JPS5621637A - Vacuum treatment equipment - Google Patents

Vacuum treatment equipment

Info

Publication number
JPS5621637A
JPS5621637A JP9615679A JP9615679A JPS5621637A JP S5621637 A JPS5621637 A JP S5621637A JP 9615679 A JP9615679 A JP 9615679A JP 9615679 A JP9615679 A JP 9615679A JP S5621637 A JPS5621637 A JP S5621637A
Authority
JP
Japan
Prior art keywords
chamber
sputter
vacuum
fixtures
fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9615679A
Other languages
Japanese (ja)
Inventor
Hideki Tateishi
Susumu Aiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9615679A priority Critical patent/JPS5621637A/en
Publication of JPS5621637A publication Critical patent/JPS5621637A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE:To continuously form thin layers of constant quality with a high yield by a method wherein substrates supported with a fixture stocker are sequentially transferred into a vacuum preparatory chamber and sputter-etching chamber which are individually maintained at vacuum so that the operation is performed through the vacuum preparatory chamber. CONSTITUTION:A fixture stocker 20 is used to mount a specified number of fixtures 1, on which substrates 17 are sequentially mounted. A gate valve 1 is opened and all the fixtures 1 are housed in a vacuum preparatory chamber, then a chamber 22 is exhausted to a specified vacuum, and each of the substrates 17 is heated. At this time, the gate valve of each chamber is closed and a specified vacuum is maintained in a transfer chamber 24, a sputter-etching chamber 26, a sputter chamber 28, and the vacuum preparatory chamber 30. Then, a gate valve 23 is opened, all the fixtures 1 are sequentially transferred into the transfer chamber 24, a fixture holder 35 sequentially holds the fixtures, and while rotating the holder 35, all the fixtures 1 are housed in the sputter- etching chamber 26. While rotating the holder 35, the sputter-etching treatment is performed, then all the fixture 1 are taken out of the chamber 26, are sent to the sputter chamber 28 via the transfer chamber 24, so that the substrate 17 is subject to the sputter treatment and transferred via the vacuum preparatory chamber 30 to the position 37 to recover the substrates.
JP9615679A 1979-07-30 1979-07-30 Vacuum treatment equipment Pending JPS5621637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9615679A JPS5621637A (en) 1979-07-30 1979-07-30 Vacuum treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9615679A JPS5621637A (en) 1979-07-30 1979-07-30 Vacuum treatment equipment

Publications (1)

Publication Number Publication Date
JPS5621637A true JPS5621637A (en) 1981-02-28

Family

ID=14157489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9615679A Pending JPS5621637A (en) 1979-07-30 1979-07-30 Vacuum treatment equipment

Country Status (1)

Country Link
JP (1) JPS5621637A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
JPS6171467U (en) * 1984-10-16 1986-05-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
JPS6171467U (en) * 1984-10-16 1986-05-15

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