JPH07111379A - Multi-chip module packaging type printed wiring board - Google Patents
Multi-chip module packaging type printed wiring boardInfo
- Publication number
- JPH07111379A JPH07111379A JP25413993A JP25413993A JPH07111379A JP H07111379 A JPH07111379 A JP H07111379A JP 25413993 A JP25413993 A JP 25413993A JP 25413993 A JP25413993 A JP 25413993A JP H07111379 A JPH07111379 A JP H07111379A
- Authority
- JP
- Japan
- Prior art keywords
- chip module
- wiring board
- printed wiring
- electrode
- module substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、単一基板上に複数個の
チップ状半導体集積回路（ＩＣチップ等）を高密度に搭
載配置して構成されるマルチチップモジュールを、プリ
ント配線板上に実装したマルチチップモジュール実装型
プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-chip module constructed by mounting a plurality of chip-shaped semiconductor integrated circuits (IC chips, etc.) on a single substrate at high density on a printed wiring board. The present invention relates to a mounted multi-chip module mounting type printed wiring board.
【０００２】[0002]
【従来の技術】従来より電子機器の超小型化や回路のデ
ジタル化、あるいはそれに伴う半導体集積回路（ＬＳ
Ｉ）の多用化の進展に対応するため、複数個のＩＣチッ
プ等の半導体集積回路を１つの小サイズのモジュール用
リジット型基板（モジュール用硬質基板）上に搭載して
高密度に実装し、１つの機能ブロックを実現するリジッ
ト基板型のマルチチップモジュール（ＭＣＭ）が実用化
されており、このようなマルチチップモジュール（以下
マルチチップモジュール基板と称す）によって、所謂１
つの大規模な半導体集積回路が形成でき、小サイズなが
ら高密度で大規模な半導体集積回路を実現化できるメリ
ットがある。2. Description of the Related Art Conventionally, the miniaturization of electronic equipment, the digitization of circuits, or the accompanying semiconductor integrated circuit (LS)
In order to cope with the progress of the I) in the widespread use, a plurality of semiconductor chips such as IC chips are mounted on one small-sized rigid board for module (hard board for module) and mounted at high density. A rigid board type multi-chip module (MCM) that realizes one functional block has been put into practical use. With such a multi-chip module (hereinafter referred to as a multi-chip module board), a so-called 1
Two large-scale semiconductor integrated circuits can be formed, and there is an advantage that a large-scale semiconductor integrated circuit can be realized with a small size and high density.
【０００３】例えば、上記従来のマルチチップモジュー
ルとしては、複数個のＩＣチップ等のチップ状半導体集
積回路をリードフレームのアイランド部に搭載したマル
チチップモジュール基板上に、ＩＣチップとマルチチッ
プモジュール基板のそれぞれの電極部、及びリードフレ
ームのインナーリード部とマルチチップモジュール基板
の外部端子部とを、金線（ワイヤー）を用いてボンディ
ング加工して電気的に接続した後に、その周囲を樹脂モ
ールド成形加工した構造の脚状の複数本の外部端子（リ
ード端子）を側部に備えた樹脂モールド型のマルチチッ
プモジュールがある。For example, as the above-mentioned conventional multi-chip module, an IC chip and a multi-chip module substrate are mounted on a multi-chip module substrate on which chip-shaped semiconductor integrated circuits such as IC chips are mounted on an island portion of a lead frame. Each electrode part, the inner lead part of the lead frame, and the external terminal part of the multi-chip module substrate are bonded and electrically connected by using a gold wire (wire), and then the periphery thereof is molded with resin. There is a resin-molded multi-chip module having a plurality of leg-shaped external terminals (lead terminals) of the above structure on its side part.
【０００４】また、その他に従来のマルチチップモジュ
ールとしては、マルチチップモジュールをさらに高密度
化するために、複数個のＩＣチップそのものを、小型の
マルチチップモジュール用ベース基板（単層若しくは多
層配線パターン、表面電極、表面外部端子等を備えた通
常のプリント配線板と同様の構造のリジット型基板）上
に直接搭載して、該ベース基板表面の電極部及び外部端
子部と各々ＩＣチップの電極部とを電気的に接続固定す
ることによって、マルチチップモジュール用ベース基板
表面の電極部や外部端子部の形成可能面積を拡げ、該ベ
ース基板表面に電極部や外部端子部をより多く形成でき
るようにした基板搭載型のマルチチップモジュールがあ
る。In addition, as a conventional multi-chip module, in order to further increase the density of the multi-chip module, a plurality of IC chips themselves are used as a small base substrate for a multi-chip module (single layer or multilayer wiring pattern). , A surface type electrode, a surface type external terminal and the like, which is mounted on a rigid type substrate having a structure similar to that of a normal printed wiring board, and the electrode part and the external terminal part on the surface of the base substrate and the electrode part of each IC chip. By electrically connecting and fixing and, it is possible to expand the formable area of the electrodes and external terminals on the surface of the base substrate for the multi-chip module, so that more electrodes and external terminals can be formed on the surface of the base substrate. There is a board-mounted multi-chip module.
【０００５】[0005]
【発明が解決しようとする課題】近年においては、上記
マルチチップモジュールをさらに高密度化あるいは超高
密度化することが要求されるようになったが、マルチチ
ップモジュールをさらに高密度化あるいは超高密度化す
るために、マルチチツプモジュール用ベース基板上に配
置するＩＣチップの個数を増加して搭載密度を上げた場
合は、それに対応して、マルチチップモジュール用ベー
ス基板表面の電極部や外部端子部の形成面積が狭くな
り、自ずと該ベース基板における単位面積当たりの電極
部や外部端子部の形成密度が高くなってパターン設計の
ための自由度が低減し、パターンエッチング精度の関係
から必要とする電極部や外部端子部の形成が不可能にな
り、マルチチップモジュール用ベース基板表面に搭載可
能なＩＣチップの集積個数に限界が生じるものである。In recent years, it has been required to further densify the above-mentioned multi-chip module into a higher density or ultra-high density. When the mounting density is increased by increasing the number of IC chips arranged on the multi-chip module base substrate in order to increase the density, the electrode portion or the external terminal on the surface of the multi-chip module base substrate is correspondingly correspondingly increased. The formation area of the parts is narrowed, the formation density of the electrode parts and the external terminal parts per unit area of the base substrate is naturally increased, and the degree of freedom for pattern design is reduced. Since it is impossible to form electrodes and external terminals, a collection of IC chips can be mounted on the surface of the base substrate for multichip modules. Number to those that limit occurs.
【０００６】本発明は、マルチチップモジュール実装型
プリント配線板において、マルチチップモジュール用ベ
ース基板表面に搭載可能なＩＣチップの集積個数を現状
よりも増やして、マルチチップモジュール基板をさらに
高密度化できるようにするとともに、高密度の接続端子
を有するマルチチップモジュール基板とプリント配線板
との接続固定構造を改良して、パターン設計のための自
由度の低減を防ぎ、より高密度のマルチチップモジュー
ル基板をプリント配線板に実装することを可能にするこ
とにある。According to the present invention, in a multi-chip module mounting type printed wiring board, the number of integrated IC chips that can be mounted on the surface of a multi-chip module base substrate can be increased from the current level, and the multi-chip module substrate can be further densified. In addition, by improving the connection and fixing structure between the multi-chip module board having high-density connection terminals and the printed wiring board, it is possible to prevent a reduction in the degree of freedom for pattern design and to achieve a higher-density multi-chip module board. Is to be mounted on a printed wiring board.
【０００７】[0007]
【課題を解決するための手段】本発明は、プリント配線
板１上にマルチチップモジュール基板２が実装固定され
たマルチチップモジュール実装型プリント配線板におい
て、プリント配線板１とマルチチップモジュール基板２
との間に設けられた接着材層３に、前記プリント配線板
１表面の電極４と互いに対向するマルチチップモジュー
ル基板２裏面の電極５とを繋ぐ導通孔７が貫設され、該
導通孔７内に前記電極４，５を電気的に接続する導電材
８が充填されていることを特徴とするマルチチップモジ
ュール実装型プリント配線板である。The present invention provides a multi-chip module mounting type printed wiring board in which a multi-chip module board 2 is mounted and fixed on a printed wiring board 1, the printed wiring board 1 and the multi-chip module board 2 being provided.
A conductive hole 7 for connecting the electrode 4 on the front surface of the printed wiring board 1 and the electrode 5 on the rear surface of the multi-chip module substrate 2 facing each other is formed through the adhesive layer 3 provided between the conductive hole 7 and A multi-chip module mounting type printed wiring board is characterized in that a conductive material 8 for electrically connecting the electrodes 4 and 5 is filled therein.
【０００８】[0008]
【実施例】本発明のマルチチップモジュール実装型プリ
ント配線板を、図１の一実施例に従って詳細に説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multi-chip module mounting type printed wiring board of the present invention will be described in detail with reference to one embodiment of FIG.
【０００９】図１に示すように、プリント配線板１はそ
の表面に複数の電極４が設けられ、その他に単層の通電
パターン等、あるいはその配線板１内部に多層に亘って
通電パターン等を備えており、またその配線板表面に１
個乃至複数個のマルチチップモジュール基板２が重ね合
わせ搭載されている。As shown in FIG. 1, a printed wiring board 1 is provided with a plurality of electrodes 4 on the surface thereof, and in addition, a single layer energization pattern or the like, or a multi-layered energization pattern within the wiring board 1 is provided. Equipped, and 1 on the surface of the wiring board
One or a plurality of multi-chip module substrates 2 are stacked and mounted.
【００１０】マルチチップモジュール基板２は、その表
面に１個乃至複数個（マルチ）のＩＣチップ６（６ａ，
６ｂ，６ｃ・・・の半導体集積回路；ＬＳＩ）が搭載さ
れ、またマルチチップモジュール基板２表面の該ＩＣチ
ップ６外側周辺には必要に応じて外部端子部（図示せ
ず）が設けられ、またマルチチップモジュール基板２裏
面（重ね合わせ内面）には、前記プリント配線板１の電
極４と対向する位置に複数の電極５が設けられ、マルチ
チップモジュール基板２裏面側の該電極５と、表面側の
ＩＣチップ６とは互いに基板２内部の通電部（図示せ
ず）を介して電気的に導通状態を形成している。なお、
図１に示す一実施例では、プリント配線板１上に、１個
のマルチチップモジュール基板２が実装固定され、該マ
ルチチップモジュール基板２上には２個のＩＣチップ６
（６ａ，６ｂ）が搭載されている。On the surface of the multi-chip module substrate 2, one or more (multi) IC chips 6 (6a,
6b, 6c ... Semiconductor integrated circuits (LSIs) are mounted, and external terminal portions (not shown) are provided around the outer side of the IC chip 6 on the surface of the multi-chip module substrate 2, if necessary. A plurality of electrodes 5 are provided on the back surface of the multi-chip module substrate 2 (inner surface of the stacking) at positions facing the electrodes 4 of the printed wiring board 1, and the electrodes 5 on the back surface side of the multi-chip module substrate 2 and the front surface side. The IC chip 6 and the IC chip 6 are electrically connected to each other via a current-carrying portion (not shown) inside the substrate 2. In addition,
In one embodiment shown in FIG. 1, one multichip module substrate 2 is mounted and fixed on a printed wiring board 1, and two IC chips 6 are mounted on the multichip module substrate 2.
(6a, 6b) are mounted.
【００１１】プリント配線板１表面のマルチチップモジ
ュール基板２外側周辺部には、部分的にプリント配線板
１側の外部端子部（図示せず）を備えてもよい。An external terminal portion (not shown) on the printed wiring board 1 side may be partially provided on the outer peripheral portion of the multi-chip module substrate 2 on the surface of the printed wiring board 1.
【００１２】また、本発明のマルチチップモジュール実
装型プリント配線板は、プリント配線板１表面に凹部状
のピットを設け、該ピット内底面に前記電極４を設け、
該ピット内にマルチチップモジュール基板２がその裏面
の電極５と対応するように嵌合されているマルチチップ
モジュール嵌合実装型であってもよく、その場合プリン
ト配線板１表面とマルチチップモジュール基板２表面と
は互いにほぼ同一面を形成していることが適当である。In the multi-chip module mounting type printed wiring board of the present invention, recessed pits are provided on the surface of the printed wiring board 1, and the electrodes 4 are provided on the bottom surface inside the pits.
It may be a multi-chip module fitting mounting type in which the multi-chip module substrate 2 is fitted in the pit so as to correspond to the electrode 5 on the back surface thereof, in which case the surface of the printed wiring board 1 and the multi-chip module substrate. It is suitable that the two surfaces are substantially flush with each other.
【００１３】図１に示すように、プリント配線板１表面
とマルチチップモジュール基板２裏面は互いに電気的に
絶縁性の接着材層３を介して接合固定されており、該接
着材層３は、その層厚方向に対向する前記電極４，５を
繋ぐ位置に孔設部７が貫設され、貫設された前記孔設部
７内には、導電材８がほぼ密に充填されており、該導電
材８によって前記電極４，５は互いに電気的に接続され
ているものである。また、図示しないがプリント配線板
１表面のマルチチップモジュール基板２外側に外部端子
部、マルチチップモジュール基板２表面に外部端子部を
備えている場合には、互いの両外部端子部を、適宜ＴＡ
Ｂシート、リード線、金線ワイヤーボンド等の外部結線
部を用いて通電可能に接続してもよい。As shown in FIG. 1, the front surface of the printed wiring board 1 and the rear surface of the multi-chip module substrate 2 are bonded and fixed to each other through an electrically insulating adhesive layer 3, and the adhesive layer 3 is A holed portion 7 is provided at a position connecting the electrodes 4 and 5 facing each other in the layer thickness direction, and a conductive material 8 is substantially densely filled in the penetrated holed portion 7. The electrodes 4 and 5 are electrically connected to each other by the conductive material 8. Further, although not shown, when the external terminal portion is provided outside the multi-chip module substrate 2 on the surface of the printed wiring board 1 and the external terminal portion is provided on the surface of the multi-chip module substrate 2, both external terminal portions are appropriately connected to each other.
You may connect so that it can energize using external connection parts, such as a B sheet, a lead wire, and a gold wire wire bond.
【００１４】なお、ＴＡＢシートは、薄いプラスチック
シート（ポリイミド樹脂フィルム）の表面に、予め薄膜
導電性材料を用いてフォトエッチング法等により適宜形
状パターンの通電パターンを形成し、該通電パターンう
ちの適宜外部端子部分をそのシート裏面側に露呈される
ためにシート端縁部より突出させたり、シートに適宜形
状（矩形状等）の窓孔部を形成した連続シート状、小片
シート状、リング状等の配線用部材、結線用部材であ
り、該通電パターン上には、絶縁保護するための適宜形
状パターンのソルダーレジスト膜（絶縁膜）等が形成さ
れているものである。In the TAB sheet, a thin plastic sheet (polyimide resin film) is preliminarily formed with a conductive pattern of a shape pattern by a photo-etching method using a thin film conductive material, and the conductive pattern is appropriately selected. The external terminal portion is exposed to the back side of the sheet so that it protrudes from the edge of the sheet, or the sheet is formed with a window hole of an appropriate shape (rectangular shape, etc.), continuous sheet shape, small piece sheet shape, ring shape, etc. The wiring member and the wiring member, in which a solder resist film (insulating film) or the like having an appropriate shape pattern for insulating protection is formed on the energizing pattern.
【００１５】前記プリント配線板１はその表面に複数の
電極４（パッド電極部）等の通電パターンが形成され、
１乃至複数枚の積層された内層板と、その表裏外側に積
層された外層板から構成されて単層若しくは多層の適宜
形状パターンのパターン配線部、外層板の表面に複数の
前記電極４（パッド電極部）を含む通電パターン、外部
端子部（リード端子部）等の通電パターンが形成された
基板（例えば３００ｍｍ角〜５００ｍｍ角程度）であ
り、また、該プリント配線板１には、該内層板あるいは
外層板の片面若しくは両面に形成された互いに相対する
表裏側のそれぞれ通電パターン層を適宜通電接続させる
ためのスルーホール等が形成されている。On the surface of the printed wiring board 1, a plurality of electrodes 4 (pad electrode portions) and other current-carrying patterns are formed.
A single-layered or multi-layered pattern wiring portion having an appropriately shaped pattern, which is composed of one to a plurality of laminated inner layer plates and outer layer plates laminated on the front and back sides thereof, and a plurality of the electrodes 4 (pads) on the surface of the outer layer plate. A substrate (for example, about 300 mm square to 500 mm square) on which an energization pattern including an electrode part and an energization pattern such as an external terminal part (lead terminal part) is formed, and the printed wiring board 1 includes the inner layer board. Alternatively, through holes and the like are formed on one surface or both surfaces of the outer layer plate for appropriately electrically connecting electrically conductive pattern layers on the front and back sides facing each other.
【００１６】マルチチップモジュール基板２は、プリン
ト配線板１と同様にその基板２表面に若しくは表裏面に
外部端子部を含む単層の配線パターン、若しくはその基
板２内部に多層の配線パターンを備え、その基板２裏面
に複数の電極５（パッド電極部）等の形成された小片
状、チップ状（ＩＣチップより大きいサイズの例えば２
０ｍｍ角〜５０ｍｍ角、厚さ２ｍｍ程度）の薄いリジッ
ト型基板（硬質性の基板）であり、その基板２表面に複
数個のＩＣチップ等の集積回路６ａ，６ｂ，６ｃ・・・
を搭載し、その基板２表面の外部端子部と金バンプ若し
くは金ワイヤーボンディングにて接続して高密度に搭載
したものである。Like the printed wiring board 1, the multi-chip module substrate 2 is provided with a single-layer wiring pattern including external terminal portions on the front surface or the back surface of the substrate 2, or a multilayer wiring pattern inside the substrate 2. On the back surface of the substrate 2, a plurality of electrodes 5 (pad electrode portions) and the like are formed in a small piece shape, a chip shape (for example, 2
It is a thin rigid type substrate (hard substrate) having a size of 0 mm square to 50 mm square and a thickness of about 2 mm, and integrated circuits 6a, 6b, 6c ...
Is mounted and connected to external terminal portions on the surface of the substrate 2 by gold bumps or gold wire bonding, and mounted at high density.
【００１７】また前記プリント配線板１の複数個の電極
４（パッド電極部）と、それに対応するマルチチップモ
ジュール基板２の複数個の電極部５（パッド電極部）と
は、接着材層３に貫設した孔設部７内に充填された導電
材８に接触状態で通電可能に接続され、互いに接着材層
３によって接着固定されている。A plurality of electrodes 4 (pad electrode portions) of the printed wiring board 1 and a plurality of electrode portions 5 (pad electrode portions) of the multichip module substrate 2 corresponding to the electrodes 4 are formed on the adhesive layer 3. The conductive material 8 filled in the penetrating hole portion 7 is electrically connected to the conductive material 8 in a contact state, and is adhesively fixed to each other by the adhesive material layer 3.
【００１８】上記孔設部７内に充填される導電材８とし
ては、バンプ（金又は半田等）あるいは金ペースト等の
導電性ペースト、又は金属製のフィルム状箔の小片ある
いは異方性導電樹脂フィルムの小片（フィルムの膜厚方
向にのみ通電性のある導電性樹脂フィルムの小片）等が
用いられる。The conductive material 8 to be filled in the hole 7 is a conductive paste such as bump (gold or solder) or gold paste, or a small piece of metal film foil or an anisotropic conductive resin. A small piece of a film (a small piece of a conductive resin film having electrical conductivity only in the film thickness direction) is used.
【００１９】次に、本発明のマルチチップモジュール実
装型プリント配線板の実装工程を図２（ａ）〜（ｃ）の
側断面図に従って説明する。まず、図２（ａ）に示すよ
うに、複数の電極４が形成されたプリント配線板１表面
に、実装すべきマルチチップモジュール基板２の実装領
域に亘って、接着剤３ａをロールコート法、エクストル
ーダー法、印刷法、若しくは接着性フィルム転写法、接
着性フィルムラミネート法等によって均一に塗布若しく
は被覆する。Next, a mounting process of the multi-chip module mounting type printed wiring board of the present invention will be described with reference to side sectional views of FIGS. First, as shown in FIG. 2A, the adhesive 3a is roll-coated on the surface of the printed wiring board 1 having the plurality of electrodes 4 over the mounting area of the multichip module substrate 2 to be mounted, It is uniformly applied or covered by an extruder method, a printing method, an adhesive film transfer method, an adhesive film laminating method, or the like.
【００２０】また同図２（ａ）に示すように、ＩＣチッ
プ６の搭載されたマルチチップモジュール基板２の前記
電極４と対向する位置に複数の電極５が形成された該基
板２裏面全面に、接着剤３ｂをロールコート法、エクス
トルーダー法、印刷法、若しくは接着性フィルム転写
法、接着性フィルムラミネート法等によって均一に塗布
若しくは被覆する。なお、塗布若しくは被覆に使用され
る接着剤３ａ，３ｂとしては、ポリイミド系樹脂等の合
成樹脂製接着剤が適当であるが、電気的絶縁性があり、
比較的耐熱性のある接着剤であれば特に限定されない。Further, as shown in FIG. 2 (a), a plurality of electrodes 5 are formed on the entire rear surface of the substrate 2 having a plurality of electrodes 5 formed at positions facing the electrodes 4 of the multi-chip module substrate 2 on which the IC chip 6 is mounted. The adhesive 3b is evenly applied or coated by a roll coating method, an extruder method, a printing method, an adhesive film transfer method, an adhesive film laminating method, or the like. As the adhesives 3a and 3b used for coating or coating, synthetic resin adhesives such as polyimide resins are suitable, but they have electrical insulation properties.
The adhesive is not particularly limited as long as it is a relatively heat-resistant adhesive.
【００２１】次に図２（ｂ）に示すように、プリント配
線板１表面の電極４上より塗布・被覆された前記接着剤
３ａのうち、該電極４相当部に塗布・被覆された接着剤
３ａをその電極４面が露呈するように穿孔除去して孔設
部７ａを貫設する。Next, as shown in FIG. 2 (b), of the adhesive 3a applied / covered from above the electrode 4 on the surface of the printed wiring board 1, the adhesive applied / covered on a portion corresponding to the electrode 4 The hole 3a is removed so that the surface of the electrode 4 is exposed, and the hole 7a is formed.
【００２２】また同図２（ｂ）に示すように、マルチチ
ップモジュール基板２裏面の電極５上に塗布・被覆され
た前記接着剤３ｂのうち、該電極５相当部に塗布・被覆
された接着剤３ｂをその電極５面が露呈するように穿孔
除去して孔設部７ｂを貫設する。Further, as shown in FIG. 2B, of the adhesive 3b applied and coated on the electrode 5 on the back surface of the multi-chip module substrate 2, the adhesive corresponding to the electrode 5 is applied and coated. The agent 3b is perforated and removed so that the surface of the electrode 5 is exposed, and the hole portion 7b is provided.
【００２３】なお、孔設部７ａ，７ｂは、互いに位置的
に整合して穿孔することが適当であるが、多少ずれても
構わない。また穿孔位置は、各電極４相当部の電極領域
全部であってもよいし、若しくは電極領域の一部分であ
ってもよい。またプリント配線板１及びマルチチップモ
ジュール基板２に塗布・被覆した接着剤３ａ，３ｂの穿
孔は、ドリルによる機械的穿孔方式、炭酸ガスレーザー
やＹＡＧレーザー等の熱レーザーによる光学的穿孔方
式、あるいはフォトファブリケーションによるフォトレ
ジストを用いたウエットエッチング方式、ドライエッチ
ング方式等が採用できる。The holes 7a and 7b are suitable for perforation while being aligned with each other, but they may be slightly displaced. Further, the perforation position may be the entire electrode region of the corresponding portion of each electrode 4 or a part of the electrode region. The adhesive 3a, 3b applied / covered on the printed wiring board 1 and the multi-chip module substrate 2 is perforated by a mechanical perforation method by a drill, an optical perforation method by a thermal laser such as a carbon dioxide gas laser or a YAG laser, or a photo. A wet etching method using a photoresist by fabrication, a dry etching method, or the like can be adopted.
【００２４】次に、図２（ｃ）に示すように、プリント
配線板１側の接着剤３ａに貫設した前記孔設部７ａ内
に、導電材８ａを充填する。また同図２（ｃ）に示すよ
うに、マルチチップモジュール基板２側の接着剤３ｂに
貫設した前記孔設部７ｂ内に、導電材８ｂを充填する。
なお導電材８ａ，８ｂとしては、金、半田等のバンプ
材、導電性ペースト、導電性樹脂フィルム小片等を使用
することができる。Next, as shown in FIG. 2C, a conductive material 8a is filled in the holed portion 7a penetrating the adhesive 3a on the printed wiring board 1 side. Further, as shown in FIG. 2C, a conductive material 8b is filled in the hole 7b penetrating the adhesive 3b on the multichip module substrate 2 side.
As the conductive materials 8a and 8b, a bump material such as gold or solder, a conductive paste, a small piece of a conductive resin film or the like can be used.
【００２５】次に、同図２（ｃ）に示すプリント配線板
１側の接着剤３ａ及び導電材８ａ上に、マルチチップモ
ジュール基板２側の接着剤３ｂ及び導電材８ｂを、その
接着材３ａ，３ｂと、導電材８ａ，８ｂとが、位置的に
互いに整合するように重ね合わせ、加熱しながら押圧す
ることにより、導電材８ａ，８ｂは互いに接触するとと
もに、接着剤３ａ，３ｂは溶融して互いに接着して接合
固定される。Next, the adhesive 3a and the conductive material 8b on the side of the multi-chip module substrate 2 are bonded onto the adhesive 3a and the conductive material 8a on the side of the printed wiring board 1 shown in FIG. 2 (c). , 3b and the conductive materials 8a, 8b are superposed so as to be positionally aligned with each other and pressed while being heated, so that the conductive materials 8a, 8b come into contact with each other and the adhesives 3a, 3b are melted. Are bonded and fixed to each other.
【００２６】なおプリント配線板１とマルチチップモジ
ュール基板２との重ね合わせにおいて、接着剤３ａ，３
ｂを加熱溶融するとともに、導電材８ａ，８ｂを加熱溶
融することによって、導電材８ａ，８ｂも互いに溶融接
合するようにしてもよい。When the printed wiring board 1 and the multichip module substrate 2 are superposed on each other, the adhesives 3a, 3
The conductive materials 8a and 8b may be melt-bonded to each other by heating and melting b and heating and melting the conductive materials 8a and 8b.
【００２７】以上のようにして、図１に示すように、前
記接着剤３ａ，３ｂが互いに接着して形成される接着材
層３と、導電材８ａ，８ｂが互いに接着して形成される
導電材８とによって、プリント配線板１上にマルチチッ
プモジュール基板２が接着固定され、且つプリント配線
板１の電極４とマルチチップモジュール基板２の電極５
とが互いに電気的に導通を得たマルチチップモジュール
実装型プリント配線板が得られる。As described above, as shown in FIG. 1, the adhesive layer 3 formed by adhering the adhesives 3a and 3b to each other and the conductive material formed by adhering the conductive materials 8a and 8b to each other. The multi-chip module substrate 2 is adhered and fixed onto the printed wiring board 1 by the material 8, and the electrode 4 of the printed wiring board 1 and the electrode 5 of the multi-chip module substrate 2 are attached.
It is possible to obtain a multi-chip module mounting type printed wiring board in which and are electrically connected to each other.
【００２８】[0028]
【作用】本発明のマルチチップモジュール実装型プリン
ト配線板によれば、プリント配線板１上に実装固定され
るマルチチップモジュール基板２は、接着材層３によっ
て接合固定されており、またプリント配線板１本体の電
極４と、それと対向する位置に形成されたマルチチップ
モジュール基板２側の電極５は、互いに接着材層３を絶
縁材として、該接着材層３に貫設された孔設部７に充填
されたバンプ等の導電材８によって電気的に導通が採ら
れ、実装接合においては、接着剤と導電材によって確実
な導通と接合固定を比較的簡潔に行なうことができる。According to the multi-chip module mounting type printed wiring board of the present invention, the multi-chip module substrate 2 mounted and fixed on the printed wiring board 1 is bonded and fixed by the adhesive layer 3, and the printed wiring board is also fixed. The electrode 4 of one main body and the electrode 5 on the side of the multi-chip module substrate 2 formed at the position opposite to the main body 1 are provided with a hole 7 formed through the adhesive layer 3 with the adhesive layer 3 as an insulating material. The conductive material 8 such as the bumps filled in is electrically connected, and in mounting and bonding, reliable bonding and bonding and fixing can be performed relatively easily by the adhesive and the conductive material.
【００２９】マルチチップモジュール基板２の駆動に必
要な複数の電極４は、少なくともその基板２の裏面側を
利用して形成されているので、従来のように表面側のみ
に形成する場合と比較して、マルチチップモジュール基
板２表裏に形成でき、その電極部、外部端子部等のパタ
ーン集積度（本数、個数）が増大でき、あるいは電極部
の形成密度が緩和するため、マルチチップモジュール基
板２に搭載可能なＩＣチップ（６ａ，６ｂ，６ｃ）の個
数を従来よりも増大できるものである。Since the plurality of electrodes 4 required for driving the multi-chip module substrate 2 are formed by utilizing at least the back surface side of the substrate 2, as compared with the conventional case where the electrodes are formed only on the front surface side. Therefore, the multi-chip module substrate 2 can be formed on the front and back sides, and the degree of pattern integration (the number and the number) of the electrode portions, external terminal portions, etc. can be increased, or the formation density of the electrode portions can be relaxed. The number of IC chips (6a, 6b, 6c) that can be mounted can be increased more than ever before.
【００３０】[0030]
【発明の効果】本発明のマルチチップモジュール実装型
プリント配線板は、複数個のＩＣチップを１つの小サイ
ズのモジュール基板上に搭載した高密度のマルチチップ
モジュール基板を、プリント配線板（単層、多層の配線
パターン及び複数の電極が形成された通常のプリント配
線板）上に実装する場合において、従来のような複数本
の脚状の金属リード端子を備えた一般的なブロック状半
導体集積回路（ＬＳＩ）をプリント配線板上に実装する
方式とは異なる接続方式で、パターン設計のための自由
度を低減させずにプリント配線板上に高密度のマルチチ
ップモジュール基板を実装することが可能となる。According to the multi-chip module mounting type printed wiring board of the present invention, a high-density multi-chip module board in which a plurality of IC chips are mounted on one small-sized module board is used. , A general block-shaped semiconductor integrated circuit provided with a plurality of leg-shaped metal lead terminals as in the conventional case when mounted on a normal printed wiring board on which a multilayer wiring pattern and a plurality of electrodes are formed) It is possible to mount a high-density multi-chip module substrate on a printed wiring board by a connection method different from the method of mounting (LSI) on the printed wiring board without reducing the freedom for pattern design. Become.
【００３１】また、本発明のマルチチップモジュール実
装型プリント配線板は、超多数の実装用接続電極部及び
外部端子部を備えた高密度のマルチチップモジュール基
板を同じく超多数のプリント配線板側の接続電極部（外
部端子部を含む）に対応させて電気的に接続実装する際
において、接続固定操作における良好な精度と正確性を
もって実装固定することを可能にする効果がある。Further, the multi-chip module mounting type printed wiring board of the present invention comprises a high density multi-chip module substrate provided with a super-large number of mounting connection electrode portions and external terminal portions on the same side as the super-large number of printed wiring board sides. When electrically connecting and mounting in correspondence with the connection electrode portion (including the external terminal portion), there is an effect that the mounting and fixing can be performed with good precision and accuracy in the connection fixing operation.
【００３２】また、本発明のマルチチップモジュール実
装型プリント配線板に実装されたマルチチップモジュー
ル基板は、その表面に搭載された各ＩＣチップの上側よ
り外装用の樹脂モールドを施さないようにすることによ
ってマルチチップモジュール基板表面に施された各電極
部や外部端子部等の配線パターンの布線状態や、該各電
極部や該外部端子部とＩＣチップとの導通状態の検査を
外側から実施し易くする効果がある。The multi-chip module board mounted on the multi-chip module mounting type printed wiring board of the present invention should not be subjected to resin molding for exterior packaging from the upper side of each IC chip mounted on the surface thereof. From the outside, the wiring state of the wiring pattern such as each electrode portion and the external terminal portion provided on the surface of the multi-chip module substrate and the conduction state between the electrode portion and the external terminal portion and the IC chip are inspected from the outside. It has the effect of facilitating.
【図１】本発明の一実施例におけるマルチチップモジュ
ール実装型プリント配線板の概要側断面図である。FIG. 1 is a schematic side sectional view of a multi-chip module mounting type printed wiring board according to an embodiment of the present invention.
【図２】（ａ）〜（ｃ）は本発明のマルチチップモジュ
ール実装型プリント配線板の実装工程を説明する概要側
断面図である。2A to 2C are schematic side sectional views illustrating a mounting process of the multi-chip module mounting type printed wiring board of the present invention.
１…プリント配線板 ２…マルチチップモジュール基板
３…接着材層 ３ａ，３ｂ…接着剤 ４…プリント配線板側の電極 ５…マルチチップモジュール基板側の電極 ６…ＩＣチ
ップ ７…孔設部 ８，８ａ，８ｂ…導電材DESCRIPTION OF SYMBOLS 1 ... Printed wiring board 2 ... Multi-chip module substrate 3 ... Adhesive layer 3a, 3b ... Adhesive 4 ... Electrode on printed wiring board side 5 ... Electrode on multi-chip module substrate 6 ... IC chip 7 ... Hole portion 8, 8a, 8b ... Conductive material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 関根 秀克 東京都台東区台東一丁目５番１号 凸版印 刷株式会社内 (72)発明者 岡野 達広 東京都台東区台東一丁目５番１号 凸版印 刷株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hidekatsu Sekine, 1-5-1 Taito, Taito-ku, Tokyo Within Toppan Printing Co., Ltd. (72) Tatsuhiro Okano 1-5-1 Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.
Claims (1)
ール基板２が実装固定されたマルチチップモジュール実
装型プリント配線板において、プリント配線板１とマル
チチップモジュール基板２との間に設けられた接着材層
３に、前記プリント配線板１表面の電極４と互いに対向
するマルチチップモジュール基板２裏面の電極５とを繋
ぐ導通孔７が貫設され、該導通孔７内に前記電極４，５
を電気的に接続する導電材８が充填されていることを特
徴とするマルチチップモジュール実装型プリント配線
板。1. A multi-chip module mounting type printed wiring board in which a multi-chip module substrate 2 is mounted and fixed on a printed wiring board 1, and an adhesive material provided between the printed wiring board 1 and the multi-chip module substrate 2. The layer 3 is provided with a through hole 7 that connects the electrode 4 on the front surface of the printed wiring board 1 and the electrode 5 on the back surface of the multi-chip module substrate 2 facing each other.
A multi-chip module mounting type printed wiring board, characterized in that it is filled with a conductive material 8 for electrically connecting the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25413993A JPH07111379A (en) | 1993-10-12 | 1993-10-12 | Multi-chip module packaging type printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25413993A JPH07111379A (en) | 1993-10-12 | 1993-10-12 | Multi-chip module packaging type printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07111379A true JPH07111379A (en) | 1995-04-25 |
Family
ID=17260766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25413993A Pending JPH07111379A (en) | 1993-10-12 | 1993-10-12 | Multi-chip module packaging type printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07111379A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5710733A (en) * | 1996-01-22 | 1998-01-20 | Silicon Graphics, Inc. | Processor-inclusive memory module |
| US5867419A (en) * | 1997-01-27 | 1999-02-02 | Silicon Graphics, Inc. | Processor-inclusive memory module |
| JP2007243223A (en) * | 2007-06-08 | 2007-09-20 | Hitachi Chem Co Ltd | Electronic component mounting structure |
| WO2009031262A1 (en) * | 2007-09-03 | 2009-03-12 | Panasonic Corporation | Wiring board |
| JP2009060015A (en) * | 2007-09-03 | 2009-03-19 | Panasonic Corp | Solid printed circuit board |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
| JP2010239344A (en) * | 2009-03-31 | 2010-10-21 | Fujikura Ltd | Radio circuit module |
| JP2013251343A (en) * | 2012-05-30 | 2013-12-12 | Alps Electric Co Ltd | Mounting structure of electronic component, input device, and manufacturing method of mounting structure |
-
1993
- 1993-10-12 JP JP25413993A patent/JPH07111379A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5710733A (en) * | 1996-01-22 | 1998-01-20 | Silicon Graphics, Inc. | Processor-inclusive memory module |
| US5867419A (en) * | 1997-01-27 | 1999-02-02 | Silicon Graphics, Inc. | Processor-inclusive memory module |
| JP2007243223A (en) * | 2007-06-08 | 2007-09-20 | Hitachi Chem Co Ltd | Electronic component mounting structure |
| WO2009031262A1 (en) * | 2007-09-03 | 2009-03-12 | Panasonic Corporation | Wiring board |
| JP2009060015A (en) * | 2007-09-03 | 2009-03-19 | Panasonic Corp | Solid printed circuit board |
| US8253033B2 (en) | 2007-09-03 | 2012-08-28 | Panasonic Corporation | Circuit board with connection layer with fillet |
| TWI422301B (en) * | 2007-09-03 | 2014-01-01 | Panasonic Corp | Wiring board |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
| JP2010239344A (en) * | 2009-03-31 | 2010-10-21 | Fujikura Ltd | Radio circuit module |
| JP2013251343A (en) * | 2012-05-30 | 2013-12-12 | Alps Electric Co Ltd | Mounting structure of electronic component, input device, and manufacturing method of mounting structure |
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