JPS63278355A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To prevent external leads from displacing when a resin-sealed semiconductor device is placed by so arranging resin body bumps on the sidewall near the bottom of the resin body at gaps corresponding to the width of the leads, and engaging fixedly the leads in the gap of the bumps. CONSTITUTION:Resin body bumps 2 arranged at gaps corresponding to the width of external leads 3 are formed on the sidewall near the bottom of a resin body 1 for sealing a semiconductor element. Then, the leads 3 connected to the element and externally extended from the sidewall of the body 1 are bent to the bottom of the body 1, engaged in the gaps of the bumps 2 to be fixed, and the ends 4 of the leads 3 are bent toward the bottom of the body 1 in a J shape. Thus, a resin-sealed semiconductor device in which the displacements of the leads are suppressed and the assembling accuracy is improved is obtained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

〔従来の技術〕[Conventional technology]

多数の外部リードを有する樹脂封止型半導体装置の一つ
としてプラスチック・リードレス・チップキャリア・パ
ッケージ（ＰＬＣＣ）と呼ばれる樹脂封止型半導体装置
がある。One type of resin-sealed semiconductor device having a large number of external leads is a resin-sealed semiconductor device called a plastic leadless chip carrier package (PLCC).

第３図（ａ）、（ｂ）は従来の樹脂封止型半導体装置の
一例の平面図および正面図である。FIGS. 3(a) and 3(b) are a plan view and a front view of an example of a conventional resin-sealed semiconductor device.

第３図（ａ）、（ｂ）に示すように、半導体素子（図示
せず）を封止した樹脂体１が設けられ、前記半導体素子
と接続され樹脂体１の側壁より外部へ導出された外部リ
ード３が樹脂体１の底面側へ折曲げられ、外部リード３
の先端部４が樹脂体１の底面に向かって５字型に折曲げ
られる。As shown in FIGS. 3(a) and 3(b), a resin body 1 in which a semiconductor element (not shown) is sealed is provided, and a resin body 1 is connected to the semiconductor element and led out from the side wall of the resin body 1. The external lead 3 is bent toward the bottom side of the resin body 1, and the external lead 3
The tip end portion 4 of the resin body 1 is bent into a five-shape toward the bottom surface of the resin body 1.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の樹脂封止型半導体装置は、外部リードが
樹脂体側壁の外部リード導出部のみで固定されているた
め外部リードの先端部が自由に動き、樹脂封止型半導体
装置を例えば印刷配線基板等に搭載して該印刷配線基板
上の配線や端子に接続するときに外部リードと位置ずれ
を生ずるという問題点があった。In the conventional resin-sealed semiconductor device described above, the external leads are fixed only by the external lead lead-out portion on the side wall of the resin body, so the tips of the external leads can move freely, allowing the resin-sealed semiconductor device to be used, for example, with printed wiring. When mounted on a board or the like and connected to wiring or terminals on the printed wiring board, there is a problem in that positional deviation occurs from external leads.

本発明の目的は、外部リードの位置ずれを抑制し、組立
精度を向上せしめる樹脂封止型半導体装置を提供するこ
とにある。An object of the present invention is to provide a resin-sealed semiconductor device that suppresses displacement of external leads and improves assembly accuracy.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の樹脂封止型半導体装置は、半導体素子を封止し
た樹脂体と、前記半導体素子と接続され前記樹脂体側壁
より外部に導出され前記樹脂体底面側へ折曲げられ且つ
先端が前記樹脂体底面に向けて、１字型に折曲げられた
外部リードとを含む樹脂封止型半導体装置において、前
記樹脂体の底面近傍の側壁に前記外部リードの両端に接
して前記外部リードを固定する樹脂体突起を設けて構成
される。The resin-sealed semiconductor device of the present invention includes a resin body in which a semiconductor element is encapsulated, and a resin body connected to the semiconductor element, led out from a side wall of the resin body, bent toward the bottom side of the resin body, and having a tip end made of the resin body. In a resin-sealed semiconductor device including an external lead bent in a single shape toward the bottom of the body, the external lead is fixed to a side wall near the bottom of the resin body in contact with both ends of the external lead. It is constructed by providing a resin protrusion.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.

第１図（ａ＞、（ｂ）および第２図は本発明の一実施例
を説明するための樹脂封止型半導体装置の平面図と正面
図および一部拡大斜視図である。FIGS. 1A and 2B are a plan view, a front view, and a partially enlarged perspective view of a resin-sealed semiconductor device for explaining an embodiment of the present invention.

第１図（ａ）、（ｂ）および第２図に示すように、半導
体素子（図示せず）を封止した樹脂体１の底面近傍の側
壁に外部リード３の幅に相当する間隙を有して配列され
た樹脂体突起２が設けられる。次に、前記半導体素子と
接続されて樹脂体１の側壁から外部へ導出された外部リ
ード３が樹脂体１の底面側へ折曲げられ且つ樹脂体突起
２の間隙に嵌込まれて位置が固定され、外部リード３の
先端部４が樹脂体１の底面に向って１字型に折曲げられ
る。As shown in FIGS. 1(a), (b) and FIG. 2, a gap corresponding to the width of the external lead 3 is provided on the side wall near the bottom of the resin body 1 in which a semiconductor element (not shown) is sealed. The resin body protrusions 2 are arranged in such a manner that the resin body protrusions 2 are arranged in the same manner. Next, the external lead 3 connected to the semiconductor element and led out from the side wall of the resin body 1 is bent toward the bottom side of the resin body 1, and is fitted into the gap between the resin body protrusions 2 and fixed in position. Then, the tip portion 4 of the external lead 3 is bent into a single shape toward the bottom surface of the resin body 1.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、樹脂体の底面近傍の側壁
に樹脂体突起を外部リード３の幅に相当する間隙を有す
るように配列して設け、樹脂体突起の間隙に外部リード
を嵌込んで固定することにより、樹脂封止型半導体装置
を印刷配線基板等に搭載する場合の外部リードの位置ず
れを防止できる効果を有する。As explained above, in the present invention, the resin body protrusions are arranged on the side wall near the bottom of the resin body so as to have gaps corresponding to the width of the external leads 3, and the external leads are fitted into the gaps between the resin body protrusions. By fixing the resin-sealed semiconductor device to a printed wiring board or the like, it is possible to prevent the external leads from shifting in position.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）、（ｂ）および第２図は本発明の一実施例
を説明するための樹脂封止型半導体装置の平面図と正面
図および一部拡大斜視図、第３図は従来の樹脂封止型半
導体装置の一例の平面図および正面図である。 １・・・樹脂体、２・・・樹脂体突起、３・・・外部リ
ード、４・・・先端部。 代理人　弁理士　内　原　　晋′丁 ＄　１　　肥1(a), (b), and 2 are a plan view, a front view, and a partially enlarged perspective view of a resin-sealed semiconductor device for explaining one embodiment of the present invention, and FIG. 3 is a conventional FIG. 2 is a plan view and a front view of an example of a resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1... Resin body, 2... Resin body protrusion, 3... External lead, 4... Tip part. Agent Patent Attorney Susumu Uchihara $1 Hi

Claims (1)

【特許請求の範囲】[Claims] 半導体素子を封止した樹脂体と、前記半導体素子と接続
され前記樹脂体側壁より外部に導出され前記樹脂体底面
側へ折曲げられ且つ先端が前記樹脂体底面に向けてＪ字
型に折曲げられた外部リードとを含む樹脂封止型半導体
装置において、前記樹脂体の底面近傍の側壁に前記外部
リードの両端に接して前記外部リードを固定する樹脂体
突起を設けたことを特徴とする樹脂封止型半導体装置。a resin body that encapsulates a semiconductor element; and a resin body connected to the semiconductor element, led out from a side wall of the resin body, bent toward the bottom side of the resin body, and whose tip is bent in a J-shape toward the bottom side of the resin body. A resin-sealed semiconductor device comprising a resin-sealed external lead, characterized in that a resin body protrusion is provided on a side wall near a bottom surface of the resin body to touch both ends of the external lead and fix the external lead. Sealed semiconductor device.