JPS63500344A - ハイブリッド回路で電気回路を製造する方法 - Google Patents

ハイブリッド回路で電気回路を製造する方法

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Publication number
JPS63500344A
JPS63500344A JP61500710A JP50071086A JPS63500344A JP S63500344 A JPS63500344 A JP S63500344A JP 61500710 A JP61500710 A JP 61500710A JP 50071086 A JP50071086 A JP 50071086A JP S63500344 A JPS63500344 A JP S63500344A
Authority
JP
Japan
Prior art keywords
protective layer
bonding
photoresist
adhesive
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61500710A
Other languages
English (en)
Japanese (ja)
Inventor
キユツトナー，クラウス
マイアー，ベルンハルト
Original Assignee
ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング filed Critical ロ−ベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Publication of JPS63500344A publication Critical patent/JPS63500344A/ja
Pending legal-status Critical Current

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    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP61500710A 1985-05-18 1986-01-15 ハイブリッド回路で電気回路を製造する方法 Pending JPS63500344A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3517965.1 1985-05-18
DE19853517965 DE3517965A1 (de) 1985-05-18 1985-05-18 Verfahren zur herstellung einer elektrischen schaltung in hybridtechnik

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JPS63500344A true JPS63500344A (ja) 1988-02-04

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DE (1) DE3517965A1 (de)
WO (1) WO1986007191A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293744A (ja) * 1996-02-29 1997-11-11 Denso Corp 電子部品の実装方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950021293A (ko) * 1993-12-03 1995-07-26 빈센트 비. 인그라시아 반도체 다이를 다이 패드에 부착하도록 산화물층을 이용한 회로 및 방법
DE19722355A1 (de) * 1997-05-28 1998-12-03 Bosch Gmbh Robert Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe
DE102008058047B4 (de) * 2008-11-18 2013-11-07 Auto-Kabel Management Gmbh Verbindung von elektrischen Leitungen mittels Ultraschallschweißen

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Publication number Priority date Publication date Assignee Title
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US4372475A (en) * 1981-04-29 1983-02-08 Goforth Melvin L Electronic assembly process and apparatus
JPS5933894A (ja) * 1982-08-19 1984-02-23 電気化学工業株式会社 混成集積用回路基板の製造法
EP0139063A1 (de) * 1983-10-24 1985-05-02 SINTRA-ALCATEL Société Anonyme dite: Verfahren zum Ersetzen eines zu den Stromführungspuren eines tragenden Substrats verbundenen elektronischen Unterteiles
DE3482013D1 (de) * 1983-11-11 1990-05-23 Toshiba Kawasaki Kk Verfahren zum herstellen einer integrierten hybridschaltung.
US4582722A (en) * 1984-10-30 1986-04-15 International Business Machines Corporation Diffusion isolation layer for maskless cladding process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293744A (ja) * 1996-02-29 1997-11-11 Denso Corp 電子部品の実装方法

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WO1986007191A1 (en) 1986-12-04

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