JPS6431971A - Vacuum treatment device - Google Patents

Vacuum treatment device

Info

Publication number
JPS6431971A
JPS6431971A JP18803087A JP18803087A JPS6431971A JP S6431971 A JPS6431971 A JP S6431971A JP 18803087 A JP18803087 A JP 18803087A JP 18803087 A JP18803087 A JP 18803087A JP S6431971 A JPS6431971 A JP S6431971A
Authority
JP
Japan
Prior art keywords
chamber
vacuum treatment
carrier
gate valves
unloading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18803087A
Other languages
Japanese (ja)
Other versions
JPH0242901B2 (en
Inventor
Kyoji Kinokiri
Osamu Watanabe
Katsuya Okumura
Toshinobu Araki
Kazuyoshi Sone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd filed Critical Toshiba Corp
Priority to JP18803087A priority Critical patent/JPS6431971A/en
Publication of JPS6431971A publication Critical patent/JPS6431971A/en
Publication of JPH0242901B2 publication Critical patent/JPH0242901B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To prevent contamination of a deposit and to enable a plurality of different treatments by communicating a vacuum treatment chamber, a loading chamber and an unloading chamber with a carrier chamber via gate valves and furthermore exhausting each chamber respectively and independently. CONSTITUTION:A first carrier chamber 20 is provided between a plural vacuum treatment chambers 16-19 equipped with electrodes, targets and magnets, etc., and a loading chamber 3 and an unloading chamber 6 and these are communicated via gate valves 8. Furthermore a second carrier chamber 21 is provided between respective vacuum treatment chamber 16-19 via the gate valves 8. Further vacuum exhausting devices 22, 23... are provided to the above-mentioned every chambers respectively. A material 12 to be treated is carried into the loading chamber 3 from a carrying part 9 and transferred to the first evacuated carrier chamber 20. Then the material 12 is carried into the vacuum treatment chamber 16 with carrying devices 43, 45 and thereafter passed through the second carrier chamber 21 and subjected to prescribed vacuum treatment successively in the vacuum treatment chambers 17-19 via carrying devices 51-53. The treated material 12 is taken out with the carrying devices 44, 45 and sent to a carrying part 10 via the unloading chamber 6.
JP18803087A 1987-07-28 1987-07-28 Vacuum treatment device Granted JPS6431971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18803087A JPS6431971A (en) 1987-07-28 1987-07-28 Vacuum treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18803087A JPS6431971A (en) 1987-07-28 1987-07-28 Vacuum treatment device

Publications (2)

Publication Number Publication Date
JPS6431971A true JPS6431971A (en) 1989-02-02
JPH0242901B2 JPH0242901B2 (en) 1990-09-26

Family

ID=16216436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18803087A Granted JPS6431971A (en) 1987-07-28 1987-07-28 Vacuum treatment device

Country Status (1)

Country Link
JP (1) JPS6431971A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841643A (en) * 1994-05-05 1996-02-13 Leybold Ag Processing unit of vacuum apparatus for processing platy workpiece and production of said unit
US5950330A (en) * 1990-08-29 1999-09-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
JP2008520837A (en) * 2004-11-18 2008-06-19 インテバック・インコーポレイテッド Wafer fab
US8206551B2 (en) 2004-11-18 2012-06-26 Intevac, Inc. Processing thin wafers

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763676A (en) * 1980-10-03 1982-04-17 Hitachi Ltd Continuous sputtering device
JPS5877239A (en) * 1981-11-04 1983-05-10 Ulvac Corp Continuous vacuum processor
JPS6040532A (en) * 1983-07-19 1985-03-02 バリアン・アソシエイツ・インコ−ポレイテツド Apparatus for handing and coating disc or wafer
JPS6050312A (en) * 1983-08-31 1985-03-20 Sharp Corp Igniter for kerosene burner
JPS60109218A (en) * 1983-11-18 1985-06-14 Hitachi Ltd Device for epitaxial growth by molecular beam
JPS6155926A (en) * 1984-08-27 1986-03-20 Nec Corp Semiconductor manufacturing device
JPS61112312A (en) * 1984-11-07 1986-05-30 Hitachi Ltd Vacuum continuous treater
JPS6328863A (en) * 1986-07-22 1988-02-06 Ulvac Corp Vacuum treatment device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763676A (en) * 1980-10-03 1982-04-17 Hitachi Ltd Continuous sputtering device
JPS5877239A (en) * 1981-11-04 1983-05-10 Ulvac Corp Continuous vacuum processor
JPS6040532A (en) * 1983-07-19 1985-03-02 バリアン・アソシエイツ・インコ−ポレイテツド Apparatus for handing and coating disc or wafer
JPS6050312A (en) * 1983-08-31 1985-03-20 Sharp Corp Igniter for kerosene burner
JPS60109218A (en) * 1983-11-18 1985-06-14 Hitachi Ltd Device for epitaxial growth by molecular beam
JPS6155926A (en) * 1984-08-27 1986-03-20 Nec Corp Semiconductor manufacturing device
JPS61112312A (en) * 1984-11-07 1986-05-30 Hitachi Ltd Vacuum continuous treater
JPS6328863A (en) * 1986-07-22 1988-02-06 Ulvac Corp Vacuum treatment device

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634116B2 (en) 1990-08-09 2003-10-21 Hitachi, Ltd. Vacuum processing apparatus
US5950330A (en) * 1990-08-29 1999-09-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6012235A (en) * 1990-08-29 2000-01-11 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6044576A (en) * 1990-08-29 2000-04-04 Hitachi, Ltd. Vacuum processing and operating method using a vacuum chamber
US6055740A (en) * 1990-08-29 2000-05-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6070341A (en) * 1990-08-29 2000-06-06 Hitachi, Ltd. Vacuum processing and operating method with wafers, substrates and/or semiconductors
US6108929A (en) * 1990-08-29 2000-08-29 Hitachi, Ltd. Vacuum processing apparatus
US6112431A (en) * 1990-08-29 2000-09-05 Hitachi, Ltd. Vacuum processing and operating method
US6263588B1 (en) 1990-08-29 2001-07-24 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301802B1 (en) 1990-08-29 2001-10-16 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301801B1 (en) 1990-08-29 2001-10-16 Shigekazu Kato Vacuum processing apparatus and operating method therefor
US6314658B2 (en) 1990-08-29 2001-11-13 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6330755B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing and operating method
US6330756B1 (en) 1990-08-29 2001-12-18 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6332280B2 (en) 1990-08-29 2001-12-25 Hitachi, Ltd. Vacuum processing apparatus
US6446353B2 (en) 1990-08-29 2002-09-10 Hitachi, Ltd. Vacuum processing apparatus
US6457253B2 (en) 1990-08-29 2002-10-01 Hitachi, Ltd. Vacuum processing apparatus
US6460270B2 (en) 1990-08-29 2002-10-08 Hitachi, Ltd. Vacuum processing apparatus
US6463678B2 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Substrate changing-over mechanism in a vaccum tank
US6463676B1 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6467186B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Transferring device for a vacuum processing apparatus and operating method therefor
US6467187B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6470596B2 (en) 1990-08-29 2002-10-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6473989B2 (en) 1990-08-29 2002-11-05 Hitachi, Ltd. Conveying system for a vacuum processing apparatus
US6484414B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6484415B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6487794B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Substrate changing-over mechanism in vacuum tank
US6487791B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus
US6487793B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6490810B2 (en) 1990-08-29 2002-12-10 Hitachi, Ltd. Vacuum processing apparatus
US6499229B2 (en) 1990-08-29 2002-12-31 Hitachi, Ltd. Vacuum processing apparatus
US6505415B2 (en) 1990-08-29 2003-01-14 Hitachi, Ltd. Vacuum processing apparatus
US6588121B2 (en) 1990-08-29 2003-07-08 Hitachi, Ltd. Vacuum processing apparatus
US6625899B2 (en) 1990-08-29 2003-09-30 Hitachi, Ltd. Vacuum processing apparatus
US6655044B2 (en) 1990-08-29 2003-12-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6662465B2 (en) 1990-08-29 2003-12-16 Hitachi, Ltd. Vacuum processing apparatus
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6904699B2 (en) 1990-08-29 2005-06-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6968630B2 (en) 1990-08-29 2005-11-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
JPH0841643A (en) * 1994-05-05 1996-02-13 Leybold Ag Processing unit of vacuum apparatus for processing platy workpiece and production of said unit
JP2008520837A (en) * 2004-11-18 2008-06-19 インテバック・インコーポレイテッド Wafer fab
US8206551B2 (en) 2004-11-18 2012-06-26 Intevac, Inc. Processing thin wafers
US8354001B2 (en) 2004-11-18 2013-01-15 Intevac, Inc. Processing thin wafers

Also Published As

Publication number Publication date
JPH0242901B2 (en) 1990-09-26

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