JP2007182062A - Multilayered anisotropic electroconductive film - Google Patents

Multilayered anisotropic electroconductive film Download PDF

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JP2007182062A
JP2007182062A JP2006274849A JP2006274849A JP2007182062A JP 2007182062 A JP2007182062 A JP 2007182062A JP 2006274849 A JP2006274849 A JP 2006274849A JP 2006274849 A JP2006274849 A JP 2006274849A JP 2007182062 A JP2007182062 A JP 2007182062A
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adhesive layer
electroconductive
conductive
anisotropic conductive
conductive film
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JP4513024B2 (en
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Sang Wook Woo
ウ，サンウ
Hyuk Soo Moon
ムン，ヒュクス
Chul Jong Han
ハン，チョルジョン
Yong Seok Han
ハン，ヨンセ
Jeong Beom Park
パク，ジェンベン
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LS Cable and Systems Ltd
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LS Cable Ltd
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    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F5/00—Sewerage structures
    • E03F5/02—Manhole shafts or other inspection chambers; Snow-filling openings; accessories
    • E03F5/021—Connection of sewer pipes to manhole shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

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  • Engineering & Computer Science (AREA)
  • Hydrology & Water Resources (AREA)
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  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayered anisotropic electroconductive film, which exhibits improved connection reliability, when members to be connected having electrodes facing each other are connected. <P>SOLUTION: The multilayered anisotropic electroconductive film includes a non-electroconductive adhesive layer composed of a first insulation adhesive, an electroconductive adhesive layer which is laminated on one side of the non-electroconductive adhesive layer and composed of, as the substrate, a second insulation adhesive having a curing speed faster than that of the first insulation adhesive and contains electroconductive particles dispersed in it and a release film attached to the opposite side of the non-electroconductive adhesive layer contacting with the electroconductive adhesive layer. The damage of the electrodes of the members to be connected due to heat is prevented and the pressurization on the electroconductive particles is improved by using the multilayered anisotropic electroconductive film because of its faster curing speed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、異方性導電フィルム（ＡＣＦ；Ａｎｉｓｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）に関し、より詳しくは、相互対向する電極を有する被接続部材を接続するために硬化速度の相異なる絶縁層を備えた多層異方性導電フィルムに関する。   The present invention relates to an anisotropic conductive film (ACF), and more particularly, to a multi-layer anisotropy having insulating layers having different curing speeds to connect connected members having electrodes facing each other. The present invention relates to a conductive film.

一般に、異方性導電フィルムは、被接続部材の材質が特殊であるか信号配線のピッチが細密であるため、部材と部材とをはんだ付け（ｓｏｌｄｅｒｉｎｇ）方式で取り付けられない場合に使う接続材料である。
このような異方性導電フィルムは、代表的にＬＣＤパネル、印刷回路基板（ＰＣＢ）、ドライバーＩＣ回路などをパッケージングする接続材料として使われる。
一例として、ＬＣＤモジュールにはＴＦＴ（Ｔｈｉｎ Ｆｉｌｍ Ｔｒａｎｓｉｓｔｏｒ）パターンを駆動させるために多数のドライバーＩＣが実装される。ドライバーＩＣを実装する方式は大別して、別途の構造物なくＬＣＤパネルのゲート領域及びデータ領域に実装する方式であるＣＯＧ（Ｃｈｉｐ ｏｎ ｇｌａｓｓ）マウント方式、ドライバーＩＣを搭載したＴＣＰ（Ｔａｐｅ ｃａｒｒｉｅｒ ｐａｃｋａｇｅ）を介してＬＣＤパネルのゲート領域及びデータ領域に間接的にドライバーＩＣを実装する方式であるＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）マウント方式に分けられる。
ところが、ドライバーＩＣ素子側の電極とＬＣＤパネル側の電極とは微小なピッチ間隔で形成されているため、いずれの実装方式を採用しても、はんだ付けなどの手段を使うことが困難である。これゆえに、ドライバーＩＣ側の電極とパネル側の電極とを電気的に接続する工程においては、異方性導電フィルムが主に使われる。 In general, anisotropic conductive film is a connection material used when the material of the connected member is special or the pitch of the signal wiring is fine, so that the member cannot be attached by soldering method. is there.
Such anisotropic conductive films are typically used as connection materials for packaging LCD panels, printed circuit boards (PCBs), driver IC circuits, and the like.
As an example, a large number of driver ICs are mounted on the LCD module in order to drive a TFT (Thin Film Transistor) pattern. The method for mounting the driver IC is roughly divided into a COG (Chip on glass) mounting method for mounting on the gate area and the data area of the LCD panel without a separate structure, and a TCP (Tape carrier package) with the driver IC mounted. In other words, it is divided into a TAB (Tape Automated Bonding) mounting method in which a driver IC is indirectly mounted on the gate region and the data region of the LCD panel.
However, since the electrode on the driver IC element side and the electrode on the LCD panel side are formed at a minute pitch interval, it is difficult to use means such as soldering regardless of which mounting method is employed. Therefore, an anisotropic conductive film is mainly used in the process of electrically connecting the driver IC side electrode and the panel side electrode.

図１を参照すれば、従来技術による異方性導電フィルム３０は絶縁性接着剤４０に導電粒子５０を分散させたものであって、被接続部材１０、２０の間に介在されて熱圧着される。これにより、図２に示されたように、導電粒子５０が対向する電極１１、２１の間に介在され、該電極１１、２１が電気的に相互繋がれて隣接する電極の間には絶縁性が保持される。すなわち、異方性導電フィルム３０によってｘ−ｙ平面上には絶縁性が保持され、ｚ軸方向には導電性が保持される。
微細ピッチで形成された電極を備えた被接続部材を接続させるにあたって、接続信頼性を改善させるための一方法として多層構造の異方性導電フィルムが使われる。多層構造の異方性導電フィルムは導電粒子が含有された導電性接着層と絶縁性接着剤層とで構成される。このとき、導電粒子が含有された層が絶縁性接着剤層より高粘度であるか、または、導電粒子が含有された層の溶融点を低める方法が使われる。
しかし、上記の方法は、硬化速度が遅くて被接続対象（例えば、ＩＣチップ）が熱によって損傷されるか、工程時間が延びるとの問題点があった。
このような問題点を改善するために、向上した硬化速度を有した異方性導電フィルムがある。このような異方性導電フィルムの場合、工程時間が短縮される長所はあるが、速い硬化速度のため導電性粒子が被接続対象の微細電極によって十分に押される前に樹脂が硬化し、接続状態が不良であるとの問題点があった。
特開平８−１０２２１８号公報 Referring to FIG. 1, an anisotropic conductive film 30 according to the prior art is obtained by dispersing conductive particles 50 in an insulating adhesive 40, and is interposed between members 10 and 20 to be thermocompression bonded. The As a result, as shown in FIG. 2, the conductive particles 50 are interposed between the opposing electrodes 11 and 21, and the electrodes 11 and 21 are electrically connected to each other so as to be insulative between adjacent electrodes. Is retained. That is, the anisotropic conductive film 30 retains insulation on the xy plane and retains conductivity in the z-axis direction.
A multi-layer anisotropic conductive film is used as a method for improving connection reliability when connecting a member to be connected having electrodes formed at a fine pitch. An anisotropic conductive film having a multilayer structure is composed of a conductive adhesive layer containing conductive particles and an insulating adhesive layer. At this time, a method is used in which the layer containing the conductive particles has a higher viscosity than the insulating adhesive layer, or the melting point of the layer containing the conductive particles is lowered.
However, the above-described method has a problem that the curing speed is slow and the connection target (for example, IC chip) is damaged by heat or the process time is extended.
In order to improve such a problem, there is an anisotropic conductive film having an improved curing rate. In the case of such an anisotropic conductive film, there is an advantage that the process time is shortened, but the resin cures before the conductive particles are sufficiently pushed by the microelectrodes to be connected due to the high curing speed, and the connection is made. There was a problem that the state was bad.
JP-A-8-102218

本発明は、上記のような問題点を解決するために創案されたものであり、微細電極を備えた被接続部材の接続において、向上した硬化速度を有することで被接続部材が熱によって損傷されることを防止すると同時に、接続信頼性を向上できる多層異方性導電フィルムを提供することにその目的がある。   The present invention was devised to solve the above-described problems, and in connecting a member to be connected with a fine electrode, the member to be connected is damaged by heat by having an improved curing speed. The object is to provide a multi-layer anisotropic conductive film that can prevent connection and improve connection reliability.

前記の目的を果たすための本発明による多層異方性導電フィルムは、第１絶縁性接着剤よりなる非導電性接着層と、非導電性接着層の一面に積層され、第１絶縁性接着剤に比べて相対的に速い硬化速度を有する第２絶縁性接着剤を基材にして導電粒子が分散した導電性接着層と、導電性接着層と接触する非導電性接着層の反対面に取り付けられた離型フィルムを含む。
望ましくは、前記第１絶縁性接着剤は熱硬化性樹脂（Ｔｈｅｒｍｏｓｅｔｔｉｎｇ ｒｅｓｉｎ）であり、前記第２絶縁性接着剤は熱可塑性樹脂（Ｔｈｅｒｍｏｐｌａｓｔｉｃ ｒｅｓｉｎ）である。 In order to achieve the above object, a multilayer anisotropic conductive film according to the present invention includes a non-conductive adhesive layer made of a first insulating adhesive and a first conductive adhesive layer laminated on one surface of the non-conductive adhesive layer. A conductive adhesive layer in which conductive particles are dispersed using a second insulating adhesive having a relatively high curing speed as compared with the above and a non-conductive adhesive layer in contact with the conductive adhesive layer. A release film.
Preferably, the first insulating adhesive is a thermosetting resin, and the second insulating adhesive is a thermoplastic resin.

本発明によれば、硬化速度の異なる樹脂層を用いて多層異方性導電フィルムを備えることで、相対的に硬化速度の遅い樹脂層の硬化が完了する間、被接続部材の電極の間に介在された導電粒子を效果的に十分に押圧できる。
また、相対的に硬化速度の速い樹脂層が含まれ、電極が熱によって損傷されることを防止すると同時に工程時間を短縮できる。 According to the present invention, by providing a multilayer anisotropic conductive film using resin layers having different curing speeds, while curing of a resin layer having a relatively slow curing speed is completed, between the electrodes of the connected member. The intervening conductive particles can be effectively pressed sufficiently.
In addition, a resin layer having a relatively high curing rate is included, so that the electrodes can be prevented from being damaged by heat, and at the same time, the process time can be shortened.

以下、添付された図面を参照して本発明の望ましい実施例を詳しく説明する。これに先立ち、本明細書及び請求範囲に使われた用語や単語は通常的や辞書的な意味に限定して解釈されてはならず、発明者は自らが発明をもっとも最善の方法で説明するために用語の概念を適切に定義できるという原則に則して本発明の技術的な思想に応ずる意味及び概念で解釈されねばならない。したがって、本明細書に記載された実施例及び図面に示された構成は、本発明のもっとも望ましい一実施例に過ぎず、本発明の技術的な思想をすべて代弁するものではないため、本出願の時点においてこれらを代替できる多様な均等物及び変形例があり得ることを理解せねばならない。   Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms and words used in the specification and claims should not be construed to be limited to ordinary or lexicographic meanings, and the inventor will describe the invention in the best possible manner. Therefore, it must be interpreted in the meaning and concept according to the technical idea of the present invention in accordance with the principle that the concept of the term can be appropriately defined. Accordingly, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. It should be understood that there are various equivalents and variations that can be substituted at this point.

図３は、本発明の望ましい実施例による多層異方性導電フィルムの構成を概略的に示した断面図である。
図３を参照すれば、本発明による多層異方性導電フィルムは、非導電性接着層１００、導電性接着層２００及び離型フィルム３００を含む。
前記非導電性接着層１００は、導電性のない第１絶縁性接着剤１１０よりなって、被接続部材（図示せず）の間を堅固に接着固定させる。また、非導電性接着層１００は多層異方性導電フィルムのｘ−ｙ平面上に絶縁性を保持させる機能を主に担う。
非導電性接着層１００は、第１絶縁性接着剤１１０及びこれを硬化させる硬化剤（図示せず）を含む。ここで、第１絶縁性接着剤１１０は熱硬化性樹脂であることが望ましい。熱硬化性樹脂は、分子量１０００以下の樹脂状物質に熱を加えるか、硬化剤を添加して硬化させたものである。 FIG. 3 is a cross-sectional view schematically illustrating the structure of a multilayer anisotropic conductive film according to a preferred embodiment of the present invention.
Referring to FIG. 3, the multilayer anisotropic conductive film according to the present invention includes a non-conductive adhesive layer 100, a conductive adhesive layer 200, and a release film 300.
The non-conductive adhesive layer 100 is made of a first insulating adhesive 110 having no conductivity, and firmly bonds and fixes between connected members (not shown). The nonconductive adhesive layer 100 mainly has a function of maintaining insulation on the xy plane of the multilayer anisotropic conductive film.
The non-conductive adhesive layer 100 includes a first insulating adhesive 110 and a curing agent (not shown) that cures the first insulating adhesive 110. Here, the first insulating adhesive 110 is preferably a thermosetting resin. The thermosetting resin is obtained by applying heat to a resinous material having a molecular weight of 1000 or less or adding a curing agent to cure.

例えば、熱硬化性樹脂としては、高分子量エポキシ樹脂または液状エポキシ樹脂を採用できる。エポキシ樹脂（Ｅｐｏｘｙ ｒｅｓｉｎ）は耐熱性、電気絶縁性にすぐれ、これと混合する硬化剤によって物性が大きく変わる。具体的に、エポキシ樹脂は接着性を生かして電気電子部品の接着剤として多く用いられる。しかし、本発明はこのような材質に限定されるものではなく、本発明の目的内で多様な変形例が採用できる。例えば、フェノール樹脂、尿素樹脂、メラミン樹脂（Ｍｅｌａｍｉｎ ｒｅｓｉｎ）などが使用できる。
前記第１絶縁性接着剤１１０よりなる非導電性接着層１００の厚さは１０ないし３０μｍが望ましい。
前記導電性接着層２００は、第２絶縁性接着剤２１０と、これを硬化させる硬化剤（図示せず）及び前記第２絶縁性接着剤２１０に分散した導電粒子２２０とを含む。このとき、第２絶縁性接着剤２００は前記第１絶縁性接着剤１００に比べて相対的に速い硬化速度を有する。
前記第２絶縁性接着剤２００は、ｘ−ｙ平面上で隣接する導電粒子２２０を相互離隔させる作用をする。したがって、微細な配線を有する基板において隣接する導電粒子２２０が相互接触してｘ−ｙ平面上の導通が生じることを防止する。ここで、第２絶縁性接着剤２１０は熱可塑性樹脂、例えば、アクリル樹脂であることが望ましい。しかし、本発明はこのような材質に限定されるものではなく、本発明の目的内で多様な変形例が採用できる。例えば、ポリエチレン、ポリプロピレン、塩化ビニル樹脂、ポリスチレンまたはこれらが混合されたポリマー樹脂などが使用できる。
熱可塑性樹脂は、加熱すれば軟化されて可塑性を呈するため多様な形状に成形が可能である。したがって、被接続部材の接触工程時、導電粒子が電極の間に介在され押圧されるのに望ましい。本実施例においては、第２絶縁性接着剤２１０としてアクリル樹脂を使う。アクリル樹脂は熱可塑性樹脂の一種類として、熱硬化性樹脂であるエポキシ樹脂に比べて硬化速度が速い。すなわち、エポキシ樹脂よりなった前記非導電性接着層１００より、アクリル樹脂よりなった前記導電性接着層２００が早く硬化される。よって、被接続部材の圧着工程時加えられる熱が、硬化速度の遅い非導電性接着層１００から硬化速度の速い導電性接着層２００へ伝達され、導電性接着層２００内に導電粒子２２０が十分に押圧された後、非導電性接着層１００の硬化が完了する。
前記導電粒子２２０は、第２絶縁性接着剤２１０、すなわち、アクリル樹脂内に分散して、被接続部材の電極を電気的に連結する。このために、導電粒子２２０は金、銀、銅、鉄、ニッケルまたはこれらの化合物の中から選択されたいずれか１つ以上の金属からなる。微細ピッチの電極を接触させるため、導電粒子２２０の直径は１ないし１５μｍが望ましい。しかし、本発明はこのような数値に限定されるものではなく、被接続部材の特性によって多様に変更できる。
前記第２絶縁性接着剤２１０よりなる導電性接着層２００の厚さは、５ないし２５μｍであることが望ましい。
前記離型フィルム３００は、前記導電性接着層２００と接触する前記非導電性接着層１００の反対面に取り付けられる。離型フィルム３００は、異方性導電フィルムが接続部材として使われる前の保管状態を安定的に保持するためのフィルムである。一般に、離型処理されたＰＥＴフィルムを使う。
一方、本発明のさらに具体的な実験例を説明することで本発明をさらに詳細に説明する。しかし、本発明は下記の実験例に限定されるものではなく、特許請求の範囲内で多様な形態の実施例が具現できる。 For example, a high molecular weight epoxy resin or a liquid epoxy resin can be adopted as the thermosetting resin. Epoxy resin is excellent in heat resistance and electrical insulation, and its physical properties vary greatly depending on the curing agent mixed therewith. Specifically, epoxy resins are often used as adhesives for electrical and electronic parts by making use of adhesiveness. However, the present invention is not limited to such materials, and various modifications can be employed within the scope of the present invention. For example, phenol resin, urea resin, melamine resin, etc. can be used.
The thickness of the non-conductive adhesive layer 100 made of the first insulating adhesive 110 is preferably 10 to 30 μm.
The conductive adhesive layer 200 includes a second insulating adhesive 210, a curing agent (not shown) that cures the second insulating adhesive 210, and conductive particles 220 dispersed in the second insulating adhesive 210. At this time, the second insulating adhesive 200 has a relatively fast curing rate as compared with the first insulating adhesive 100.
The second insulating adhesive 200 acts to separate the adjacent conductive particles 220 on the xy plane. Therefore, the conductive particles 220 adjacent to each other on the substrate having fine wiring are prevented from contacting each other and conducting on the xy plane is prevented. Here, the second insulating adhesive 210 is preferably a thermoplastic resin, for example, an acrylic resin. However, the present invention is not limited to such materials, and various modifications can be employed within the scope of the present invention. For example, polyethylene, polypropylene, vinyl chloride resin, polystyrene, or a polymer resin in which these are mixed can be used.
Thermoplastic resins can be molded into various shapes because they are softened when heated and exhibit plasticity. Therefore, it is desirable that the conductive particles are interposed and pressed between the electrodes during the contact process of the connected member. In this embodiment, an acrylic resin is used as the second insulating adhesive 210. An acrylic resin is a kind of thermoplastic resin, and has a faster curing speed than an epoxy resin that is a thermosetting resin. That is, the conductive adhesive layer 200 made of acrylic resin is hardened more quickly than the nonconductive adhesive layer 100 made of epoxy resin. Therefore, heat applied during the crimping process of the connected member is transmitted from the non-conductive adhesive layer 100 having a low curing speed to the conductive adhesive layer 200 having a high curing speed, and the conductive particles 220 are sufficiently contained in the conductive adhesive layer 200. After being pressed, the curing of the nonconductive adhesive layer 100 is completed.
The conductive particles 220 are dispersed in the second insulating adhesive 210, that is, acrylic resin, to electrically connect the electrodes of the connected members. For this, the conductive particles 220 are made of one or more metals selected from gold, silver, copper, iron, nickel, or a compound thereof. The diameter of the conductive particles 220 is preferably 1 to 15 μm in order to contact the fine pitch electrodes. However, the present invention is not limited to such numerical values, and can be variously changed according to the characteristics of the connected member.
The thickness of the conductive adhesive layer 200 made of the second insulating adhesive 210 is preferably 5 to 25 μm.
The release film 300 is attached to the opposite surface of the non-conductive adhesive layer 100 that contacts the conductive adhesive layer 200. The release film 300 is a film for stably holding the storage state before the anisotropic conductive film is used as the connection member. Generally, a PET film that has been subjected to a release treatment is used.
On the other hand, the present invention will be described in more detail by explaining more specific experimental examples of the present invention. However, the present invention is not limited to the following experimental examples, and various embodiments can be implemented within the scope of the claims.

［実施例］
図４に示されたように、エポキシ樹脂とイミダゾール誘導体エポキシ化合物とでなった潜在性硬化剤よりなった非導電性接着層１００を１２μｍの厚さに作製し、アクリル樹脂２１０とペロキサイド硬化剤とを基材にして導電粒子２２０が分散した導電性接着層２００を１３μｍの厚さに作製した。そして、非導電性接着層１００及び導電性接着層２００をゴムロールを用いて圧延し、２つの層が積層された多層異方性導電フィルム１を作製した。その後、前記多層異方性導電フィルム１を被接続部材４００、５００の間に介在させ、１８０℃で３ＭＰａの圧力を加えて７秒間圧着した。 [Example]
As shown in FIG. 4, a non-conductive adhesive layer 100 made of a latent curing agent made of an epoxy resin and an imidazole derivative epoxy compound was made to a thickness of 12 μm, and an acrylic resin 210, a peroxide curing agent, The conductive adhesive layer 200 in which the conductive particles 220 are dispersed with the substrate as a base material was formed to a thickness of 13 μm. And the non-conductive adhesive layer 100 and the conductive adhesive layer 200 were rolled using the rubber roll, and the multilayer anisotropic conductive film 1 by which two layers were laminated | stacked was produced. Thereafter, the multilayer anisotropic conductive film 1 was interposed between the members to be connected 400 and 500, and a pressure of 3 MPa was applied at 180 ° C. for 7 seconds.

［比較例］
図５に示されたように、ラジカル硬化樹脂６１０を基材にして導電粒子６２０が分散した単層異方性導電フィルム２を２５μｍの厚さに作製した。そして、単層異方性導電フィルム２を被接続部材４００、５００の間に介在させ、１８０℃で３ＭＰａの圧力を加えて７秒間圧着した。
前記実験例によって製造されたそれぞれのサンプルに対し、導電性粒子の押圧状態及び接続信頼性を測定した。
１．導電性粒子の押圧状態
被接続部材４００、５００の間に多層または単層異方性導電フィルム１、２を介在させて圧着したサンプルを３００ないし１０００倍の光学顕微鏡を用いて各バンプに残留する導電粒子２２０、６２０の押圧特性を肉眼観察した。
２．接続信頼性
多層または単層異方性導電フィルム１、２で接着された被接続部材４００、５００の電極４１０、５１０間接続抵抗をマルチメータ（ｍｕｌｔｉｍｅｔｅｒ）を用いて測定した。このとき、接続抵抗が１Ω以下であれば、「接続状態良好」、それ以上であれば「接続状態不良」と判断した。 [Comparative example]
As shown in FIG. 5, a single-layer anisotropic conductive film 2 in which conductive particles 620 were dispersed using a radical curable resin 610 as a base material was formed to a thickness of 25 μm. And the single layer anisotropic conductive film 2 was interposed between the to-be-connected members 400 and 500, the pressure of 3 MPa was applied at 180 degreeC, and it crimped | bonded for 7 seconds.
The pressed state of the conductive particles and the connection reliability were measured for each sample manufactured according to the experimental example.
1. Pressed state of conductive particles A sample, which is pressure-bonded with multilayer or single-layer anisotropic conductive films 1 and 2 interposed between the connected members 400 and 500, remains on each bump using an optical microscope of 300 to 1000 times. The pressing characteristics of the conductive particles 220 and 620 were visually observed.
2. Connection reliability The connection resistance between the electrodes 410 and 510 of the members to be connected 400 and 500 bonded by the multilayer or single-layer anisotropic conductive films 1 and 2 was measured using a multimeter. At this time, if the connection resistance was 1Ω or less, it was determined that “the connection state was good”, and if it was more than that, “the connection state was bad”.

下記の表１は前記実験例によって観察された導電性粒子の押圧状態及び被接続部材の電極間接続抵抗についての判定結果である。   Table 1 below shows the determination results of the pressed state of the conductive particles and the interelectrode connection resistance of the connected member observed in the experimental example.

Figure 2007182062
Figure 2007182062

表１を参照すれば、実施例の場合、硬化速度の異なる２種類の樹脂よりなる層を用いることで、熱圧着時、硬化速度が相対的に遅い樹脂層から硬化速度が相対的に速い樹脂層へ熱が伝達され、硬化速度が遅い樹脂層の硬化が完了する以前に被接続部材の電極の間に介在された導電粒子が十分に押圧された（図４のｃ参照）。これによって電極間接続抵抗も小さかった。
一方、比較例の場合、硬化速度の速い樹脂層だけが形成された場合、被接続部材の電極の間に介在された導電粒子が加圧される前に、樹脂層の硬化がすでに完了して電極と導電粒子間に間隙が生じ（図５のｃ参照）、これにより接続抵抗が大きかった。
したがって、硬化速度の速い樹脂層だけよりなった異方性導電フィルムより硬化速度の相異なる樹脂層よりなった多層異方性導電フィルムが、導電粒子の押圧状態を改善させるのに效果的であることが分かる。
以上のように、本発明は限定された実施例及び図面によって説明されたが、本発明は、これによって限定されず、当業者によって本発明の技術的思想及び特許請求の範囲の均等範囲内で多様な修正及び変形が可能であることは言うまでもない。 Referring to Table 1, in the case of the example, by using a layer made of two types of resins having different curing rates, a resin having a relatively fast curing rate from a resin layer having a relatively slow curing rate during thermocompression bonding. Heat was transferred to the layer, and the conductive particles interposed between the electrodes of the connected member were sufficiently pressed before the curing of the resin layer having a slow curing rate was completed (see c in FIG. 4). As a result, the interelectrode connection resistance was also small.
On the other hand, in the case of the comparative example, when only the resin layer having a high curing speed is formed, the curing of the resin layer is already completed before the conductive particles interposed between the electrodes of the connected member are pressed. A gap was generated between the electrode and the conductive particles (see c in FIG. 5), and thereby the connection resistance was large.
Therefore, a multilayer anisotropic conductive film made of a resin layer having a different curing rate is more effective in improving the pressing state of the conductive particles than an anisotropic conductive film made only of a resin layer having a high curing rate. I understand that.
As described above, the present invention has been described with reference to the limited embodiments and drawings. However, the present invention is not limited thereto, and those skilled in the art can within the technical scope of the present invention and the scope of claims. It goes without saying that various modifications and variations are possible.

本明細書に添付される次の図面は、本発明の望ましい実施例を例示するものであり、発明の詳細な説明とともに本発明の技術的な思想をさらに理解させる役割をするため、本発明は図面に記載された事項だけに限定されて解釈されてはならない。
一般の異方性導電フィルムが被接続部材の間に介在された様子を示した断面図である。 一般の異方性導電フィルムを用いて被接続部材を接続させる様子を示した断面図である。 本発明の望ましい実施例に係る多層異方性導電フィルムを示した断面図である。 本発明の実施例に係る多層異方性導電フィルムを用いて被接続部材を接続させる様子を示した断面図である。 従来技術に係る単層異方性導電フィルムを用いて被接続部材を接続させる様子を示した断面図である。 The following drawings attached to the specification illustrate preferred embodiments of the present invention, and together with the detailed description, serve to further understand the technical idea of the present invention. It should not be construed as being limited to the matters described in the drawings.
It is sectional drawing which showed a mode that the general anisotropic conductive film was interposed between to-be-connected members. It is sectional drawing which showed a mode that a to-be-connected member was connected using a general anisotropic conductive film. 1 is a cross-sectional view illustrating a multilayer anisotropic conductive film according to a preferred embodiment of the present invention. It is sectional drawing which showed a mode that a to-be-connected member was connected using the multilayer anisotropic conductive film which concerns on the Example of this invention. It is sectional drawing which showed a mode that a to-be-connected member was connected using the single layer anisotropic conductive film which concerns on a prior art.

符号の説明Explanation of symbols

１００ 非導電性接着層
１１０ 第１絶縁性接着剤
２００ 導電性接着層
２１０ 第２絶縁性接着剤
２２０ 導電粒子
３００ 離型フィルム DESCRIPTION OF SYMBOLS 100 Nonelectroconductive adhesive layer 110 1st insulating adhesive 200 Conductive adhesive layer 210 2nd insulating adhesive 220 Conductive particle 300 Release film

Claims (4)

第１絶縁性接着剤よりなる非導電性接着層と、
前記非導電性接着層の一面に積層され、前記第１絶縁性接着剤に比べて相対的に速い硬化速度を有する第２絶縁性接着剤を基材にして導電粒子が分散した導電性接着層と、
前記導電性接着層と接触する前記非導電性接着層の反対面に取り付けられた離型フィルムと、を含む多層異方性導電フィルム。 A non-conductive adhesive layer made of a first insulating adhesive;
A conductive adhesive layer in which conductive particles are dispersed using a second insulating adhesive as a base material, which is laminated on one surface of the nonconductive adhesive layer and has a relatively fast curing rate compared to the first insulating adhesive. When,
A multilayer anisotropic conductive film comprising: a release film attached to an opposite surface of the non-conductive adhesive layer in contact with the conductive adhesive layer. 前記第１絶縁性接着剤は、熱硬化性樹脂であることを特徴とする請求項１に記載の多層異方性導電フィルム。   The multilayer anisotropic conductive film according to claim 1, wherein the first insulating adhesive is a thermosetting resin. 前記第２絶縁性接着剤は、熱可塑性樹脂であることを特徴とする請求項１に記載の多層異方性導電フィルム。   The multilayer anisotropic conductive film according to claim 1, wherein the second insulating adhesive is a thermoplastic resin. 前記導電性粒子は、金、銀、鉄、銅、ニッケル及びこれらの混合物からなる群より選択されたいずれか１つであることを特徴とする請求項１ないし請求項３のいずれか１項に記載の多層異方性導電フィルム。   The conductive particles according to any one of claims 1 to 3, wherein the conductive particles are any one selected from the group consisting of gold, silver, iron, copper, nickel, and a mixture thereof. The multilayer anisotropic conductive film as described.
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