JPS63165271A - Laminating method for viscous film piece - Google Patents
Laminating method for viscous film pieceInfo
- Publication number
- JPS63165271A JPS63165271A JP61315278A JP31527886A JPS63165271A JP S63165271 A JPS63165271 A JP S63165271A JP 61315278 A JP61315278 A JP 61315278A JP 31527886 A JP31527886 A JP 31527886A JP S63165271 A JPS63165271 A JP S63165271A
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- adhesive film
- film piece
- strip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000010030 laminating Methods 0.000 title abstract 2
- 239000002313 adhesive film Substances 0.000 claims description 73
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000037303 wrinkles Effects 0.000 abstract description 5
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、シリコンウェハのような薄板状の被着体の
表面に、その被着体と同形で略同じ大きさの粘着フィル
ム片を貼付ける粘着フィルム片の貼付方法に関するもの
である。[Detailed Description of the Invention] [Industrial Application Field] This invention is a method of attaching a piece of adhesive film having the same shape and approximately the same size as the adherend to the surface of a thin plate-like adherend such as a silicon wafer. The present invention relates to a method for attaching pieces of adhesive film.
上記粘着フィルム片の貼付方法の従来の技術として本件
出願人が提案した特開昭５９−１６９８１１号公報に示
されたものがある。A conventional technique for pasting the adhesive film pieces described above is disclosed in Japanese Patent Application Laid-Open No. 169811/1983, which was proposed by the applicant of the present invention.
上記の貼付方法は、吸引台上に送り込まれた被着体をス
トッパに当接させて位置決めし、その被着体と同形で略
同じ大きさの粘着フィルム片を貼付した帯状体を上記被
着体の上方において急角度に屈曲しつつ移動して粘着フ
ィルム片の一部を帯状体から剥離し、その粘着フィルム
片の先端を上記ストッパに当接して被着体に対して相対
的に位置決めしたのち、被着体と粘着フィルム片とを一
対の引取りロールに向けて移動して両者を互いに貼り合
わせるようにしている。The above pasting method involves positioning the adherend by bringing it into contact with a stopper, which is fed onto a suction table, and then attaching a strip of adhesive film having the same shape and size as the adherend to the adherend. A portion of the adhesive film piece was peeled off from the strip by moving while bending at a steep angle above the body, and the tip of the adhesive film piece was brought into contact with the stopper to position it relative to the adherend. Afterwards, the adherend and the piece of adhesive film are moved toward a pair of take-up rolls to bond them together.
ところで、上記の貼付方法においては、帯状体を急角度
に折曲げる部位と一対の引取りロールとの間に所定の寸
法が存在するため、一対の引をりロールによって粘着フ
ィルム片の中央部が転圧作用を受けるとき、その粘着フ
ィルム片の後端は帯状体から剥離して被着体の上面に重
なるため、粘着フィルム片にしわが生じたり、被着体と
の間に気泡を含むおそれがある。By the way, in the above pasting method, since there is a predetermined dimension between the part where the strip is bent at a steep angle and the pair of pulling rolls, the central part of the adhesive film piece is folded by the pair of pulling rolls. When subjected to rolling pressure, the rear end of the adhesive film peels off from the strip and overlaps the top surface of the adherend, so there is a risk that the adhesive film piece may wrinkle or contain air bubbles between it and the adherend. be.
〔発明の目的〕
この発明は上記の点に鑑み、被着体に対して粘着フィル
ム片を気泡を含ませることなく、しかも皺を生じさせず
に精度よく貼付けることができるようにした粘着フィル
ム片の貼付方法を提供することを目的としている。[Object of the Invention] In view of the above-mentioned points, the present invention provides an adhesive film that allows adhesive film pieces to be accurately attached to an adherend without incorporating air bubbles and without causing wrinkles. The purpose is to provide a method for pasting the strips.
上記の目的を達成するために、この発明は、一方向に搬
送される被着体をストッパに対する当接によって位置決
めし、その被着体と同形で略同じ大きさの粘着フィルム
片を貼付した帯状体を上記被着体の上方において急角度
に屈曲しつつ移動させることにより、粘着フィルム片の
一部を帯状体から剥離し、その粘着フィルム片を上記被
着体に対して相対的に位置決めしたのち粘着フィルム片
の先端部と被着体の先端部とを圧着し、上記帯状体の移
動によって粘着フィルム片を移動し、同時に被着体を同
方向に搬送し、その搬送方向前方に配置した一対の引取
りロール間に上記圧着部をかみ込ませて転圧し、その転
圧作用を受けるまでの間粘着フィルム片の後端部を被着
体に対して遊離状態に保持するようにしたのである。In order to achieve the above object, the present invention positions an adherend being conveyed in one direction by abutting against a stopper, and provides a strip-shaped adhesive film having the same shape and approximately the same size as the adherend. By moving the body while bending at a steep angle above the adherend, a part of the adhesive film piece was peeled off from the strip, and the adhesive film piece was positioned relative to the adherend. Afterwards, the tip of the adhesive film piece and the tip of the adherend were crimped together, and the adhesive film piece was moved by the movement of the strip, and at the same time, the adherend was conveyed in the same direction and placed in front of the conveyance direction. The pressure bonding part is caught between a pair of take-up rolls and rolled, and the rear end of the adhesive film piece is held free from the adherend until it receives the rolling action. be.
ここで、粘着フィルム片め遊離状態の保持に際しては、
引取りロールが被着体および粘着フィルム片を引き取る
速度を帯状体の移動速度より速くして帯状体にたるみを
もたせる方法や粘着フィルム片と被着体との間にエアを
噴射する方法等を採用することができる。Here, when maintaining the adhesive film in a free state,
There are methods such as making the speed at which the take-up roll picks up the adherend and adhesive film pieces faster than the moving speed of the strip to give the strip some slack, and a method of injecting air between the adhesive film piece and the adherend. Can be adopted.
（実施例〕
以下、この発明の実施例を添付図面に基づいて説明する
。(Example) Hereinafter, an example of the present invention will be described based on the accompanying drawings.
第１図および第２図に示すように、シリコンウェハ等の
薄板状の円形被着体Ａは、一対の平行な第１コンベヤ１
によって第２図の右側から左側に搬送される。As shown in FIGS. 1 and 2, a thin plate-like circular adherend A such as a silicon wafer is conveyed to a pair of parallel first conveyors 1.
It is conveyed from the right side to the left side in FIG.
ここで、被着体Ａは、外周の一部に直線部ａを備え、そ
の直線部ａ先にして前方に搬送される。Here, the adherend A has a straight part a on a part of its outer periphery, and is conveyed forward with the straight part a ahead.
第１コンベヤ１の前方には、上記被着体Ａをさらに前方
に搬送する第２コンベヤ２が接続され、その第２コンベ
ヤ２の搬出側端部に吸着テーブル３が配置されている。A second conveyor 2 for conveying the adherend A further forward is connected to the front of the first conveyor 1, and a suction table 3 is disposed at the discharge side end of the second conveyor 2.
吸着テーブル３上に送り込まれた被着体Ａは、その吸着
テーブル３の前方に配置したストッパ４と被着体Ａの後
方からストッパ４に向けて移動するブツシャ５とによっ
て前後方向に位置決めされる。The adherend A fed onto the suction table 3 is positioned in the front-rear direction by a stopper 4 placed in front of the suction table 3 and a button 5 that moves toward the stopper 4 from behind the adherend A. .
また、吸着テーブル３の両側から被着体Ａの側方に向け
て左右対称に移動可能な一対のサイドローラ６により被
着体Ａの両側部が位置決めされる。Further, both sides of the adherend A are positioned by a pair of side rollers 6 that can be moved symmetrically from both sides of the suction table 3 toward the sides of the adherend A.
被着体Ａを支持する吸着テーブル３は、上面に多数の吸
引孔（図示省略）を備え、その吸引孔に作用する吸引力
によって位置決め後の被着体Ａが吸着支持される。The suction table 3 that supports the adherend A has a large number of suction holes (not shown) on its upper surface, and the adherend A after positioning is suction-supported by the suction force acting on the suction holes.
なお、図ではストッパ４およびブツシャ５の移動機構を
省略しているが、ストッパ４はソレノイド等の作動によ
って被着体Ａの搬送面に対して出没され、一方ブソシャ
５は、被着体Ａの移動方向に長いカム面に沿って移動可
能となり、被着体Ａの通過後、その被着体Ａに追従して
動かされ、その移動途中において被着体Ａの搬送面上に
突出するようになっている。Although the movement mechanism of the stopper 4 and the pusher 5 is omitted in the figure, the stopper 4 is moved in and out of the conveying surface of the adherend A by the operation of a solenoid, etc., while the pusher 5 moves against the transport surface of the adherend A. It is movable along a long cam surface in the moving direction, and after passing the adherend A, it is moved to follow the adherend A, and during the movement, it protrudes onto the conveying surface of the adherend A. It has become.
前記第２コンベヤ２の上方には、支持軸７と巻取軸８と
が配置され、支持軸７には帯状体Ｔのロール体が支持さ
れている。A support shaft 7 and a take-up shaft 8 are arranged above the second conveyor 2, and a roll of the strip T is supported on the support shaft 7.
ここで、帯状体Ｔは、片面が離型処理され、その処理面
に第３図に示すように、被着体Ａと同形の略同じ大きさ
の粘着フィルム片Ｂが所要の間障をおいて貼付されてい
る。Here, one side of the strip T has been subjected to a mold release treatment, and as shown in FIG. It is attached.
支持軸７から引き出された帯状体Ｔは複数のロー ＪＬ
／ ９ ニヨって案内され、一対のピンチロール１０．
１０の回転によって所定長さ引き出され、その引出し量
に対応する長さだけ巻取軸８によって巻取られるように
なっている。The strip T pulled out from the support shaft 7 has a plurality of rows JL
/ 9 I was guided around and was given a pair of pinch rolls 10.
It is pulled out by a predetermined length by the rotation of 10, and wound up by the winding shaft 8 by a length corresponding to the pulled-out amount.
上記帯状体Ｔの移送路には、その帯状体Ｔを吸着テーブ
ル３の上方位置において急角度に折曲げる板状のピーリ
ング部材１１が配置されている。A plate-shaped peeling member 11 that bends the strip T at a steep angle at a position above the suction table 3 is disposed on the transport path of the strip T.
このピーリング部材１１は前後に分割され、その前側分
割体１１ａは固定配置の後側分割体１１ｂにビン１２に
よって揺動可能に支持されている。This peeling member 11 is divided into front and rear parts, and the front divided body 11a is swingably supported by the bin 12 on the rear divided body 11b which is fixedly arranged.
また、前側分割体１１ａは、図示省略したスプリングの
弾力により上方に偏向されて上面が後側分割体Ｎｂの上
面と同一面に保持されている。Further, the front divided body 11a is deflected upward by the elasticity of a spring (not shown), and its upper surface is held flush with the upper surface of the rear divided body Nb.
上記のようなピーリング部材１１の配置によって帯状体
Ｔを移動するとピーリング部材１１の先端位置において
帯状体Ｔから粘着フィルム片ＢがＭｌ＋ １される。粘
着フィルム片Ｂが所定長さ剥離して、その上方に配置し
た検出器１３が粘着フィルム片Ｂの後端を検出すると、
ピンチロール１ｏが停止する。When the strip T is moved with the arrangement of the peeling member 11 as described above, the adhesive film piece B is removed from the strip T by Ml+1 at the tip position of the peeling member 11. When the adhesive film piece B is peeled off for a predetermined length and the detector 13 placed above detects the rear end of the adhesive film piece B,
The pinch roll 1o stops.
検出８１３は、粘着フィルム片Ｂをその下方で停止する
被着体Ａに対して相対的に位置決めするものであり、実
施例の場合は、粘着フィルム片Ｂの後端を検出するよう
にしたが、粘着フィルム片Ｂの先端を検出するようにし
てもよい。Detection 813 is to position the adhesive film piece B relative to the adherend A stopped below it, and in the example, the rear end of the adhesive film piece B was detected. , the tip of the adhesive film piece B may be detected.
上記ピーリング部材１１の先端部上方には、帯状体Ｔか
ら一部が別離された粘着フィルム片Ｂを吸着保持してそ
の先端部を被着体Ａの先端部に圧着する圧着袋！２０が
設けられている。Above the tip of the peeling member 11 is a pressure-bonding bag that holds the adhesive film piece B, which has been partially separated from the strip T, by suction and presses the tip of the piece to the tip of the adherend A. 20 are provided.
この圧着装置２０は、エンドレスの孔あきベルト２１を
備え、そのベルト２１の内側に吸着箱２２を配置しであ
る。ベルト２１は、適宜の駆動装置の作動によって第１
図の矢印方向に搬送される。This crimping device 20 includes an endless perforated belt 21, and a suction box 22 is arranged inside the belt 21. The belt 21 is moved to the first position by actuation of a suitable drive device.
It is transported in the direction of the arrow in the figure.
マｆ、−、ベルト２１、吸着箱２２およびベルト２１の
移動を案内するプーリ２３は図示省略したフレームで支
持され、そのフレームはプーリ軸２４を中心に揺動可能
に支持され、シリンダ等の作動によって先端部が下方に
押し下げられる。The belt 21, the suction box 22, and the pulley 23 that guides the movement of the belt 21 are supported by a frame (not shown), and the frame is supported so as to be able to swing around a pulley shaft 24, and operates the cylinder, etc. The tip is pushed down.
前記第２コンベヤ２の前方には、一対の引取りロール３
０が配置され、さらに、その前方に搬出コンベヤ３１が
配置されている。In front of the second conveyor 2, a pair of take-up rolls 3
0 is arranged, and furthermore, a carry-out conveyor 31 is arranged in front of it.
第４図乃至第８図は粘着フィルム片Ｂの貼付けを段階的
に示す概略図である。FIG. 4 to FIG. 8 are schematic diagrams showing the step-by-step application of the adhesive film piece B.
いま、第４図に示すように、第２コンベヤ２によって搬
送された被着体Ａが吸着テーブル３上において位置決め
されると、吸着テーブル３の吸引孔に吸引力が作用し、
被着体Ａを吸着支持する。Now, as shown in FIG. 4, when the adherend A transported by the second conveyor 2 is positioned on the suction table 3, a suction force acts on the suction hole of the suction table 3,
The adherend A is supported by suction.
一方、帯状体Ｔは、ピンチロール１０の回転によって移
動され、その移動によって粘着フィルム片Ｂは帯状体Ｔ
から剥離される。粘着フィルム片Ｂの後端が第５図に示
すように、検出器１３によって検出されると、ピンチロ
ール１０は停止する。On the other hand, the strip T is moved by the rotation of the pinch roll 10, and the adhesive film piece B is moved by the rotation of the pinch roll 10.
peeled off from. When the rear end of the adhesive film piece B is detected by the detector 13 as shown in FIG. 5, the pinch roll 10 stops.
このため、粘着フィルム片Ｂは、その下方で停止する被
着体Ａに対して相対的に位置決めされる。Therefore, the adhesive film piece B is positioned relative to the adherend A that stops below it.
このとき、吸引箱２２内には吸引力が付与され、その吸
引力は、孔あきベルト２１を介して粘着フィルム片Ｂに
作用するため、粘着フィルム片Ｂはベルト２１に吸着さ
れる。At this time, a suction force is applied inside the suction box 22, and the suction force acts on the adhesive film piece B through the perforated belt 21, so that the adhesive film piece B is attracted to the belt 21.
粘着フィルム片Ｂの位置決め後、ベルト２１は先端部が
押し下げられる。その押し下げによりベルト２１はプー
リ軸２４を中心に回転し、同時にピーリング部材１１の
前側分割体ｔｔａが押し下げられて下方に回動し、粘着
フィルム片Ｂの先端部が被着体Ａの先端部に圧着される
（第６図参照）。After positioning the adhesive film piece B, the leading end of the belt 21 is pushed down. This pushing down causes the belt 21 to rotate around the pulley shaft 24, and at the same time, the front divided body tta of the peeling member 11 is pushed down and rotated downward, so that the tip of the adhesive film piece B touches the tip of the adherend A. It is crimped (see Figure 6).
圧着後、吸着テーブル３は被着体Ａの吸着を解除し、同
時にベルト２１ば上方に移動され、次に第２コンベヤ２
の移動と帯状体Ｔの引き取りとによって被着体Ａおよび
粘着フィルム片Ｂが前方に搬送される（第７図参照）。After crimping, the suction table 3 releases the adsorption of the adherend A, and at the same time, the belt 21 is moved upward, and then the second conveyor 2
The adherend A and the adhesive film piece B are transported forward by the movement of the belt-shaped body T and the taking-up of the strip T (see FIG. 7).
被着体Ａおよび粘着フィルム片Ｂの先端の圧着部が一対
の引取りロール３０間に進入すると、その一対の引取り
ロール３０の回転によって、被着体Ａおよび粘着フィル
ム片Ｂが前方に搬送され、同時に一対の引取りロール３
０により転圧作用を受けて互いに貼付される。When the crimped parts at the tips of the adherend A and the adhesive film piece B enter between the pair of take-up rolls 30, the rotation of the pair of take-up rolls 30 transports the adherend A and the adhesive film piece B forward. At the same time, a pair of take-up rolls 3
0, they are pasted together under the rolling action.
このとき、引取りロール３０は、被着体Ａおよび粘着フ
ィルム片Ｂを、帯状体Ｔの移動速度より速い速度で前方
に搬送させるようになっている。At this time, the take-up roll 30 transports the adherend A and the adhesive film piece B forward at a speed faster than the moving speed of the strip T.
このため、帯状体Ｔは、第８図に示すようにたるみが生
じ、そのたるみによって粘着フィルム片Ｂの後端部が持
ち上げられ、被着体Ａに対してＭ離状態に保持される。For this reason, the strip T becomes slack as shown in FIG. 8, and due to the slack, the rear end of the adhesive film piece B is lifted and held at a distance M from the adherend A.
したがって、粘着フィルム片Ｂは、被着体Ａに対する接
着位置より後端の部分が被着体Ａに先に接着せず、一対
の引取ロール３０間を通過するとき被着体Ａに接着され
、気泡やしわを発生させることなく粘着フィルム片Ｂを
貼付することができる。貼付後の製品は搬出コンベヤ３
１によって前方に搬送される。Therefore, the adhesive film piece B does not adhere to the adherend A at the rear end of the adhesion position to the adherend A first, but is adhered to the adherend A when passing between the pair of take-up rolls 30, The adhesive film piece B can be attached without generating bubbles or wrinkles. After pasting, the products are carried out on conveyor 3.
1 and transported forward.
なお、第７図および第８図においては、ピーリング部材
１１の先端部において帯状体Ｔが風船状にたるみ、その
下側のたるみが被着体Ａの表面に接触する可能性がある
。In addition, in FIGS. 7 and 8, there is a possibility that the band-shaped body T slacks like a balloon at the tip of the peeling member 11, and the slack on the lower side may come into contact with the surface of the adherend A.
そこで、第９図に示すように、ピーリング部材１１の後
側分割体１１ｂを前後に分割し、その前側部分を帯状体
Ｔのたるみに合わせて第１０図に示すように前進させ、
あるいは帯状体Ｔの移動と同時に強制的に前進させるこ
とにより被着体Ａに帯状体Ｔが接触するのを防止するこ
とができる。Therefore, as shown in FIG. 9, the rear divided body 11b of the peeling member 11 is divided into front and rear parts, and the front part thereof is advanced as shown in FIG. 10 in accordance with the slack of the strip T.
Alternatively, it is possible to prevent the strip T from coming into contact with the adherend A by forcibly advancing the strip T at the same time as the strip T is moved.
実施例の場合は、引取りロール３０が被着体Ａおよび粘
着フィルム片Ｂを引き取る速度を帯状体Ｔの引き取り速
度により速くして帯状体Ｔにたるみをもたせ、そのたる
みの形成によって粘着フィルム片Ｂの後端部を被着体Ａ
に対して遊離状態に保持するようにしたが、遊離状態に
保持する手段はこれに限定されるものではない０例えば
、第７図および第８図に示すように、ピーリング部材１
１の下方にエア噴射ノズル４０を設け、そのノズル４０
から被着体Ａと粘着フィルム片８間にエアを噴射して粘
着フィルム片Ｂの後端部を持ち上げるようにしてもよい
。In the case of the embodiment, the speed at which the take-up roll 30 picks up the adherend A and the adhesive film piece B is made faster than the take-up speed of the strip T to give slack to the strip T, and by forming the slack, the adhesive film pieces are Place the rear end of B on the adherend A.
However, the means for holding the peeling member 1 in the released state is not limited to this. For example, as shown in FIGS. 7 and 8, the peeling member 1
An air injection nozzle 40 is provided below 1, and the nozzle 40
Alternatively, air may be injected between the adherend A and the adhesive film piece 8 to lift the rear end of the adhesive film piece B.
以上のように、この発明は、帯状体の移動によってその
帯状体から粘着フィルムを剥離し、この粘着フィルムを
その下方で予め位置決めされた被着体に対して相対的に
位置決めしたのち、粘着フィルム片の先端部と被着体の
先端部とを圧着し、その圧着部を一対の引取りロール間
に送り込み、粘着フィルム片の後端部が被着体に圧着さ
れるまで粘着フィルム片の後端部を被着体に対して遊離
状態に保持するようにしたので、被着体と粘着フィルム
片間に気泡の入らないように、しかも粘着フィルム片に
しわを発生させることなく粘着フィルム片を貼付するこ
とができる。As described above, in the present invention, the adhesive film is peeled from the strip by moving the strip, the adhesive film is positioned below the adhesive film relative to the adherend that has been positioned in advance, and then the adhesive film is removed from the adhesive film by moving the strip. The tip of the adhesive film piece is crimped to the tip of the adherend, and the crimped part is fed between a pair of take-up rolls, and the adhesive film piece is crimped until the rear end of the adhesive film piece is crimped to the adherend. Since the end portion is held free from the adherend, the adhesive film piece can be attached without creating air bubbles between the adherend and the adhesive film piece, and without causing wrinkles in the adhesive film piece. Can be pasted.
第１図は、この発明に係る方法に実施する貼付装置の概
略図、第２図は同上の平面図、第３図は同上帯状体の斜
視図、第４図乃至第８図は粘着フィルム片の貼付は状態
を段階的に示す正面図、第９図は同上ピーリング部材の
他の実施例を示す概略図、第１０図は第９図の作動状態
を示す概略図である。
Ａ・・・・・・被着体、Ｔ・・・・・・帯状体、Ｂ・・
・・・・粘着フィルム片、４・・・・・・ストッパ、３
０・・・・・・引取りロール。
第９図
第１０図FIG. 1 is a schematic diagram of a pasting device used in the method according to the present invention, FIG. 2 is a plan view of the same as above, FIG. 3 is a perspective view of the same strip, and FIGS. 4 to 8 are adhesive film pieces. 9 is a schematic diagram showing another embodiment of the same peeling member as above, and FIG. 10 is a schematic diagram showing the operating state of FIG. 9. A: Adherent, T: Band-shaped body, B:
...Adhesive film piece, 4...Stopper, 3
0...Takeover roll. Figure 9 Figure 10
Claims (3)
接によって位置決めし、その被着体と同形で略同じ大き
さの粘着フィルム片を貼付した帯状体を上記被着体の上
方において急角度に屈曲しつつ移動させることにより、
粘着フィルム片の一部を帯状体から剥離し、その粘着フ
ィルム片を上記被着体に対して相対的に位置決めしたの
ち粘着フィルム片の先端部と被着体の先端部とを圧着し
、上記帯状体の移動によって粘着フィルム片を移動し、
同時に被着体を同方向に搬送し、その搬送方向前方に配
置した一対の引取りロール間に上記圧着部をかみ込ませ
て転圧し、その転圧作用を受けるまでの間粘着フィルム
片の後端部を被着体に対して遊離状態に保持するように
した粘着フィルム片の貼付方法。(1) An adherend being conveyed in one direction is positioned by contact with a stopper, and a strip of adhesive film having the same shape and size as that of the adherend is affixed to the adherend and suddenly placed above the adherend. By moving while bending at an angle,
A part of the adhesive film piece is peeled off from the strip, and the adhesive film piece is positioned relative to the adherend, and then the tip of the adhesive film piece and the tip of the adherend are crimped together, and The adhesive film piece is moved by the movement of the strip,
At the same time, the adherend is conveyed in the same direction, the above-mentioned pressure bonding part is caught between a pair of take-up rolls placed in front of the conveyance direction, and the pressure bonding part is rolled, and the adhesive film piece remains behind until it receives the rolling pressure action. A method for attaching a piece of adhesive film in which the end portion is kept free from the adherend.
を引き取る速度を帯状体の移動速度より速くして帯状体
に粘着フィルム片の後端部を持ち上げるたるみをもたせ
た特許請求の範囲第１項記載の粘着フィルム片の貼付方
法。(2) The speed at which the take-up roll takes up the adherend and the adhesive film piece is faster than the moving speed of the strip, so that the strip has a slack that lifts the rear end of the adhesive film. Method for attaching adhesive film pieces as described in Section 1.
ィルム片との間にエアを噴射して粘着フィルム片の先端
部を持ち上げるようにした特許請求の範囲第１項記載の
粘着フィルム片の貼付方法。(3) The tip of the adhesive film piece is lifted by injecting air between the adherend and the adhesive film piece whose tip end is crimped to the adherend. How to apply adhesive film pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315278A JPS63165271A (en) | 1986-12-26 | 1986-12-26 | Laminating method for viscous film piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315278A JPS63165271A (en) | 1986-12-26 | 1986-12-26 | Laminating method for viscous film piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63165271A true JPS63165271A (en) | 1988-07-08 |
Family
ID=18063484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61315278A Pending JPS63165271A (en) | 1986-12-26 | 1986-12-26 | Laminating method for viscous film piece |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63165271A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314887A (en) * | 1989-06-13 | 1991-01-23 | Dainippon Printing Co Ltd | Method and device for sticking strip of double-side self-adhesive material |
| JP2003023061A (en) * | 2001-07-09 | 2003-01-24 | Lintec Corp | Lamination apparatus |
| JP2003023063A (en) * | 2001-07-09 | 2003-01-24 | Lintec Corp | Lamination apparatus |
| AT500076A3 (en) * | 2004-03-12 | 2006-11-15 | Erich Thallner | DEVICE AND METHOD FOR APPLYING A SURFACE CONNECTOR TO A CONTACT SURFACE OF A WATER |
| JP2008189441A (en) * | 2007-02-05 | 2008-08-21 | Ricoh Co Ltd | Sheet member adhesion device, image forming device, and sheet member adhesion method |
| JP2008308297A (en) * | 2007-06-14 | 2008-12-25 | Ricoh Co Ltd | Sheet member pasting device and image forming device |
| JP2009029600A (en) * | 2007-07-30 | 2009-02-12 | Ricoh Co Ltd | Image sheet forming method, bonding device and image forming apparatus |
| JP2009062196A (en) * | 2007-08-16 | 2009-03-26 | Ricoh Co Ltd | Sheet bonding device, postprocessing device, image forming device and sheet bonding method |
| JP2010050119A (en) * | 2008-08-19 | 2010-03-04 | Lintec Corp | Sheet bonding device and bonding method |
| WO2010140402A1 (en) * | 2009-06-04 | 2010-12-09 | 日東電工株式会社 | A filter support |
| JP2012084688A (en) * | 2010-10-12 | 2012-04-26 | Nitto Denko Corp | Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape |
| JP2014027081A (en) * | 2012-07-26 | 2014-02-06 | Nitto Denko Corp | Semiconductor wafer mounting method and semiconductor wafer mounting device |
| JP2014116422A (en) * | 2012-12-07 | 2014-06-26 | Lintec Corp | Sheet sticking device, and sheet sticking method |
| KR20150131943A (en) * | 2014-05-16 | 2015-11-25 | 닛토덴코 가부시키가이샤 | Apparatus for Transporting Glass Substrate |
| CN112249795A (en) * | 2020-10-19 | 2021-01-22 | 广东利元亨智能装备股份有限公司 | Real-time correction method and device for rubberizing process, electronic equipment and readable storage medium |
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1986
- 1986-12-26 JP JP61315278A patent/JPS63165271A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314887A (en) * | 1989-06-13 | 1991-01-23 | Dainippon Printing Co Ltd | Method and device for sticking strip of double-side self-adhesive material |
| JP2003023061A (en) * | 2001-07-09 | 2003-01-24 | Lintec Corp | Lamination apparatus |
| JP2003023063A (en) * | 2001-07-09 | 2003-01-24 | Lintec Corp | Lamination apparatus |
| AT500076A3 (en) * | 2004-03-12 | 2006-11-15 | Erich Thallner | DEVICE AND METHOD FOR APPLYING A SURFACE CONNECTOR TO A CONTACT SURFACE OF A WATER |
| AT500076B1 (en) * | 2004-03-12 | 2007-11-15 | Erich Thallner | DEVICE AND METHOD FOR APPLYING A SURFACE CONNECTOR TO A CONTACT AREA OF A WATER |
| US8875766B2 (en) | 2004-03-12 | 2014-11-04 | Erich Thallner | Device and method for the application of a sheet-like jointing means onto a contact area of a wafer |
| US8500930B2 (en) | 2004-03-12 | 2013-08-06 | Erich Thallner | Device and method for the application of a sheet-like jointing means onto a contact area of a wafer |
| JP2008189441A (en) * | 2007-02-05 | 2008-08-21 | Ricoh Co Ltd | Sheet member adhesion device, image forming device, and sheet member adhesion method |
| JP2008308297A (en) * | 2007-06-14 | 2008-12-25 | Ricoh Co Ltd | Sheet member pasting device and image forming device |
| JP2009029600A (en) * | 2007-07-30 | 2009-02-12 | Ricoh Co Ltd | Image sheet forming method, bonding device and image forming apparatus |
| JP2009062196A (en) * | 2007-08-16 | 2009-03-26 | Ricoh Co Ltd | Sheet bonding device, postprocessing device, image forming device and sheet bonding method |
| JP2010050119A (en) * | 2008-08-19 | 2010-03-04 | Lintec Corp | Sheet bonding device and bonding method |
| CN102065975A (en) * | 2009-06-04 | 2011-05-18 | 日东电工株式会社 | A filter support |
| CN105214385A (en) * | 2009-06-04 | 2016-01-06 | 日东电工株式会社 | Filter carrying body |
| US8252083B2 (en) | 2009-06-04 | 2012-08-28 | Nitto Denko Corporation | Filter-holding object |
| JP2010279891A (en) * | 2009-06-04 | 2010-12-16 | Nitto Denko Corp | Filter carrier |
| CN105214385B (en) * | 2009-06-04 | 2017-04-12 | 日东电工株式会社 | Filter support |
| WO2010140402A1 (en) * | 2009-06-04 | 2010-12-09 | 日東電工株式会社 | A filter support |
| JP2012084688A (en) * | 2010-10-12 | 2012-04-26 | Nitto Denko Corp | Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape |
| CN103579066A (en) * | 2012-07-26 | 2014-02-12 | 日东电工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
| JP2014027081A (en) * | 2012-07-26 | 2014-02-06 | Nitto Denko Corp | Semiconductor wafer mounting method and semiconductor wafer mounting device |
| JP2014116422A (en) * | 2012-12-07 | 2014-06-26 | Lintec Corp | Sheet sticking device, and sheet sticking method |
| KR20150131943A (en) * | 2014-05-16 | 2015-11-25 | 닛토덴코 가부시키가이샤 | Apparatus for Transporting Glass Substrate |
| JP2015218065A (en) * | 2014-05-16 | 2015-12-07 | 日東電工株式会社 | Glass substrate conveyance device |
| JP2021068817A (en) * | 2019-10-24 | 2021-04-30 | 株式会社ディスコ | Tape sticking device |
| CN112249795A (en) * | 2020-10-19 | 2021-01-22 | 广东利元亨智能装备股份有限公司 | Real-time correction method and device for rubberizing process, electronic equipment and readable storage medium |
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