JPS57177536A - Vacuum attracting stand and method for vacuum attraction - Google Patents

Vacuum attracting stand and method for vacuum attraction

Info

Publication number
JPS57177536A
JPS57177536A JP6246781A JP6246781A JPS57177536A JP S57177536 A JPS57177536 A JP S57177536A JP 6246781 A JP6246781 A JP 6246781A JP 6246781 A JP6246781 A JP 6246781A JP S57177536 A JPS57177536 A JP S57177536A
Authority
JP
Japan
Prior art keywords
vacuum
attracting
holes
wafers
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6246781A
Other languages
Japanese (ja)
Inventor
Masaki Tsukagoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6246781A priority Critical patent/JPS57177536A/en
Publication of JPS57177536A publication Critical patent/JPS57177536A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To bring a thin material to a fully conformed state on the attracting surface by a method wherein a pluraity of vacuum attracting holes are separated in a plurality of groups, and each of these groups is connected to an independent vacuum system. CONSTITUTION:A chuck 6 has concentric circular holes 7b-7d arranged in B-D rows with the center hole 7 as the center point, and each row is connected to the vacuum holes 9a-9d respectively by communication passages 8a-8d. Wafers 5 are placed on the chuck 6, and they are successively vacuum-attracted on the B-D rows through the center hole. Accordingly, the wafers 5 are fully adhered on the entire surface of the chuck, and the correction of warpage can be performed more effectively than that where the wafers are attracted to all holes simultaneously.
JP6246781A 1981-04-27 1981-04-27 Vacuum attracting stand and method for vacuum attraction Pending JPS57177536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6246781A JPS57177536A (en) 1981-04-27 1981-04-27 Vacuum attracting stand and method for vacuum attraction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6246781A JPS57177536A (en) 1981-04-27 1981-04-27 Vacuum attracting stand and method for vacuum attraction

Publications (1)

Publication Number Publication Date
JPS57177536A true JPS57177536A (en) 1982-11-01

Family

ID=13201032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6246781A Pending JPS57177536A (en) 1981-04-27 1981-04-27 Vacuum attracting stand and method for vacuum attraction

Country Status (1)

Country Link
JP (1) JPS57177536A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737824A (en) * 1984-10-16 1988-04-12 Canon Kabushiki Kaisha Surface shape controlling device
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
US4963921A (en) * 1985-06-24 1990-10-16 Canon Kabushiki Kaisha Device for holding a mask
WO2013003877A1 (en) * 2011-07-01 2013-01-10 Mechatronic Systemtechnik Gmbh Device for holding a planar substrate
CN105159033A (en) * 2015-08-20 2015-12-16 上海华力微电子有限公司 Design method of exposure slide holder for improving lithography alignment accuracy
CN110774077A (en) * 2019-10-21 2020-02-11 王春宏 Wafer processing thinning machine

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737824A (en) * 1984-10-16 1988-04-12 Canon Kabushiki Kaisha Surface shape controlling device
US4963921A (en) * 1985-06-24 1990-10-16 Canon Kabushiki Kaisha Device for holding a mask
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
WO2013003877A1 (en) * 2011-07-01 2013-01-10 Mechatronic Systemtechnik Gmbh Device for holding a planar substrate
US9558984B2 (en) 2011-07-01 2017-01-31 Mechatronic Systemtechnik Gmbh Device for holding a planar substrate
CN105159033A (en) * 2015-08-20 2015-12-16 上海华力微电子有限公司 Design method of exposure slide holder for improving lithography alignment accuracy
CN110774077A (en) * 2019-10-21 2020-02-11 王春宏 Wafer processing thinning machine
CN110774077B (en) * 2019-10-21 2021-08-10 无锡芯坤电子科技有限公司 Wafer processing thinning machine

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