JPS6431971A - Vacuum treatment device - Google Patents
Vacuum treatment deviceInfo
- Publication number
- JPS6431971A JPS6431971A JP18803087A JP18803087A JPS6431971A JP S6431971 A JPS6431971 A JP S6431971A JP 18803087 A JP18803087 A JP 18803087A JP 18803087 A JP18803087 A JP 18803087A JP S6431971 A JPS6431971 A JP S6431971A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- vacuum treatment
- carrier
- gate valves
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To prevent contamination of a deposit and to enable a plurality of different treatments by communicating a vacuum treatment chamber, a loading chamber and an unloading chamber with a carrier chamber via gate valves and furthermore exhausting each chamber respectively and independently. CONSTITUTION:A first carrier chamber 20 is provided between a plural vacuum treatment chambers 16-19 equipped with electrodes, targets and magnets, etc., and a loading chamber 3 and an unloading chamber 6 and these are communicated via gate valves 8. Furthermore a second carrier chamber 21 is provided between respective vacuum treatment chamber 16-19 via the gate valves 8. Further vacuum exhausting devices 22, 23... are provided to the above-mentioned every chambers respectively. A material 12 to be treated is carried into the loading chamber 3 from a carrying part 9 and transferred to the first evacuated carrier chamber 20. Then the material 12 is carried into the vacuum treatment chamber 16 with carrying devices 43, 45 and thereafter passed through the second carrier chamber 21 and subjected to prescribed vacuum treatment successively in the vacuum treatment chambers 17-19 via carrying devices 51-53. The treated material 12 is taken out with the carrying devices 44, 45 and sent to a carrying part 10 via the unloading chamber 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18803087A JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18803087A JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6431971A true JPS6431971A (en) | 1989-02-02 |
JPH0242901B2 JPH0242901B2 (en) | 1990-09-26 |
Family
ID=16216436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18803087A Granted JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431971A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0841643A (en) * | 1994-05-05 | 1996-02-13 | Leybold Ag | Processing unit of vacuum apparatus for processing platy workpiece and production of said unit |
US5950330A (en) * | 1990-08-29 | 1999-09-14 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US7089680B1 (en) | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
USRE39756E1 (en) * | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
USRE39775E1 (en) * | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
JP2008520837A (en) * | 2004-11-18 | 2008-06-19 | インテバック・インコーポレイテッド | Wafer fab |
US8206551B2 (en) | 2004-11-18 | 2012-06-26 | Intevac, Inc. | Processing thin wafers |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763676A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Continuous sputtering device |
JPS5877239A (en) * | 1981-11-04 | 1983-05-10 | Ulvac Corp | Continuous vacuum processor |
JPS6040532A (en) * | 1983-07-19 | 1985-03-02 | バリアン・アソシエイツ・インコ−ポレイテツド | Apparatus for handing and coating disc or wafer |
JPS6050312A (en) * | 1983-08-31 | 1985-03-20 | Sharp Corp | Igniter for kerosene burner |
JPS60109218A (en) * | 1983-11-18 | 1985-06-14 | Hitachi Ltd | Device for epitaxial growth by molecular beam |
JPS6155926A (en) * | 1984-08-27 | 1986-03-20 | Nec Corp | Semiconductor manufacturing device |
JPS61112312A (en) * | 1984-11-07 | 1986-05-30 | Hitachi Ltd | Vacuum continuous treater |
JPS6328863A (en) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | Vacuum treatment device |
-
1987
- 1987-07-28 JP JP18803087A patent/JPS6431971A/en active Granted
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763676A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Continuous sputtering device |
JPS5877239A (en) * | 1981-11-04 | 1983-05-10 | Ulvac Corp | Continuous vacuum processor |
JPS6040532A (en) * | 1983-07-19 | 1985-03-02 | バリアン・アソシエイツ・インコ−ポレイテツド | Apparatus for handing and coating disc or wafer |
JPS6050312A (en) * | 1983-08-31 | 1985-03-20 | Sharp Corp | Igniter for kerosene burner |
JPS60109218A (en) * | 1983-11-18 | 1985-06-14 | Hitachi Ltd | Device for epitaxial growth by molecular beam |
JPS6155926A (en) * | 1984-08-27 | 1986-03-20 | Nec Corp | Semiconductor manufacturing device |
JPS61112312A (en) * | 1984-11-07 | 1986-05-30 | Hitachi Ltd | Vacuum continuous treater |
JPS6328863A (en) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | Vacuum treatment device |
Cited By (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6634116B2 (en) | 1990-08-09 | 2003-10-21 | Hitachi, Ltd. | Vacuum processing apparatus |
US5950330A (en) * | 1990-08-29 | 1999-09-14 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6012235A (en) * | 1990-08-29 | 2000-01-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6044576A (en) * | 1990-08-29 | 2000-04-04 | Hitachi, Ltd. | Vacuum processing and operating method using a vacuum chamber |
US6055740A (en) * | 1990-08-29 | 2000-05-02 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6070341A (en) * | 1990-08-29 | 2000-06-06 | Hitachi, Ltd. | Vacuum processing and operating method with wafers, substrates and/or semiconductors |
US6108929A (en) * | 1990-08-29 | 2000-08-29 | Hitachi, Ltd. | Vacuum processing apparatus |
US6112431A (en) * | 1990-08-29 | 2000-09-05 | Hitachi, Ltd. | Vacuum processing and operating method |
US6263588B1 (en) | 1990-08-29 | 2001-07-24 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6301802B1 (en) | 1990-08-29 | 2001-10-16 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6301801B1 (en) | 1990-08-29 | 2001-10-16 | Shigekazu Kato | Vacuum processing apparatus and operating method therefor |
US6314658B2 (en) | 1990-08-29 | 2001-11-13 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6330755B1 (en) | 1990-08-29 | 2001-12-18 | Hitachi, Ltd. | Vacuum processing and operating method |
US6330756B1 (en) | 1990-08-29 | 2001-12-18 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6332280B2 (en) | 1990-08-29 | 2001-12-25 | Hitachi, Ltd. | Vacuum processing apparatus |
US6446353B2 (en) | 1990-08-29 | 2002-09-10 | Hitachi, Ltd. | Vacuum processing apparatus |
US6457253B2 (en) | 1990-08-29 | 2002-10-01 | Hitachi, Ltd. | Vacuum processing apparatus |
US6460270B2 (en) | 1990-08-29 | 2002-10-08 | Hitachi, Ltd. | Vacuum processing apparatus |
US6463678B2 (en) | 1990-08-29 | 2002-10-15 | Hitachi, Ltd. | Substrate changing-over mechanism in a vaccum tank |
US6463676B1 (en) | 1990-08-29 | 2002-10-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6467186B2 (en) | 1990-08-29 | 2002-10-22 | Hitachi, Ltd. | Transferring device for a vacuum processing apparatus and operating method therefor |
US6467187B2 (en) | 1990-08-29 | 2002-10-22 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6470596B2 (en) | 1990-08-29 | 2002-10-29 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6473989B2 (en) | 1990-08-29 | 2002-11-05 | Hitachi, Ltd. | Conveying system for a vacuum processing apparatus |
US6484414B2 (en) | 1990-08-29 | 2002-11-26 | Hitachi, Ltd. | Vacuum processing apparatus |
US6484415B2 (en) | 1990-08-29 | 2002-11-26 | Hitachi, Ltd. | Vacuum processing apparatus |
US6487794B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Substrate changing-over mechanism in vacuum tank |
US6487791B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Vacuum processing apparatus |
US6487793B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6490810B2 (en) | 1990-08-29 | 2002-12-10 | Hitachi, Ltd. | Vacuum processing apparatus |
US6499229B2 (en) | 1990-08-29 | 2002-12-31 | Hitachi, Ltd. | Vacuum processing apparatus |
US6505415B2 (en) | 1990-08-29 | 2003-01-14 | Hitachi, Ltd. | Vacuum processing apparatus |
US6588121B2 (en) | 1990-08-29 | 2003-07-08 | Hitachi, Ltd. | Vacuum processing apparatus |
US6625899B2 (en) | 1990-08-29 | 2003-09-30 | Hitachi, Ltd. | Vacuum processing apparatus |
US6655044B2 (en) | 1990-08-29 | 2003-12-02 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6662465B2 (en) | 1990-08-29 | 2003-12-16 | Hitachi, Ltd. | Vacuum processing apparatus |
US6880264B2 (en) | 1990-08-29 | 2005-04-19 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6886272B2 (en) | 1990-08-29 | 2005-05-03 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6904699B2 (en) | 1990-08-29 | 2005-06-14 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US6968630B2 (en) | 1990-08-29 | 2005-11-29 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US7089680B1 (en) | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
USRE39756E1 (en) * | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
USRE39775E1 (en) * | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
USRE39776E1 (en) | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
USRE39823E1 (en) * | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
USRE39824E1 (en) * | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
US7367135B2 (en) | 1990-08-29 | 2008-05-06 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
JPH0841643A (en) * | 1994-05-05 | 1996-02-13 | Leybold Ag | Processing unit of vacuum apparatus for processing platy workpiece and production of said unit |
JP2008520837A (en) * | 2004-11-18 | 2008-06-19 | インテバック・インコーポレイテッド | Wafer fab |
US8206551B2 (en) | 2004-11-18 | 2012-06-26 | Intevac, Inc. | Processing thin wafers |
US8354001B2 (en) | 2004-11-18 | 2013-01-15 | Intevac, Inc. | Processing thin wafers |
Also Published As
Publication number | Publication date |
---|---|
JPH0242901B2 (en) | 1990-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0398365A3 (en) | Multiple chamber staged-vacuum semiconductor wafer processing system | |
KR950034488A (en) | Semiconductor Manufacturing Device and Manufacturing Method and Semiconductor Device | |
TW329019B (en) | Sputtering apparatus | |
AU2002365591A1 (en) | Wafer handling apparatus and method | |
JPS6431971A (en) | Vacuum treatment device | |
JPS6362233A (en) | Reactive ion etching apparatus | |
TW278200B (en) | Door drive mechanisms for substrate carrier and load lock | |
JPS5877239A (en) | Continuous vacuum processor | |
JPH11293459A (en) | Multilayer film forming device | |
JPS56278A (en) | Method and apparatus for plasma ethcing of aluminum | |
JPS61246381A (en) | Vacuum treatment device | |
JPS5521553A (en) | Device for fabricating film | |
JPS6328863A (en) | Vacuum treatment device | |
JPS6431970A (en) | Vacuum treatment equipment | |
JPS60102744A (en) | Vacuum treater | |
JPS5741369A (en) | Continuous vacuum treatment device | |
JPS57177536A (en) | Vacuum attracting stand and method for vacuum attraction | |
JPS60115227A (en) | Plasma processing method and apparatus for the same | |
EP0367423A3 (en) | Vacuum deposition system | |
JPH0230759A (en) | Vacuum treatment equipment | |
JPS57200558A (en) | Gate valve method of transferring wafer into air-tight chamber | |
JPS61113766A (en) | End station | |
JPH01120811A (en) | Semiconductor wafer treatment equipment | |
JPS5621637A (en) | Vacuum treatment equipment | |
JPS5918195A (en) | Thin film growth device in extremely high vacuum |