWO2008102628 A1 JP WO2008102628A1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
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- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
5a・・・繊維状体
5b・・・蛍光体コア
11・・・発光装置
19・・・波長変換器
23・・・樹脂
Claims (11)
- M1(M1はSr、BaおよびCaから選ばれる少なくとも1種)、EuおよびSiを含有する蛍光体であって、該蛍光体が(M1,Eu)2SiO4で表される結晶を主結晶とし、前記蛍光体のX線吸収端近傍構造スペクトル(X-ray Absorption Near Edge Structure:XANES)による2価のEuイオンおよび3価のEuイオンの合量に対する前記2価のEuイオンの濃度が90%以上であり、さらに、前記Si 1モルに対する前記M1のモル比と、前記Si 1モルに対する前記Euのモル比との合計((M1+Eu)/Si)が2未満であることを特徴とする蛍光体。
- 前記Si 1モルに対する前記M1のモル比と、前記Si 1モルに対する前記Euのモル比との合計((M1+Eu)/Si)が1.78以上であることを特徴とする請求項1記載の蛍光体。
- 2価のEuイオンおよび3価のEuイオンの合量に対する前記2価のEuイオンの濃度が96%以上であることを特徴とする請求項1または2記載の蛍光体。
- 前記蛍光体は複数の蛍光体粒子を含むとともに、該蛍光体粒子が、蛍光体コアと該蛍光体コアの表面にある多数の繊維状体とを含み、該多数の繊維状体は、それぞれ少なくとも一方の端部が前記蛍光体コアに埋設されていることを特徴とする請求項1乃至3のうちのいずれかに記載の蛍光体。
- 前記繊維状体は、前記蛍光体コアに埋設されている埋設部と、前記蛍光体コアに埋設されていない非埋設部とを有し、該非埋設部は、前記蛍光体コアの表面から離間していることを特徴とする請求項4記載の蛍光体。
- M1(M1はSr、BaおよびCaから選ばれる少なくとも1種)原料、Eu原料およびSi原料を含有し、Si 1モルに対するM1のモル比とEuのモル比の合計が2未満である蛍光体原料と融剤とを混合した原料混合体を酸化雰囲気中で熱処理して、Euを含有するアパタイト型結晶粉末と式M1 2SiO4で表される母材粒子粉末とを有する混合粉末を作製する酸化処理工程と、
前記混合粉末を還元雰囲気で熱処理して蛍光体粒子を作製する還元処理工程と
を具備することを特徴とする蛍光体の製法。 - 前記還元処理工程での熱処理温度が1150℃以下であることを特徴とする請求項6記載の蛍光体の製法。
- 前記還元処理工程の後に、蛍光体粒子の表面を洗浄して、繊維状体の少なくとも一方の端部を蛍光体コアに埋設させた状態で、他の部分を露出させる工程を具備することを特徴とする請求項7記載の蛍光体の製法。
- 入射光の波長を変換して、波長が変換された光を含む出力光を出力する波長変換器であって、透明マトリックスと、該透明マトリックス中に分散した請求項1乃至5のうちのいずれかに記載の蛍光体とを具備してなることを特徴とする波長変換器。
- 表面に発光素子が載置される載置部を有する基体と、該基体の表面または内部に設けられた電気配線と、前記載置部に載置されるとともに前記電気配線に電気的に接続された前記発光素子と、該発光素子が発光する光を波長変換する請求項9記載の波長変換器とを具備することを特徴とする発光装置。
- 請求項10記載の発光装置を複数具備してなることを特徴とする照明装置。
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PCT/JP2008/051588 WO2008102628A1 (ja) | 2007-02-23 | 2008-01-31 | 蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 |
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JP5272204B2 (ja) * | 2008-02-26 | 2013-08-28 | シャープ株式会社 | 発光装置用蛍光体およびそれを用いた発光装置 |
JP2009209332A (ja) * | 2008-03-06 | 2009-09-17 | Sharp Corp | 発光装置用蛍光体およびそれを用いた発光装置 |
WO2010025876A1 (de) * | 2008-09-04 | 2010-03-11 | Bayer Materialscience Ag | Lichtemittierende vorrichtung und verfahren zu deren herstellung |
CN102020851B (zh) | 2009-09-16 | 2013-10-16 | 大连路明发光科技股份有限公司 | 一种光转换柔性高分子材料及其用途 |
JP4949525B2 (ja) * | 2010-03-03 | 2012-06-13 | シャープ株式会社 | 波長変換部材、発光装置および画像表示装置ならびに波長変換部材の製造方法 |
US8901578B2 (en) | 2011-05-10 | 2014-12-02 | Rohm Co., Ltd. | LED module having LED chips as light source |
CN102337122B (zh) * | 2011-10-12 | 2014-01-15 | 江门市科恒实业股份有限公司 | 一种硅酸盐绿色荧光粉及其制备方法 |
CN102408890A (zh) * | 2011-11-15 | 2012-04-11 | 杭州广陵科技开发有限公司 | 一种硅酸盐绿色荧光粉及其制备方法 |
JP5490083B2 (ja) * | 2011-12-22 | 2014-05-14 | 住友金属鉱山株式会社 | アルカリ土類金属シリケート蛍光体の製造方法およびアルカリ土類金属シリケート蛍光体 |
JP5905956B2 (ja) * | 2012-04-26 | 2016-04-20 | 株式会社トクヤマ | 金属フッ化物結晶、発光素子、シンチレーター、中性子の検出方法及び金属フッ化物結晶の製造方法 |
CN104321407B (zh) * | 2013-04-09 | 2016-07-06 | 松下知识产权经营株式会社 | 荧光体和发光装置 |
JP5512871B1 (ja) * | 2013-05-20 | 2014-06-04 | 住友金属鉱山株式会社 | 青色発光シリケート蛍光体及びその製造方法 |
JP6070536B2 (ja) * | 2013-12-26 | 2017-02-01 | 住友金属鉱山株式会社 | シリケート蛍光体粒子の製造方法 |
JP6447557B2 (ja) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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