JPWO2007058096A1 - 実装基板および電子機器 - Google Patents
実装基板および電子機器 Download PDFInfo
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- JPWO2007058096A1 JPWO2007058096A1 JP2007545204A JP2007545204A JPWO2007058096A1 JP WO2007058096 A1 JPWO2007058096 A1 JP WO2007058096A1 JP 2007545204 A JP2007545204 A JP 2007545204A JP 2007545204 A JP2007545204 A JP 2007545204A JP WO2007058096 A1 JPWO2007058096 A1 JP WO2007058096A1
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Abstract
Description
10 曲面基板(配線基板)
11 基材
12 配線層
13 絶縁層
13a 台座部
13b 肩部
13c 凹部
14 ビア
15 配線層
15a、15b パッド部
16 第2絶縁層
20 半導体パッケージ
21 外部端子
30 はんだボール
40、41、42、43、44 プレス型
50 電子部品
60 曲面基板
61 配線基板
61a 絶縁層
61b 配線層
61c ビア
61d 配線層
62 台座部
63 配線層(配線パターン)
63a パッド部
110 半導体装置
112 基板
114 半導体チップ
116 バンプ
118 構造物
120 接着剤
122 アンダーフィル
124 ボールバンプ
126 凹陥部
128 隙間
201 半導体パッケージ
202 はんだボール
203 基板
204 パッド
301 曲面基板
302 チップ
302a 電極
303 半田バンプ
303a チップバンプ
303b 基板バンプ
304 アンダーフィル樹脂
305 加熱冷却ヘッド
306 吸着穴
本発明の実施形態1に係る実装基板について図面を用いて説明する。図1は、本発明の実施形態1に係る実装基板の構成を模式的に示した断面図である。図2は、本発明の実施形態1に係る実装基板における曲面基板の構成を模式的に示した断面図である。図3は、本発明の実施形態1に係る実装基板における基材の第1の曲面形状を模式的に示した(A)上面図、(B)X−X´間の断面図、(C)Y−Y´間の断面図である。図4は、本発明の実施形態1に係る実装基板における基材の第2の曲面形状を模式的に示した(A)上面図、(B)X−X´間の断面図、(C)Y−Y´間の断面図である。
本発明の実施形態2に係る実装基板について図面を用いて説明する。図7は、本発明の実施形態2に係る実装基板の構成を模式的に示した断面図である。
本発明の実施形態3に係る実装基板について図面を用いて説明する。図9は、本発明の実施形態3に係る実装基板の構成を模式的に示した断面図である。
本発明の実施形態4に係る実装基板について図面を用いて説明する。図11は、本発明の実施形態4に係る実装基板の構成を模式的に示した断面図である。
本発明の実施形態5に係る実装基板について図面を用いて説明する。図13は、本発明の実施形態5に係る実装基板の構成を模式的に示した断面図であり、(A)は凸面側に半導体パッケージを実装した実装基板、(B)は凹面側に半導体パッケージを実装した実装基板に関するものである。
本発明の実施形態6に係る実装基板について図面を用いて説明する。図14は、本発明の実施形態6に係る実装基板の構成を模式的に示した断面図であり、(A)は凸面側に半導体パッケージを実装した実装基板、(B)は凹面側に半導体パッケージを実装した実装基板に関するものである。
本発明の実施形態7に係る実装基板について図面を用いて説明する。図15は、本発明の実施形態7に係る実装基板の構成を模式的に示した断面図であり、(A)は凸面側に半導体パッケージを実装した実装基板、(B)は凹面側に半導体パッケージを実装した実装基板に関するものである。
本発明の実施形態8に係る実装基板について図面を用いて説明する。図16は、本発明の実施形態8に係る実装基板の構成を模式的に示した断面図であり、(A)は凸面側に半導体パッケージを実装した実装基板、(B)は凹面側に半導体パッケージを実装した実装基板に関するものである。
Claims (21)
- 少なくとも一部に曲面を有する曲面基板上に半導体パッケージが実装された実装基板であって、
前記曲面基板は、
曲面部位のうち前記半導体パッケージが搭載される部位に配設されるとともに上面が平坦に形成された絶縁材料よりなる台座部と、
前記台座部の平坦面上に配設される複数のパッド部と、
を備え、
前記半導体パッケージは、前記パッド部上に搭載されることを特徴とする実装基板。 - 前記台座部は、前記曲面基板において用いられている絶縁層を成型して構成されたことを特徴とする請求項1記載の実装基板。
- 前記絶縁層は、前記台座部と隣接する部位に表面が平坦な肩部を有し、
前記肩部の平坦面は、曲面部位の接線と平行となるよう構成されたことを特徴とする請求項1又は2記載の実装基板。 - 前記台座部上の平坦面上に配設される複数の第2パッド部と、
前記第2パッド部上に搭載される電子部品と、
を備えることを特徴とする請求項3記載の実装基板。 - 前記台座部は、隣り合う前記パッド部間の領域に凹部を有することを特徴とする請求項1乃至4のいずれか一に記載の実装基板。
- 前記台座部は、第2絶縁層を内包して構成されたことを特徴とする請求項1乃至5のいずれか一に記載の実装基板。
- 前記第2絶縁層は、フィルム状の樹脂を積層した積層体、熱可塑性樹脂、熱可塑性樹脂および熱硬化性樹脂を含有したハイブリッド型樹脂、及び、無機材料のいずれか一つよりなることを特徴とする請求項6記載の実装基板。
- 前記台座部は、前記曲面基板において用いられている絶縁層以外の絶縁材料を成型して構成されたことを特徴とする請求項1記載の実装基板。
- 前記台座部は、フィラーを含有した樹脂材料よりなることを特徴とする請求項8記載の実装基板。
- 前記台座部の内部に、電子部品が実装されていることを特徴とする請求項8又は9記載の実装基板。
- 少なくとも一部に曲面を有する曲面基板上に半導体パッケージが実装された実装基板であって、
前記曲面基板は、曲面部位のうち前記半導体パッケージが搭載される部位に配設されるとともに絶縁材料よりなる台座部を備え、
前記台座部は、前記曲面基板において用いられている絶縁層以外の絶縁材料を成型して構成され、
前記半導体パッケージは、前記台座部の内部に配され、
前記半導体パッケージの外部端子は、基板面と反対側に配されるとともに、前記台座部から露出し、
少なくとも前記台座部および前記半導体パッケージ上に配設されるとともに、前記曲面基板の配線層と前記半導体パッケージの前記外部端子を電気的に接続する配線パターンを備えることを特徴とする実装基板。 - 前記半導体パッケージの前記外部端子上に前記配線パターンのパッド部を介して搭載された電子部品を備えることを特徴とする請求項11記載の実装基板。
- 少なくとも一部に曲面を有する曲面基板であって、
曲面部位のうち半導体パッケージが搭載される部位に配設されるとともに上面が平坦に形成された絶縁材料よりなる台座部と、
前記台座部の平坦面上に配設される複数のパッド部と、
を備えることを特徴とする曲面基板。 - 前記台座部は、前記曲面基板において用いられている絶縁層を成型して構成されたことを特徴とする請求項13記載の曲面基板。
- 前記絶縁層は、前記台座部と隣接する部位に表面が平坦な肩部を有し、
前記肩部の平坦面は、曲面部位の接線と平行となるよう構成されたことを特徴とする請求項13又は14記載の曲面基板。 - 前記台座部上の平坦面上に配設される複数の第2パッド部と、
前記第2パッド部上に搭載される電子部品と、
を備えることを特徴とする請求項15記載の曲面基板。 - 前記台座部は、隣り合う前記パッド部間の領域に凹部を有することを特徴とする請求項13乃至16のいずれか一に記載の曲面基板。
- 前記台座部は、第2絶縁層を内包して構成されたことを特徴とする請求項13乃至17のいずれか一に記載の曲面基板。
- 前記第2絶縁層は、フィルム状の樹脂を積層した積層体、熱可塑性樹脂、熱可塑性樹脂および熱硬化性樹脂を含有したハイブリッド型樹脂、及び、無機材料のいずれか一つよりなることを特徴とする請求項18記載の曲面基板。
- 請求項1乃至12のいずれか一に記載の実装基板を含んで構成されたことを特徴とする電子機器。
- 請求項13乃至19のいずれか一に記載の曲面基板を含んで構成されたされたことを特徴とする電子機器。
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US20100300734A1 (en) * | 2009-05-27 | 2010-12-02 | Raytheon Company | Method and Apparatus for Building Multilayer Circuits |
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WO2016111721A1 (en) | 2015-01-06 | 2016-07-14 | Building Creative Kids, Llc | Toy building systems including adjustable connector clips, building planks, and panels |
US10398999B2 (en) | 2011-10-13 | 2019-09-03 | Building Creative Kids, Llc | Toy couplers including a plurality of block retaining channels |
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Also Published As
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US20090002973A1 (en) | 2009-01-01 |
WO2007058096A1 (ja) | 2007-05-24 |
CN101310570B (zh) | 2010-11-10 |
US8625296B2 (en) | 2014-01-07 |
US20110242780A1 (en) | 2011-10-06 |
CN101310570A (zh) | 2008-11-19 |
US20140003015A1 (en) | 2014-01-02 |
JP5088138B2 (ja) | 2012-12-05 |
US8913398B2 (en) | 2014-12-16 |
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