JPS6389261U - - Google Patents

Info

Publication number
JPS6389261U
JPS6389261U JP18305786U JP18305786U JPS6389261U JP S6389261 U JPS6389261 U JP S6389261U JP 18305786 U JP18305786 U JP 18305786U JP 18305786 U JP18305786 U JP 18305786U JP S6389261 U JPS6389261 U JP S6389261U
Authority
JP
Japan
Prior art keywords
resin
metal block
sealed
lead frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18305786U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18305786U priority Critical patent/JPS6389261U/ja
Publication of JPS6389261U publication Critical patent/JPS6389261U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は従来構造図、第2図は本考案の一実施
例構造図である。図において1……IC等の半導
体ペレツト、2……ヒートシンク、3……半田、
4……リード、5……ワイヤー、6……樹脂、6
―1〜6―4は突起、8……接続用リード、9…
…カシメ部、10……取りつけ穴、11……リー
ドフレーム、12,13……タイバー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属ブロツク上に半田等を介して、IC等の半
    導体ペレツトを固着すると共に、前記半導体ペレ
    ツトの電極部を金等の細線によりリードフレーム
    と電気接続し、前記金属ブロツクを包囲して樹脂
    封止するようにした樹脂封止型半導体装置におい
    て、前記リードフレームに前記金属ブロツクとの
    接続用リード部を設けて、該金属ブロツクに固着
    せしめ、且つ前記樹脂封止部において表面に露出
    する前記接続用リード部より突出する樹脂部を設
    けたことを特徴とする樹脂封止型半導体装置。
JP18305786U 1986-11-28 1986-11-28 Pending JPS6389261U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18305786U JPS6389261U (ja) 1986-11-28 1986-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18305786U JPS6389261U (ja) 1986-11-28 1986-11-28

Publications (1)

Publication Number Publication Date
JPS6389261U true JPS6389261U (ja) 1988-06-10

Family

ID=31129439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18305786U Pending JPS6389261U (ja) 1986-11-28 1986-11-28

Country Status (1)

Country Link
JP (1) JPS6389261U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922855U (ja) * 1972-05-29 1974-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922855U (ja) * 1972-05-29 1974-02-26

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