JPS63249146A - Mask cleaning device - Google Patents

Mask cleaning device

Info

Publication number
JPS63249146A
JPS63249146A JP62083174A JP8317487A JPS63249146A JP S63249146 A JPS63249146 A JP S63249146A JP 62083174 A JP62083174 A JP 62083174A JP 8317487 A JP8317487 A JP 8317487A JP S63249146 A JPS63249146 A JP S63249146A
Authority
JP
Japan
Prior art keywords
mask
cleaning
chamber
ashing
asher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62083174A
Other languages
Japanese (ja)
Inventor
Iwao Ejiri
磐夫 江尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62083174A priority Critical patent/JPS63249146A/en
Publication of JPS63249146A publication Critical patent/JPS63249146A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the cleaning effect of a mask cleaning device, by providing an asher to be used for ashing the surface of a mask in the device and improving the wettability of the mask surface. CONSTITUTION:An asher section 12 for ashing the surface of a mask is provided. A mask 4 is set on a mask holder 14 provided inside a chamber 13 and a reactive gas is led into the chamber 13 at the moment when a set degree of vacuum is attained after a lid 15 is closed and the chamber 13 is exhausted of air by means of a vacuum pump. Then a high-frequency power is supplied and gaseous plasma is produced between electrodes. The surface of the mask 4 is ashed by means of the plasma for a fixed time. After ashing, the lid 15 is opened and the mask 4 is raised. The mask 4 is then carried to a cleaning section along a carrying path. Therefore, the wettability of the mask surface is improved and organic matters are removed from the mask surface. As a result, the cleaning effect of the mask surface is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体製造工程で使用するマスクやレチク
ルを洗浄する装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for cleaning masks and reticles used in semiconductor manufacturing processes.

〔従来の技術〕[Conventional technology]

第3図は、従来のマスク洗浄装置を示す模式構成図であ
る。図において(1)は洗浄前および洗浄後のマスクを
保管しておく保管部、(2)はマスクを洗浄する洗浄部
、(3)は洗浄後のマスクをイソプロピルアルコール(
以下IPAと略す)の蒸気で乾燥させる乾燥部、(4)
はマスク、(5)は装置内でのマスクの搬送経路、(6
)はマスク(4)表面をこすることによりマスク上のゴ
ミを落とす回転ブラシ、(力はブラシ(6)によるマス
ク洗浄を行なう際にブラシ(6)およびマスク(4)の
表面に洗剤をかける洗剤ノズル、(8)はブラシ(6)
によるマスク洗浄終了後にマスク(4)上に残っている
ゴミ、洗剤等を洗い流す純水ノズル、(9)は洗浄後の
マスク(4)を蒸気により乾かすIPA、(10)はI
PA(9)を蒸気にするために乾燥部(3)の下部に取
り付けられて加熱するヒーター、(11)はIPA蒸気
が乾燥部(3)の外部にもれるのを防ぐ冷却コイルであ
る。
FIG. 3 is a schematic configuration diagram showing a conventional mask cleaning apparatus. In the figure, (1) is a storage section where masks are stored before and after cleaning, (2) is a cleaning section where masks are cleaned, and (3) is a cleaning section where masks are cleaned using isopropyl alcohol.
(hereinafter abbreviated as IPA) drying section for drying with steam; (4)
is the mask, (5) is the mask transport path within the device, and (6
) is a rotating brush that removes dust on the mask by scrubbing the surface of the mask (4); Detergent nozzle, (8) is a brush (6)
(9) is a pure water nozzle that washes away dust, detergent, etc. remaining on the mask (4) after mask cleaning is completed, (9) is an IPA that dries the mask (4) after cleaning with steam, and (10) is an IPA nozzle that uses steam to dry the mask (4) after cleaning.
A heater (11) is attached to the lower part of the drying section (3) to heat the PA (9) to vaporize it, and a cooling coil (11) prevents IPA vapor from leaking to the outside of the drying section (3).

次に動作について説明する。保管部(1)に保管されて
いた洗浄すべきマスク(4)は縦に保持された状態で洗
浄部(2)上方に位置決めされ、ブラシ(6)下部まで
下降する。その後ブラシ(6)が回転し、洗剤ノズル(
7)から洗剤が純水ノズル(8)から純水が噴霧された
状態において、マスク(4)がブラシ(6)の間を上昇
し、洗浄が終了する。洗浄終了後、マスク(4)は乾燥
部(3)上方まで移動し、そして冷却コイル(11)よ
り下部のIPA蒸気が満ちている空間まで下降し、蒸気
乾燥が行なわれる。
Next, the operation will be explained. The mask (4) to be cleaned, which has been stored in the storage section (1), is held vertically and positioned above the cleaning section (2), and is lowered to the bottom of the brush (6). The brush (6) then rotates and the detergent nozzle (
In the state where the detergent is sprayed from the pure water nozzle (8) from step 7), the mask (4) moves up between the brushes (6) and the cleaning is completed. After the cleaning is completed, the mask (4) is moved above the drying section (3) and then lowered to a space filled with IPA vapor below the cooling coil (11), where vapor drying is performed.

蒸気乾燥終了後、マスク(4)は保管部(1)に移動し
、保管されることにより、一連の洗浄動作が終了する。
After the steam drying is completed, the mask (4) is moved to the storage section (1) and stored, thereby completing a series of cleaning operations.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のマスク洗浄装置は以上のように構成されていたた
め、洗浄前のマスク表面が疎水性のまま洗浄作業が行な
われていた。このために洗剤および純水とマスク表面の
なじみが悪いため、マスク表面に付着しているゴミがマ
スク表面より浮き上がらず、ゴミを洗い流す能力が低下
していた。
Since the conventional mask cleaning apparatus is configured as described above, the cleaning operation is performed while the mask surface remains hydrophobic before cleaning. For this reason, the detergent and pure water do not fit well with the mask surface, so that the dust adhering to the mask surface cannot be lifted off the mask surface, reducing the ability to wash away dust.

この発明は上記のような問題点を解消するためになされ
たもので、洗浄前のマスクを7ツシングすることにより
マスク表面の濡れ性の改善および有機物の除去をするこ
とにより洗浄能力が向上するマスク洗浄装置を得ること
を目的とする。
This invention was made to solve the above-mentioned problems, and provides a mask that improves the cleaning ability by improving the wettability of the mask surface and removing organic substances by tucking the mask before cleaning. The purpose is to obtain a cleaning device.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るマスク洗浄装置は、マスク表面をアッシ
ングするためのアッシャ−を装置内に設け、マスク表面
の濡れ性を改善すること番こより、洗浄効果の向上をは
かると共に、一連の洗浄動作を装置内で行なうことによ
り乾燥したマスクを得るまでの洗浄工程の能力を低下さ
せないようにしたものである。
The mask cleaning device according to the present invention is provided with an asher for ashing the mask surface in the device to improve the wettability of the mask surface, thereby improving the cleaning effect and performing a series of cleaning operations in the device. By performing the cleaning process inside the chamber, the performance of the cleaning process until a dry mask is obtained is not reduced.

〔作用〕[Effect]

この発明では、洗浄前のマスク表面をアッシングするこ
とによりマスク表面が疎水性から親水性にかわり、マス
ク表面が洗剤、純水となじみがよくなり、付着していた
ゴミが浮き上がり、ブラシによる洗浄の際にゴミが落ち
やすくなると共にマスク表面に付着した有機物がアッシ
ングすることにより除去される。
In this invention, by ashing the mask surface before cleaning, the mask surface changes from hydrophobic to hydrophilic, making the mask surface compatible with detergent and pure water, and the attached dirt is lifted, making cleaning with a brush easier. At the same time, dust falls off easily, and organic matter adhering to the mask surface is removed by ashing.

〔実施例〕〔Example〕

以下、この発明の一実施例を第1図および第2図につい
て説明する。これらの図において(1)〜(11)は第
3図に示したものと同じであり、(12)はマスク表面
をアッシングするアッシャ一部、(13)はアッシャ一
部内に備えられたチャンバー、(14)はチャンバー内
でのマスクの姿勢を一定に保つためのマスクホルダー、
(15)はアッシャ一部上力にありアッシング中は閉じ
ていてチャンバー(13)上部と接触している蓋、(1
6)は蓋(15)を開閉させるシリンダーである。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. In these figures, (1) to (11) are the same as those shown in FIG. 3, (12) is a part of the asher for ashing the mask surface, (13) is a chamber provided in the part of the asher, (14) is a mask holder for keeping the posture of the mask constant in the chamber;
(15) is a lid that is partially in the upper position of the asher and is closed during ashing and is in contact with the upper part of the chamber (13);
6) is a cylinder that opens and closes the lid (15).

次に動作について説明する。保管部(1)に収納された
洗浄すべきマスク(4)は縦に保持された状態で経路(
5)に従って7ツシヤ一部(工2)の上方に位置決めさ
れる。その後マスク(4)は下降しチャンバー(13)
内に設けられたマスクホルダー(14)上にセットされ
ろ。次に蓋(15)が閉じチャンバー(13)内を真空
ポンプ(図示せず)で排気して設定の真空度(数ミIJ
)−ル)Iこ達した時点で、反応ガス(08等)をチャ
ンバー(13)内に流し込む。そして電源より高周波電
力を供給して電極間(図示せず)にガスプラズマを発生
させ、マスクの表面を一定時間アツシングする。アッシ
ング終了後蓋(15)が開き、マスク(4)が上昇し搬
送経路(5)にしたがって、洗浄部(2)上部に位置決
めされる。以下の洗浄手順は従来の装置と同様なので説
明を省略する。
Next, the operation will be explained. The mask (4) to be cleaned stored in the storage section (1) is held vertically along the path (
According to 5), it is positioned above part of the 7th shear (work 2). The mask (4) then descends into the chamber (13).
Place it on the mask holder (14) provided inside. Next, the lid (15) is closed and the inside of the chamber (13) is evacuated using a vacuum pump (not shown) to set the vacuum level (several milliliter
)-r)I When this is reached, the reaction gas (08 etc.) is flowed into the chamber (13). Then, high-frequency power is supplied from a power source to generate gas plasma between the electrodes (not shown), and the surface of the mask is ashed for a certain period of time. After ashing is completed, the lid (15) is opened and the mask (4) is raised and positioned above the cleaning section (2) along the transport path (5). The following cleaning procedure is the same as that of the conventional apparatus, so the explanation will be omitted.

なお上記実施例では、マスク(4)を7ツシヤ一部(1
2)へ上部より搬入・搬出する場合を示したがチャンバ
ー(13)を横にしてマスク(4)を横方向から搬入・
搬出するようにしても同様の効果が得られる。
In addition, in the above example, the mask (4) is made up of 7 pieces and a part (1 piece).
2) The case of loading and unloading from the top is shown, but it is also possible to load and unload the mask (4) from the side with the chamber (13) on its side.
A similar effect can be obtained even if it is carried out.

また第2図ではマスク(4)をチャンバー(13)内で
たてた状態を示しているが、水平にしてもよくまたチャ
ンバー(13)は円筒に描いているが長方形でも正方形
でも同様の効果が得られる。
Also, although Figure 2 shows the mask (4) standing upright inside the chamber (13), it can also be placed horizontally.Although the chamber (13) is drawn as a cylinder, the same effect can be achieved with a rectangular or square chamber. is obtained.

〔発明の効果〕 以上のように、この発明によればマスク表面をアッシン
グし濡れ性を改善しかつ有機物を除去することによりブ
ラシによる洗浄効果を高められる。このことによりマス
ク洗浄装置の生産性が向上する。
[Effects of the Invention] As described above, according to the present invention, the cleaning effect of the brush can be enhanced by ashing the mask surface to improve wettability and remove organic substances. This improves the productivity of the mask cleaning device.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例によるマスク洗浄装置を示
す模式図、第2図はアッシャ一部の斜視図、第3図は従
来のマスク洗浄装置の模式図中、(1)は保管部、(2
)は洗浄部、(3)は乾燥部、(4)はマスク、(5)
は搬送経路、(6)はブラシ、(7)はミ先剤ノズル、
(8)は純水ノズル、(9)はイソピロピルアルコール
、(10)はヒーター、(11)は冷却コイル、(12
)はアッシャ一部、(13)はチャンバー、(14)は
マスクホルダー、(15)は蓋、(16)はシリンダー
である。 なお図中同一符号は同一または相当部分を示す。 代理人 弁理士  大  岩  増  雄第3図 偽吻寸Sす
FIG. 1 is a schematic diagram showing a mask cleaning device according to an embodiment of the present invention, FIG. 2 is a perspective view of a part of the asher, and FIG. 3 is a schematic diagram of a conventional mask cleaning device, in which (1) is a storage section. ,(2
) is the cleaning section, (3) is the drying section, (4) is the mask, (5)
is the conveyance path, (6) is the brush, (7) is the tip agent nozzle,
(8) is a pure water nozzle, (9) is isopropyl alcohol, (10) is a heater, (11) is a cooling coil, (12) is a
) is a part of the asher, (13) is a chamber, (14) is a mask holder, (15) is a lid, and (16) is a cylinder. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent: Masuo Oiwa, Patent Attorney Figure 3 False snout size S

Claims (1)

【特許請求の範囲】[Claims] (1)洗浄すベきマスクを保持して該マスクを洗浄部、
乾燥部に搬入および搬出する搬送手段を備えたマスク洗
浄装置において、装置内で一連の洗浄動作が行なえかつ
マスク表面をアツシングするアツシヤーを装置内に備え
たことを特徴とするマスク洗浄装置。
(1) Hold the mask to be cleaned and transfer the mask to the cleaning section.
What is claimed is: 1. A mask cleaning device equipped with a conveying means for loading and unloading the mask into a drying section, characterized in that the device is capable of performing a series of cleaning operations within the device and is equipped with an assher for ashing the surface of the mask.
JP62083174A 1987-04-03 1987-04-03 Mask cleaning device Pending JPS63249146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62083174A JPS63249146A (en) 1987-04-03 1987-04-03 Mask cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62083174A JPS63249146A (en) 1987-04-03 1987-04-03 Mask cleaning device

Publications (1)

Publication Number Publication Date
JPS63249146A true JPS63249146A (en) 1988-10-17

Family

ID=13794919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62083174A Pending JPS63249146A (en) 1987-04-03 1987-04-03 Mask cleaning device

Country Status (1)

Country Link
JP (1) JPS63249146A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04163456A (en) * 1990-10-26 1992-06-09 Nec Kyushu Ltd Reticle washing device
JPH04186351A (en) * 1990-11-21 1992-07-03 Nec Kyushu Ltd Cleaning of reticle
KR101098968B1 (en) * 2010-08-03 2011-12-28 (주)지니아텍 Deposition mask cleaning apparatus and method for active matrix organic light emitting diode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04163456A (en) * 1990-10-26 1992-06-09 Nec Kyushu Ltd Reticle washing device
JPH04186351A (en) * 1990-11-21 1992-07-03 Nec Kyushu Ltd Cleaning of reticle
KR101098968B1 (en) * 2010-08-03 2011-12-28 (주)지니아텍 Deposition mask cleaning apparatus and method for active matrix organic light emitting diode

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