JP5230594B2 - 蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 - Google Patents
蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 Download PDFInfo
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- JP5230594B2 JP5230594B2 JP2009500125A JP2009500125A JP5230594B2 JP 5230594 B2 JP5230594 B2 JP 5230594B2 JP 2009500125 A JP2009500125 A JP 2009500125A JP 2009500125 A JP2009500125 A JP 2009500125A JP 5230594 B2 JP5230594 B2 JP 5230594B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
Description
トル(X-ray Absorption Near Edge Structure:XANES)による2価のEuイオンおよび3価のEuイオンの合量に対する前記2価のEuイオンの濃度が90%以上であり、また、前記Si 1モルに対する前記M1のモル比と、前記Si 1モルに対する前記Euのモル比との合計((M1+Eu)/Si)が2未満である。さらに、蛍光体粒子は、(M1,Eu) 2 SiO 4 で表される結晶を主結晶とし、蛍光体コアと該蛍光体コアの表面に存在する前記主結晶と同じ結晶を含む繊維状体とを有してなるとともに、該繊維状体のそれぞれ少なくとも一方の端部が前記蛍光体コアに埋設されている。
5a・・・繊維状体
5b・・・蛍光体コア
11・・・発光装置
19・・・波長変換器
23・・・樹脂
Claims (8)
- M1(M1はSr、BaおよびCaから選ばれる少なくとも1種)、EuおよびSiを含有する複数の蛍光体粒子により構成されてなり、X線吸収端近傍構造スペクトル(X-ray Absorption Near Edge Structure:XANES)による2価のEuイオンおよび3価のEuイオンの合量に対する前記2価のEuイオンの濃度が90%以上であるとともに、前記Si 1モルに対する前記M1のモル比と、前記Si 1モルに対する前記Euのモル比との合計((M1+Eu)/Si)が2未満であり、前記蛍光体粒子は、(M1,Eu)2SiO4で表される結晶を主結晶とし、蛍光体コアと該蛍光体コアの表面に存在する前記主結晶と同じ結晶を含む繊維状体とを有してなるとともに、該繊維状体のそれぞれ少なくとも一方の端部が前記蛍光体コアに埋設されていることを特徴とする蛍光体。
- 前記Si 1モルに対する前記M1のモル比と、前記Si 1モルに対する前記Euのモル比との合計((M1+Eu)/Si)が1.78以上であることを特徴とする請求項1記載の蛍光体。
- 2価のEuイオンおよび3価のEuイオンの合量に対する前記2価のEuイオンの濃度が96%以上であることを特徴とする請求項1または2記載の蛍光体。
- 前記繊維状体は、前記蛍光体コアに埋設されている埋設部と、前記蛍光体コアに埋設されていない非埋設部とを有し、該非埋設部は、前記蛍光体コアの表面から離間していることを特徴とする請求項1乃至3のうちいずれかに記載の蛍光体。
- 請求項1に記載の蛍光体の製法であって、M1(M1はSr、BaおよびCaから選ばれる少なくとも1種)原料、Eu原料およびSi原料を含有し、Si 1モルに対するM1のモル比とEuのモル比の合計が2未満である蛍光体原料と融剤とを混合した原料混合体を酸化雰囲気中、1000〜1100℃にて熱処理した後、還元雰囲気中、1000〜1150℃にて熱処理して蛍光体粒子を作製する還元処理工程と、前記蛍光体粒子の表面を洗浄する工程と、を具備することを特徴とする蛍光体の製法。
- 透明マトリックスと、該透明マトリックス中に分散した蛍光体とを有し、入射光の波長を変換して、波長が変換された光を含む出力光を出力する波長変換器であって、前記蛍光体が請求項1乃至4のうちのいずれかに記載の蛍光体であることを特徴とする波長変換器。
- 表面に発光素子が載置される載置部を有する基体と、該基体の表面または内部に設けられた電気配線と、前記載置部に載置されるとともに前記電気配線に電気的に接続された前記発光素子と、該発光素子が発光する光を波長変換する波長変換器と、を具備する発光装置であって、前記波長変換器が請求項6に記載の波長変換器であることを特徴とする発光装置。
- 請求項7記載の発光装置を複数具備してなることを特徴とする照明装置。
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PCT/JP2008/051588 WO2008102628A1 (ja) | 2007-02-23 | 2008-01-31 | 蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 |
JP2009500125A JP5230594B2 (ja) | 2007-02-23 | 2008-01-31 | 蛍光体およびその製法ならびに波長変換器、発光装置、照明装置 |
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JP5272204B2 (ja) * | 2008-02-26 | 2013-08-28 | シャープ株式会社 | 発光装置用蛍光体およびそれを用いた発光装置 |
JP2009209332A (ja) * | 2008-03-06 | 2009-09-17 | Sharp Corp | 発光装置用蛍光体およびそれを用いた発光装置 |
US20110278614A1 (en) * | 2008-09-04 | 2011-11-17 | Bayer Materialscience Ag | Light emitting device, and method for the production thereof |
CN102020851B (zh) * | 2009-09-16 | 2013-10-16 | 大连路明发光科技股份有限公司 | 一种光转换柔性高分子材料及其用途 |
JP4949525B2 (ja) * | 2010-03-03 | 2012-06-13 | シャープ株式会社 | 波長変換部材、発光装置および画像表示装置ならびに波長変換部材の製造方法 |
US8901578B2 (en) | 2011-05-10 | 2014-12-02 | Rohm Co., Ltd. | LED module having LED chips as light source |
CN102337122B (zh) * | 2011-10-12 | 2014-01-15 | 江门市科恒实业股份有限公司 | 一种硅酸盐绿色荧光粉及其制备方法 |
CN102408890A (zh) * | 2011-11-15 | 2012-04-11 | 杭州广陵科技开发有限公司 | 一种硅酸盐绿色荧光粉及其制备方法 |
JP5490083B2 (ja) * | 2011-12-22 | 2014-05-14 | 住友金属鉱山株式会社 | アルカリ土類金属シリケート蛍光体の製造方法およびアルカリ土類金属シリケート蛍光体 |
US9388337B2 (en) * | 2012-04-26 | 2016-07-12 | Tokuyama Corporation | Metal fluoride crystal, light emitting element, scintillator, method of detecting neutron, and method of producing metal fluoride crystal |
CN104321407B (zh) * | 2013-04-09 | 2016-07-06 | 松下知识产权经营株式会社 | 荧光体和发光装置 |
JP5512871B1 (ja) * | 2013-05-20 | 2014-06-04 | 住友金属鉱山株式会社 | 青色発光シリケート蛍光体及びその製造方法 |
JP6070536B2 (ja) * | 2013-12-26 | 2017-02-01 | 住友金属鉱山株式会社 | シリケート蛍光体粒子の製造方法 |
JP6447557B2 (ja) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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JP2004115633A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 珪酸塩蛍光体およびそれを用いた発光装置 |
JP2006111830A (ja) * | 2004-10-18 | 2006-04-27 | Toshiba Corp | 蛍光体,蛍光体の製造方法およびこれを用いた発光装置 |
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JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
DE10311820A1 (de) * | 2003-03-13 | 2004-09-30 | Schott Glas | Halbleiterlichtquelle |
US7267787B2 (en) * | 2004-08-04 | 2007-09-11 | Intematix Corporation | Phosphor systems for a white light emitting diode (LED) |
JP4836429B2 (ja) * | 2004-10-18 | 2011-12-14 | 株式会社東芝 | 蛍光体およびこれを用いた発光装置 |
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JP2004115633A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 珪酸塩蛍光体およびそれを用いた発光装置 |
JP2006111830A (ja) * | 2004-10-18 | 2006-04-27 | Toshiba Corp | 蛍光体,蛍光体の製造方法およびこれを用いた発光装置 |
JP2009506195A (ja) * | 2005-08-31 | 2009-02-12 | ルミネイション リミテッド ライアビリティ カンパニー | Ledに使用する蛍光体及びその配合物 |
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EP2128219A4 (en) | 2011-09-14 |
US8313844B2 (en) | 2012-11-20 |
WO2008102628A1 (ja) | 2008-08-28 |
US20100033074A1 (en) | 2010-02-11 |
EP2128219A1 (en) | 2009-12-02 |
EP2128219B1 (en) | 2014-05-07 |
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