JPWO2006009194A1 - 半導体センサ - Google Patents
半導体センサ Download PDFInfo
- Publication number
- JPWO2006009194A1 JPWO2006009194A1 JP2006529266A JP2006529266A JPWO2006009194A1 JP WO2006009194 A1 JPWO2006009194 A1 JP WO2006009194A1 JP 2006529266 A JP2006529266 A JP 2006529266A JP 2006529266 A JP2006529266 A JP 2006529266A JP WO2006009194 A1 JPWO2006009194 A1 JP WO2006009194A1
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- JP
- Japan
- Prior art keywords
- semiconductor
- integrated circuit
- semiconductor integrated
- weight
- semiconductor sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/02—Arrangements for preventing, or for compensating for, effects of inclination or acceleration of the measuring device; Zero-setting means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
Claims (5)
- 外周部が支持部に支持された半導体材料からなるダイアフラム部と、前記ダイアフラム部の中央部に配置された重錘と、前記ダイアフラム部に形成された拡散抵抗からなるセンサ素子を有する半導体センサ素子と、
前記半導体センサ素子と電気的に接続されて前記半導体センサ素子からの出力信号を信号処理する半導体集積回路基板と、
前記半導体センサ素子及び前記半導体集積回路基板を収納する絶縁材料からなる収納ケースとを備え、
前記収納ケースの収納室を囲む壁面上に前記半導体集積回路基板の裏面が接合され、
前記半導体集積回路基板の表面上に前記半導体センサ素子の前記支持部が接合され、
前記半導体集積回路基板の前記表面のうち少なくとも前記半導体センサ素子の前記重錘と対向する表面部分には、前記重錘が前記半導体集積回路基板に衝突したときに前記重錘の跳ね返りを抑制する緩衝層が形成されている半導体センサ。 - 前記緩衝層により前記半導体集積回路基板の前記表面の保護も図られている請求項1に記載の半導体センサ。
- 前記緩衝層がポリイミド樹脂からなる請求項2に記載の半導体センサ。
- 前記緩衝層の厚みが1〜10μmである請求項3に記載の半導体センサ。
- 前記支持部と前記半導体集積回路基板とがシリコン系接着剤で接合されている請求項1に記載の半導体センサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004212891 | 2004-07-21 | ||
JP2004212891 | 2004-07-21 | ||
PCT/JP2005/013362 WO2006009194A1 (ja) | 2004-07-21 | 2005-07-21 | 半導体センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2006009194A1 true JPWO2006009194A1 (ja) | 2008-05-01 |
Family
ID=35785301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006529266A Pending JPWO2006009194A1 (ja) | 2004-07-21 | 2005-07-21 | 半導体センサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7640807B2 (ja) |
EP (1) | EP1777528B1 (ja) |
JP (1) | JPWO2006009194A1 (ja) |
AT (1) | ATE534914T1 (ja) |
WO (1) | WO2006009194A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7562575B2 (en) * | 2005-08-05 | 2009-07-21 | Hitachi Metals, Ltd. | Impact-resistant acceleration sensor |
US7845229B2 (en) * | 2006-08-11 | 2010-12-07 | Rohm Co., Ltd. | Acceleration sensor |
US8646332B2 (en) | 2007-09-03 | 2014-02-11 | Panasonic Corporation | Inertia force sensor |
JP4973443B2 (ja) * | 2007-10-22 | 2012-07-11 | 株式会社デンソー | センサ装置 |
JP5716149B2 (ja) * | 2009-11-24 | 2015-05-13 | パナソニックIpマネジメント株式会社 | 加速度センサ |
JP2011112390A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
JP2011112392A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
JP5789737B2 (ja) | 2009-11-24 | 2015-10-07 | パナソニックIpマネジメント株式会社 | 加速度センサ |
JP2011112389A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
WO2011064642A2 (ja) | 2009-11-24 | 2011-06-03 | パナソニック電工株式会社 | 加速度センサ |
JP5742170B2 (ja) * | 2010-10-22 | 2015-07-01 | 大日本印刷株式会社 | Memsデバイス、その製造方法、及びそれを有する半導体装置 |
JP5742172B2 (ja) * | 2010-10-25 | 2015-07-01 | 大日本印刷株式会社 | Memsデバイス及びその製造方法 |
JP6214433B2 (ja) * | 2013-10-04 | 2017-10-18 | 株式会社フジクラ | 半導体圧力センサ |
JP6346279B2 (ja) * | 2014-06-27 | 2018-06-20 | 北陸電気工業株式会社 | 力検出器 |
TWI633290B (zh) * | 2015-11-26 | 2018-08-21 | 李美燕 | 微型回饋腔感測器及其製造方法 |
CN113030221B (zh) * | 2021-04-14 | 2023-03-10 | 武汉理工大学 | 一种氢气传感器及其应用 |
JP2023042084A (ja) * | 2021-09-14 | 2023-03-27 | セイコーエプソン株式会社 | 慣性センサーモジュール |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08110351A (ja) * | 1994-10-12 | 1996-04-30 | Nippondenso Co Ltd | 半導体力学センサ装置 |
JPH1026634A (ja) * | 1996-07-11 | 1998-01-27 | Fujikura Ltd | ダイヤフラム型加速度センサの製造方法 |
JPH10123167A (ja) * | 1996-08-09 | 1998-05-15 | Denso Corp | 半導体加速度センサ |
JP2000066257A (ja) * | 1998-08-19 | 2000-03-03 | Nikon Corp | ブレ補正装置、ブレ補正カメラ及び交換レンズ |
JP2000187041A (ja) * | 1998-12-24 | 2000-07-04 | Mitsubishi Electric Corp | 容量式加速度センサ及びその製造方法 |
WO2001055277A1 (fr) * | 2000-01-19 | 2001-08-02 | Hitachi Chemical Co., Ltd. | Film adhesif pour semi-conducteurs grille de connexion a film adhesif pour semi-conducteurs et dispositif semi-conducteur les utilisant |
JP2002005951A (ja) * | 2000-06-26 | 2002-01-09 | Denso Corp | 半導体力学量センサ及びその製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02151770A (ja) | 1988-12-05 | 1990-06-11 | Hitachi Ltd | 磁気式加速度センサおよびその製造方法 |
JPH0499964A (ja) | 1990-08-18 | 1992-03-31 | Mitsubishi Electric Corp | 半導体加速度センサ |
DE4129218A1 (de) * | 1991-09-03 | 1993-03-04 | Deutsche Aerospace | Beschleunigungssensor, auf mikromechanischem wege hergestellt |
JPH05256869A (ja) | 1992-03-12 | 1993-10-08 | Murata Mfg Co Ltd | 半導体式加速度センサおよびその製造方法 |
JP3278926B2 (ja) | 1992-09-29 | 2002-04-30 | 株式会社デンソー | 半導体圧力センサ |
FR2710741B1 (fr) * | 1993-09-30 | 1995-10-27 | Commissariat Energie Atomique | Capteur électronique destiné à la caractérisation de grandeurs physiques et procédé de réalisation d'un tel capteur. |
JP3346118B2 (ja) | 1995-09-21 | 2002-11-18 | 富士電機株式会社 | 半導体加速度センサ |
JP2003021647A (ja) | 2001-07-06 | 2003-01-24 | Denso Corp | 電子装置 |
JP2003166998A (ja) | 2001-12-03 | 2003-06-13 | Matsushita Electric Works Ltd | 半導体加速度センサ |
US7004030B2 (en) * | 2002-09-27 | 2006-02-28 | Oki Electric Industry Co., Ltd. | Acceleration sensor |
US6892578B2 (en) * | 2002-11-29 | 2005-05-17 | Hitachi Metals Ltd. | Acceleration sensor |
JP4578087B2 (ja) * | 2003-11-10 | 2010-11-10 | Okiセミコンダクタ株式会社 | 加速度センサ |
-
2005
- 2005-07-07 US US11/572,384 patent/US7640807B2/en not_active Expired - Fee Related
- 2005-07-21 WO PCT/JP2005/013362 patent/WO2006009194A1/ja active Application Filing
- 2005-07-21 EP EP05766267A patent/EP1777528B1/en not_active Not-in-force
- 2005-07-21 AT AT05766267T patent/ATE534914T1/de active
- 2005-07-21 JP JP2006529266A patent/JPWO2006009194A1/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08110351A (ja) * | 1994-10-12 | 1996-04-30 | Nippondenso Co Ltd | 半導体力学センサ装置 |
JPH1026634A (ja) * | 1996-07-11 | 1998-01-27 | Fujikura Ltd | ダイヤフラム型加速度センサの製造方法 |
JPH10123167A (ja) * | 1996-08-09 | 1998-05-15 | Denso Corp | 半導体加速度センサ |
JP2000066257A (ja) * | 1998-08-19 | 2000-03-03 | Nikon Corp | ブレ補正装置、ブレ補正カメラ及び交換レンズ |
JP2000187041A (ja) * | 1998-12-24 | 2000-07-04 | Mitsubishi Electric Corp | 容量式加速度センサ及びその製造方法 |
WO2001055277A1 (fr) * | 2000-01-19 | 2001-08-02 | Hitachi Chemical Co., Ltd. | Film adhesif pour semi-conducteurs grille de connexion a film adhesif pour semi-conducteurs et dispositif semi-conducteur les utilisant |
JP2002005951A (ja) * | 2000-06-26 | 2002-01-09 | Denso Corp | 半導体力学量センサ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE534914T1 (de) | 2011-12-15 |
EP1777528A1 (en) | 2007-04-25 |
EP1777528A4 (en) | 2010-08-18 |
WO2006009194A1 (ja) | 2006-01-26 |
US7640807B2 (en) | 2010-01-05 |
EP1777528B1 (en) | 2011-11-23 |
US20070234804A1 (en) | 2007-10-11 |
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