JP5082296B2 - Adhesive with wiring and circuit connection structure - Google Patents

Adhesive with wiring and circuit connection structure Download PDF

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JP5082296B2
JP5082296B2 JP2006140473A JP2006140473A JP5082296B2 JP 5082296 B2 JP5082296 B2 JP 5082296B2 JP 2006140473 A JP2006140473 A JP 2006140473A JP 2006140473 A JP2006140473 A JP 2006140473A JP 5082296 B2 JP5082296 B2 JP 5082296B2
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adhesive
wiring
film
circuit board
circuit connection
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JP2007191674A (en
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征宏 有福
宏治 小林
孝 中澤
日臣 望月
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Description

本発明は、配線付き接着剤に関する。   The present invention relates to an adhesive with wiring.

集積回路類等の回路基板は、基材上に銅、アルミ等の金属箔層を形成し、エッチング、めっきによって配線を基材上に形成することで作製される。基材としては、セラミックやガラス−エポキシ等の硬質基材やポリイミドフィルムやＰＥＴフィルム等のフィルム状基材が用いられる。この回路基板はそれ自体に接着性を有しないため、回路基板間の機械的接続、電気的接続には、はんだや異方導電性接着剤が用いられている。   Circuit boards such as integrated circuits are produced by forming a metal foil layer such as copper or aluminum on a base material and forming wiring on the base material by etching or plating. As the substrate, a hard substrate such as ceramic or glass-epoxy, or a film-like substrate such as polyimide film or PET film is used. Since this circuit board itself does not have adhesiveness, solder and anisotropic conductive adhesive are used for mechanical connection and electrical connection between the circuit boards.

また近年、精密電子機器の分野では回路の高密度化が進んでおり、配線幅、配線間隔が極めて狭くなっているため、配線の脱落、剥離や位置ずれ等が生じ易くなっている。この問題を解決するため、低温速硬化性に優れ、且つ、十分に長い可使時間を有する電気・電子用の回路接続用接着剤が開発されている（例えば、特許文献１、２参照）。   In recent years, the density of circuits has been increasing in the field of precision electronic equipment, and the wiring width and the wiring interval have become extremely narrow, so that the wiring is easily dropped, peeled off, or misaligned. In order to solve this problem, adhesives for circuit connection for electric and electronic use that have excellent low-temperature fast curing properties and have a sufficiently long pot life have been developed (for example, see Patent Documents 1 and 2).

この回路接続用接着剤は、従来から液晶表示装置の製造工程等においてフレキシブル配線板（Flexible Printed Circuit：以下、ＦＰＣ）を液晶表示パネルに実装する場合等に広く用いられてきた。このような従来の回路接続用接着剤を用いて実装する場合、
（１）ガラス上にインジウム錫酸化物（Indium TinOxide：以下、ＩＴＯ）等で形成された接続端子や、ガラス−エポキシ基板上に形成された金属端子を有する回路基板を用意する、
（２）回路基板上に回路接続用接着剤を仮圧着する、
（３）回路接続用接着剤の基材（セパレータ）を剥離する、
（４）ＦＰＣを回路基板上に配置し、位置合わせ（アライメント）する、
（５）本圧着（接続）する、
という工程を経ていた。 Conventionally, this circuit connecting adhesive has been widely used when a flexible printed circuit (hereinafter referred to as FPC) is mounted on a liquid crystal display panel in a manufacturing process of a liquid crystal display device or the like. When mounting using such a conventional adhesive for circuit connection,
(1) Prepare a circuit board having a connection terminal formed of indium tin oxide (hereinafter referred to as ITO) on a glass or a metal terminal formed on a glass-epoxy substrate.
(2) Temporarily press-bonding an adhesive for circuit connection onto the circuit board,
(3) peeling the base material (separator) of the adhesive for circuit connection,
(4) The FPC is placed on the circuit board and aligned (aligned).
(5) Final crimping (connection)
I went through the process.

また、ＦＰＣの酸化防止、コストダウンを目的として、ＦＰＣに予め回路接続用接着剤（異方導電性フィルム）を形成しておくという技術も提案されている（例えば、特許文献３参照）。
国際公開第９８／４４０６７号パンフレット 国際公開第０１／０１５５０５号パンフレット 特開２００５−２８５６４０号公報 In addition, for the purpose of preventing FPC oxidation and reducing costs, a technique in which an adhesive for circuit connection (anisotropic conductive film) is previously formed on the FPC has also been proposed (see, for example, Patent Document 3).
International Publication No. 98/44067 Pamphlet International Publication No. 01/015505 pamphlet JP 2005-285640 A

このような従来の技術では、上記の通り多くの工程を必要とするため、長時間の製造時間を有しコストアップの要因となっていた。また、回路接続用接着剤、回路基板、ＦＰＣの３点の部材が必要であり、これもコストアップの大きな要因となっていた。   Such a conventional technique requires many steps as described above, and therefore has a long manufacturing time, which causes an increase in cost. In addition, three members, that is, an adhesive for circuit connection, a circuit board, and an FPC, are necessary, which is a major factor in increasing the cost.

本発明者らは、上述のように従来の回路基板同士をはんだや接着剤で接続する方法よりも、回路接続に必要な工程数及び部材点数が少なく、かつ良好な接続抵抗を得ることができる回路接続部材及び回路接続方法を探索した。   As described above, the present inventors have fewer steps and member points required for circuit connection than the conventional method of connecting circuit boards with solder or adhesive, and can obtain a good connection resistance. Circuit connection members and circuit connection methods were searched.

本発明はかかる状況に鑑みてなされたものであり、回路接続に必要な工程数及び部材点数を少なく、かつ良好な接続抵抗を得ることができる配線付き接着剤を提供することを目的とする。   The present invention has been made in view of such a situation, and an object of the present invention is to provide an adhesive with wiring that can reduce the number of steps and the number of members necessary for circuit connection and can obtain good connection resistance.

上述の課題を解決するため、本発明の配線付き接着剤は、フィルム状接着剤と、前記フィルム状接着剤の主面上に設けられた配線とを備える。   In order to solve the above-mentioned problem, the adhesive with wiring of the present invention includes a film adhesive and a wiring provided on the main surface of the film adhesive.

本発明の配線付き接着剤を回路基板に押圧すると、フィルム状接着剤が回路基板に接着することにより、配線付き接着剤の配線が回路基板に接続される。よって、本発明の配線付き接着剤を用いることにより、回路接続を行う際に別途はんだや接着剤を用いる必要がなくなる。したがって、回路接続に必要な工程数及び部材点数を少なくすることができる。さらに、本発明の配線付き接着剤を用いることにより、良好な接続抵抗を得ることができる。   When the adhesive with wiring of the present invention is pressed against the circuit board, the film adhesive adheres to the circuit board, whereby the wiring of the adhesive with wiring is connected to the circuit board. Therefore, by using the adhesive with wiring of the present invention, it is not necessary to separately use solder or an adhesive when circuit connection is performed. Therefore, the number of processes and the number of members necessary for circuit connection can be reduced. Furthermore, favorable connection resistance can be obtained by using the adhesive with wiring of the present invention.

また、前記フィルム状接着剤は導電粒子を含有することが好ましい。これにより、配線付き接着剤を回路基板に接続する際に、配線付き接着剤の配線と回路基板との接続抵抗を小さくすることができる。   The film adhesive preferably contains conductive particles. Thereby, when connecting the adhesive with wiring to the circuit board, the connection resistance between the wiring of the adhesive with wiring and the circuit board can be reduced.

また、上記配線付き接着剤は、前記フィルム状接着剤の前記主面とは反対側の面上に設けられた基材を更に備えることが好ましい。これにより、配線付き接着剤をロール状に巻き取る際に、フィルム状接着剤同士の接着を抑制することができる。また、基材がフィルム状接着剤を支持するので、フィルム状接着剤の主面上に配線を形成する際に、フィルム状接着剤の取り扱いが容易になる。さらに、フィルム状接着剤の主面とは反対側の面が他の部材や装置等に接着してしまうことを抑制できる。   Moreover, it is preferable that the said adhesive with a wiring is further equipped with the base material provided on the surface on the opposite side to the said main surface of the said film adhesive. Thereby, when winding adhesive agent with wiring in roll shape, adhesion | attachment of film adhesives can be suppressed. Moreover, since a base material supports a film adhesive, when forming wiring on the main surface of a film adhesive, handling of a film adhesive becomes easy. Furthermore, it can suppress that the surface on the opposite side to the main surface of a film adhesive adheres to another member, an apparatus, etc.

また、上記配線付き接着剤は、前記フィルム状接着剤の前記主面上に、前記配線を覆うように設けられた別のフィルム状接着剤を更に備えることが好ましい。この場合、配線付き接着剤を回路基板する際に、配線付き接着剤と回路基板との密着性を高めることができる。   Moreover, it is preferable that the said adhesive agent with a wiring is further equipped with another film adhesive provided so that the said wiring might be covered on the said main surface of the said film adhesive. In this case, when the adhesive with wiring is used as a circuit board, the adhesion between the adhesive with wiring and the circuit board can be improved.

さらに、前記別のフィルム状接着剤は導電粒子を含有することが好ましい。これにより、配線付き接着剤を回路基板に接続する際に、配線付き接着剤の配線と回路基板との接続抵抗を小さくすることができる。   Furthermore, the another film adhesive preferably contains conductive particles. Thereby, when connecting the adhesive with wiring to the circuit board, the connection resistance between the wiring of the adhesive with wiring and the circuit board can be reduced.

本発明によれば、回路接続に必要な工程数及び部材点数を少なく、かつ良好な接続抵抗を得ることができる配線付き接着剤が提供される。   ADVANTAGE OF THE INVENTION According to this invention, the adhesive agent with a wiring which can obtain the favorable connection resistance with few process steps and number of members required for circuit connection is provided.

以下、添付図面を参照しながら本発明の実施形態を詳細に説明する。なお、図面の説明において、同一又は同等の要素には同一符号を用い、重複する説明を省略する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used for the same or equivalent elements, and duplicate descriptions are omitted.

（第１実施形態）
図１は、第１実施形態に係る配線付き接着剤を模式的に示す斜視図である。図１に示される配線付き接着剤２０（以下、「接着剤２０」という。）は、フィルム状接着剤１と、フィルム状接着剤１の主面２１上に設けられた配線２とを備える。接着剤２０は後述する回路基板３０に接続される。配線２は、主面２１の面方向に沿って所定の間隔で複数設けられている。 (First embodiment)
FIG. 1 is a perspective view schematically showing an adhesive with wiring according to the first embodiment. An adhesive with wiring 20 shown in FIG. 1 (hereinafter referred to as “adhesive 20”) includes a film adhesive 1 and a wiring 2 provided on a main surface 21 of the film adhesive 1. The adhesive 20 is connected to a circuit board 30 described later. A plurality of wirings 2 are provided at predetermined intervals along the surface direction of the main surface 21.

図２は、第１実施形態に係る配線付き接着剤を回路基板に接続することによって得られる回路接続構造の製造方法の各工程を模式的に示す斜視図である。   FIG. 2 is a perspective view schematically showing each step of the method for manufacturing the circuit connection structure obtained by connecting the adhesive with wiring according to the first embodiment to the circuit board.

まず、図２(ａ)に示されるようにフィルム状接着剤１を準備する。フィルム状接着剤１は、例えばフィルム基材上に接着剤組成物を含む溶液を塗布し、塗布された溶液を乾燥させることによって得られる。   First, a film adhesive 1 is prepared as shown in FIG. The film adhesive 1 is obtained, for example, by applying a solution containing an adhesive composition on a film substrate and drying the applied solution.

続いて、図２(ｂ)に示されるようにフィルム状接着剤１の主面２１上に配線２を形成して接着剤２０を得る。配線２は、フィルム状接着剤１の主面２１上に金属箔をラミネート等により形成した後、その金属箔をエッチングすることによって形成されることが好ましい。この場合、高精細な配線２の形成が可能である。また、金属線をフィルム状接着剤１の主面２１に直接押し付けることにより配線２を形成してもよい。この場合、工程数が少ないので、短時間で配線２を形成することができる。   Subsequently, as shown in FIG. 2B, the wiring 2 is formed on the main surface 21 of the film adhesive 1 to obtain the adhesive 20. The wiring 2 is preferably formed by forming a metal foil on the main surface 21 of the film adhesive 1 by laminating or the like and then etching the metal foil. In this case, the high-definition wiring 2 can be formed. Alternatively, the wiring 2 may be formed by directly pressing a metal wire against the main surface 21 of the film adhesive 1. In this case, since the number of steps is small, the wiring 2 can be formed in a short time.

一方、基板３と基板３上に設けられた配線１２とを有する回路基板３０を準備する。基板３は、例えばガラスやセラミック、ガラス−エポキシ等からなる硬質基材であってもよいし、例えばポリイミドフィルムやＰＥＴフィルム等であってもよい。配線１２は、例えば配線２と同様の材料から構成される。接着剤２０は、図２(ｂ)に示されるように回路基板３０に位置合わせされ、対向配置される。その結果、配線２は配線１２に対向配置される。   On the other hand, a circuit board 30 having a substrate 3 and wirings 12 provided on the substrate 3 is prepared. The substrate 3 may be a hard base made of glass, ceramic, glass-epoxy, or the like, or may be a polyimide film or a PET film, for example. The wiring 12 is made of the same material as that of the wiring 2, for example. The adhesive 20 is aligned with the circuit board 30 as shown in FIG. As a result, the wiring 2 is disposed opposite to the wiring 12.

次に、接着剤２０を回路基板３０に押圧することによって接着剤２０を回路基板３０に接続し、図２(ｃ)に示されるように、回路接続構造４０を作製する。このとき、例えば接着剤２０及び回路基板２０を加熱及び加圧することによって、フィルム状接着剤１が硬化する。これにより、フィルム状接着剤１の硬化物８が得られる。この硬化物８によって、配線２と配線１２とが電気的及び機械的に接続される。また、硬化物８によって隣り合う配線２間は絶縁される。   Next, the adhesive 20 is connected to the circuit board 30 by pressing the adhesive 20 against the circuit board 30, and the circuit connection structure 40 is produced as shown in FIG. At this time, for example, the film adhesive 1 is cured by heating and pressurizing the adhesive 20 and the circuit board 20. Thereby, the hardened | cured material 8 of the film adhesive 1 is obtained. The cured product 8 connects the wiring 2 and the wiring 12 electrically and mechanically. Further, the adjacent wirings 2 are insulated by the cured product 8.

以上説明したように、本実施形態の接着剤２０を回路基板３０に押圧すると、フィルム状接着剤１が回路基板３０に接着することにより、配線２が配線１２に接続される。よって、接着剤２０を用いることにより、回路接続を行う際に別途はんだや接着剤を用いる必要がなくなる。よって、回路接続に用いる部材点数を少なくすることができると共に、回路接続の工程数も少なくすることができる。したがって、回路接続構造４０の生産効率を向上できると共に生産コストを低減できる。さらに、接着剤２０を用いることにより、良好な接続抵抗を得ることができる。   As described above, when the adhesive 20 of this embodiment is pressed against the circuit board 30, the film adhesive 1 adheres to the circuit board 30, whereby the wiring 2 is connected to the wiring 12. Therefore, the use of the adhesive 20 eliminates the need to separately use solder or an adhesive when performing circuit connection. Therefore, the number of members used for circuit connection can be reduced, and the number of circuit connection steps can be reduced. Therefore, the production efficiency of the circuit connection structure 40 can be improved and the production cost can be reduced. Furthermore, by using the adhesive 20, a good connection resistance can be obtained.

フィルム状接着剤１は、光硬化性接着剤又は熱硬化性接着剤を含有することが好ましい。この場合、接着剤２０を回路基板３０に接続する際にフィルム状接着剤１を化学反応させて硬化させることができる。また、硬化物８の耐熱性及び耐湿性が飛躍的に向上するので、配線２と配線１２との電気的及び機械的接続の信頼性が向上する。フィルム状接着剤１の材料としては、例えば、接着ハンドブック（第２版、日刊工業新聞社刊、日本接着協会編）のＩＩ．接着剤編に記述されている接着剤が挙げられる。   It is preferable that the film adhesive 1 contains a photocurable adhesive or a thermosetting adhesive. In this case, when the adhesive 20 is connected to the circuit board 30, the film adhesive 1 can be chemically reacted and cured. Moreover, since the heat resistance and moisture resistance of the cured product 8 are dramatically improved, the reliability of electrical and mechanical connection between the wiring 2 and the wiring 12 is improved. Examples of the material for the film adhesive 1 include II. Of the Adhesion Handbook (2nd edition, published by Nikkan Kogyo Shimbun, edited by Japan Adhesion Association). Adhesives described in the adhesive section are listed.

配線２の材質としては、例えば銅、銀、金等の延伸性に優れた金属が好ましい。この場合、配線２の幅や径を小さくすることができるので、高密度な配線２の形成が可能になる。また、配線２の表層が金を含有することが好ましい。これにより、配線２と配線１２との接続抵抗を低くすることができる。   As a material of the wiring 2, for example, a metal excellent in stretchability such as copper, silver, and gold is preferable. In this case, since the width and diameter of the wiring 2 can be reduced, the high-density wiring 2 can be formed. Moreover, it is preferable that the surface layer of the wiring 2 contains gold. Thereby, the connection resistance between the wiring 2 and the wiring 12 can be lowered.

（第２実施形態）
図３は、第２実施形態に係る配線付き接着剤を模式的に示す斜視図である。図３に示される配線付き接着剤２０ａ（以下、「接着剤２０ａ」という。）は、第１実施形態に係る接着剤２０のフィルム状接着剤１に代えて、フィルム状接着剤１中に導電粒子Ｐを含有するフィルム状接着剤１ａを備える。フィルム状接着剤１ａは、例えば異方導電性接着剤である。接着剤２０ａは、接着剤２０と同様に、上述の回路基板３０に接続される。 (Second Embodiment)
FIG. 3 is a perspective view schematically showing an adhesive with wiring according to the second embodiment. An adhesive with wiring 20a shown in FIG. 3 (hereinafter referred to as “adhesive 20a”) is electrically conductive in the film adhesive 1 instead of the film adhesive 1 of the adhesive 20 according to the first embodiment. A film adhesive 1a containing particles P is provided. The film adhesive 1a is, for example, an anisotropic conductive adhesive. The adhesive 20 a is connected to the above-described circuit board 30 in the same manner as the adhesive 20.

接着剤２０ａでは、接着剤２０を回路基板３０に接続する場合に比べて、接着剤２０ａを回路基板３０に接続する際に、より安定して配線２を配線１２に接続できると共に、配線２と配線１２との接続抵抗を小さくすることができる。   In the adhesive 20a, the wiring 2 can be connected to the wiring 12 more stably when the adhesive 20a is connected to the circuit board 30 than when the adhesive 20 is connected to the circuit board 30. The connection resistance with the wiring 12 can be reduced.

導電粒子Ｐとしては、Ａｕ、Ａｇ、Ｎｉ、Ｃｕ、はんだ等の金属やカーボン等からなる粒子が挙げられる。導電粒子Ｐは、Ｎｉ等の遷移金属類からなる粒子の表面をＡｕ等の貴金属類からなる層で被覆したものでもよい。また、導電粒子Ｐは、非導電性のガラス、セラミック、プラスチック等からなる粒子の表面を導電層で被覆し、その導電層を貴金属類からなる最外層で被覆したものでもよいし、熱溶融金属粒子でもよい。この場合、導電粒子Ｐが、加熱及び加圧による変形性を有するので、回路接続時に導電粒子Ｐと配線２，１２との接触面積が増加し、信頼性が向上するので好ましい。貴金属類からなる層の厚さは、良好な接続抵抗を得るために、１００オングストローム（１０ｎｍ）以上であることが好ましい。導電粒子Pの含有量は、用途に応じて、フィルム状接着剤１の樹脂成分１００体積部に対して０．１〜３０体積部の範囲とすることができる。過剰な導電粒子Pによる隣接配線間の短絡等を防止するためには、導電粒子Pの含有量を０．１〜１０体積部とするのが好ましい。   Examples of the conductive particles P include particles made of metal such as Au, Ag, Ni, Cu, and solder, carbon, and the like. The conductive particles P may be those in which the surfaces of particles made of a transition metal such as Ni are coated with a layer made of a noble metal such as Au. In addition, the conductive particles P may be those in which the surface of particles made of non-conductive glass, ceramic, plastic, etc. is coated with a conductive layer, and the conductive layer is coated with an outermost layer made of noble metals, Particles may be used. In this case, since the conductive particles P are deformable by heating and pressurization, the contact area between the conductive particles P and the wirings 2 and 12 increases at the time of circuit connection, which is preferable because the reliability is improved. The thickness of the noble metal layer is preferably 100 angstroms (10 nm) or more in order to obtain good connection resistance. Content of the electroconductive particle P can be made into the range of 0.1-30 volume parts with respect to 100 volume parts of resin components of the film adhesive 1 according to a use. In order to prevent a short circuit between adjacent wires due to excessive conductive particles P, the content of the conductive particles P is preferably 0.1 to 10 parts by volume.

（第３実施形態）
図４は、第３実施形態に係る配線付き接着剤を模式的に示す斜視図である。図４に示される配線付き接着剤２０ｂ（以下、「接着剤２０ｂ」という。）は、第１実施形態に係る接着剤２０の構成に加えて、基材（セパレータともいう。）４を更に備える。基材４は、フィルム状接着剤１の主面２１とは反対側の面２２上に設けられる。接着剤２０ｂは、接着剤２０と同様に、上述の回路基板３０に接続される。 (Third embodiment)
FIG. 4 is a perspective view schematically showing an adhesive with wiring according to the third embodiment. An adhesive with wiring 20b shown in FIG. 4 (hereinafter referred to as “adhesive 20b”) further includes a base material (also referred to as a separator) 4 in addition to the configuration of the adhesive 20 according to the first embodiment. . The substrate 4 is provided on a surface 22 opposite to the main surface 21 of the film adhesive 1. The adhesive 20 b is connected to the circuit board 30 described above, similarly to the adhesive 20.

接着剤２０ｂは、例えば、まず基材４上に接着剤組成物を含む溶液を塗布し、塗布された溶液を乾燥させることによりフィルム状接着剤１を形成し、その後フィルム状接着剤１の主面２１上に配線２を形成することによって得られる。   For example, the adhesive 20b is formed by first applying a solution containing the adhesive composition on the substrate 4 and drying the applied solution to form the film-like adhesive 1, and then forming the main adhesive of the film-like adhesive 1. It is obtained by forming the wiring 2 on the surface 21.

接着剤２０ｂでは、接着剤２０ｂをロール状に巻き取る際に、フィルム状接着剤１同士の接着を抑制することができる。また、基材４がフィルム状接着剤１を支持するので、フィルム状接着剤１の主面２１上に配線２を形成する際に、フィルム状接着剤１の取り扱いが容易になる。さらに、フィルム状接着剤１の面２２が加熱及び加圧を行うプレス機等に接触しても、接着剤がプレス機等に転写されることを抑制できる。   In the adhesive 20b, adhesion between the film adhesives 1 can be suppressed when the adhesive 20b is wound into a roll. Moreover, since the base material 4 supports the film adhesive 1, when forming the wiring 2 on the main surface 21 of the film adhesive 1, handling of the film adhesive 1 becomes easy. Furthermore, even if the surface 22 of the film adhesive 1 comes into contact with a press machine or the like that performs heating and pressurization, the adhesive can be prevented from being transferred to the press machine or the like.

（第４実施形態）
図５は、第４実施形態に係る配線付き接着剤を模式的に示す斜視図である。図５に示される配線付き接着剤２０ｃ（以下、「接着剤２０ｃ」という。）は、第３実施形態に係る接着剤２０ｂの構成に加えて、別のフィルム状接着剤５を更に備える。フィルム状接着剤５は、フィルム状接着剤１の主面２１上に、配線２を覆うように設けられる。接着剤２０ｃは、接着剤２０と同様に、上述の回路基板３０に接続される。 (Fourth embodiment)
FIG. 5 is a perspective view schematically showing an adhesive with wiring according to the fourth embodiment. The adhesive with wiring 20c shown in FIG. 5 (hereinafter referred to as “adhesive 20c”) further includes another film adhesive 5 in addition to the configuration of the adhesive 20b according to the third embodiment. The film adhesive 5 is provided on the main surface 21 of the film adhesive 1 so as to cover the wiring 2. The adhesive 20 c is connected to the above-described circuit board 30 in the same manner as the adhesive 20.

接着剤２０ｃは、例えば、接着剤２０ｂの配線２上にフィルム状接着剤５を押圧することによってフィルム状接着剤１とフィルム状接着剤５とを接着させることによって得られる。   The adhesive 20c is obtained by, for example, bonding the film adhesive 1 and the film adhesive 5 by pressing the film adhesive 5 on the wiring 2 of the adhesive 20b.

接着剤２０ｃでは、接着剤２０ｃを回路基板３０に接続する際にフィルム状接着剤５が回路基板３０に接着する。よって、接着剤２０ｃと回路基板３０とが隙間無く接続されるので、接着剤２０ｂを用いる場合に比べて、接着剤２０ｃと回路基板３０との密着性を高めることができる。その結果、配線２と配線１２との電気的及び機械的な接続信頼性が向上する。   In the adhesive 20 c, the film adhesive 5 adheres to the circuit board 30 when the adhesive 20 c is connected to the circuit board 30. Therefore, since the adhesive 20c and the circuit board 30 are connected without a gap, the adhesiveness between the adhesive 20c and the circuit board 30 can be improved as compared with the case where the adhesive 20b is used. As a result, the electrical and mechanical connection reliability between the wiring 2 and the wiring 12 is improved.

フィルム状接着剤５は、フィルム状接着剤１と同様の材料からなることが好ましい。この場合、フィルム状接着剤１，５間が強固に接着する。   The film adhesive 5 is preferably made of the same material as the film adhesive 1. In this case, the film adhesives 1 and 5 are firmly bonded.

（第５実施形態）
図６は、第５実施形態に係る配線付き接着剤を模式的に示す斜視図である。図６に示される配線付き接着剤２０ｄ（以下、「接着剤２０ｄ」という。）は、第４実施形態に係る接着剤２０ｃのフィルム状接着剤５に代えて、フィルム状接着剤５中に導電粒子Ｐを含有するフィルム状接着剤５ａを備える。フィルム状接着剤５ａは、例えば異方導電性接着剤である。接着剤２０ｄは、接着剤２０と同様に、上述の回路基板３０に接続される。 (Fifth embodiment)
FIG. 6 is a perspective view schematically showing an adhesive with wiring according to the fifth embodiment. An adhesive with wiring 20d shown in FIG. 6 (hereinafter referred to as “adhesive 20d”) is conductive in the film adhesive 5 instead of the film adhesive 5 of the adhesive 20c according to the fourth embodiment. A film adhesive 5a containing particles P is provided. The film adhesive 5a is, for example, an anisotropic conductive adhesive. The adhesive 20 d is connected to the above-described circuit board 30 in the same manner as the adhesive 20.

接着剤２０ｄでは、接着剤２０ｃを回路基板３０に接続する場合に比べて、接着剤２０ｄを回路基板３０に接続する際に、より安定して配線２を配線１２に接続できると共に、配線２と配線１２との接続抵抗を小さくすることができる。   In the adhesive 20d, the wiring 2 can be connected to the wiring 12 more stably when the adhesive 20d is connected to the circuit board 30 than when the adhesive 20c is connected to the circuit board 30. The connection resistance with the wiring 12 can be reduced.

なお、接着剤２０ｄにおいて、フィルム状接着剤１に代えてフィルム状接着剤１ａを用いてもよいが、図６に示されるように、フィルム状接着剤１とフィルム状接着剤５ａとの組み合わせが特に好ましい。この場合、隣接配線間の絶縁性が良好に維持され、かつ、対向配線間の接続抵抗を低減することができる。   In the adhesive 20d, the film adhesive 1a may be used instead of the film adhesive 1, but as shown in FIG. 6, the combination of the film adhesive 1 and the film adhesive 5a is different. Particularly preferred. In this case, the insulation between the adjacent wirings can be maintained well, and the connection resistance between the opposing wirings can be reduced.

以上、本発明の好適な実施形態について詳細に説明したが、本発明は上記実施形態に限定されない。   As mentioned above, although preferred embodiment of this invention was described in detail, this invention is not limited to the said embodiment.

以下、実施例及び比較例に基づいて本発明をより具体的に説明するが、本発明は以下の実施例に限定されるものではない。   EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

（実施例１）
フィルム状接着剤として、厚さ５０μｍのポリエステルシート（（株）東洋紡製、バイロン５００（製品名））を準備した。続いて、布線機を用いて、ポリエステルシートの表面上に長さ１０ｃｍ、直径０．１ｍｍの金線を２００μｍピッチで１０本形成した。このようにして、実施例１の配線付き接着剤を得た（図１参照）。 Example 1
A polyester sheet having a thickness of 50 μm (manufactured by Toyobo Co., Ltd., Byron 500 (product name)) was prepared as a film adhesive. Subsequently, ten gold wires having a length of 10 cm and a diameter of 0.1 mm were formed at a pitch of 200 μm on the surface of the polyester sheet using a wiring machine. Thus, the adhesive with a wiring of Example 1 was obtained (refer FIG. 1).

（実施例２）
固形エポキシ樹脂（ジャパンエポキシレジン（株）、エピコート＃１００７（製品名））５０ｇを、質量比でトルエン（沸点１１０．６℃、ＳＰ値８．９０）／酢酸エチル（沸点７７．１℃、ＳＰ値９．１０）＝５０／５０の混合溶剤に溶解して、固形分４０％の溶液を得た。続いて、固形質量比で、固形エポキシ樹脂５０ｇ、ビスフェノールＡ型液状エポキシ樹脂４５ｇ、硬化促進剤としてイミダゾール５ｇとなるように配合して塗布用溶液を得た。この塗布用溶液を、片面が表面処理された厚さ８０μｍのＰＥＴフィルムに塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥を行った。これにより、ＰＥＴフィルム上に厚さ５０μｍのフィルム状接着剤を形成した。さらに、このフィルム状接着剤上に実施例１と同様に金線を形成することにより、実施例２の配線付き接着剤を得た（図４参照）。 (Example 2)
50 g of a solid epoxy resin (Japan Epoxy Resin Co., Ltd., Epicoat # 1007 (product name)) in toluene (boiling point 110.6 ° C., SP value 8.90) / ethyl acetate (boiling point 77.1 ° C., SP Value 9.10) = dissolved in a 50/50 mixed solvent to obtain a 40% solids solution. Subsequently, a solid epoxy resin 50 g, a bisphenol A type liquid epoxy resin 45 g, and 5 g of imidazole as a curing accelerator were blended to obtain a coating solution. This coating solution was applied to a PET film having a thickness of 80 μm, one side of which was surface-treated, using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes. Thereby, a film adhesive having a thickness of 50 μm was formed on the PET film. Furthermore, the adhesive with a wiring of Example 2 was obtained by forming a gold wire on this film adhesive similarly to Example 1 (refer FIG. 4).

（実施例３）
実施例２と同様に、ＰＥＴフィルム上に厚さ５０μｍのフィルム状接着剤を形成し、積層体を得た。この積層体を、実施例２の配線付き接着剤の主面（金線が露出した面）上にラミネートした後、その積層体のＰＥＴフィルムを剥離することにより、実施例３の配線付き接着剤を得た（図５参照）。 (Example 3)
Similarly to Example 2, a film adhesive having a thickness of 50 μm was formed on a PET film to obtain a laminate. After laminating this laminate on the main surface of the adhesive with wiring of Example 2 (surface on which the gold wire was exposed), the PET film of the laminate was peeled off, whereby the adhesive with wiring of Example 3 was used. Was obtained (see FIG. 5).

（実施例４）
フィルム状接着剤として、厚さ５０μｍの異方導電フィルム（日立化成工業（株）製、ＡＣ−７０７３Ｚ（製品名））を用いたこと以外は実施例１と同様にして、実施例４の配線付き接着剤を得た（図３参照）。 Example 4
The wiring of Example 4 was the same as Example 1 except that an anisotropic conductive film (manufactured by Hitachi Chemical Co., Ltd., AC-7073Z (product name)) having a thickness of 50 μm was used as the film adhesive. A sticky adhesive was obtained (see FIG. 3).

（実施例５）
積層体として、ＰＥＴフィルム上に実施例４の異方導電フィルムを形成したものを用いたこと以外は実施例３と同様にして、実施例５の配線付き接着剤を得た（図６参照）。 (Example 5)
The adhesive with wiring of Example 5 was obtained in the same manner as in Example 3 except that the laminate was formed by forming the anisotropic conductive film of Example 4 on a PET film (see FIG. 6). .

（実施例６）
長さ１０ｃｍ、直径０．１ｍｍの金線に代えて長さ１０ｃｍ、直径０．１ｍｍの銅線を用いたこと以外は実施例２と同様にして、実施例６の配線付き接着剤を得た。 (Example 6)
An adhesive with wiring of Example 6 was obtained in the same manner as in Example 2 except that a copper wire having a length of 10 cm and a diameter of 0.1 mm was used instead of the gold wire having a length of 10 cm and a diameter of 0.1 mm. .

（実施例７）
長さ１０ｃｍ、直径０．１ｍｍの金線に代えて長さ１０ｃｍ、直径０．１ｍｍの白金線を用いたこと以外は実施例２と同様にして、実施例７の配線付き接着剤を得た。 (Example 7)
An adhesive with wiring of Example 7 was obtained in the same manner as Example 2 except that a platinum wire having a length of 10 cm and a diameter of 0.1 mm was used instead of the gold wire having a length of 10 cm and a diameter of 0.1 mm. .

（実施例８）
長さ１０ｃｍ、直径０．１ｍｍの金線に代えて長さ１０ｃｍ、直径０．１ｍｍの銅線を用いたこと以外は実施例４と同様にして、実施例８の配線付き接着剤を得た。 (Example 8)
An adhesive with wiring of Example 8 was obtained in the same manner as Example 4 except that a copper wire having a length of 10 cm and a diameter of 0.1 mm was used instead of the gold wire having a length of 10 cm and a diameter of 0.1 mm. .

（実施例９）
長さ１０ｃｍ、直径０．１ｍｍの金線に代えて長さ１０ｃｍ、直径０．１ｍｍの白金線を用いたこと以外は実施例４と同様にして、実施例９の配線付き接着剤を得た。 Example 9
An adhesive with wiring of Example 9 was obtained in the same manner as in Example 4 except that a platinum wire having a length of 10 cm and a diameter of 0.1 mm was used instead of the gold wire having a length of 10 cm and a diameter of 0.1 mm. .

（回路接続）
実施例１〜９の配線付き接着剤を用いて以下のように回路接続を行った。図７は、回路接続構造の特性を評価するための特性評価用基板（回路基板ともいう。）を模式的に示す斜視図である。図７に示される特性評価用基板５０では、ガラス−エポキシ基板９の一端上に長さ２ｃｍ、幅１ｃｍの配線６が形成されている。ガラス−エポキシ基板９の他端上には、長さ２ｃｍの配線（接続端子ともいう。）７が２００μｍピッチで１０本形成されている。配線６と配線７との間には、長さ８ｃｍにわたって、配線６，７が形成されずガラス−エポキシ基板９の表面が露出する領域が設けられている。 (Circuit connection)
Using the adhesive with wiring of Examples 1 to 9, circuit connection was performed as follows. FIG. 7 is a perspective view schematically showing a characteristic evaluation board (also referred to as a circuit board) for evaluating the characteristics of the circuit connection structure. In the characteristic evaluation substrate 50 shown in FIG. 7, a wiring 6 having a length of 2 cm and a width of 1 cm is formed on one end of the glass-epoxy substrate 9. On the other end of the glass-epoxy substrate 9, ten wires (also referred to as connection terminals) 7 having a length of 2 cm are formed at a pitch of 200 μm. Between the wiring 6 and the wiring 7, the area | region which the surface of the glass-epoxy board | substrate 9 is exposed is formed over 8 cm in length without the wirings 6 and 7 being formed.

図８は、図７の特性評価用基板に図４の配線付き接着剤を接続して得られる回路接続構造を模式的に示す斜視図である。図８は、実施例２における回路接続構造を示している。図８に示される回路接続構造６０では、接着剤２０ｂの配線２が配線６，７に接続されている。特性評価用基板５０と接着剤２０ｂとは、配線２の一端と配線６が幅１ｃｍにわたって接続され、かつ、配線２の他端と配線７が幅１ｃｍにわたって接続されるように位置合わせされている。このとき、１８０℃、３ＭＰａで２０秒間加熱及び加圧することによって、接着剤２０ｂを特性評価用基板５０に接続した。なお、実施例１，３〜９についても実施例２と同様にして回路接続構造を得た。   FIG. 8 is a perspective view schematically showing a circuit connection structure obtained by connecting the adhesive with wiring of FIG. 4 to the characteristic evaluation substrate of FIG. FIG. 8 shows a circuit connection structure in the second embodiment. In the circuit connection structure 60 shown in FIG. 8, the wiring 2 of the adhesive 20 b is connected to the wirings 6 and 7. The characteristic evaluation substrate 50 and the adhesive 20b are aligned so that one end of the wiring 2 and the wiring 6 are connected over a width of 1 cm, and the other end of the wiring 2 and the wiring 7 are connected over a width of 1 cm. . At this time, the adhesive 20b was connected to the characteristic evaluation substrate 50 by heating and pressing at 180 ° C. and 3 MPa for 20 seconds. In addition, about Example 1, 3-9, it carried out similarly to Example 2, and obtained the circuit connection structure.

（比較例１）
特性評価用基板５０上に、厚さ５０μｍの異方導電フィルム（日立化成工業（株）製、ＡＣ−７０７３Ｚ（製品名））を転写した。続いて、ポリイミドフィルムを作製し、そのポリイミドフィルムの表面上に長さ１０ｃｍの金線を２００μｍピッチで１０本形成してＦＰＣ（Flexible Printed Circuits）を得た。このＦＰＣを、異方導電フィルムを介して特性評価用基板５０に接続した。このとき、１８０℃、３ＭＰａで２０秒間加熱及び加圧することによって、ＦＰＣを特性評価用基板５０に接続した。 (Comparative Example 1)
An anisotropic conductive film (manufactured by Hitachi Chemical Co., Ltd., AC-7073Z (product name)) having a thickness of 50 μm was transferred onto the characteristic evaluation substrate 50. Subsequently, a polyimide film was produced, and 10 gold wires having a length of 10 cm were formed on the surface of the polyimide film at a pitch of 200 μm to obtain FPC (Flexible Printed Circuits). This FPC was connected to the substrate for characteristic evaluation 50 through an anisotropic conductive film. At this time, the FPC was connected to the characteristic evaluation substrate 50 by heating and pressurizing at 180 ° C. and 3 MPa for 20 seconds.

（比較例２）
金線を形成しなかったこと以外は実施例２と同様にして配線が形成されていない接着シートを得た。続いて、この接着シートを特性評価用基板５０に接続した。 (Comparative Example 2)
An adhesive sheet on which no wiring was formed was obtained in the same manner as in Example 2 except that no gold wire was formed. Subsequently, this adhesive sheet was connected to the characteristic evaluation substrate 50.

（接続抵抗の測定）
実施例１〜９及び比較例１，２について、隣接する配線７間の抵抗値を、回路接続の直後（初期）、及び８５℃、８５％ＲＨの高温高湿槽中に５００時間保持した後（高温高湿処理後）にマルチメータで測定した。抵抗値は隣接する配線７間の抵抗９点の平均（ｘ＋３σ）で示した。得られた結果を表１に示す。また、実施例１〜９及び比較例１について、回路接続の工程数及び回路接続に用いる部材点数を表１に示した。 (Measurement of connection resistance)
For Examples 1 to 9 and Comparative Examples 1 and 2, the resistance value between adjacent wirings 7 was held immediately after circuit connection (initial) and in a high-temperature and high-humidity tank at 85 ° C. and 85% RH for 500 hours. It was measured with a multimeter (after high temperature and high humidity treatment). The resistance value is shown as an average (x + 3σ) of nine resistances between adjacent wirings 7. The obtained results are shown in Table 1. Table 1 shows the number of steps for circuit connection and the number of members used for circuit connection for Examples 1 to 9 and Comparative Example 1.

Figure 0005082296
Figure 0005082296

実施例１で用いたフィルム状接着剤は熱可塑性接着剤からなり、実施例２〜９で用いたフィルム状接着剤は熱硬化性接着剤からなるので、実施例２〜９の接続抵抗は、実施例１の接続抵抗と同じか又はそれよりも低くなっている。なお、実施例１において回路の断線は発生しなかった。実施例４，５，８，９で用いたフィルム状接着剤には導電粒子が含まれているため、特に高温高湿処理後の接続抵抗が低い値であった。   Since the film adhesive used in Example 1 consists of a thermoplastic adhesive, and the film adhesive used in Examples 2-9 consists of a thermosetting adhesive, the connection resistance of Examples 2-9 is It is the same as or lower than the connection resistance of the first embodiment. In Example 1, disconnection of the circuit did not occur. Since the film-like adhesives used in Examples 4, 5, 8, and 9 contained conductive particles, the connection resistance after high-temperature and high-humidity treatment was particularly low.

実施例１，４，８，９において、回路接続の工程数は、
（１）特性評価用基板５０を用意する、
（２）特性評価用基板５０の配線７と接着剤２０ｂの配線２とを位置合わせする、
（３）特性評価用基板５０と接着剤２０ｂとを圧着する、
の３工程であった。 In Examples 1, 4, 8, and 9, the number of circuit connection steps is
(1) Prepare a characteristic evaluation substrate 50;
(2) The wiring 7 of the characteristic evaluation substrate 50 and the wiring 2 of the adhesive 20b are aligned.
(3) Crimping the characteristic evaluation substrate 50 and the adhesive 20b;
It was three steps.

実施例２，３，５〜７において、回路接続の工程数は、
（１）特性評価用基板５０を用意する、
（２）特性評価用基板５０の配線７と接着剤２０ｂの配線２とを位置合わせする、
（３）特性評価用基板５０と接着剤２０ｂとを圧着する、
（４）接着剤２０ｂの基材４を剥離する、
の４工程であった。 In Examples 2, 3, 5-7, the number of circuit connection steps is
(1) Prepare a characteristic evaluation substrate 50;
(2) The wiring 7 of the characteristic evaluation substrate 50 and the wiring 2 of the adhesive 20b are aligned.
(3) Crimping the characteristic evaluation substrate 50 and the adhesive 20b;
(4) The base material 4 of the adhesive 20b is peeled off.
4 steps.

比較例１において、回路接続の工程数は、
（１）特性評価用基板５０を用意する、
（２）特性評価用基板５０上に異方導電フィルムを仮圧着する、
（３）異方導電フィルムの基材（セパレータ）を剥離する、
（４）特性評価用基板５０の配線７とＦＰＣの端子とを位置合わせする、
（５）特性評価用基板５０とＦＰＣとを本圧着（接続）する、
の５工程であった。 In Comparative Example 1, the number of circuit connection steps is
(1) Prepare a characteristic evaluation substrate 50;
(2) Temporarily press-bonding an anisotropic conductive film on the substrate for characteristic evaluation 50;
(3) peeling the base material (separator) of the anisotropic conductive film;
(4) The wiring 7 of the characteristic evaluation substrate 50 and the FPC terminal are aligned.
(5) Full pressure bonding (connecting) the characteristic evaluation substrate 50 and the FPC.
5 steps.

また、実施例１〜９では、配線付き接着剤、特性評価用基板５０の２点を部材として用いて回路接続を行った。一方、比較例１では、ＦＰＣ、異方導電フィルム、特性評価用基板５０の３点を部材として用いて回路接続を行った。比較例２では回路接続を行うことができなかった。   Moreover, in Examples 1-9, circuit connection was performed using two points of the adhesive with wiring and the board | substrate 50 for characteristic evaluation as a member. On the other hand, in Comparative Example 1, circuit connection was performed using the three points of FPC, anisotropic conductive film, and characteristic evaluation substrate 50 as members. In Comparative Example 2, circuit connection could not be performed.

第１実施形態に係る配線付き接着剤を模式的に示す斜視図である。It is a perspective view which shows typically the adhesive agent with a wiring which concerns on 1st Embodiment. 第１実施形態に係る配線付き接着剤を回路基板に接続することによって得られる回路接続構造の製造方法の各工程を模式的に示す斜視図である。It is a perspective view which shows typically each process of the manufacturing method of the circuit connection structure obtained by connecting the adhesive agent with wiring which concerns on 1st Embodiment to a circuit board. 第２実施形態に係る配線付き接着剤を模式的に示す斜視図である。It is a perspective view which shows typically the adhesive agent with a wiring which concerns on 2nd Embodiment. 第３実施形態に係る配線付き接着剤を模式的に示す斜視図である。It is a perspective view which shows typically the adhesive agent with a wiring which concerns on 3rd Embodiment. 第４実施形態に係る配線付き接着剤を模式的に示す斜視図である。It is a perspective view which shows typically the adhesive agent with a wiring which concerns on 4th Embodiment. 第５実施形態に係る配線付き接着剤を模式的に示す斜視図である。It is a perspective view which shows typically the adhesive agent with a wiring which concerns on 5th Embodiment. 回路接続構造の特性を評価するための特性評価用基板を模式的に示す斜視図である。It is a perspective view which shows typically the board | substrate for characteristic evaluation for evaluating the characteristic of a circuit connection structure. 図７の特性評価用基板に図４の配線付き接着剤を接続して得られる回路接続構造を模式的に示す斜視図である。It is a perspective view which shows typically the circuit connection structure obtained by connecting the adhesive agent with a wiring of FIG. 4 to the board | substrate for characteristic evaluation of FIG.

符号の説明Explanation of symbols

１，１ａ…フィルム状接着剤、２…配線、４…基材、５，５ａ…別のフィルム状接着剤、２０，２０ａ，２０ｂ，２０ｃ，２０ｄ…配線付き接着剤、２１…フィルム状接着剤の主面、２２…フィルム状接着剤の主面とは反対側の面、Ｐ…導電粒子。
DESCRIPTION OF SYMBOLS 1,1a ... Film adhesive, 2 ... Wiring, 4 ... Base material, 5, 5a ... Another film adhesive, 20, 20a, 20b, 20c, 20d ... Adhesive with wiring, 21 ... Film adhesive , 22 ... surface opposite to the main surface of the film adhesive, P ... conductive particles.

Claims (5)

フィルム状接着剤と、
前記フィルム状接着剤の主面上に設けられた配線と、
前記フィルム状接着剤の前記主面上に、前記配線を覆うように設けられた別のフィルム状接着剤と、
を備える、配線付き接着剤。 And the non-Irumu-like adhesive,
Wiring provided on the main surface of the film adhesive,
On the main surface of the film adhesive, another film adhesive provided to cover the wiring,
An adhesive with wiring. 前記フィルム状接着剤は導電粒子を含有する、請求項１に記載の配線付き接着剤。  The adhesive with wiring according to claim 1, wherein the film-like adhesive contains conductive particles. 前記フィルム状接着剤の前記主面とは反対側の面上に設けられた基材を更に備える、請求項１又は２に記載の配線付き接着剤。 The adhesive with wiring of Claim 1 or 2 further provided with the base material provided on the surface on the opposite side to the said main surface of the said film adhesive. 前記別のフィルム状接着剤は導電粒子を含有する、請求項１〜３のいずれか一項に記載の配線付き接着剤。 The adhesive with wiring according to any one of claims 1 to 3, wherein the another film adhesive contains conductive particles. 請求項１〜４のいずれか一項に記載の配線付き接着剤の前記配線が接続された回路基板を備える、回路接続構造。   A circuit connection structure provided with the circuit board to which the said wiring of the adhesive agent with a wiring as described in any one of Claims 1-4 was connected.
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