JP2002126678A - Method and apparatus for cleaning tightly closed type container - Google Patents
Method and apparatus for cleaning tightly closed type containerInfo
- Publication number
- JP2002126678A JP2002126678A JP2000325836A JP2000325836A JP2002126678A JP 2002126678 A JP2002126678 A JP 2002126678A JP 2000325836 A JP2000325836 A JP 2000325836A JP 2000325836 A JP2000325836 A JP 2000325836A JP 2002126678 A JP2002126678 A JP 2002126678A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- container
- drying
- tank
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウエハ等の半導体
基板を収納するための密閉型容器を洗浄する方法及び装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cleaning an airtight container for housing a semiconductor substrate such as a wafer.
【０００２】[0002]
【従来の技術】半導体の製造は多数の工程を極めて高い
クリーン度のもとで行わなければならないが、全ての工
程におよぶ広大な環境を高いクリーン度に保つのはコス
ト面で限界がある。このため、最近では局所環境（ミニ
・エンバイロメント）だけを高いクリーン度に保つ手段
の開発が進められている。例えば、ウエハをＦＯＵＰ
（Front Opening Unified Pod）と呼ばれる密閉型容器
で搬送し、密閉型容器ごとウエハを半導体製造工程に入
れ、密閉型容器を直接製造装置とドッキングさせて作業
を進めるもので、密閉型容器内部の環境を管理すること
で製造工程内におけるウエハの高いクリーン度を維持す
ることができることになる。2. Description of the Related Art In the manufacture of semiconductors, a large number of processes must be carried out under extremely high cleanliness. However, maintaining a vast environment covering all processes at high cleanliness has a limit in terms of cost. For this reason, recently, means for maintaining only a local environment (mini environment) at a high degree of cleanliness has been developed. For example, FOUP
(Front Opening Unified Pod), which is transported in a sealed container, puts the wafer into the semiconductor manufacturing process together with the sealed container, and docks the sealed container directly with the manufacturing equipment to proceed with the work. , It is possible to maintain a high degree of cleanness of the wafer in the manufacturing process.
【０００３】ところで、このような密閉型容器は、多数
のウエハを収納して搬送するのであるが、その際にウエ
ハと容器内面とが擦れて内部にパーティクル等の汚れが
生じ、また容器はクリーン度の低いところを移送される
ため外面が汚染され易く、蓋を外したときに内部に収納
したウエハを汚染するおそれがある。そこで、容器を定
期的に洗浄する必要がある。By the way, such a closed type container accommodates and transports a large number of wafers. At this time, the wafers rub against the inner surface of the container, thereby causing dirt such as particles inside the container, and the container being cleaned. The outer surface is easily contaminated because it is transported at a low temperature, and there is a possibility that the wafer stored inside may be contaminated when the lid is removed. Therefore, it is necessary to periodically clean the container.
【０００４】従来、密閉型容器の洗浄方法は、容器本体
の方は蓋を外した状態で開口部を下側に向けて洗浄槽中
に配置し、先ず内外面を高圧シャワーで洗浄し、洗浄が
終了した時点で容器内外にクリーン温風を吹き付けて乾
燥させている。Conventionally, in a method of cleaning a closed container, the container main body is disposed in a cleaning tank with an opening directed downward with a lid removed, and the inner and outer surfaces are first cleaned by a high-pressure shower, and the cleaning is performed. When the process is completed, clean hot air is blown into and out of the container to dry the container.
【０００５】[0005]
【発明が解決しようとする課題】ところが、ウエハ等の
半導体基板を収納する密閉型容器は、サブミクロン粒子
の汚れを除去する必要があるが、高圧シャワーによる洗
浄のみでは満足する洗浄性を得られない。また、洗浄後
の乾燥においても、ウエハ搬送容器のように形状が複雑
で重なり合うような部分が多い容器では、温風吹きつけ
により完全乾燥させるには約４０分を要する。温風の温
度を高めれば乾燥時間を短縮することが可能ではないか
と考えられるが、容器の材質が樹脂（耐熱１００℃）で
あるので温度をあまり高くすることができない（通常７
０〜８０℃）。However, in a closed container for storing a semiconductor substrate such as a wafer, it is necessary to remove submicron particles, but satisfactory cleaning properties can be obtained only by cleaning with a high pressure shower. Absent. Also, in the drying after cleaning, in a container having a complicated shape and many overlapping portions such as a wafer transfer container, it takes about 40 minutes to completely dry by blowing hot air. It is considered that if the temperature of the hot air is increased, the drying time can be shortened. However, since the material of the container is a resin (heat resistance of 100 ° C.), the temperature cannot be increased much (usually 7).
0-80 ° C).
【０００６】本発明の課題は、付着したサブミクロン粒
子まで洗浄除去でき、かつ短時間で乾燥させることがで
きる密閉型容器の洗浄方法及び洗浄装置の提供にある。[0006] An object of the present invention is to provide a method and an apparatus for cleaning a hermetically sealed container capable of cleaning and removing attached submicron particles and drying in a short time.
【０００７】[0007]
【課題を解決するための手段】上述課題を解決するため
に、本発明は、次のような手段を採用した。請求項１の
密閉型容器の洗浄方法は、超音波洗浄槽内に洗浄液を供
給するとともに蓋を外した密閉型容器をその開口部を下
に向けて前記洗浄液中に浸漬し、かつ前記容器の内部に
残留するエアを排出して超音波洗浄を行う工程と、洗浄
液を排出し或いはそのままで容器の内外部を高圧シャワ
ーにて洗浄する工程とを有する洗浄工程と、前記洗浄工
程を終了した密閉型容器を乾燥槽に搬送して熱風を送り
込み熱風加熱する工程と、乾燥槽内を減圧して減圧乾燥
する工程とを有する乾燥工程とを備えたものである。こ
の場合に、前記洗浄工程は、超音波洗浄を行う工程と高
圧シャワーによる洗浄工程とを交互に複数回繰り返すよ
うに構成し、前記乾燥工程も熱風加熱する工程と減圧工
程とを交互に複数回繰り返すように構成するのが好まし
い。In order to solve the above-mentioned problems, the present invention employs the following means. The method for cleaning a closed container according to claim 1 includes supplying a cleaning liquid into an ultrasonic cleaning tank and immersing the closed container with the lid removed with the opening thereof downward in the cleaning liquid, and A step of discharging the air remaining inside to perform ultrasonic cleaning, a step of discharging the cleaning liquid or cleaning the inside and outside of the container with a high-pressure shower as it is, and a hermetic seal after the cleaning step is completed The drying method includes a step of transporting the mold container to a drying tank and feeding hot air thereinto to heat it with hot air, and a step of reducing the pressure in the drying tank and drying under reduced pressure. In this case, the cleaning step is configured to alternately repeat the step of performing ultrasonic cleaning and the step of cleaning with a high-pressure shower a plurality of times, and the drying step is also performed by alternately performing the step of heating with hot air and the step of depressurizing a plurality of times. It is preferable to configure so as to repeat.
【０００８】請求項３の密閉型容器の洗浄装置は、蓋を
外した密閉型容器を、その開口部を下にした状態で載置
し昇降する機構を有するとともに、洗浄液を噴射する高
圧シャワーを有し、かつ洗浄液中に前記容器を浸漬する
際に前記容器の内部に残留するエアを排出する機構を備
え、超音波振動による超音波洗浄が行える超音波洗浄槽
と、前記超音波洗浄槽による洗浄工程を終了した密閉型
容器を収納して熱風を送り込み熱風加熱させる熱風送風
機構を有するとともに、内部を減圧する減圧機構を有す
る乾燥槽とを備えたものである。なお、この場合に前記
超音波洗浄槽は、高圧シャワー洗浄と超音波洗浄と交互
に複数回繰り返すように構成し、前記乾燥槽も熱風加熱
と減圧乾燥とを交互に複数回繰り返すように構成するの
が好ましい。[0008] In a third aspect of the present invention, there is provided an apparatus for cleaning a closed container, which has a mechanism for placing and lifting the closed container with the lid removed with its opening down, and a high-pressure shower for spraying a cleaning liquid. An ultrasonic cleaning tank having a mechanism for discharging air remaining inside the container when immersing the container in a cleaning liquid, and performing ultrasonic cleaning by ultrasonic vibration, and It has a hot-air blowing mechanism for housing the closed type container after the washing step and sending hot air to heat it with hot air, and a drying tank having a depressurizing mechanism for depressurizing the inside. In this case, the ultrasonic cleaning tank is configured to alternately repeat high-pressure shower cleaning and ultrasonic cleaning multiple times, and the drying tank is configured to alternately repeat hot-air heating and drying under reduced pressure multiple times. Is preferred.
【０００９】[0009]
【発明の実施の形態】以下、図面を参照して、本発明に
係る密閉型容器の洗浄装置の実施の形態について説明す
る。図１は、本発明に係る密閉型容器の洗浄装置の実施
の形態を模式的に表した図である。密閉型容器の洗浄装
置１０は従来のものと異なり、洗浄部と乾燥部とが分離
されている。すなわち、洗浄部は洗浄槽２０により構成
され、乾燥部は乾燥槽３０によって構成されている。前
記洗浄槽２０は、洗浄液を貯留することができる洗浄槽
本体２１を有しており、該洗浄槽本体２１の底面には超
音波振動子２２が取り付けられていて超音波洗浄が行え
るように構成されている。また、洗浄槽２０は、蓋を外
した密閉型容器１００を開口部を下にした状態で載置す
る受台２３を有する。この受台２３は、洗浄槽本体２１
の液面より上方で密閉型容器１００を受け、洗浄槽本体
２１内に貯留する洗浄液２４中に出し入れできるように
昇降自在に構成されたものである。なお、密閉型容器１
００を受台２４を洗浄槽本体２１内に下降させておき、
後から洗浄液２４を供給することも当然可能である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an apparatus for cleaning a closed container according to the present invention. FIG. 1 is a view schematically showing an embodiment of a closed container cleaning apparatus according to the present invention. The cleaning device 10 for a closed container differs from the conventional one in that a cleaning unit and a drying unit are separated. That is, the washing section is constituted by the washing tank 20, and the drying section is constituted by the drying tank 30. The cleaning tank 20 has a cleaning tank main body 21 capable of storing a cleaning liquid, and an ultrasonic vibrator 22 is attached to a bottom surface of the cleaning tank main body 21 so that ultrasonic cleaning can be performed. Have been. Further, the cleaning tank 20 has a receiving table 23 on which the closed container 100 with the lid removed is placed with the opening part down. The receiving table 23 is provided with the cleaning tank main body 21.
The container is configured so as to be able to move up and down so as to receive the closed container 100 above the liquid level of the cleaning liquid 24 and to put it in and out of the cleaning liquid 24 stored in the cleaning tank main body 21. In addition, closed container 1
00, the receiving stand 24 is lowered into the cleaning tank main body 21,
Of course, it is also possible to supply the cleaning liquid 24 later.
【００１０】開口部を下側にした密閉型容器１００を洗
浄液中に浸漬していくと、密閉型容器１００の内部に溜
まっているエアを排出する機構が必要になる。この洗浄
槽２０では、図３に示すように、前記受台２３と一体に
組み付けられて先端部が受台２３に載置された密閉型容
器１００の底近傍まで届くエア抜きパイプ２５が設けら
れており、受台２３が降下して密閉型容器１００が洗浄
液中に浸漬されていくと、容器１００内に残留するエア
は容器１００の重量により圧力が高まりエア抜きパイプ
２５を介して自然に排出される。なお、エア抜きパイプ
２５は、図４に示すように、洗浄槽本体２１の中に支持
具２６によって固定させておいてもよい。その場合、エ
ア抜きパイプ２５の先端部は受台２３が降下して密閉型
容器１００が洗浄液中に浸漬され最も下にきたときに、
密閉型容器１００の底近傍まで届くように配置する必要
がある。この方法で行う場合、洗浄液は密閉型容器１０
０が洗浄槽本体２１内の受台２３に置かれた状態で供給
する。洗浄液が供給されて洗浄槽本体２１内の液面が上
昇するにしたがって、密閉型容器１００中の空気は徐々
にエア抜きパイプ２５を通って排出される。When the hermetically sealed container 100 whose opening is on the lower side is immersed in the cleaning liquid, a mechanism for discharging the air accumulated inside the hermetically sealed container 100 becomes necessary. As shown in FIG. 3, the cleaning tank 20 is provided with an air release pipe 25 that is assembled integrally with the receiving stand 23 and has a tip portion reaching the vicinity of the bottom of the closed container 100 placed on the receiving stand 23. When the pedestal 23 descends and the closed container 100 is immersed in the cleaning liquid, the pressure of the air remaining in the container 100 increases due to the weight of the container 100, and the air is naturally discharged through the air vent pipe 25. Is done. The air release pipe 25 may be fixed in the cleaning tank main body 21 by a support 26 as shown in FIG. In that case, when the pedestal 23 descends and the hermetic container 100 is immersed in the cleaning liquid and comes to the lowest position,
It is necessary to arrange so as to reach near the bottom of the closed container 100. When this method is used, the cleaning liquid is supplied in a closed container 10.
0 is supplied in a state of being placed on a receiving table 23 in the cleaning tank main body 21. As the cleaning liquid is supplied and the liquid level in the cleaning tank main body 21 rises, the air in the closed container 100 is gradually discharged through the air vent pipe 25.
【００１１】また、洗浄槽２０の受台２３には、密閉型
容器１００の内面を洗浄するため先端部から洗浄液を噴
射する高圧シャワー用配管２７が並設されているととも
に、洗浄槽本体２１の側面にも密閉型容器１００の外面
を高圧シャワー洗浄するため多数のノズル２８が設けら
れており、これらノズル２８には高圧シャワー用配管
（図示を省略）が接続されている。なお、エア抜きパイ
プ２５が前述したのように、洗浄槽本体２１側に直接取
り付ける場合には、高圧シャワー用配管２７も、同様に
洗浄槽本体２１側に設けることになる。また、図におけ
る、符号２９は洗浄槽本体２１の側面に設けられている
オーバーフロー装置である。また、洗浄液を供給する機
構や排出する機構は従来と同様の構成になっているので
図示を省略した。A high pressure shower pipe 27 for spraying a cleaning liquid from a tip portion for cleaning the inner surface of the sealed container 100 is arranged in parallel with a receiving stand 23 of the cleaning tank 20. A number of nozzles 28 are also provided on the side surface for high-pressure shower cleaning of the outer surface of the sealed container 100, and high-pressure shower piping (not shown) is connected to these nozzles 28. When the air release pipe 25 is directly attached to the cleaning tank main body 21 side as described above, the high pressure shower pipe 27 is also provided on the cleaning tank main body 21 side. In the figure, reference numeral 29 denotes an overflow device provided on a side surface of the cleaning tank body 21. Also, the mechanism for supplying and discharging the cleaning liquid has the same configuration as that of the related art, and thus is not shown.
【００１２】次に、乾燥槽３０について説明する。乾燥
槽３０は、図１に示すように、上辺にスライド蓋３１ａ
を有する密閉型の乾燥槽本体３１を有しており、該乾燥
槽本体３１内部には、開口部を下側に向けた密閉型容器
１００を載置する受台３３が設けられている。また、乾
燥槽本体３１には、熱風送風機３４が取り付けられてい
る。この熱風送風機３４は、ブロア３４ａ、ヒータ３４
ｂ、フィルタ（HEPA: high efficiency particulate fi
lter）３４ｃにより構成されており、バルブＶ１を介し
て配管３６により乾燥槽本体３１に接続されている。ま
た、配管３６の一部３６ａは分岐され乾燥槽本体３１の
側面を貫通して前記受台３３の下側から上方に延出され
ていて、受台３３に載置された密閉型容器１００の内面
に、外面と同様に熱風（７０〜８０℃、最高９０℃）を
送ることができるようになっている。Next, the drying tank 30 will be described. The drying tank 30 has a slide lid 31a on the upper side as shown in FIG.
The inside of the drying tank main body 31 is provided with a receiving table 33 on which the closed container 100 having an opening directed downward is placed. Further, a hot air blower 34 is attached to the drying tank main body 31. The hot air blower 34 includes a blower 34a, a heater 34
b, Filter (HEPA: high efficiency particulate fi
lter) 34c, and is connected to the drying tank main body 31 by a pipe 36 via a valve V1. A part 36 a of the pipe 36 is branched and penetrates through the side surface of the drying tank main body 31 and extends upward from below the receiving table 33. Hot air (70 to 80 ° C, maximum 90 ° C) can be sent to the inner surface in the same manner as the outer surface.
【００１３】また、乾燥槽本体３１の底面には、排気用
配管３７が取り付けられており、該排気用配管３７には
バルブＶ２を介して真空ポンプ３５が取り付けられてい
るととともに、排気用配管３７にはバルブＶ３を介して
熱風排気と、バルブＶ４を介してドレインも排出できる
ように構成されている。An exhaust pipe 37 is attached to the bottom of the drying tank main body 31, and a vacuum pump 35 is attached to the exhaust pipe 37 via a valve V2. 37 is configured such that hot air can be exhausted through a valve V3 and the drain can be exhausted through a valve V4.
【００１４】次に、この密閉型容器１００の洗浄装置の
使用方法について説明する。先ず、図２に示すような搬
送機５０によって洗浄対象物である密閉型容器１００
を、図１に示す洗浄槽２０まで搬送する。搬送機５０
は、左右方向に移動自在でかつ昇降自在な本体５１を有
しており、本体５１の上部５１ａから水平に２本の平行
なバー５２が延びていて、それぞれのバー５２には２本
のアーム５３が垂直に固着されている。各アーム５３の
下端部は内側に曲げられており、開口部が下側になった
密閉型容器１００の開口部端部を支持するフック５３ａ
として形成されている。また、前記棒５２は、本体５１
の上部５１ａ内に設けられた装置によって回転するよう
に構成されており、バー５２を回転させると、バー５２
に固着されているアーム５３は図の矢印Ａのように動
く。Next, a method of using the cleaning device for the closed container 100 will be described. First, a sealed container 100 to be cleaned by a transfer device 50 as shown in FIG.
Is transported to the cleaning tank 20 shown in FIG. Transfer machine 50
Has a main body 51 that is movable in the left-right direction and that can move up and down. Two parallel bars 52 extend horizontally from the upper part 51a of the main body 51, and each bar 52 has two arms. 53 is fixed vertically. The lower end of each arm 53 is bent inward, and a hook 53a that supports the end of the opening of the sealed container 100 with the opening facing down.
It is formed as. The rod 52 is attached to the main body 51.
It is configured to rotate by a device provided in the upper portion 51a of the
The arm 53 fixed to the arm moves as shown by the arrow A in the figure.
【００１５】このアーム５３のフック５３ａによって、
開口部が下側に向いた密閉型容器１００の開口部端部を
支持して、容器１００を洗浄槽２０の上方まで搬送し、
アーム５３を開いて容器１００を受台２３に移す。洗浄
槽本体２１内には、純水（洗浄液）を所定量供給する。
純水の供給が終了したらバルブＶ５を閉め、バルブＶ６
を開けておく。容器１００を載置した受台２３はエア抜
きパイプ２５と一体となって洗浄槽本体２１の洗浄液２
４の中に下降していく。容器１００の内部に溜まってい
るエアはエア抜きパイプ２５を介して開けてあるバルブ
Ｖ６を介し自然に排出される。受台２３が所定位置まで
降下したら止まり、洗浄槽本体２１の底面に取り付けら
れている超音波振動子２２を振動させ容器１００を超音
波洗浄する。By the hook 53a of the arm 53,
The opening supports the end of the opening of the closed type container 100 facing downward, and conveys the container 100 to above the cleaning tank 20,
The arm 53 is opened and the container 100 is moved to the cradle 23. A predetermined amount of pure water (cleaning liquid) is supplied into the cleaning tank body 21.
When the supply of pure water is completed, the valve V5 is closed and the valve V6 is closed.
Open. The receiving stand 23 on which the container 100 is placed is integrated with the air release pipe 25 and the cleaning liquid 2 in the cleaning tank main body 21.
It descends into 4. The air accumulated inside the container 100 is naturally discharged through a valve V6 opened through an air release pipe 25. When the cradle 23 descends to a predetermined position, it stops and the ultrasonic vibrator 22 attached to the bottom of the cleaning tank body 21 is vibrated to ultrasonically clean the container 100.
【００１６】超音波洗浄を所定時間行った後、洗浄槽本
体２１内の洗浄液２４を排水して、バルブＶ６を閉め
て、バルブＶ５を開けて純水を高圧シャワー用配管２７
及びノズル２８に供給して容器１００の内外面に高圧シ
ャワー洗浄を行う。この時当然に、洗浄槽本体２１の排
水口は開けておき、高圧シャワーで使用した純水を排出
する。所定時間高圧シャワー洗浄を行った後、洗浄槽本
体２１の排水口を閉めて中に純水を供給し、先ほどと同
じように所定時間超音波洗浄を行い、排水して続いて高
圧シャワー洗浄を行う。超音波洗浄と高圧シャワー洗浄
とを交互に数回繰り返して洗浄を終了する。勿論、繰り
返しを行わなくても汚れを除去できれば繰り返えさなく
てもよい。なお、上記の例では、高圧シャワー洗浄を行
うときに、洗浄液２４を排出して行ったが、排出しない
状態のまま液中噴流洗浄を行ってもよい。また、洗浄対
象の汚れの種類によって超音波洗浄と高圧シャワー洗浄
のいずれか一方のみを行うこともできる。After performing the ultrasonic cleaning for a predetermined time, the cleaning liquid 24 in the cleaning tank main body 21 is drained, the valve V6 is closed, the valve V5 is opened, and pure water is supplied to the high pressure shower pipe 27.
And the high pressure shower cleaning is performed on the inner and outer surfaces of the container 100 by supplying the high pressure shower to the nozzle 28. At this time, naturally, the drain port of the cleaning tank main body 21 is opened, and the pure water used in the high-pressure shower is discharged. After performing the high-pressure shower cleaning for a predetermined time, the drain port of the cleaning tank main body 21 is closed, pure water is supplied therein, ultrasonic cleaning is performed for a predetermined time in the same manner as above, drainage is performed, and then high-pressure shower cleaning is performed. Do. The cleaning is completed by repeating the ultrasonic cleaning and the high pressure shower cleaning alternately several times. Of course, it is not necessary to repeat the process as long as dirt can be removed without performing the process. In the above example, the high-pressure shower cleaning is performed by discharging the cleaning liquid 24. However, the submerged jet cleaning may be performed without discharging the cleaning liquid. Further, only one of ultrasonic cleaning and high-pressure shower cleaning can be performed depending on the type of dirt to be cleaned.
【００１７】洗浄が終了すると、受台２３が洗浄槽本体
２１の上方まで上昇し、搬送機５０のアーム５３によっ
て容器１００が受け取られ乾燥槽３０の上方まで搬送さ
れる。乾燥槽本体３１の上部の蓋３１ａが開くと、搬送
機５０が下降して容器１００を乾燥槽本体３１内に設け
られた受台３３に移す。容器１００を放した搬送機５０
は上昇し、乾燥槽本体３１の蓋３１ａが閉じられる。When the washing is completed, the receiving stand 23 is raised above the washing tank main body 21, and the container 100 is received by the arm 53 of the transfer device 50 and is transferred above the drying tank 30. When the lid 31a on the upper part of the drying tank main body 31 is opened, the transporter 50 descends and moves the container 100 to the receiving table 33 provided in the drying tank main body 31. Conveyor 50 which released container 100
Rises, and the lid 31a of the drying tank main body 31 is closed.
【００１８】先ず、バルブＶ１、Ｖ３，Ｖ４を開けた状
態で熱風送風機３４から乾燥槽本体３１内に熱風を送っ
て容器１００の加熱を行う。所定時間経過した後、バル
ブＶ１、Ｖ３，Ｖ４を閉じ、バルブＶ２を開けて真空ポ
ンプ３５を作動し、乾燥機本体３１内部を減圧して容器
１００の減圧乾燥を行う。所定時間減圧した後、バルブ
Ｖ７を開けて乾燥槽本体３１内を大気開放し、常圧に戻
してから、バルブＶ１、Ｖ３，Ｖ４を開けた状態でまた
熱風送風機３４から乾燥槽本体３１内に熱風を送って容
器１００の加熱を行い、所定時間経過した後また減圧乾
燥を行う。熱風加熱と減圧乾燥とを数回繰り返して乾燥
を終了する。この場合も、洗浄と同じに、繰り返しを行
わなくても十分な乾燥ができれば繰り返して行わなくと
もよい。乾燥が終了した時点で、乾燥槽本体３１の上部
の蓋３１ａを開け、搬送機５０によって容器１００を乾
燥槽本体３１から取り出して、容器１００の洗浄が終了
する。First, with the valves V1, V3 and V4 opened, hot air is blown into the drying tank main body 31 from the hot air blower 34 to heat the container 100. After a lapse of a predetermined time, the valves V1, V3, and V4 are closed, the valve V2 is opened, the vacuum pump 35 is operated, and the inside of the dryer main body 31 is depressurized to dry the container 100 under reduced pressure. After the pressure is reduced for a predetermined time, the valve V7 is opened to open the inside of the drying tank main body 31 to the atmosphere, and the pressure is returned to normal pressure. Then, with the valves V1, V3, and V4 open, the hot air blower 34 is again used to open the inside of the drying tank main body 31. The container 100 is heated by sending hot air, and dried under reduced pressure after a predetermined time has elapsed. The drying is completed by repeating the heating with hot air and the drying under reduced pressure several times. Also in this case, as in the case of washing, it is not necessary to repeat the process as long as sufficient drying can be performed without performing the process. When the drying is completed, the lid 31a on the upper part of the drying tank main body 31 is opened, the container 100 is taken out of the drying tank main body 31 by the transporter 50, and the cleaning of the container 100 is completed.
【００１９】容器１００の乾燥を密閉型の乾燥槽本体３
１で熱風加熱と減圧乾燥とを交互に繰り返し行うので、
従来の乾燥方法では乾燥に４０分程かかったものが１０
分程度に短縮することができた。The container 100 is dried by using a closed drying tank main body 3.
In step 1, hot air heating and vacuum drying are alternately repeated.
In the conventional drying method, it took about 40 minutes to dry, but 10
Could be reduced to about a minute.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
洗浄槽と乾燥槽とを分離して洗浄槽では超音波洗浄と高
圧シャワー洗浄とを交互に行えるようにしたので、サブ
ミクロンの塵芥まで洗浄でき、かつ乾燥槽では熱風加熱
と減圧乾燥とを交互に行えるようにしたので、乾燥時間
を大幅に短縮することができる。As described above, according to the present invention,
The cleaning tank and the drying tank are separated so that ultrasonic cleaning and high-pressure shower cleaning can be performed alternately in the cleaning tank, so that sub-micron dust can be cleaned, and in the drying tank, hot air heating and vacuum drying can be alternately performed. The drying time can be greatly reduced.
【図１】本発明の実施の形態を模式的に示した図であ
る。FIG. 1 is a diagram schematically showing an embodiment of the present invention.
【図２】本発明に利用する搬送機を模式的に示した図で
ある。FIG. 2 is a diagram schematically showing a transporter used in the present invention.
【図３】本発明を構成する超音波洗浄槽の受台と高圧シ
ャワーとの位置関係の一例を示す図である。FIG. 3 is a diagram showing an example of a positional relationship between a pedestal of an ultrasonic cleaning tank and a high-pressure shower constituting the present invention.
【図４】本発明を構成する超音波洗浄槽の高圧シャワー
の設置位置の他の例を示す図である。FIG. 4 is a view showing another example of the installation position of the high-pressure shower of the ultrasonic cleaning tank constituting the present invention.
１０ 密閉型容器の洗浄装置 ２０ 洗浄槽 ２１ 洗浄槽本体 ２２ 超音波振動子 ２３ 受台 ２４ 洗浄液 ２５ エア抜きパイプ ２７ 高圧シャワー用配管 ２８ ノズル ３０ 乾燥槽 ３３ 受台 ３４ 熱風送風機 ３５ 真空ポンプ ５０ 搬送機 １００ 密閉型容器 DESCRIPTION OF SYMBOLS 10 Cleaning apparatus of closed container 20 Cleaning tank 21 Cleaning tank main body 22 Ultrasonic vibrator 23 Cradle 24 Cleaning liquid 25 Air release pipe 27 High-pressure shower pipe 28 Nozzle 30 Drying tank 33 Cradle 34 Hot air blower 35 Vacuum pump 50 Transporter 100 sealed container
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 3B116 AA21 AB08 AB42 BB03 BB22 BB33 BB85 BB90 CC03 CD11 3B201 AA21 AB08 AB42 BB04 BB22 BB33 BB85 BB90 BB93 CB12 CC12 CC15 CD11 5F031 DA08 PA24 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3B116 AA21 AB08 AB42 BB03 BB22 BB33 BB85 BB90 CC03 CD11 3B201 AA21 AB08 AB42 BB04 BB22 BB33 BB85 BB90 BB93 CB12 CC12 CC15 CD11 5F031 DA08 PA24
Claims (4)
もに蓋を外した密閉型容器をその開口部を下に向けて前
記洗浄液中に浸漬し、かつ前記容器の内部に残留するエ
アを排出して超音波洗浄を行う工程と、洗浄液を排出し
或いはそのままで容器の内外部を高圧シャワーにて洗浄
する工程とを有する洗浄工程と、 前記洗浄工程を終了した密閉型容器を乾燥槽に搬送して
熱風を送り込み熱風加熱する工程と、乾燥槽内を減圧し
て減圧乾燥する工程とを有する乾燥工程とを備えた密閉
型容器の洗浄方法。1. A cleaning liquid is supplied into an ultrasonic cleaning tank, and a hermetically sealed container having a lid removed is immersed in the cleaning liquid with its opening facing downward, and air remaining inside the container is discharged. A cleaning step including a step of performing ultrasonic cleaning, and a step of discharging the cleaning liquid or cleaning the inside and outside of the container with a high-pressure shower as it is, and transporting the sealed container after the cleaning step to a drying tank. A method for cleaning an airtight container, comprising: a step of feeding hot air and heating with hot air, and a step of drying the drying tank under reduced pressure and drying under reduced pressure.
と高圧シャワーによる洗浄工程とを交互に複数回繰り返
すように構成されるとともに、前記乾燥工程も熱風加熱
する工程と減圧工程とを交互に複数回繰り返すように構
成されていることを特徴とする請求項１記載の密閉型容
器の洗浄方法。2. The cleaning step is configured to alternately repeat the step of performing ultrasonic cleaning and the step of cleaning with a high-pressure shower a plurality of times, and the drying step alternately includes a step of heating with hot air and a step of reducing pressure. The method for cleaning a closed container according to claim 1, wherein the method is configured to be repeated a plurality of times.
下にした状態で載置し昇降する機構を有するとともに、
洗浄液を噴射する高圧シャワーを有し、かつ洗浄液中に
前記容器を浸漬する際に前記容器の内部に残留するエア
を排出する機構を備え、超音波振動による超音波洗浄が
行える超音波洗浄槽と、 前記超音波洗浄槽による洗浄工程を終了した密閉型容器
を収納して熱風を送り込み熱風加熱させる熱風送風機構
を有するとともに、内部を減圧する減圧機構を有する乾
燥槽とを備えた密閉型容器の洗浄装置。3. A mechanism for mounting and lifting the closed container with the lid removed, with the opening thereof down,
An ultrasonic cleaning tank having a high-pressure shower for spraying a cleaning liquid, and having a mechanism for discharging air remaining inside the container when the container is immersed in the cleaning liquid, and capable of performing ultrasonic cleaning by ultrasonic vibration; A closed container having a drying tank having a hot air blowing mechanism for receiving hot air and heating with hot air by storing the closed container having completed the cleaning process by the ultrasonic cleaning tank, and having a decompression mechanism for depressurizing the inside. Cleaning equipment.
と超音波洗浄と交互に複数回繰り返すように構成されて
いるとともに、前記乾燥槽も熱風加熱と減圧乾燥とを交
互に複数回繰り返すように構成されていることを特徴と
する請求項３記載の密閉型容器の洗浄装置。4. The ultrasonic cleaning tank is configured to alternately repeat high-pressure shower cleaning and ultrasonic cleaning a plurality of times, and the drying tank also repeats hot air heating and reduced-pressure drying alternately a plurality of times. 4. The apparatus for cleaning a closed container according to claim 3, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000325836A JP3494293B2 (en) | 2000-10-25 | 2000-10-25 | Method and apparatus for cleaning closed container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000325836A JP3494293B2 (en) | 2000-10-25 | 2000-10-25 | Method and apparatus for cleaning closed container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002126678A true JP2002126678A (en) | 2002-05-08 |
| JP3494293B2 JP3494293B2 (en) | 2004-02-09 |
Family
ID=18803136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000325836A Expired - Fee Related JP3494293B2 (en) | 2000-10-25 | 2000-10-25 | Method and apparatus for cleaning closed container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3494293B2 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004037452A1 (en) * | 2002-10-24 | 2004-05-06 | Arakawa Chemical Industries, Ltd. | Equipment and method for washing parts |
| JP2009088513A (en) * | 2007-09-28 | 2009-04-23 | Siltron Inc | Box cleaner for cleaning of wafer shipping box |
| JP2010536185A (en) * | 2007-08-13 | 2010-11-25 | アルカテル−ルーセント | Method for processing a transport support for transport and storage in the air of a semiconductor substrate, and a processing station for carrying out such a method |
| JP2011169886A (en) * | 2010-01-21 | 2011-09-01 | Sysmex Corp | Sample preparation apparatus |
| CN102274843A (en) * | 2011-05-30 | 2011-12-14 | 天津金牛电源材料有限责任公司 | Cleaning method for package barrel for electrolyte for lithium ion battery |
| US20120042534A1 (en) * | 2010-08-17 | 2012-02-23 | Josh Martin | System, method and apparatus for drying a shower |
| CN102553871A (en) * | 2011-12-29 | 2012-07-11 | 中国石油天然气股份有限公司 | Cleaning system and cleaning method for high-temperature high-pressure oil-gas interface tensiometer |
| CN102744223A (en) * | 2011-04-19 | 2012-10-24 | 武汉韩泰智能科技有限公司 | Multi-station horizontal rotary cleaning machine |
| CN110369383A (en) * | 2019-07-17 | 2019-10-25 | 海安光易通信设备有限公司 | A kind of dust cap cleaning method |
| CN112374513A (en) * | 2020-10-21 | 2021-02-19 | 艾氢技术(苏州)有限公司 | Automatic recovery system of solid hydrogen reactant |
| CN112474511A (en) * | 2020-11-10 | 2021-03-12 | 泰兴市海虹机械制造有限公司 | Internal circulation type rapid self-cleaning mechanism of speed reducer |
| KR20220057802A (en) * | 2020-10-30 | 2022-05-09 | 정인웅 | ultrasonic container washing machine |
| CN117936433A (en) * | 2024-03-20 | 2024-04-26 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
| CN117936433B (en) * | 2024-03-20 | 2024-05-31 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101367582B1 (en) * | 2011-11-14 | 2014-02-26 | 주식회사 엘지실트론 | Box cleaner |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3059826U (en) | 1998-12-14 | 1999-07-13 | ジェイ総合サービス株式会社 | Automatic basket cleaning device |
-
2000
- 2000-10-25 JP JP2000325836A patent/JP3494293B2/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100988294B1 (en) | 2002-10-24 | 2010-10-18 | 아라까와 가가꾸 고교 가부시끼가이샤 | Equipment and method for washing parts |
| WO2004037452A1 (en) * | 2002-10-24 | 2004-05-06 | Arakawa Chemical Industries, Ltd. | Equipment and method for washing parts |
| JP2010536185A (en) * | 2007-08-13 | 2010-11-25 | アルカテル−ルーセント | Method for processing a transport support for transport and storage in the air of a semiconductor substrate, and a processing station for carrying out such a method |
| US8898930B2 (en) | 2007-08-13 | 2014-12-02 | Alcatel Lucent | Method for treating a transport support for the conveyance and atmospheric storage of semiconductor substrates, and treatment station for the implementation of such a method |
| KR101176715B1 (en) * | 2007-08-13 | 2012-08-23 | 알까뗄 루슨트 | Method of treating a transport support for the atmospheric storage and conveyance of semiconductor substrates, and treatment station for the implementation of such a method |
| JP2009088513A (en) * | 2007-09-28 | 2009-04-23 | Siltron Inc | Box cleaner for cleaning of wafer shipping box |
| JP2011169886A (en) * | 2010-01-21 | 2011-09-01 | Sysmex Corp | Sample preparation apparatus |
| US8713814B2 (en) | 2010-08-17 | 2014-05-06 | Josh Martin | System, method and apparatus for drying a shower |
| US20120042534A1 (en) * | 2010-08-17 | 2012-02-23 | Josh Martin | System, method and apparatus for drying a shower |
| US8438753B2 (en) * | 2010-08-17 | 2013-05-14 | Josh Martin | System, method and apparatus for drying a shower |
| CN102744223A (en) * | 2011-04-19 | 2012-10-24 | 武汉韩泰智能科技有限公司 | Multi-station horizontal rotary cleaning machine |
| CN102274843A (en) * | 2011-05-30 | 2011-12-14 | 天津金牛电源材料有限责任公司 | Cleaning method for package barrel for electrolyte for lithium ion battery |
| CN102553871A (en) * | 2011-12-29 | 2012-07-11 | 中国石油天然气股份有限公司 | Cleaning system and cleaning method for high-temperature high-pressure oil-gas interface tensiometer |
| CN110369383A (en) * | 2019-07-17 | 2019-10-25 | 海安光易通信设备有限公司 | A kind of dust cap cleaning method |
| CN112374513A (en) * | 2020-10-21 | 2021-02-19 | 艾氢技术(苏州)有限公司 | Automatic recovery system of solid hydrogen reactant |
| KR20220057802A (en) * | 2020-10-30 | 2022-05-09 | 정인웅 | ultrasonic container washing machine |
| KR102414114B1 (en) | 2020-10-30 | 2022-06-29 | 정인웅 | ultrasonic container washing machine |
| CN112474511A (en) * | 2020-11-10 | 2021-03-12 | 泰兴市海虹机械制造有限公司 | Internal circulation type rapid self-cleaning mechanism of speed reducer |
| CN117936433A (en) * | 2024-03-20 | 2024-04-26 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
| CN117936433B (en) * | 2024-03-20 | 2024-05-31 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3494293B2 (en) | 2004-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6374837B2 (en) | Single semiconductor wafer processor | |
| JP4597478B2 (en) | Substrate processing in dipping, scrubbing and drying systems | |
| US5547515A (en) | Method for handling or processing semiconductor wafers | |
| KR100958793B1 (en) | Box cleaner for cleaning wafer shipping box | |
| JP3494293B2 (en) | Method and apparatus for cleaning closed container | |
| JP4025096B2 (en) | Substrate processing method | |
| US20080041429A1 (en) | Photomask cleaner | |
| TWI629741B (en) | Substrate liquid processing device | |
| WO2003105208A1 (en) | Cleaning and drying device | |
| US6322633B1 (en) | Wafer container cleaning system | |
| KR100687161B1 (en) | Method of cleaning wafer carrier | |
| JPH1034094A (en) | Washing method for substrate cassette rack | |
| JP2002334863A (en) | Method and apparatus for cleaning and drying door shell for foup | |
| KR101045058B1 (en) | Back nozzle assembly and substrate treating apparatus using the same | |
| JP2002520132A (en) | Method and apparatus for cleaning a substrate | |
| JP3635659B2 (en) | Cleaning device | |
| JP3999540B2 (en) | Brush cleaning method and processing system for scrub cleaning apparatus | |
| KR102374872B1 (en) | Improved substrate compartment cleaning | |
| JPH06224174A (en) | Work processing method and device | |
| JP3540550B2 (en) | Processing device and processing method | |
| JPH1131676A (en) | Cleaning system | |
| JPH06252115A (en) | Method for cleaning object to be cleaned | |
| JP2007123769A (en) | Apparatus and method of foup cleaning and drying | |
| JP2002118090A (en) | Drying system for drying semiconductor wafer, and method for drying wafer using the same | |
| JP2007123770A (en) | Door shell cleaning apparatus and door shell cleaning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |