JPS6425520A - Vapor growth method for compound semiconductor - Google Patents

Vapor growth method for compound semiconductor

Info

Publication number
JPS6425520A
JPS6425520A JP18252287A JP18252287A JPS6425520A JP S6425520 A JPS6425520 A JP S6425520A JP 18252287 A JP18252287 A JP 18252287A JP 18252287 A JP18252287 A JP 18252287A JP S6425520 A JPS6425520 A JP S6425520A
Authority
JP
Japan
Prior art keywords
gas
susceptor
substrate
gas stream
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18252287A
Other languages
Japanese (ja)
Inventor
Mototsugu Ogura
Minoru Kubo
Yuzaburo Ban
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18252287A priority Critical patent/JPS6425520A/en
Publication of JPS6425520A publication Critical patent/JPS6425520A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simplify a piping system as an MOVPE apparatus and to make it possible to form a semiconductor at a low cost, by mounting a semiconductor substrate in a susceptor without exposing the substrate to a reacting gas stream when reacting gas is changed, sliding the susceptor after the gas stream is stabilized, exposing the semiconductor substrate to the reacting gas, and performing epitaxial growing. CONSTITUTION:Reacting gas flows through a VENT line 13 by way of a three-way valve 12. Only H2 gas is introduced through a line 11. A substrate 2 is set at a substrate holder part 15 of a susceptor 14. The substrate is covered with a susceptor 16 in a fitting manner. Even if the reacting gas is introduced through a line 10 in this state, the material hardly grows on the semiconductor substrate 2. During this period, a mass flow 9 is adjusted to 2.0l/min. The inside of a furnace core tube 8 is kept at constant pressure and gas stream. Thereafter, the susceptor 14 is pushed to the upstream side of the gas stream with a manipulating rod 17. The semiconductor substrate 2 is exposed to the mixed gas of the reacting gas and carrier gas. Thus an excellent epitaxial film is obtained. The periphery of the semiconductor substrate 2 is formed as a planar shape. The upstream sides of the susceptors 14 and 16 in the gas stream are tapered. Thus the disturbance of the gas stream is prevented.
JP18252287A 1987-07-22 1987-07-22 Vapor growth method for compound semiconductor Pending JPS6425520A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18252287A JPS6425520A (en) 1987-07-22 1987-07-22 Vapor growth method for compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18252287A JPS6425520A (en) 1987-07-22 1987-07-22 Vapor growth method for compound semiconductor

Publications (1)

Publication Number Publication Date
JPS6425520A true JPS6425520A (en) 1989-01-27

Family

ID=16119775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18252287A Pending JPS6425520A (en) 1987-07-22 1987-07-22 Vapor growth method for compound semiconductor

Country Status (1)

Country Link
JP (1) JPS6425520A (en)

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