JPH0176040U - - Google Patents
Info
- Publication number
- JPH0176040U JPH0176040U JP17183287U JP17183287U JPH0176040U JP H0176040 U JPH0176040 U JP H0176040U JP 17183287 U JP17183287 U JP 17183287U JP 17183287 U JP17183287 U JP 17183287U JP H0176040 U JPH0176040 U JP H0176040U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- semiconductor device
- mounting part
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
第１図は本考案により製造された半導体装置の
断面図であり、第２図は従来の半導体装置の断面
図である。第３図は本考案による実施例２の断面
図である。 １…ボンデイングワイヤー、２…封止樹脂、３
…リードフレーム、４…ペレツト、５…絶縁性物
質でできたペレツト搭載部、６…ペレツト搭載部
の凹部、７…ペレツト、８…ボンデイングワイヤ
ー、９…封止樹脂、１０…リードフレーム、１１
…ペレツト搭載部（導伝性物質）、１２…ペレツ
ト、１３…ボンデイングワイヤー、１４…封止樹
脂、１５…リードフレーム、１６…絶縁性物質で
できたペレツト搭載部、１７…ペレツト搭載部突
起部。
断面図であり、第２図は従来の半導体装置の断面
図である。第３図は本考案による実施例２の断面
図である。 １…ボンデイングワイヤー、２…封止樹脂、３
…リードフレーム、４…ペレツト、５…絶縁性物
質でできたペレツト搭載部、６…ペレツト搭載部
の凹部、７…ペレツト、８…ボンデイングワイヤ
ー、９…封止樹脂、１０…リードフレーム、１１
…ペレツト搭載部（導伝性物質）、１２…ペレツ
ト、１３…ボンデイングワイヤー、１４…封止樹
脂、１５…リードフレーム、１６…絶縁性物質で
できたペレツト搭載部、１７…ペレツト搭載部突
起部。
Claims (1)
- 樹脂封止型半導体装置においてペレツト搭載部
を有しないリードフレームを用いて、ペレツト搭
載部が樹脂とは異なる絶縁性物質で形成され、且
つペレツト搭載部の一部が凹状になつており、そ
の凹部にペレツトを搭載されていることを特徴と
する樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17183287U JPH0176040U (ja) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17183287U JPH0176040U (ja) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176040U true JPH0176040U (ja) | 1989-05-23 |
Family
ID=31463837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17183287U Pending JPH0176040U (ja) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176040U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
-
1987
- 1987-11-09 JP JP17183287U patent/JPH0176040U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
| US10741413B2 (en) | 2016-05-12 | 2020-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |