JPWO2007080863A1 - 半導体装置、該半導体装置を実装するプリント配線基板、及びそれらの接続構造 - Google Patents
半導体装置、該半導体装置を実装するプリント配線基板、及びそれらの接続構造 Download PDFInfo
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Abstract
Description
図3は、本発明の半導体装置の一例を示す模式断面図である。図3に示す半導体装置1は、BGAタイプの半導体装置であって、シリコンチップ搭載基板14(以下、単に「基板14」という。)と、基板14の一方の面に搭載されたシリコンチップ10と、基板14を貫通するように形成されてその先端が他方の面に現れる外部電極端子9とを有している。外部接続端子9は、シリコンチップ10から引き出されたワイヤ11に接続されたものであり、柱状電極17と、その柱状電極17の周囲に設けられた絶縁層16と、その絶縁層16の周囲に設けられた輪状電極15とで構成されている。この半導体装置1は、絶縁層16を挟んだ柱状電極17と輪状電極15とが電極端子として作用し、プリント配線板(図11を参照)の電極にはんだ接続されて実装される。
次に、本発明の半導体装置を製造する方法について、主に基板(シリコンチップ搭載基板)の工程フローを図示して説明する。図6は、図3に示した半導体装置1を構成するシリコンチップ搭載基板14の製造方法の一例を示す工程図である。
図9は、本発明のプリント配線板の一例を示す模式断面図である。図9に示す本発明のプリント配線板2は、上記本発明の半導体装置1を実装するための電極パッドである搭載部26に特徴があり、その搭載部26以外は通常のビルドアップ基板タイプのプリント配線板と同一構造である。以下においては、主に、搭載部26について説明する。
次に、本発明のプリント配線板の製造する方法について説明する。図10は、図9に示すプリント配線板の製造方法の一例を示す工程図である。まず、図10(a)に示すように、通常の製造方法で造られたプリント配線板81を準備する。プリント配線板81の表層には、最終的に図10(g)で示される穴底部の下層電極90になる配線が形成されている。
図11は、本発明の接続構造の一例を示す模式断面図であり、上述した本発明の半導体装置とプリント配線板との接続構造を示したものである。
次に、その接続方法について、図11を参照しつつ説明する。半導体装置1はプリント配線板2上に通常の表面実装技術により搭載される。
Claims (11)
- プリント配線板に搭載される側の面に外部電極端子が形成されたBGAタイプの半導体装置であって、
前記外部電極端子は、柱状電極と、当該柱状電極の周囲に設けられた絶縁層と、当該絶縁層の周囲に設けられた輪状電極とを有する半導体装置。 - 前記絶縁層の高さが、前記柱状電極の高さとほぼ同じである、請求項1に記載の半導体装置。
- 前記絶縁層の高さが、前記輪状電極の高さとほぼ同じである、請求項1に記載の半導体装置。
- 前記外部電極端子の表面には、前記柱状電極の表面と前記輪状電極の表面とを繋ぐバンプ状のはんだ層が形成されている、請求項1から3のいずれか1項に記載の半導体装置。
- 前記外部電極端子の表面には、前記柱状電極の表面の形成されたバンプ状のはんだ層と、前記輪状電極の表面に形成された円形状のはんだ層とが、分離形成されている、請求項1から3のいずれか1項に記載の半導体装置。
- 柱状電極と、当該柱状電極の周囲に設けられた絶縁層と、当該絶縁層の周囲に設けられた輪状電極とからなる外部電極端子を有するBGAタイプの半導体装置を実装でき、前記外部電極端子に対応する電極パッドを備えたプリント配線板であって、
前記電極パッドは、前記外部電極端子が有する柱状電極とはんだ接続するための下層電極と、前記外部電極端子が有する輪状電極とはんだ接続するための上層電極とを有するプリント配線板。 - 前記柱状電極とはんだ接続するための下層電極が、プリント配線板表面に形成された穴の底部に形成されており、前記輪状電極とはんだ接続するための上層電極が、プリント配線板表面に前記輪状電極とほぼ同じ輪形状で形成されている、請求項6に記載のプリント配線板。
- 柱状電極と当該柱状電極の周囲に設けられた絶縁層と当該絶縁層の周囲に設けられた輪状電極とからなる外部電極端子をプリント配線板に搭載される側の面に有するBGAタイプの半導体装置と、
前記半導体装置を実装でき、前記外部電極端子が有する柱状電極とはんだ接続するための下層電極と、前記外部電極端子が有する輪状電極とはんだ接続するための上層電極とを有する電極パッドを備えたプリント配線板との接続構造であって、
前記半導体装置の柱状電極が前記プリント配線板の下層電極とはんだ接続され、前記半導体装置の輪状電極が前記プリント配線板の上層電極にはんだ接続されている接続構造。 - 前記柱状電極とはんだ接続する下層電極が、プリント配線板表面に形成された穴の底部に形成されており、前記輪状電極とはんだ接続する上層電極が、プリント配線板表面に前記輪状電極とほぼ同じ輪形状で形成されていることを特徴とする請求項8に記載の接続構造。
- 前記絶縁層の高さが、前記柱状電極の高さとほぼ同じである、請求項8又は9に記載の接続構造。
- 前記絶縁層の高さが、前記輪状電極の高さとほぼ同じである、請求項8又は9に記載の接続構造。
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PCT/JP2007/050116 WO2007080863A1 (ja) | 2006-01-16 | 2007-01-10 | 半導体装置、該半導体装置を実装するプリント配線基板、及びそれらの接続構造 |
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TWI576022B (zh) * | 2016-05-16 | 2017-03-21 | 中華精測科技股份有限公司 | 支撐結構與其製造方法 |
CN108493629A (zh) * | 2018-03-12 | 2018-09-04 | 福耀集团(上海)汽车玻璃有限公司 | 一种电气联接元件和汽车玻璃 |
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