JPS63310581A - Film body for electric connection - Google Patents
Film body for electric connectionInfo
- Publication number
- JPS63310581A JPS63310581A JP62146371A JP14637187A JPS63310581A JP S63310581 A JPS63310581 A JP S63310581A JP 62146371 A JP62146371 A JP 62146371A JP 14637187 A JP14637187 A JP 14637187A JP S63310581 A JPS63310581 A JP S63310581A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating resin
- resin
- insulating
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【発明の詳細な説明】
（発明の分野）
本発明は、絶縁性樹脂中に導電体を分散、含有させたフ
ィルム形状の異方性導電フィルム、特に接続部の分解能
と接着強度を高めることを可能とした異方性導電フィル
ムに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to an anisotropic conductive film in the form of a film in which a conductor is dispersed and contained in an insulating resin. The present invention relates to an anisotropic conductive film that has been made possible.
（従来技術〕
従来、ＦＰＣ（フレキシブルプリント基板）と配線基板
（ガラスエポキシ基板、ガラス基板、セラミック基板、
ＦＰＣ等）とを相互に接続する一手段として絶縁性樹脂
中に導電体を分散含有させたフィルム形状の異方性導電
フィルムを熱圧着して接続する方法が広く用いられてい
る。とくに近年、従来のＣＲＴにかわるディスプレイと
して液晶表示素子やＥＬ表示素子等の画像表示装置や従
来のＣＣＤにかわるセンサーとしてアモルファス−３ｉ
等を用いた長尺一体形成の密着型イメージセンサ−等の
画像読取装置の分野では、高密度分解能を持つ、異方性
導電フィルムによる接続方法は広く用いられている。(Prior art) Conventionally, FPC (flexible printed circuit board) and wiring board (glass epoxy board, glass board, ceramic board,
As a means of interconnecting FPCs, etc., a method is widely used in which an anisotropic conductive film in the form of a film in which a conductor is dispersed in an insulating resin is bonded by thermocompression. In particular, in recent years, amorphous-3i has been used as an image display device such as a liquid crystal display element or an EL display element as a display to replace the conventional CRT, and as a sensor to replace the conventional CCD.
In the field of image reading devices such as long, integrally formed contact type image sensors, etc., a connection method using an anisotropic conductive film having high density resolution is widely used.
又、ＦＰＣとしては、ＩＣチップを直接搭載することが
でき、かつ画像表示素子や画像読取素子に接続するため
の配線機能を有し、なおかつ組立工程の合理化を可能な
らしめる搬送機能をも合せ持っているフィルムキャリア
テープが多く用いられている。In addition, FPCs can directly mount IC chips, have wiring functions for connecting to image display elements and image reading elements, and also have transport functions that enable rationalization of the assembly process. Film carrier tapes are often used.
ところで、従来の異方性導電フィルムを用いたフィルム
キャリアテープとガラス基板等の配線基板（この場合、
画像表示素子や画像読取素子も含む）とを接続する実装
構造において接続分解能は約２００μｍピッチが限度で
あった。By the way, a film carrier tape using a conventional anisotropic conductive film and a wiring board such as a glass substrate (in this case,
In a mounting structure that connects devices (including image display devices and image reading devices), the connection resolution has been limited to a pitch of approximately 200 μm.
フィルムキャリアテープは、搬゛送機能を持つために、
そのためのパーフォレーションの破損やテープのたわみ
を防ぐために、通常７５μｍ〜１２５μｍ厚のポリイミ
ドフィルムが用いられるとともに、ＩＣチップを直接搭
載するためにＩＣチップのパッド部と接続するインナー
リードボンディング部をフィンガー状にポリイミドフィ
ルムから突出させており、インナーリードボンディング
部の倒れを防ぐために、通常３５μｍ厚の銅箔が用いら
れている。In order to have a transport function, film carrier tape has
In order to prevent damage to the perforations and bending of the tape, a polyimide film with a thickness of 75 μm to 125 μm is usually used, and in order to directly mount an IC chip, the inner lead bonding part that connects to the pad part of the IC chip is made into a finger shape. It protrudes from the polyimide film, and a copper foil with a thickness of 35 μm is usually used to prevent the inner lead bonding portion from falling.
この異方性導電フィルムの厚さは、一般的に対向する銅
箔パターン厚と配線パターン厚との合計の厚さ程度とさ
れている。The thickness of this anisotropic conductive film is generally about the total thickness of the opposing copper foil pattern and wiring pattern.
ところで、異方性導電フィルムの接続分解能がその厚み
と関係していることは、広く知られている所であり、異
方性導電フィルムの厚さが厚いと接続分解能が低下し厚
さが薄いと接続分解能が向上するが、従来の異方性導電
フィルムを用いてフィルムキャリアテープと配線基板と
を接続する実装構造において、５木／ ｍ ｍを越える
（２００μｍピッチより小さいピッチで）接続を行うこ
とは不可能であった。By the way, it is widely known that the connection resolution of an anisotropic conductive film is related to its thickness; the thicker the anisotropic conductive film, the lower the connection resolution; However, in a mounting structure that connects a film carrier tape and a wiring board using a conventional anisotropic conductive film, connections exceeding 5 pieces/mm (with a pitch smaller than 200 μm pitch) are required. That was impossible.
本発明の目的は、前述した従来例の欠点を除去して接続
部の分解能を高めると同時に、接着強度をも高めること
によって、信頼性を高めることも可能とした異方性導電
フィルムを提供することにある。An object of the present invention is to provide an anisotropic conductive film that eliminates the drawbacks of the conventional examples described above and improves the resolution of the connection part, and at the same time improves the reliability by increasing the adhesive strength. There is a particular thing.
すなわち、本発明は、熱溶融性で、且つ絶縁性の第１フ
ィルムと、熱溶融性で、且つ異、１導電性の第２フィル
ムとを接合させた積層体構造を有する電気的接続のため
のフィルム体に特徴を有している。That is, the present invention provides an electrical connection having a laminate structure in which a first film that is heat-fusible and has an insulating property and a second film that is heat-fusible and has a different electrical conductivity are bonded to each other. It has the characteristics of a film body.
以下、本発明を図面に従フて説明する。 The present invention will be explained below with reference to the drawings.
第１図は、本発明の積層フィルム体１０の断面図で、第
１フィルム１１は導電体を分散していない絶縁性樹脂１
４（ａ）より成り、第２フィルム１２は導電体１３を絶
縁性樹脂１４（ｂ）に分散含有（混入）されており、第
１フィルムと第２フィルムは互いに接着されて多層形成
されている。FIG. 1 is a cross-sectional view of a laminated film body 10 of the present invention, in which the first film 11 is an insulating resin 1 in which no conductor is dispersed.
4(a), the second film 12 has a conductor 13 dispersed in (mixed with) an insulating resin 14(b), and the first film and the second film are bonded to each other to form a multilayer structure. .
導電体１３は、Ｎｉ、Ａｕ、Ａｇ、はんだ等の金属又は
合金粒子や樹脂球状粒子にＡｕ、Ｎｉ等をコーディング
した良導電性を有する粒子を用いることができる。この
導電体１３は、樹脂の固形分１００重量部に対して０．
５〜５０重量部、好ましくは５〜２０重量部の割合で含
有され、又、その平均粒径は５〜５０μｍ、好ましくは
１０〜３０ｔ１ｍである。As the conductor 13, metal or alloy particles such as Ni, Au, Ag, or solder, or particles having good conductivity, such as resin spherical particles coated with Au, Ni, etc., can be used. This conductor 13 has a content of 0.00% based on 100 parts by weight of the solid content of the resin.
It is contained in a proportion of 5 to 50 parts by weight, preferably 5 to 20 parts by weight, and its average particle size is 5 to 50 μm, preferably 10 to 30 t1m.
第１フィルム１１と第２フィルム１２の絶縁性樹脂１４
（ａ）と（ｂ）は、同一組成のものを用いることが望ま
しく、スチレン−ブタジェン共重合体、テルペンフェー
ル樹脂、アクリルゴム、エポキシ樹脂、ポリビニルフェ
ノール、アクリルニトリル−ブタジェン共重合体、フェ
ノール樹脂、ポリエステル樹脂、ナイロン等の熱溶融性
樹脂を用いることができる。又、本発明では、これらの
樹脂を１種又は２種以上組合わせて用いることができる
。又、フィルム形成時には、通常のコーチイン法、例え
ばロールコート法、印刷法、スプレィコート法を用いる
ことができ、この際の塗液溶剤としては、トルエン、メ
チルエチルケトン、エタノール、キシレンなどの１ ｆ
ｆｆｉ又はその混合溶剤が用いられる。Insulating resin 14 of first film 11 and second film 12
(a) and (b) are preferably of the same composition; styrene-butadiene copolymer, terpene phenol resin, acrylic rubber, epoxy resin, polyvinylphenol, acrylonitrile-butadiene copolymer, phenolic resin, Heat-melting resins such as polyester resins and nylon can be used. Further, in the present invention, these resins may be used alone or in combination of two or more. Further, when forming a film, a usual coach-in method, such as a roll coating method, a printing method, or a spray coating method, can be used, and the coating solution solvent used in this case may be 1 F, such as toluene, methyl ethyl ketone, ethanol, or xylene.
ffi or a mixed solvent thereof is used.
又、本発明で用いた第１フィルム１１の乾燥後の厚さは
、５μｍ〜５０μｍ、好ましくは１５３ｍ〜３０μｍで
、第２フィルム１２の乾燥後の厚みは１〜２５μｍ、好
ましくは５〜１５μｍ程度に設定され、これら第１フィ
ルム１１と第２フィルム１２の積層体構造では、１０〜
１００μｍ、好ましくは２０〜５０μｍ程度に設定され
ているのがよい。Further, the thickness of the first film 11 used in the present invention after drying is 5 μm to 50 μm, preferably 153 m to 30 μm, and the thickness of the second film 12 after drying is 1 to 25 μm, preferably about 5 to 15 μm. In the laminate structure of the first film 11 and the second film 12, 10 to
The thickness is preferably set to about 100 μm, preferably about 20 to 50 μm.
本発明の積層体構造は、例えば以下の工程で作成するこ
とができる。The laminate structure of the present invention can be created, for example, by the following steps.
（１）下記組成の塗液を乾燥後の厚さが１７μｍになる
様に剥離シート（図示せず）の上にコーターによって塗
布し、乾燥して第１フィルム１１の連結シートを得る。(1) A coating liquid having the following composition is applied onto a release sheet (not shown) using a coater so that the thickness after drying becomes 17 μm, and is dried to obtain a connecting sheet of the first film 11.
スチレン−ブタジェン共重合体 ５０重量部テルペンフ
ェノール樹脂 ５０重量部トルエン
１５０重量部メチルエチルケトン
５０重量部（２）更に第１フィルム１１の連結シート上
に、前述の組成の絶縁性樹脂の固形分１００容量部に対
して、液晶セルの上下基板間の隙間制御用の絶縁性スペ
ーサとして利用されている高精度硬化樹脂球状粒子・エ
ポスターＧＰ−９０（日本触媒化学工業■製）の表面に
Ａｕをコートした良導電性粒子１３を１０重量部の割合
で分散・混入した塗料を乾燥後の厚さが８μｍになる様
にコーターによって塗布し、乾燥して、第１フィルムに
接着した第２フィルムを得た。Styrene-butadiene copolymer 50 parts by weight Terpene phenol resin 50 parts by weight Toluene
150 parts by weight methyl ethyl ketone
50 parts by weight (2) Furthermore, on the connecting sheet of the first film 11, 100 parts by volume of the solid content of the insulating resin having the above-mentioned composition is used as an insulating spacer for controlling the gap between the upper and lower substrates of the liquid crystal cell. After drying, a paint containing 10 parts by weight of highly conductive particles 13 coated with Au was dispersed and mixed on the surface of high-precision cured resin spherical particles Eposter GP-90 (manufactured by Nippon Shokubai Chemical Co., Ltd.). It was coated with a coater to a thickness of 8 μm and dried to obtain a second film adhered to the first film.
この様にして得た連結シートの剥離紙を剥がして第１フ
ィルム１１の絶縁性樹脂の表面が一部溶融してＦＰＣの
銅箔パターンに接着する様に仮接着される。第２図は仮
接着された状態の断面図を示す。The release paper of the thus obtained connection sheet is peeled off, and the surface of the insulating resin of the first film 11 is partially melted and temporarily adhered to the copper foil pattern of the FPC. FIG. 2 shows a cross-sectional view of the temporarily bonded state.
（３）次いで、異方性導電フィルム（積層フィルム体１
０）が仮接着されたＦＰＣ基板２１と配線基板２３の配
線パターン２２と２４とを位置合せ対峙させ、パルスヒ
ートツール（図示せず）で、１５０℃の温度下で、加圧
４０ Ｋ ｇ ／ ｃ ｒｎ’を２０秒間熱圧着し、接
続される。(3) Next, the anisotropic conductive film (laminated film body 1
The wiring patterns 22 and 24 of the FPC board 21 and the wiring board 23, to which the FPC board 21 and wiring board 23 were temporarily bonded, were aligned and faced each other, and then a pulse heat tool (not shown) was used to apply a pressure of 40 Kg/at a temperature of 150°C. crn' is thermocompressed for 20 seconds and connected.
第３図は、本発明の異方性導電フィルムの効果を概念的
に示す断面で、導電体１３は加熱溶融後、一体形成され
た樹脂層２５の中で、配線基板２３の側にのみ分散され
る。このことは、異方性導電フィルム１０の第２フィル
ム１２にのみ導電体１３が分散されていることによるも
のである。FIG. 3 is a cross section conceptually showing the effect of the anisotropic conductive film of the present invention, in which the conductor 13 is heated and melted and then dispersed only on the wiring board 23 side in the integrally formed resin layer 25. be done. This is because the conductor 13 is dispersed only in the second film 12 of the anisotropic conductive film 10.
第１フィルム１１と、第２フィルム１２の絶縁性樹脂１
４（ａ）と（ｂ）は、ＦＰＣ基板２１と配線基板２３の
隙間に一体となって充填され、電気的接続を保持すると
ともに、接続部を外気から保護する役割を果たす訳であ
るが、ＦＰＣ基板２１の銅箔パターン２２の下に存在し
た第１フィルム１１の大部分と第２フィルム１２の絶縁
性樹脂１４（ａ）と（ｂ）の一部は、銅箔パターン２２
と２４との間に流れ出し、第１フィルム１１に分散・混
入された導電体１３を介して銅箔パターン２２と配線パ
ターン２４は電気的に導通状態となる。Insulating resin 1 of the first film 11 and the second film 12
4(a) and (b) are integrally filled in the gap between the FPC board 21 and the wiring board 23, and play the role of maintaining electrical connection and protecting the connection part from the outside air. A large part of the first film 11 and a part of the insulating resin 14 (a) and (b) of the second film 12 that were present under the copper foil pattern 22 of the FPC board 21 are removed from the copper foil pattern 22.
and 24, and the copper foil pattern 22 and the wiring pattern 24 become electrically connected via the conductor 13 dispersed and mixed in the first film 11.
本例で明らかな様に、導電体１３を分散した薄い第２フ
ィルム１２によって、接続部の分解能を向上させ得ると
ともに、導電体１３を分散していない第１フィルム１１
の絶縁性樹脂１４（ａ）によって接続部の接着強度を向
上させ、ひいては信頼性の向上に寄与するものである。As is clear from this example, the resolution of the connection part can be improved by the thin second film 12 in which the conductor 13 is dispersed, and the first film 12 in which the conductor 13 is not dispersed can improve the resolution of the connection part.
The insulating resin 14(a) improves the adhesive strength of the connection portion, which in turn contributes to improved reliability.
本発明の異方性導電フィルム１０を用いて、３５μｍ銅
箔を有するフィルムキャリアテープと１０００人ＩＴＯ
電極を有するガラス基板とを各々１００μｍピッチ、５
０ｕｍ導体幅、５０μｍ導体間隔に形成して接続したと
ころ、接続抵抗１００Ω以下、９０” ビール強度５０
０ ｇ ／ ｃ ｍ以上で良好な接続が得られた。Using the anisotropic conductive film 10 of the present invention, film carrier tape with 35 μm copper foil and 1000 ITO
glass substrates with electrodes, each with a pitch of 100 μm, 5
When connected with a conductor width of 0um and a conductor spacing of 50μm, the connection resistance was 100Ω or less, 90" beer strength 50
A good connection was obtained at 0 g/cm or higher.
なお本実施例では、ＦＰＣ基板２１と配線基板２３との
接続について詳述したが、ＩＣチップの接続など部品接
続の高分解能、高信頼性に対しても本発明が有用である
ことはいうまでもない。In this embodiment, the connection between the FPC board 21 and the wiring board 23 has been described in detail, but it goes without saying that the present invention is also useful for high resolution and high reliability connection of components such as connection of IC chips. Nor.
第４図は、本発明における別の実施態様を表わした断面
図である。第４図によれば、接続部Ａには、ＦＰＣ基板
２１の基板部が省略されている。FIG. 4 is a sectional view showing another embodiment of the present invention. According to FIG. 4, the board part of the FPC board 21 is omitted from the connection part A.
又、第５図に示す別の態様の断面図では、接続部ＡにＦ
ＰＣ基板２１の基板の一部が配線パターン２２の端部に
残されたまま他の部分で省略されている態様を表わして
いる。In addition, in the cross-sectional view of another embodiment shown in FIG.
This shows a mode in which a part of the PC board 21 is left at the end of the wiring pattern 22 while other parts are omitted.
以上の例で使用したＦＰＣ基板２１に形成されている銅
箔パターン２２の膜厚は、一般に１０〜５０μｍが適し
ており、又配線基板２３に配線したパターン２４は、銅
箔の他に、Ａ１１．Ｃｒ。The film thickness of the copper foil pattern 22 formed on the FPC board 21 used in the above example is generally suitable to be 10 to 50 μm, and the pattern 24 wired on the wiring board 23 is made of A11 ．． Cr.
Ａｇ、Ｎｉ、ＩＴＯ（インジウム−ティン−オキサイド
）透明導電膜によって形成することができ、その膜厚は
５００人〜１０μｍ程度である。It can be formed using Ag, Ni, or ITO (indium tin oxide) transparent conductive film, and the film thickness is about 500 to 10 μm.
以上詳細に説明した様に、絶縁性樹脂の第１フィルムと
絶縁性樹脂に導電体を分散・混入した第２フィルムとを
多層形成した異方性導電フィルムを提供することによっ
て、ＦＰＣ特に厚い銅箔パターンを使用するフィルムキ
ャリアテープと配線基板とが高分解能で接着強度の強い
高信頼性を有する相互接続が可能となった。As explained in detail above, by providing an anisotropic conductive film in which a first film of an insulating resin and a second film in which a conductor is dispersed/mixed in an insulating resin are formed in multiple layers, FPCs, especially thick copper It has become possible to interconnect a film carrier tape using a foil pattern and a wiring board with high resolution, strong adhesive strength, and high reliability.
第１図は、本発明の積層フィルム体の断面図である。第
２図は、本発明の積層フィルム体を用いて仮接続した時
の態様、第３図は本接続した時の態様をそれぞれ表わす
断面図である。第４図及び第５図は、それぞれ本発明の
積層フィルム体を用いて仮接続した時の別の態様を表わ
す断面図である。
第２図FIG. 1 is a sectional view of the laminated film body of the present invention. FIG. 2 is a sectional view showing a temporary connection using the laminated film body of the present invention, and FIG. 3 is a cross-sectional view showing a final connection. FIGS. 4 and 5 are cross-sectional views each showing another mode of temporary connection using the laminated film body of the present invention. Figure 2
Claims (5)
性で且つ異方導電性の第２フィルムとを接合させた積層
体構造を有することを特徴とする電気的接続のためのフ
ィルム体。(1) For electrical connection, characterized by having a laminate structure in which a first film that is heat-fusible and insulating and a second film that is heat-fusible and anisotropically conductive are bonded together. film body.
形成されている特許請求の範囲第１項記載のフィルム体
。(2) The film body according to claim 1, wherein the first film is formed of an insulating resin having heat-melting properties.
融性をもつ絶縁性樹脂で形成されている特許請求の範囲
第１項記載のフィルム体。(3) The film body according to claim 1, wherein the second film is formed of a heat-melting insulating resin containing a conductor dispersed therein.
形成され、第２フィルムが導電体を分散含有させた熱溶
融性をもつ絶縁性樹脂で形成されているとともに、該第
１フィルムと第２フィルムとを形成している絶縁性樹脂
が同一の樹脂である特許請求の範囲第１項記載のフィル
ム体。(4) The first film is formed of a heat-melting insulating resin, and the second film is made of a heat-melting insulating resin containing a conductor dispersed therein; The film body according to claim 1, wherein the insulating resins forming the first film and the second film are the same resin.
範囲第１項記載のフィルム体。(5) The film body according to claim 1, wherein the conductor is a metal or alloy particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62146371A JPS63310581A (en) | 1987-06-12 | 1987-06-12 | Film body for electric connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62146371A JPS63310581A (en) | 1987-06-12 | 1987-06-12 | Film body for electric connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63310581A true JPS63310581A (en) | 1988-12-19 |
Family
ID=15406205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62146371A Pending JPS63310581A (en) | 1987-06-12 | 1987-06-12 | Film body for electric connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63310581A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582934A (en) * | 1991-07-08 | 1993-04-02 | Alps Electric Co Ltd | Terminal connection structure, terminal connection method, manufacture of conductive particle, and manufacturing board |
| JPH0690082A (en) * | 1990-12-22 | 1994-03-29 | Sony Chem Corp | Method of connecting circuit substrate |
| JPH0918121A (en) * | 1995-06-27 | 1997-01-17 | S I I R D Center:Kk | Electronic component mounted body and production thereof |
| JP2002201438A (en) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | Adhesive composition, and connection method and connection structure of circuit terminal using the same |
| JP2007182062A (en) * | 2006-01-04 | 2007-07-19 | Ls Cable Ltd | Multilayered anisotropic electroconductive film |
| JP2008022037A (en) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | Connection member, connection structure of electrode using the same, and connection method |
| JP2008022036A (en) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | Connection member, connection structure of electrode using the same, and connection method |
| JP2008060084A (en) * | 2007-10-03 | 2008-03-13 | Hitachi Chem Co Ltd | Connecting member, and connection structure and connecting method of electrode using the connecting member |
| JP2008071748A (en) * | 2006-08-16 | 2008-03-27 | Sony Chemical & Information Device Corp | Connecting method |
| WO2009078409A1 (en) * | 2007-12-17 | 2009-06-25 | Hitachi Chemical Company, Ltd. | Circuit connecting material and structure for connecting circuit member |
| JP2010010142A (en) * | 2009-10-07 | 2010-01-14 | Hitachi Chem Co Ltd | Thermosetting circuit connection member and connection structure of electrode using it and connecting method of electrode |
| JP2011049175A (en) * | 2010-10-28 | 2011-03-10 | Sony Chemical & Information Device Corp | Connection method and connection structure for electronic component |
| JP2013045956A (en) * | 2011-08-25 | 2013-03-04 | Kyocera Corp | Wiring board and input device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54153676U (en) * | 1978-04-17 | 1979-10-25 | ||
| JPS60177891A (en) * | 1984-02-22 | 1985-09-11 | 松下電器産業株式会社 | Gripper for hollow part |
-
1987
- 1987-06-12 JP JP62146371A patent/JPS63310581A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54153676U (en) * | 1978-04-17 | 1979-10-25 | ||
| JPS60177891A (en) * | 1984-02-22 | 1985-09-11 | 松下電器産業株式会社 | Gripper for hollow part |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0690082A (en) * | 1990-12-22 | 1994-03-29 | Sony Chem Corp | Method of connecting circuit substrate |
| JPH0582934A (en) * | 1991-07-08 | 1993-04-02 | Alps Electric Co Ltd | Terminal connection structure, terminal connection method, manufacture of conductive particle, and manufacturing board |
| JPH0918121A (en) * | 1995-06-27 | 1997-01-17 | S I I R D Center:Kk | Electronic component mounted body and production thereof |
| JP2002201438A (en) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | Adhesive composition, and connection method and connection structure of circuit terminal using the same |
| JP4696360B2 (en) * | 2000-12-28 | 2011-06-08 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
| JP2007182062A (en) * | 2006-01-04 | 2007-07-19 | Ls Cable Ltd | Multilayered anisotropic electroconductive film |
| JP4513024B2 (en) * | 2006-01-04 | 2010-07-28 | エルジー イノテック カンパニー リミテッド | Multilayer anisotropic conductive film |
| JP2008071748A (en) * | 2006-08-16 | 2008-03-27 | Sony Chemical & Information Device Corp | Connecting method |
| JP2008060084A (en) * | 2007-10-03 | 2008-03-13 | Hitachi Chem Co Ltd | Connecting member, and connection structure and connecting method of electrode using the connecting member |
| JP2008022036A (en) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | Connection member, connection structure of electrode using the same, and connection method |
| JP2008022037A (en) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | Connection member, connection structure of electrode using the same, and connection method |
| WO2009078409A1 (en) * | 2007-12-17 | 2009-06-25 | Hitachi Chemical Company, Ltd. | Circuit connecting material and structure for connecting circuit member |
| JP4862944B2 (en) * | 2007-12-17 | 2012-01-25 | 日立化成工業株式会社 | Circuit connection material |
| JP2010010142A (en) * | 2009-10-07 | 2010-01-14 | Hitachi Chem Co Ltd | Thermosetting circuit connection member and connection structure of electrode using it and connecting method of electrode |
| JP2011049175A (en) * | 2010-10-28 | 2011-03-10 | Sony Chemical & Information Device Corp | Connection method and connection structure for electronic component |
| WO2012057227A1 (en) * | 2010-10-28 | 2012-05-03 | ソニーケミカル＆インフォメーションデバイス株式会社 | Method for connecting electronic part and connecting structure |
| JP2013045956A (en) * | 2011-08-25 | 2013-03-04 | Kyocera Corp | Wiring board and input device |
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