JPS6445039A - Manufacture of electron tube cathode device - Google Patents

Manufacture of electron tube cathode device

Info

Publication number
JPS6445039A
JPS6445039A JP20254187A JP20254187A JPS6445039A JP S6445039 A JPS6445039 A JP S6445039A JP 20254187 A JP20254187 A JP 20254187A JP 20254187 A JP20254187 A JP 20254187A JP S6445039 A JPS6445039 A JP S6445039A
Authority
JP
Japan
Prior art keywords
layer
mask layer
lead
guided
base metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20254187A
Other languages
Japanese (ja)
Inventor
Shinjiro Umeya
Kenichi Kanna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP20254187A priority Critical patent/JPS6445039A/en
Publication of JPS6445039A publication Critical patent/JPS6445039A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To form a guided metallic layer with a solid and fine pattern on a base metal by using a mask layer which has a heat-resisting property and besides etching properties dissimilar to those of the base metal and the guided metallic layer. CONSTITUTION:A lead guided part 4 is exposed from a base metal layer 10 formed on a substrate 1, with a mask layer 11 and an etching mask layer 12 in between. The base metal layer 10 and the mask layer 11 are dissimilar in their etching properties to each other. The etching mask layer 12 is removed in a following process, and the whole surface including the lead guided part 4 is coated with a lead guided metallic layer 17. Dissimilarity in their etching properties between the mask layer 11 and the lead guided metallic layer 17 is utilized to remove only the mask layer 11 and concurrently the lead guided metallic layer on the mask layer 11 is removed. The mask layer is characteristic of enduring heat generated in the case that the lead is solidly fixed with the lead guided metallic layer 17, and it holds a fine pattern in the fixing process.
JP20254187A 1987-08-13 1987-08-13 Manufacture of electron tube cathode device Pending JPS6445039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20254187A JPS6445039A (en) 1987-08-13 1987-08-13 Manufacture of electron tube cathode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20254187A JPS6445039A (en) 1987-08-13 1987-08-13 Manufacture of electron tube cathode device

Publications (1)

Publication Number Publication Date
JPS6445039A true JPS6445039A (en) 1989-02-17

Family

ID=16459210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20254187A Pending JPS6445039A (en) 1987-08-13 1987-08-13 Manufacture of electron tube cathode device

Country Status (1)

Country Link
JP (1) JPS6445039A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790620A (en) * 1995-01-31 1998-08-04 Kabushiki Kaisha Toshiba Underwater laser processing method and apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227260A (en) * 1975-08-25 1977-03-01 Sony Corp Cathode manufacturing process
JPS5498179A (en) * 1978-01-20 1979-08-02 Nippon Telegr & Teleph Corp <Ntt> Preparation of minute circuits and elements
JPS6047452A (en) * 1983-08-25 1985-03-14 Mitsubishi Electric Corp Manufacture of au bonding pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227260A (en) * 1975-08-25 1977-03-01 Sony Corp Cathode manufacturing process
JPS5498179A (en) * 1978-01-20 1979-08-02 Nippon Telegr & Teleph Corp <Ntt> Preparation of minute circuits and elements
JPS6047452A (en) * 1983-08-25 1985-03-14 Mitsubishi Electric Corp Manufacture of au bonding pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790620A (en) * 1995-01-31 1998-08-04 Kabushiki Kaisha Toshiba Underwater laser processing method and apparatus
US6084202A (en) * 1995-01-31 2000-07-04 Kabushiki Kaisha Toshiba Underwater laser processing method and apparatus

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